CN102956573A - Triode with firm structure - Google Patents
Triode with firm structure Download PDFInfo
- Publication number
- CN102956573A CN102956573A CN2012104675280A CN201210467528A CN102956573A CN 102956573 A CN102956573 A CN 102956573A CN 2012104675280 A CN2012104675280 A CN 2012104675280A CN 201210467528 A CN201210467528 A CN 201210467528A CN 102956573 A CN102956573 A CN 102956573A
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- CN
- China
- Prior art keywords
- triode
- emc
- main body
- piece
- casting groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
The invention discloses a triode with a firm structure, and the triode comprises a triode main body, wherein a pouring groove is arranged inside the main body, the pouring groove is in a rectangular shape, the ratio of the rectangle is 4:3.5, an electro magnetic compatibility (EMC0 EMC) block is poured inside the pouring groove of the triode main body, and four edges of the pouring groove are designed into an undulate shape, so that a combination edge of the EMC block and the main body is provided with an undulate edge. The outer surface of the EMC block is parallel to the surface of the main body. Due to the adoption of the triode with the firm structure, the combination force between the EMC block and the triode main body is firmer and not easy to fracturecrack.
Description
Technical field
The present invention relates to a kind of semiconductor package.
Background technology
Existing Discrete device packaging framework capillary groove is the square structure, and the edge all is smooth, and adhesion is poor, cast EMC(External Memory Controller exterior storage controll block) after, EMC and framework adhesion are poor.
Summary of the invention
In order to improve the stability of triode encapsulating structure, the invention provides a kind of robust structure triode.
Purpose of the present invention is come specific implementation by the following technical programs:
A kind of robust structure triode, comprise the triode body, have the casting groove in body interior, described casting groove is rectangle, and rectangular ratio is 4:3.5, be cast with the EMC piece in the casting groove of triode body, four edges of described casting groove are made as waveform, and what make described EMC piece and body has the waveform limit in conjunction with the limit.
The outer surface of described EMC piece parallels with body surface.
Robust structure triode provided by the invention can make the adhesion between EMC piece and the triode body more firm, is not easy cracking.
Description of drawings
The below is described in further detail the present invention with embodiment with reference to the accompanying drawings.
Fig. 1 is the structure chart of the described robust structure triode of the embodiment of the invention.
Embodiment
As shown in Figure 1, the described robust structure triode of the embodiment of the invention, comprise the triode body, have the casting groove in body interior, described casting groove is rectangle, and rectangular ratio is 4:3.5, is cast with the EMC piece in the casting groove of triode body, four edges of described casting groove are made as waveform, and what make described EMC piece and body has the waveform limit in conjunction with the limit.
The outer surface of described EMC piece parallels with body surface.
Robust structure triode provided by the invention can make the adhesion between EMC piece and the triode body more firm, is not easy cracking.
Robust structure triode provided by the invention can carry out comprehensive location to triode blank band, guarantees the accuracy of cross cutting, improves the production efficiency of cross cutting.
Claims (2)
1. robust structure triode, comprise the triode body, it is characterized in that, have the casting groove in body interior, described casting groove is rectangle, and rectangular ratio is 4:3.5, is cast with the EMC piece in the casting groove of triode body, four edges of described casting groove are made as waveform, and what make described EMC piece and body has the waveform limit in conjunction with the limit.
2. robust structure triode as claimed in claim 1 is characterized in that, the outer surface of described EMC piece parallels with body surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104675280A CN102956573A (en) | 2012-11-19 | 2012-11-19 | Triode with firm structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104675280A CN102956573A (en) | 2012-11-19 | 2012-11-19 | Triode with firm structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102956573A true CN102956573A (en) | 2013-03-06 |
Family
ID=47765194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104675280A Pending CN102956573A (en) | 2012-11-19 | 2012-11-19 | Triode with firm structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102956573A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6132278A (en) * | 1996-06-25 | 2000-10-17 | Vanderbilt University | Mold method for forming vacuum field emitters and method for forming diamond emitters |
| CN2893922Y (en) * | 2006-04-19 | 2007-04-25 | 宁波康强电子股份有限公司 | Improved large-power lead wire frame |
| CN201332090Y (en) * | 2008-12-21 | 2009-10-21 | 肖智轶 | Packaging mould for electronic devices and components in semi package |
| CN202003987U (en) * | 2011-01-05 | 2011-10-05 | 无锡市玉祁红光电子有限公司 | Bare copper frame with water-proof groove structure |
-
2012
- 2012-11-19 CN CN2012104675280A patent/CN102956573A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6132278A (en) * | 1996-06-25 | 2000-10-17 | Vanderbilt University | Mold method for forming vacuum field emitters and method for forming diamond emitters |
| CN2893922Y (en) * | 2006-04-19 | 2007-04-25 | 宁波康强电子股份有限公司 | Improved large-power lead wire frame |
| CN201332090Y (en) * | 2008-12-21 | 2009-10-21 | 肖智轶 | Packaging mould for electronic devices and components in semi package |
| CN202003987U (en) * | 2011-01-05 | 2011-10-05 | 无锡市玉祁红光电子有限公司 | Bare copper frame with water-proof groove structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130306 |