CN202259268U - Carving-first plating-second lead frame structure with base island prefilled with plastic packaging materials - Google Patents
Carving-first plating-second lead frame structure with base island prefilled with plastic packaging materials Download PDFInfo
- Publication number
- CN202259268U CN202259268U CN2011203400031U CN201120340003U CN202259268U CN 202259268 U CN202259268 U CN 202259268U CN 2011203400031 U CN2011203400031 U CN 2011203400031U CN 201120340003 U CN201120340003 U CN 201120340003U CN 202259268 U CN202259268 U CN 202259268U
- Authority
- CN
- China
- Prior art keywords
- pin
- lead frame
- plastic packaging
- base island
- frame structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a carving-first plating-second lead frame structure with a base island prefilled with plastic packaging materials, which comprises the base island (1) and a pin (2). A first metal layer (5) is plated on the front face of the base island (1) and the pin (2), a second metal layer (6) is plated on the back face of the base island (1) and the pin (2), the plastic packaging materials (4) are filled in etching areas between the base island (1) and the pin (2) and between the pin (2) and the pin (2), and the plastic packaging materials (4) are aligned at the front face and the back face of the base island (1) and the pin (2). The carving-first plating-second lead frame structure has the advantages that an expensive high temperature resistant soft organic film is not required to be bonded to the bottom of a lead frame, various problems caused by piece loading, routing and packaging in the background can be avoided, and finished product yield is greatly improved. Further, the lead frame adopts the mode of simultaneous etching of the front face and the back face, 50% of complexity can be reduced in work procedures, cost is reduced, and malposition danger caused by secondary para-position can be reduced.
Description
Technical field
The utility model relates to a kind of lead frame structure, belongs to the semiconductor packaging field.
Background technology
Traditional lead frame structure mainly contains two kinds:
A kind of is that flat-four-side does not have pin package (QFN) lead frame; The lead frame of this structure is when preventing that the lead frame front from sealing operation; The back side of lead frame can produce the flash of plastic packaging material; So be pasted with the expensive high temperature glued membrane (as shown in Figure 2) of one deck at the lead frame back side, there is following shortcoming in this lead frame structure:
1, the bottom of die-attach area has attached one deck high temperature resistance glued membrane, has increased by at least 50% lead frame cost;
2, the glued membrane of metal lead wire frame bottom attaching is soft organic substance; So in the load and wire bonds operation of follow-up encapsulation process; Can pollute because high-temperature baking has produced organic volatility; The associativity of chip front side and lead frame front and wire bonds can be directly polluteed, even the binding ability failure (being commonly called as layering) that causes in chip front side and the positive follow-up encapsulation process of lead frame with plastic packaging material can be had influence on;
3, because the lead frame bottom has attached soft organic glued membrane; So in the wire bonds operation in follow-up encapsulation process; The strength of its part bonding is given by soft organic glued membrane and is absorbed; Increase the difficulty of wire bonds, caused the instability of wire bonds yield, possibly produce integrity problem;
4, because lead frame bottom has attached soft organic glued membrane, the wire material also is limited in comparatively soft and expensive spun gold when causing the bonding operation, and can not use hard and copper, aluminium matter with low cost or other wire or metal tape cheaply;
5, because the lead frame bottom has attached soft organic glued membrane; So follow-up when sealing operation; Can be because glued membrane separate with die-attach area and cause in high pressure plastic packaging process, plastic packaging material infiltrates the centre (like Fig. 3, shown in Figure 4) of pin or Ji Dao and soft organic glued membrane.
Design and manufacturing that lead frame (as shown in Figure 5) is sealed in another kind of two-sided etching in advance are after adopting metal substrate to carry out back etched earlier, to carry out sealing in advance of back side plastic packaging material again, and then carry out the etching and the electroplating surface of lead frame front pin.There is following shortcoming in this lead frame structure:
1, the production process too complex of lead frame causes the lead frame cost to increase;
2, the etching of lead frame is divided into each etching of top and bottom once, easily because the resetting error of location of etch up and down causes dislocation.
Summary of the invention
The purpose of the utility model is to overcome above-mentioned deficiency; Provide a kind of Ji Dao of having to fill out plastic packaging material carving before plating lead frame structure in advance; It has saved the high temperature resistant glued membrane at the back side, has solved the shortcoming of bringing because of soft glued membrane natch, and reduction simultaneously the cost of encapsulating material, processing procedure and production efficiency etc.; Relative raising the reliability of encapsulation process, and production craft step is simple, cost is low.
The purpose of the utility model is achieved in that a kind of Ji Dao of having fills out plastic packaging material carving before plating lead frame structure in advance; It comprises Ji Dao and pin; Said Ji Dao and pin front are coated with the first metal layer; The Ji Dao and the pin back side are coated with second metal level, between said Ji Dao and the pin and the etching area between pin and the pin all be filled with plastic packaging material, said plastic packaging material flushes with the front and the back side of metal substrate.
Compared with prior art, the beneficial effect of the utility model is:
The utility model relates to a kind of Ji Dao of having and fills out plastic packaging material carving before plating lead frame structure in advance; All be filled with plastic packaging material between its Ji Dao and the pin and in the etching area between pin and the pin; And the top and bottom of plastic packaging material all flush with the positive back side of metal substrate, and it has the following advantages:
1, the lead frame bottom does not need to attach the expensive soft organic substance glued membrane of high temperature resistance of one deck again.Therefore also do not have the load described in the background of front, routing, seal the variety of issue that can produce, material cost, processing procedure cost and quality cost etc. can be reduced greatly.
2, lead frame adopts the etching simultaneously of the positive back side, contrasts two-sided etching and seals lead frame in advance, on operation, can reduce by 50% complexity, reduces cost; Can reduce again because the dislocation risk that secondary contraposition causes.
Description of drawings
Fig. 1 fills out plastic packaging material carving before plating lead frame structure sketch map in advance for the utility model has Ji Dao.
Fig. 2 was not for there was the sketch map that high temperature resistant glued membrane is sticked at the pin lead frame back side on four sides in the past.
The sketch map of flash when the four sides that Fig. 3 sticks high temperature resistant glued membrane for the back side does not in the past have the pin leadframe package.
The four sides that produces flash when Fig. 4 is encapsulation does not have the sketch map after the pin leadframe package is taken high temperature resistant glued membrane off.
Fig. 5 was for sealed the structural representation of two-sided etched lead frame in the past in advance.
Wherein:
Base island 1
High temperature resistant glued membrane 3
The first metal layer 5
Second metal level 6.
Embodiment
Referring to Fig. 1; The utility model has Ji Dao to fill out plastic packaging material carving before plating lead frame structure in advance; It comprises basic island 1 and pin 2, and said basic island 1 is coated with the first metal layer 5 with pin 2 fronts, and basic island 1 is coated with second metal level 6 with pin 2 back sides; Between said basic island 1 and the pin 2 and the etching area between pin 2 and the pin 2 all be filled with plastic packaging material 4, said plastic packaging material 4 flushes with the back side with the front of basic island 1 and pin 2.
Claims (1)
1. one kind has Ji Dao to fill out plastic packaging material carving before plating lead frame structure in advance; It comprises Ji Dao (1) and pin (2); Said Ji Dao (1) and pin (2) front are coated with the first metal layer (5); The Ji Dao (1) and pin (2) back side are coated with second metal level (6); It is characterized in that: between said Ji Dao (1) and the pin (2) and the etching area between pin (2) and the pin (2) all be filled with plastic packaging material (4), said plastic packaging material (4) flushes with the back side with the front of Ji Dao (1) and pin (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203400031U CN202259268U (en) | 2011-09-13 | 2011-09-13 | Carving-first plating-second lead frame structure with base island prefilled with plastic packaging materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203400031U CN202259268U (en) | 2011-09-13 | 2011-09-13 | Carving-first plating-second lead frame structure with base island prefilled with plastic packaging materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259268U true CN202259268U (en) | 2012-05-30 |
Family
ID=46120467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203400031U Expired - Lifetime CN202259268U (en) | 2011-09-13 | 2011-09-13 | Carving-first plating-second lead frame structure with base island prefilled with plastic packaging materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259268U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324413A (en) * | 2011-09-13 | 2012-01-18 | 江苏长电科技股份有限公司 | Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof |
-
2011
- 2011-09-13 CN CN2011203400031U patent/CN202259268U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324413A (en) * | 2011-09-13 | 2012-01-18 | 江苏长电科技股份有限公司 | Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof |
| WO2013037183A1 (en) * | 2011-09-13 | 2013-03-21 | Jiangsu Changjiang Electronics Technology Co. Ltd | Sequentially etched and plated lead frame structure with island prepacked molding compound and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170210 Address after: Tianjin free trade zone (Dongjiang Bonded Port) No. 6865 North Road, 1-1-1802-7 financial and trade center of Asia Patentee after: Xin Xin finance leasing (Tianjin) Co., Ltd. Address before: 214434 Binjiang Middle Road, Jiangyin Development Zone, Jiangsu, China, No. 275, No. Patentee before: Jiangsu Changjiang Electronics Technology Co., Ltd. |
|
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu Changjiang Electronics Technology Co., Ltd. Assignor: Xin Xin finance leasing (Tianjin) Co., Ltd. Contract record no.: 2017320000152 Denomination of utility model: Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof Granted publication date: 20120530 License type: Exclusive License Record date: 20170614 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY Co.,Ltd. Assignor: Xin Xin finance leasing (Tianjin) Co., Ltd. Contract record no.: 2017320000152 Date of cancellation: 20200416 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200426 Address after: 214434, No. 78, mayor road, Chengjiang, Jiangsu, Jiangyin, Wuxi Patentee after: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 1-1-1802-7, North Zone, financial and Trade Center, No. 6865, Asia Road, Tianjin pilot free trade zone (Dongjiang Free Trade Port Area) Patentee before: Xin Xin finance leasing (Tianjin) Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120530 |
|
| CX01 | Expiry of patent term |