CN205863162U - A kind of high power device frame structure of anti-plastic packaging flash - Google Patents
A kind of high power device frame structure of anti-plastic packaging flash Download PDFInfo
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- CN205863162U CN205863162U CN201620546946.2U CN201620546946U CN205863162U CN 205863162 U CN205863162 U CN 205863162U CN 201620546946 U CN201620546946 U CN 201620546946U CN 205863162 U CN205863162 U CN 205863162U
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- plastic
- pin
- sealed body
- slide holder
- flash
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Abstract
The utility model discloses the high power device frame structure of a kind of anti-plastic packaging flash, the pin that the fin being connected with slide holder conduction of heat including slide holder electrically connects with slide holder, part heat sink and part pin that described slide holder is adjacent with slide holder close with plastic-sealed body thermoplastic sealed knot, and the position that described fin closes on plastic-sealed body is provided with anti-overflow groove；The position closing on plastic-sealed body on described pin is provided with bending guide portion.By using frame structure described herein, anti-overflow groove is added in fin plastic-sealed body proximity, plastic package die normal operation may wear to flash lose control of time, flash flows into anti-overflow groove, the service life of mould spare and accessory parts can be extended, greatly save production cost, it is to avoid force to remove the quality risk of flash.Bending guide portion at pin can lock the stress point of pin bending, it is to avoid plastic-sealed body and the stress of framework junction, improves the reliability of machine on product.
Description
Technical field
This utility model relates to the high power device frame structure of a kind of anti-plastic packaging flash.
Background technology
High power device is because the requirement of heat radiation and high pressure, the application requirement of big electric current, and the frame requirements of encapsulation is all
Relatively thick (0.5-2.0mm), dimensional accuracy compares poor；Plastic packaging material mostly is crystallization for the silica flour in heat radiation formula simultaneously
Silica flour (granularity is bigger), because the mould of above-mentioned factor encapsulation weares and teares quickly in actual production process, general 6 months left
The product that right plastic packaging operation goes out arises that overproof plastic packaging flash (general fin top in plastic packaging flash standard industry
Control in the range of 0.2-0.3mm with pin positive and negative), process cannot remove by normal rear operation.Can only be by strengthening
The measures such as the process of rear operation or replacing plastic package die spare and accessory parts reduce or remove flash, and the matter affecting product is comprehended at this place
Measure or cause the increase of production cost.Additionally high power device is actual use on the machine during large-tonnage product need the most curved
Bent use, because high power device is half encapsulating, framework and plastic packaging material adhesion are poor, it may appear that chip, plastic-sealed body bend because of pin
The situation that stress fragmentation or framework separate with plastic packaging material.Prior art is badly in need of one and is prevented from plastic packaging flash, and bending pins is not
The high power device frame structure of the anti-plastic packaging flash that easy and plastic-sealed body departs from.
Utility model content
The purpose of this utility model is to overcome defect present in prior art, it is provided that one is prevented from plastic packaging and overflows
Material, bending pins is difficult to the high power device frame structure of the anti-plastic packaging flash departed from plastic-sealed body.
For achieving the above object, the technical solution of the utility model there is provided the high power device of a kind of anti-plastic packaging flash
Frame structure, the pin that the fin being connected with slide holder conduction of heat including slide holder electrically connects with slide holder, described slide glass
Part heat sink and part pin that platform is adjacent with slide holder close with plastic-sealed body thermoplastic sealed knot, and described fin closes on plastic packaging
The position of body is provided with anti-overflow groove；The position closing on plastic-sealed body on described pin is provided with bending guide portion.
By using frame structure described herein, add anti-overflow groove, at plastic packaging in fin plastic-sealed body proximity
Mould normal operation may wear to flash when losing control of, and flash flows into anti-overflow groove, can extend the service life of mould spare and accessory parts,
Greatly save production cost, it is to avoid force to remove the quality risk of flash.Bending guide portion at pin can lock
The stress point of pin bending, it is to avoid plastic-sealed body and the stress of framework junction, improves the reliability of machine on product.
As preferably, the degree of depth of described anti-overflow groove is 0.5mm, and width is 0.2mm.Such anti-overflow groove size design can
To play the effect preventing flash from overflowing.
As preferably, described pin closing on and offers breach on the position of plastic-sealed body, described breach symmetry is opened in
Pin both sides, described in pin sheet material between the breach and the breach that are arranged in pairs constitute bending guide portion.Such design makes
Pin sheet material between breach and breach is more prone to form stress point when by folding force, it is to avoid plastic-sealed body and framework knot
Stress at conjunction.
As preferably, the degree of depth of described breach is 0.1mm, and width is 0.2mm.Such design is the one to scheme
Optimize.
As preferably, described pin closes on and on the position of plastic-sealed body, in a row offers punching, described punching and punching
Between pin sheet material constitute bending guide portion.Such design makes the pin sheet material between punching and punching bent
It is more prone to during power form stress point, it is to avoid plastic-sealed body and the stress of framework junction.
Advantage of the present utility model and having the beneficial effects that: by using frame structure described herein, at fin
Plastic-sealed body proximity adds anti-overflow groove, plastic package die normal operation may wear to flash lose control of time, flash flow into anti-overflow
Groove, can extend the service life of mould spare and accessory parts, greatly saves production cost, it is to avoid force to remove the quality of flash
Risk.Bending guide portion at pin can lock the stress point of pin bending, it is to avoid being subject to of plastic-sealed body and framework junction
Power, improves the reliability of machine on product.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation；
Fig. 2 is B-B sectional view in Fig. 1；
Fig. 3 is this utility model anti-overflow groove schematic enlarged-scale view；
Fig. 4 is gap structure schematic diagram on pin；
Fig. 5 is punch structure schematic diagram on pin；
Fig. 6 is corrugated sheet metal sections structural representation on pin.
In figure: 1, fin；2, slide holder；3, pin；4, anti-overflow groove；5, bending guide portion；6, breach；7, punching；8、
Corrugated sheet metal sections；9, plastic-sealed body.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment, detailed description of the invention of the present utility model is further described.Hereinafter implement
Example is only used for clearly illustrating the technical solution of the utility model, and can not limit protection model of the present utility model with this
Enclose.
As shown in figs 1 to 6, the high power device frame structure of a kind of anti-plastic packaging flash, including slide holder 2 and slide holder
The pin 3 that the fin 1 that 2 conduction of heat connect electrically connects with slide holder 2, the part that described slide holder 2 is adjacent with slide holder 2 dissipates
Backing 1 and part pin 3 close with plastic-sealed body 9 thermoplastic sealed knot, and the position that described fin 1 closes on plastic-sealed body 9 is provided with anti-overflow
Groove 4；The position closing on plastic-sealed body 9 on described pin 3 is provided with bending guide portion 5.
The degree of depth of described anti-overflow groove 4 is 0.5mm, and width is 0.2mm.
Closing on described pin 3 and offer breach 6 on the position of plastic-sealed body 9, described breach 6 symmetry is opened in pin 3 liang
Side, described in pin 3 sheet material between the breach 6 and the breach 6 that are arranged in pairs constitute bending guide portion 5.
The degree of depth of described breach 6 is 0.1mm, and width is 0.2mm.
Close on described pin 3 and on the position of plastic-sealed body 9, in a row offer punching 7, between described punching 7 and punching 7
Pin 3 sheet material constitutes bending guide portion 5.
During plastic packaging, flash flows into anti-overflow groove 4, can extend the service life of mould spare and accessory parts, greatly save
Production cost, it is to avoid force to remove the quality risk of flash；Bending guide portion 5 at pin 3 can lock pin 3 and bend
Stress point, it is to avoid plastic-sealed body 9 and the stress of framework junction；Bending guide portion 5 has following three kinds of embodiments:
Example one (such as Fig. 4), described pin 3 closes on and offers breach 6 on the position of plastic-sealed body 9, and described breach 6 symmetry is opened
Be located at pin 3 both sides, described in pin 3 sheet material between the breach 6 and the breach 6 that are arranged in pairs constitute bending guide portion 5.State breach
The degree of depth of 6 is 0.1mm, and width is 0.2mm.
Example two (such as Fig. 5), described pin 3 closes on and in a row offers punching 7 on the position of plastic-sealed body 9, described punching 7 with
Pin 3 sheet material between punching 7 constitutes bending guide portion 5.
Example three (such as Fig. 6), pin 3 slabbing, on the pin 3 of plastic part, it is being provided with one section of corrugated sheet metal sections 8,
Described corrugated sheet metal sections 8 thickness is less than the thickness of other parts of pin 3, when pin 3 bends, at corrugated sheet metal sections
Bending is formed under the guiding of 8.
The above is only preferred implementation of the present utility model, it is noted that for the common skill of the art
For art personnel, front lower without departing from this utility model know-why, it is also possible to making some improvements and modifications, these improve
Also protection domain of the present utility model is should be regarded as with retouching.
Claims (5)
1. the high power device frame structure of an anti-plastic packaging flash, it is characterised in that: include slide holder and slide holder conduction of heat
The pin that the fin connected electrically connects with slide holder, part heat sink and part that described slide holder is adjacent with slide holder are drawn
Foot closes with plastic-sealed body thermoplastic sealed knot, and the position that described fin closes on plastic-sealed body is provided with anti-overflow groove；Close on described pin
The position of plastic-sealed body is provided with bending guide portion.
The high power device frame structure of anti-plastic packaging flash the most as claimed in claim 1, it is characterised in that: described anti-overflow groove
The degree of depth is 0.5mm, and width is 0.2mm.
The high power device frame structure of anti-plastic packaging flash the most as claimed in claim 1 or 2, it is characterised in that: described pin
On close on and offer breach on the position of plastic-sealed body, described breach symmetry is opened in pin both sides, described in the breach that is arranged in pairs
And the pin sheet material between breach constitutes bending guide portion.
The high power device frame structure of anti-plastic packaging flash the most as claimed in claim 3, it is characterised in that: described breach deep
Degree is 0.1mm, and width is 0.2mm.
The high power device frame structure of anti-plastic packaging flash the most as claimed in claim 1 or 2, it is characterised in that: described pin
On close on and in a row offer punching on the position of plastic-sealed body, the pin sheet material between described punching and punching constitutes bending and guides
Portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620546946.2U CN205863162U (en) | 2016-06-07 | 2016-06-07 | A kind of high power device frame structure of anti-plastic packaging flash |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620546946.2U CN205863162U (en) | 2016-06-07 | 2016-06-07 | A kind of high power device frame structure of anti-plastic packaging flash |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205863162U true CN205863162U (en) | 2017-01-04 |
Family
ID=57637928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620546946.2U Active CN205863162U (en) | 2016-06-07 | 2016-06-07 | A kind of high power device frame structure of anti-plastic packaging flash |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205863162U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109727947A (en) * | 2018-11-19 | 2019-05-07 | 华为技术有限公司 | A kind of pin, pin composite structure, packaging body and preparation method thereof |
| WO2020135002A1 (en) * | 2018-12-26 | 2020-07-02 | 长电科技（宿迁）有限公司 | Encapsulation mold structure convenient for removing molding-flash and process method |
-
2016
- 2016-06-07 CN CN201620546946.2U patent/CN205863162U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109727947A (en) * | 2018-11-19 | 2019-05-07 | 华为技术有限公司 | A kind of pin, pin composite structure, packaging body and preparation method thereof |
| CN109727947B (en) * | 2018-11-19 | 2020-12-15 | 华为技术有限公司 | Pin, pin combination structure, packaging body and manufacturing method thereof |
| US11539150B2 (en) | 2018-11-19 | 2022-12-27 | Huawei Technologies Co., Ltd. | Pin, pin combination structure, package body, and method for manufacturing package body |
| WO2020135002A1 (en) * | 2018-12-26 | 2020-07-02 | 长电科技（宿迁）有限公司 | Encapsulation mold structure convenient for removing molding-flash and process method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 214400, 10 Yingbin Avenue, Xu Xiake Town, Wuxi, Jiangsu, Jiangyin Patentee after: Jiangyin Huatuo Electronic Co. Ltd. Address before: Jiangsu province Wuxi City Cai village 214400 Jiangyin Yunting street she Village No. 111 Patentee before: Jiangyin Jinke Electronic Technology Co., Ltd. |
|
| CP03 | Change of name, title or address |