CN203733781U - TO-220 waterproof seal lead frame - Google Patents
TO-220 waterproof seal lead frame Download PDFInfo
- Publication number
- CN203733781U CN203733781U CN201320813576.0U CN201320813576U CN203733781U CN 203733781 U CN203733781 U CN 203733781U CN 201320813576 U CN201320813576 U CN 201320813576U CN 203733781 U CN203733781 U CN 203733781U
- Authority
- CN
- China
- Prior art keywords
- waterproof
- groove
- sealing groove
- waterproof sealing
- slide holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a TO-220HF waterproof seal lead frame. The frame comprises a chip holder. One end of the chip holder is connected to a heat radiation sheet that is provided with an installation hole. The other end of the chip holder is provided with a frame lead welding part. The top part of the chip holder is provided with a first waterproof seal groove. The left side of the chip holder is provided with a second waterproof seal groove. The right side of the chip holder is provided with a third waterproof seal groove. A connecting part is disposed between the chip holder and the heat radiation sheet. The connecting part is provided with a waterproof groove having a width ranging from 0.7 to 0.9mm. The bottom central part of the waterproof groove is provided with a swallowtail-shaped groove. The upper surface of the bottom part of the swallowtail-shaped groove is uniformly provided with a concave-convex structure. The bottom part of the chip holder is provided with pins. The connecting part between the pins and the frame lead welding part is provided with a fourth waterproof seal groove. The beneficial effects are that the TO-220 waterproof seal lead frame is good in airtightness and high in impact resistance.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of TO-220 waterproof sealed lead wire frame.
Background technology
In the process of employing lead-frame packages semiconductor device, after being placed on the chip section of lead frame, chip needs to carry out plastic packaging, in order to make the semiconductor device after plastic packaging there is stronger air-tightness, current lead frame offers groove at the edge of chip section conventionally, and be provided with seal groove in groove inner side, groove and seal groove the bond strength that can strengthen lead frame and plastic packaging material is set, thereby make semiconductor device there is certain air-tightness.But the lead frame that changes profile of general design at present, the surface of capillary groove is smooth plane, the adhesion of plastic packaging material and lead frame is insecure, air-tightness is good not, maintain and do not there is better anti-impact force in operations such as immersion, plating and Trim Moldings, can not effectively ensure the reliability of product.
Utility model content
In view of the above-mentioned problems in the prior art, the purpose of this utility model is to address the deficiencies of the prior art, and the TO-220 that a kind of waterproof sealing is good and anti-impact force is strong waterproof sealed lead wire frame is provided.
The utility model provides a kind of TO-220 waterproof sealed lead wire frame, comprise chip slide holder, one end of described chip slide holder is connected with fin, on described fin, be provided with installing hole, the other end is provided with support lead weld part, the top of described chip slide holder is provided with the first waterproof sealing groove, the left side of described chip slide holder is provided with the second waterproof sealing groove, the right side of described chip slide holder is provided with the 3rd waterproof sealing groove, between described chip slide holder and described fin, be provided with connecting portion, on described connecting portion, being provided with width is the waterproof groove of 0.7～0.9mm, the bottom centre of described waterproof groove is provided with dove-tail form groove, the upper base surface of described dove-tail form groove is evenly set to concaveconvex structure, the bottom of described chip slide holder is provided with pin, the junction of described pin and described support lead weld part is provided with the 4th waterproof sealing groove.
Further, described the first waterproof sealing groove, described the second waterproof sealing groove and described the 3rd waterproof sealing groove form the waterproof construction of a sealing.
Further, the width of described the first waterproof sealing groove, described the second waterproof sealing groove and described the 3rd waterproof sealing groove is 0.10～0.16mm.
Further, the width of described waterproof groove is 0.8mm, and the degree of depth of described waterproof groove is 0.3mm.
Further, the degree of depth of described dove-tail form groove is 0.15mm.
Further, described for concaveconvex structure is wavy shaped configuration, in order to increase the area of described dove-tail form trench bottom upper surface.
Further, the width of described the 4th waterproof sealing groove is 0.06～0.10mm.
The advantage the utlity model has and beneficial effect are: the TO-220 waterproof sealed lead wire frame of the present embodiment is provided with the first waterproof sealing groove, the second waterproof sealing groove, the 3rd waterproof sealing groove and the 4th waterproof sealing groove, makes the air-tightness of this lead frame more excellent; Between described chip slide holder and described fin, be provided with connecting portion simultaneously, on described connecting portion, being provided with width is the waterproof groove of 0.7～0.9mm, the bottom centre of described waterproof groove is provided with dove-tail form groove, the upper base surface of described dove-tail form groove is evenly set to concaveconvex structure, strengthen the contact area of plastic packaging material and this TO-220 waterproof sealed lead wire frame, improved the impact resistance of this TO-220 waterproof sealed lead wire frame.
Brief description of the drawings
Fig. 1 is the structural representation of the TO-220 waterproof sealed lead wire frame of the present embodiment;
Fig. 2 is that the A-A of Fig. 1 cuts open structural representation enlarged drawing;
Fig. 3 is that the B-B of Fig. 1 cuts open structural representation enlarged drawing.
Embodiment
With specific embodiment, the utility model is further described below with reference to accompanying drawings.
As Fig. 1, shown in Fig. 2 and Fig. 3: a kind of TO-220 waterproof sealed lead wire frame of the utility model embodiment comprises multiple separate units 1, each separate unit 1 comprises chip slide holder 106, one end of described chip slide holder 106 is connected with fin 100, on described fin 100, be provided with installing hole 101, the other end is provided with support lead weld part 107, the top of described chip slide holder 106 is provided with the first waterproof sealing groove 103, the left side of described chip slide holder 106 is provided with the second waterproof sealing groove 105, the right side of described chip slide holder 106 is provided with the 3rd waterproof sealing groove 104, between described chip slide holder 106 and described fin 100, be provided with connecting portion, on described connecting portion 102, being provided with width is the waterproof groove 1021 of 0.7～0.9mm, the bottom centre of described waterproof groove 1021 is provided with dove-tail form groove 1022, the upper base surface of described dove-tail form groove 1022 is evenly set to concaveconvex structure, the bottom of described chip slide holder 106 is provided with pin one 09, described pin one 09 is provided with the 4th waterproof sealing groove 108 with the junction of described support lead weld part 107, described the first waterproof sealing groove 103, described the second waterproof sealing groove 105, the setting of described the 3rd waterproof sealing groove 104 and described the 4th waterproof sealing groove 108 makes the air-tightness of described TO-220 waterproof sealed lead wire frame better, reach the object of more excellent water resistance.
As the preferred implementation of above-described embodiment, described the first waterproof sealing groove 103, described the second waterproof sealing groove 105 and described the 3rd waterproof sealing groove 104 form the waterproof construction of a sealing, the water resistance of chip slide holder 106 is got a promotion, and setting is more safe and reliable with the chip on it.
As the preferred implementation of above-described embodiment, the width of described the first waterproof sealing groove 103, described the second waterproof sealing groove 105 and described the 3rd waterproof sealing groove 104 is 0.10～0.16mm.
As the preferred implementation of above-described embodiment, the width of described waterproof groove 1021 is 0.8mm, and the degree of depth of described waterproof groove 1021 is 0.3mm.
As the preferred implementation of above-described embodiment, the degree of depth of described dove-tail form groove 1022 is 0.15mm.
As the preferred implementation of above-described embodiment, described for concaveconvex structure be wavy shaped configuration, in order to increase the area of described dove-tail form groove 1022 upper base surface, to increase the contact area of plastic packaging material and described dove-tail form groove 1022, the snap close coupling mechanism force forming be thus intrinsic 3-5 doubly, so the adhesion of plastic packaging material and framework is better in the time of encapsulation, air-tightness is better, maintain better anti-impact force in operations such as immersion, plating, Trim Moldings, can effectively ensure the reliability of product.
As the preferred implementation of above-described embodiment, the width of described the 4th waterproof sealing groove 108 is 0.06～0.10mm.
Finally it should be noted that: above-described each embodiment, only for the technical solution of the utility model is described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record previous embodiment is modified, or to wherein partly or entirely technical characterictic be equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the scope of the each embodiment technical scheme of the utility model.
Claims (7)
1. a TO-220 waterproof sealed lead wire frame, comprise chip slide holder, one end of described chip slide holder is connected with fin, on described fin, be provided with installing hole, the other end is provided with support lead weld part, it is characterized in that: the top of described chip slide holder is provided with the first waterproof sealing groove, the left side of described chip slide holder is provided with the second waterproof sealing groove, the right side of described chip slide holder is provided with the 3rd waterproof sealing groove, between described chip slide holder and described fin, be provided with connecting portion, on described connecting portion, being provided with width is the waterproof groove of 0.7～0.9mm, the bottom centre of described waterproof groove is provided with dove-tail form groove, the upper base surface of described dove-tail form groove is evenly set to concaveconvex structure, the bottom of described chip slide holder is provided with pin, the junction of described pin and described support lead weld part is provided with the 4th waterproof sealing groove.
2. TO-220 waterproof sealed lead wire frame according to claim 1, is characterized in that, described the first waterproof sealing groove, described the second waterproof sealing groove and described the 3rd waterproof sealing groove form the waterproof construction of a sealing.
3. TO-220 waterproof sealed lead wire frame according to claim 2, is characterized in that, the width of described the first waterproof sealing groove, described the second waterproof sealing groove and described the 3rd waterproof sealing groove is 0.10～0.16mm.
4. TO-220 waterproof sealed lead wire frame according to claim 1, is characterized in that, the width of described waterproof groove is 0.8mm, and the degree of depth of described waterproof groove is 0.3mm.
5. TO-220 waterproof sealed lead wire frame according to claim 3, is characterized in that, the degree of depth of described dove-tail form groove is 0.15mm.
6. TO-220 waterproof sealed lead wire frame according to claim 1, is characterized in that, described for concaveconvex structure is wavy shaped configuration, in order to increase the area of described dove-tail form trench bottom upper surface.
7. TO-220 waterproof sealed lead wire frame according to claim 1, is characterized in that, the width of described the 4th waterproof sealing groove is 0.06～0.10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320813576.0U CN203733781U (en) | 2013-12-12 | 2013-12-12 | TO-220 waterproof seal lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320813576.0U CN203733781U (en) | 2013-12-12 | 2013-12-12 | TO-220 waterproof seal lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733781U true CN203733781U (en) | 2014-07-23 |
Family
ID=51203832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320813576.0U Expired - Fee Related CN203733781U (en) | 2013-12-12 | 2013-12-12 | TO-220 waterproof seal lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203733781U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103646940A (en) * | 2013-12-12 | 2014-03-19 | 南通华隆微电子有限公司 | TO-220 waterproof sealing lead frame |
| CN106206341A (en) * | 2016-08-22 | 2016-12-07 | 杰群电子科技（东莞）有限公司 | A kind of method preventing short circuit after chip face-down bonding and lead frame |
| CN107887530A (en) * | 2016-08-02 | 2018-04-06 | 罗伯特·博世有限公司 | Battery module |
-
2013
- 2013-12-12 CN CN201320813576.0U patent/CN203733781U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103646940A (en) * | 2013-12-12 | 2014-03-19 | 南通华隆微电子有限公司 | TO-220 waterproof sealing lead frame |
| CN107887530A (en) * | 2016-08-02 | 2018-04-06 | 罗伯特·博世有限公司 | Battery module |
| CN106206341A (en) * | 2016-08-22 | 2016-12-07 | 杰群电子科技（东莞）有限公司 | A kind of method preventing short circuit after chip face-down bonding and lead frame |
| CN106206341B (en) * | 2016-08-22 | 2019-02-22 | 杰群电子科技（东莞）有限公司 | It is a kind of to prevent method and lead frame short-circuit after chip face-down bonding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20161212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |