CN205428911U - Slim lead frame with forked tail structure - Google Patents
Slim lead frame with forked tail structure Download PDFInfo
- Publication number
- CN205428911U CN205428911U CN201620279259.9U CN201620279259U CN205428911U CN 205428911 U CN205428911 U CN 205428911U CN 201620279259 U CN201620279259 U CN 201620279259U CN 205428911 U CN205428911 U CN 205428911U
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- groove
- dovetail
- lead frame
- slim
- forked tail
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Abstract
The utility model discloses a slim lead frame with forked tail structure relates to semiconductor lead frame processing field. This slim lead frame with forked tail structure is provided with the forked tail structure, and the forked tail structure includes the dovetail, sets up the V type groove in the dovetail below. The utility model discloses a change the dovetail structure, solve the problem that lead frame dimensional change is big that the blanking was produced.
Description
Technical field
This utility model relates to semiconductor lead frame manufacture field, is specifically related to a kind of slim lead frame with dovetail configuration.
Background technology
In order to improve the reliability of lead-frame packages finished product, the lock plastic structure of dovetail is had in leadframe design, dovetail configuration is inside recessed material, its section line length is more than length surface, so after encapsulation finished product is assemblied on electrical equipment, the probability using the harmful substances such as the steam in environment, Acid-base Gas to enter finished product corrosion chip will reduce or stop completely.
Existing dovetail configuration, shape is rectangular-shaped molding, its degree of depth is general all at more than 0.3mm, in forming process the biggest to material crimp, so it is more suitable for blaster fuse frame material thickness more than 1.0mm's, if so thickness less than 0.5mm lead frame on this structure of molding, it is the most inapplicable, it can cause material produce distortion, roll up curved, Pingdu is poor, last blanking size lead frame out changes greatly, it cannot be guaranteed that encapsulation factory normally uses when encapsulating finished product, causing product rejection, cost increases.
Utility model content
This utility model aims to provide a kind of slim lead frame with dovetail configuration, by changing the structure of dovetail groove to solve the problems referred to above.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of slim lead frame with dovetail configuration, it is characterised in that: being provided with dovetail configuration on the lead frames, dovetail configuration includes dovetail groove, is arranged on the V-groove below dovetail groove.
Further, described dovetail groove is that two and half triangular grooves are connected to the formation of V-groove opening both sides.
Further, described V-groove and half triangular groove junction are provided with interior bent arc.
Further, the degree of depth of described V-groove is more than depth of dovetail.
The beneficial effects of the utility model are: this utility model changes the structure of dovetail groove on former slim lead frame, substituted for rectangular channel with V-groove, it is ensured that wire frame deformation does not interferes with product size, surface smoothness；And the circular arc of inflection it is provided with in V-groove and triangular groove junction, top half, after interior bent arc can effectively prevent injection, plastic cement comes off；And in the depth ratio half triangle groove depth of V-groove, more conducively half triangular groove molding, it is to avoid pressed and overlapped out copper scale.
Accompanying drawing explanation
Fig. 1 is the slim lead frame schematic diagram with dovetail configuration that this utility model provides.
Fig. 2 is the side view of Fig. 1.
Fig. 3 is the close-up schematic view in Fig. 2 at I.
Labelling in figure: 1 be V-groove, 2 be dovetail groove, 3 for interior bent arc.
Detailed description of the invention
With specific embodiment, this utility model is described further below in conjunction with the accompanying drawings.
As Figure 1-3, a kind of slim lead frame with dovetail configuration, it is provided with dovetail configuration on the lead frames, dovetail configuration includes dovetail groove 2, is arranged on the V-groove 1 below dovetail groove 2.
Described dovetail groove 2 is that two and half triangular grooves are connected to the formation of V-groove opening both sides.
Described V-groove 1 and half triangular groove junction are provided with interior bent arc.The degree of depth of described V-groove is more than the degree of depth of dovetail groove 2.
This utility model have changed the construction features of tradition dovetail groove, the cell body of dovetail groove 2 bottom is designed as V-groove 1, and the degree of depth of this V-groove 1 has been more than the degree of depth of top dovetail groove 2.Make in actual pressing process, the flowing in material width direction when effectively reducing molding, decrease the deformation of material.And the depth ratio dovetail groove 2 of V-groove 1 is deep, more conducively dovetail groove 2 molding, it is to avoid pressed and overlapped out copper scale.
After shaping, typically can be molded in dovetail configuration, after condensation, interior bent arc can play the function of clip, it is to avoid plastic cement comes off.So, using the dovetail configuration of this V-groove to thin material, the material molding of especially less than 0.5mm thickness is easier to realize.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, for a person skilled in the art, this utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. made, within should be included in protection domain of the present utility model.
Claims (4)
1. a slim lead frame with dovetail configuration, it is characterised in that: being provided with dovetail configuration on the lead frames, dovetail configuration includes dovetail groove, is arranged on the V-groove below dovetail groove.
The slim lead frame with dovetail configuration the most according to claim 1, it is characterised in that: described dovetail groove is that two and half triangular grooves are connected to the formation of V-groove opening both sides.
The slim lead frame with dovetail configuration the most according to claim 2, it is characterised in that: described V-groove and half triangular groove junction are provided with interior bent arc.
The slim lead frame with dovetail configuration the most according to claim 1, it is characterised in that: the degree of depth of described V-groove is more than depth of dovetail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620279259.9U CN205428911U (en) | 2016-04-06 | 2016-04-06 | Slim lead frame with forked tail structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620279259.9U CN205428911U (en) | 2016-04-06 | 2016-04-06 | Slim lead frame with forked tail structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205428911U true CN205428911U (en) | 2016-08-03 |
Family
ID=56522468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620279259.9U Active CN205428911U (en) | 2016-04-06 | 2016-04-06 | Slim lead frame with forked tail structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205428911U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206341A (en) * | 2016-08-22 | 2016-12-07 | 杰群电子科技（东莞）有限公司 | A kind of method preventing short circuit after chip face-down bonding and lead frame |
| CN108637084A (en) * | 2018-05-09 | 2018-10-12 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| DE102017118913A1 (en) * | 2017-08-18 | 2019-04-18 | Danfoss Silicon Power Gmbh | Power semiconductor with a shunt resistor |
-
2016
- 2016-04-06 CN CN201620279259.9U patent/CN205428911U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206341A (en) * | 2016-08-22 | 2016-12-07 | 杰群电子科技（东莞）有限公司 | A kind of method preventing short circuit after chip face-down bonding and lead frame |
| CN106206341B (en) * | 2016-08-22 | 2019-02-22 | 杰群电子科技（东莞）有限公司 | It is a kind of to prevent method and lead frame short-circuit after chip face-down bonding |
| DE102017118913A1 (en) * | 2017-08-18 | 2019-04-18 | Danfoss Silicon Power Gmbh | Power semiconductor with a shunt resistor |
| CN108637084A (en) * | 2018-05-09 | 2018-10-12 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| CN108637084B (en) * | 2018-05-09 | 2019-06-04 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |