CN206388699U - High-density packages body, lead frame and encapsulation unit - Google Patents
High-density packages body, lead frame and encapsulation unit Download PDFInfo
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- CN206388699U CN206388699U CN201621455874.7U CN201621455874U CN206388699U CN 206388699 U CN206388699 U CN 206388699U CN 201621455874 U CN201621455874 U CN 201621455874U CN 206388699 U CN206388699 U CN 206388699U
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Abstract
The utility model provides a kind of high-density packages body, lead frame, encapsulation unit, the high-density packages array includes multiple packaging bodies, each packaging body includes an encapsulation part and multiple pins for protruding from the encapsulation part, two adjacent pins of each packaging body are connected by barrier rib, and the pin of each packaging body is separated each other with the barrier rib of adjacent packaging body.Good effect of the present utility model is, the pin of each packaging body is separated each other with the barrier rib of adjacent packaging body, reduce the space of pin occupancy, improve packaging density, a kind of highdensity array of packages, and the distance of increase barrier rib and packaging body can be provided, in plastic packaging, the stopper of mould can be inserted between barrier rib and packaging body, fundamentally avoid overlap from producing.
Description
Technical field
The utility model is related to field of semiconductor package, more particularly to a kind of high-density packages body, lead frame and encapsulation
Unit.
Background technology
In technical field of semiconductor encapsulation, how high density designs are realized, be one of the emphasis that researcher pursues.Due to drawing
There are many gaps between pin and pin, these clearance spaces are that framework is unavailable, gap wastes also more, therefore
High density designs, which are contemplated that from change pin design, starts with.The example of an existing semiconductor packages is set forth below, referring to Fig. 1
Shown, array of packages includes multiple packaging bodies 10, and each packaging body 10 includes an encapsulation part 11 and multiple protrudes from the encapsulation
The pin 12 in portion 11, two adjacent pins 12 of each packaging body 10 are connected by barrier rib 13, each packaging body
The barrier rib 13 of 10 pin 12 and adjacent packaging body 10 is connected to each other, and the barrier rib 13 to its where packaging body
The distance of encapsulation part 11 is less than 0.1mm.
There are the following problems for above-mentioned semiconductor packages array：1st, the pin 12 of each packaging body 10 and adjacent encapsulation
The barrier rib 13 of body 10 is connected to each other, and needs to separate pin 12 with barrier rib 13 during shaping, due to separate blade thickness with
And the reason for tolerance, more than the pin length ＞ 0.2mm that the design length of pin 12 should be than POD add the occupancy of pin 12
Space, it is impossible to realize high-density packages.Can not possibly be complete between the tolerance barrier rib 13 and encapsulation part 11 of mould when the 2, due to plastic packaging
It is complete very close to each other, then after packaging, overlap is just inevitably had in this gap, traditional design is to try to reduce resistance
The distance between blend stop 13 and encapsulation part 11 arrive ＜ 0.1mm, to reduce the length of overlap, and behind the work of deflashing is left to
Process, this causes the production cycle to extend, production efficiency reduction.
Therefore, need a kind of new encapsulating structure badly and method for packing solves above-mentioned technical problem.
Utility model content
It is single that technical problem to be solved in the utility model is to provide a kind of high-density packages body, lead frame and encapsulation
Member, it can realize high-density packages, and overlap can be avoided to produce.
In order to solve the above problems, the utility model provides a kind of high-density packages array, including multiple packaging bodies, often
Packaging body described in one includes an encapsulation part and multiple pins for protruding from the encapsulation part, adjacent two of each packaging body
Pin is connected by barrier rib, and the pin of each packaging body is separated each other with the barrier rib of adjacent packaging body.
Further, the pin of two adjacent packaging bodies is arranged in interdigitated, so that the pin of two adjacent packaging bodies
Partly overlap.
Further, the barrier rib of each packaging body to the distance of the encapsulation part is more than one times of material thickness,
To allow outer barrier block to insert between the barrier rib and the encapsulation part.
Further, the distance of barrier rib of the pin of each packaging body to adjacent packaging body is less than one times of material thickness
Degree.
The utility model also provides a kind of lead frame, including multiple leadframes units, each lead frame list
Member includes a packaging area and multiple pins for protruding from the packaging area, adjacent two of each leadframes unit
Pin is connected by barrier rib, and the barrier rib of the pin of each leadframes unit and adjacent leadframes unit is each other
Separation.
Further, the pin of two adjacent leadframes units is arranged in interdigitated, so that two adjacent lead frames
The pin portions of frame unit are overlapping.
Further, the distance of the barrier rib of each leadframes unit to the packaging area is more than one times of material
Thickness is expected, to allow outer barrier block to insert between the barrier rib and the packaging area.
Further, the distance of barrier rib of the pin of each leadframes unit to adjacent leadframes unit is small
In one times of material thickness.
The utility model also provides a kind of encapsulation unit, including an encapsulation main body and multiple protrudes from the encapsulation main body
Pin, it is characterised in that remove the vestige of excessive glue on the exposed face of the encapsulation main body between pin both sides and pin without external force.
Further, the pin both sides have tangent plane, and top surface is without tangent plane.
Further, the lower edge of the tangent plane to the distance of the encapsulation main body is more than one times of material thickness.
The utility model has the advantage of by the barrier rib of the pin of each packaging body and adjacent packaging body each other
Separation, reduces the space of pin occupancy, improves packaging density, using the teaching of the invention it is possible to provide a kind of highdensity array of packages.With tradition
The lead frame of 73mm width can only accommodate 18Row packaging bodies, and the lead frame of the utility model 78mm width can be accommodated
27Row packaging bodies, lead frame utilization rate improves 40%, substantially increases packaging density.In addition, the utility model increase resistance
The distance of blend stop and packaging body, in plastic packaging, the stopper of mould can be inserted between barrier rib and packaging body, fundamentally avoid
Overlap is produced.
Brief description of the drawings
Fig. 1 is the structural representation of existing array of packages；
Fig. 2 is the structural representation of the utility model high-density packages array；
Fig. 3 is the structural representation of the utility model lead frame；
Fig. 4 is the structural representation of the utility model encapsulation unit.
Embodiment
The specific reality of the high-density packages body, lead frame and the encapsulation unit that provide below in conjunction with the accompanying drawings the utility model
The mode of applying elaborates.
Shown in Figure 2, the utility model high-density packages array includes multiple packaging bodies, in present embodiment
In, for clear explanation the utility model technical characteristic, two packaging bodies are schematically drawn, and be named as the first packaging body 20
With the second packaging body 21, first packaging body 20 is disposed adjacent with the second packaging body 21.
First packaging body 20 includes an encapsulation part 201 and multiple pins 202 for protruding from the encapsulation part 201.
In present embodiment, two pins 202 are schematically included.Two pins 202 are connected by barrier rib 203.
Preferably, in this embodiment, the barrier rib 203 connects the side of two pins 202 respectively, to reduce pin
202 and barrier rib 203 shared by space.
Second packaging body 21 includes an encapsulation part 211 and multiple pins 212 for protruding from the encapsulation part 211.
In present embodiment, a pin 212 is schematically drawn.The pin 212 is connected by barrier rib 213, in this tool
In body embodiment, two barrier ribs 213 are schematically drawn.Preferably, in this embodiment, the barrier rib
213 connect the side of pin 212 respectively, to reduce pin 212 and the space shared by barrier rib 213.
The pin of each packaging body is separated each other with the barrier rib of adjacent packaging body.I.e. described first packaging body 20
Pin 202 separated each other with the barrier rib 213 of second packaging body 21, the pin 212 of second packaging body 21 and institute
The barrier rib 203 for stating the first packaging body 20 is separated each other, i.e., pin 202 and second packaging body of described first packaging body 20
21 barrier rib 213 is not connected to, and the barrier rib 203 of the pin 212 of second packaging body 21 and first packaging body 20 is not
Connection.It the advantage is that, only need to stay one to meet punching press or etching frame between the barrier rib of pin and adjacent packaging body
The minimum clearance of frame requirement, minimum clearance ＜ 0.2mm, and this thinner gap of framework is just smaller, reduces shared by pin
Space, improve the packaging density of array of packages.And in the prior art, referring to Fig. 1, the pin 12 of each packaging body 10
It is connected to each other with the barrier rib 13 of adjacent packaging body 10, needs to separate pin 12 with barrier rib 13 during shaping, due to separation
The reason for thickness and tolerance of blade, more than the pin length ＞ 0.2mm that the design length of pin 12 should be than POD are added
The space that pin 12 takes, it is impossible to realize high-density array.
Preferably, the distance of barrier rib of the pin of each packaging body to adjacent packaging body is less than one times of material thickness
Degree.The distance of the barrier rib 213 of the packaging body of pin 202 to the second 21 of i.e. described first packaging body 20 is less than one times of material thickness
Degree, the distance of the barrier rib 203 of the packaging body of pin 212 to the first 20 of second packaging body 21 is less than one times of material thickness.
One times of material thickness described here refers to drawing for the thickness for the lead frame that the packaging body is used, i.e. each packaging body
Pin is relevant with the material thickness of lead frame to the size of the distance of the barrier rib of adjacent packaging body, for example, the packaging body
The thickness of the lead frame of use is 0.152mm, then the pin of each packaging body to adjacent packaging body barrier rib
Distance is less than 0.152mm, the thickness for the lead frame that the packaging body is used is 0.200mm, then each packaging body draws
The distance of pin to the barrier rib of adjacent packaging body is less than 0.200mm.
Preferably, the pin of two adjacent packaging bodies is arranged in interdigitated, so that the pin of two adjacent packaging bodies
Partly overlap.The pin 202 of i.e. described first packaging body 20 is arranged with the pin 212 of second packaging body 21 in interdigitated,
Pin 202 partly overlaps with pin 212, further to reduce the space shared by the pin, improves packaging density.
Preferably, the barrier rib of each packaging body to the distance of the encapsulation part is more than one times of material thickness,
To allow outer barrier block to insert between the barrier rib and the encapsulation part.The barrier rib 203 of i.e. described first packaging body 20
Distance to the encapsulation part 201 is more than one times of material thickness, the barrier rib 213 of second packaging body 21 to the encapsulation part
211 distance is more than one times of material thickness.One times of material thickness with it is defined above consistent.It the advantage is that, by packaging body
Spacing between barrier rib is increased above one times of material thickness, for example, more than 0.2mm, then in plastic package process, can be
Stopper is inserted between packaging body and barrier rib（The stopper belongs to outer mold design）, stopper is because belong to mould sheet
Body is designed, and it can be close to packaging body, so in plastic packaging, due to the presence of stopper, encapsulation body side surface is not in overlap
Situation, can fundamentally deflashing black glue.
The utility model high-density packages array is by the barrier rib of the pin of each packaging body and adjacent packaging body
Separate each other, reduce the space of pin occupancy, improve packaging density, using the teaching of the invention it is possible to provide a kind of highdensity array of packages.
Shown in Figure 3, the utility model also provides a kind of lead frame, and the lead frame is used as the height
The package substrate of density array of packages.The lead frame includes multiple leadframes units.In this embodiment, it is
Clear explanation the utility model technical characteristic, schematically draws two leadframes units, and be named as the first lead frame
The leadframes unit 31 of frame unit 30 and second, first leadframes unit 30 is adjacent with the second leadframes unit 31 to be set
Put.
First leadframes unit 30 includes a packaging area 301 and multiple protrudes from the packaging area 301
Pin 302, two pins 302 are connected by barrier rib 303.Preferably, in this embodiment, the barrier rib
303 connect the side of two pins 302 respectively, to reduce pin 302 and the space shared by barrier rib 303.
Second leadframes unit 31 includes a packaging area 311 and multiple protrudes from the packaging area 311
Pin 312.The pin 312 is connected by barrier rib 313, in this embodiment, schematically draws two stops
Bar 313.Preferably, in this embodiment, the barrier rib 313 connects the side of pin 312 respectively, to reduce pin
312 and barrier rib 313 shared by space.
In figure 3, the border of packaging area 301 and packaging area 311 is shown using dotted line.In the envelope
Chip, which is provided with, in dress region pastes area（Do not indicated in accompanying drawing）, setting those skilled in the art inside the packaging area can
Obtain, no longer describe herein from the prior art.
The pin of each leadframes unit is separated each other with the barrier rib of adjacent leadframes unit；Adjacent
The pin of two leadframes units is arranged in interdigitated, so that the pin portions of two adjacent leadframes units are overlapping；
The distance of the barrier rib of each leadframes unit to the packaging area is more than one times of material thickness, outer to allow
Portion's stopper is inserted between the barrier rib and the packaging area；The pin of each leadframes unit to adjacent is drawn
The distance of the barrier rib of wire frame unit is less than one times of material thickness.Specifically describe and can be found in high-density packages array above and retouch
State.
Referring to Fig. 4, the utility model also provides a kind of encapsulation unit, is formed by the cutting of above-specified high density array of packages.Institute
Stating encapsulation unit includes an encapsulation main body 401 and multiple pins 402 for protruding from the encapsulation main body 401, in this specific implementation
In mode, two pins 402 are schematically shown.Encapsulation main body 401 between the both sides of pin 402 and pin 402 it is outer
The vestige of excessive glue is removed on showing up without external force.
In the prior art, after plastic packaging, deburring can be gone using the method for laser ablation overlap, this method can be in encapsulation
Body edges have very low amount overlap, and tangent plane is neat, have the vestige burnt, pin side is without excessive glue；Or using tradition
WaterJet or punch punching presses go the method for deburring to go deburring, this method can have irregularly at encapsulation main body edge
Overlap is remained, and there is excessive glue residual different in size pin side.And the utility model in packaging body and can hinder in plastic package process
Stopper is inserted between blend stop, is not in the situation of overlap in encapsulation main body side, can fundamentally deflashing black glue, and
The vestige of excessive glue is removed on the exposed face of encapsulation main body 401 between the both sides of pin 402 and pin 402 without external force.
Alternatively, the both sides of pin 402 have tangent plane 403, and top surface is without tangent plane.This is due to barrier rib and pin 402
Side is connected, and the top surface of pin 402 is not connected with adjacent barrier rib, then cut down in encapsulation unit from array of packages
Afterwards, the cutting vestige of barrier rib is left in pin side, and top surface does not cut vestige.Alternatively, the lower edge of the tangent plane 403
Distance to the encapsulation main body 401 is more than one times of material thickness.
The utility model also provides a kind of method for packing, and the method for packing comprises the following steps：
（1）A lead frame is provided, the structure of the lead frame can be found in shown in Fig. 3.
（2）One stopper is arranged between barrier rib and packaging area, i.e., by a stopper be arranged on barrier rib 303 with
Between packaging area 301 and between barrier rib 313 and packaging area 311.The stopper belongs to outer mold design, in the step
In rapid, after lead frame is placed on mould, stopper can be inserted directly between barrier rib and packaging area.Due to stopper
Belong to mould to design in itself, it can be close to packaging area edge, so in plastic packaging, due to the presence of stopper, after plastic packaging
Encapsulation body side surface is not in the situation of overlap, can fundamentally deflashing black glue.
（3）Before or after the resistance stopper is set, the fixed chip on the lead frame, and by chip with drawing
The pin electrical connection of wire frame, the step is known steps.
（4）Plastic packaging, forms packaging body, the step is known steps, shown in Figure 2.After the completion of the step, the resistance
Block is fitted in the encapsulation body side surface, and encapsulation body side surface is not in the situation of overlap.
（5）The pin is cut, the pin is separated with the barrier rib, and by the stopper and the packaging body
Separation, forms encapsulation unit, shown in Figure 4.
Described above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art
Art personnel, on the premise of the utility model principle is not departed from, can also make some improvements and modifications, these improvements and modifications
Also it should be regarded as protection domain of the present utility model.
Claims (11)
1. a kind of high-density packages array, it is characterised in that including multiple packaging bodies, each packaging body includes an encapsulation part
And multiple pins for protruding from the encapsulation part, two adjacent pins of each packaging body are connected by barrier rib, each
The pin of the packaging body is separated each other with the barrier rib of adjacent packaging body.
2. high-density packages array according to claim 1, it is characterised in that the pin of two adjacent packaging bodies is in fork
Finger-like is arranged, so that the pin portions of two adjacent packaging bodies are overlapping.
3. high-density packages array according to claim 1, it is characterised in that the barrier rib of each packaging body
Distance to the encapsulation part is more than one times of material thickness, to allow outer barrier block to insert the barrier rib and the encapsulation part
Between.
4. high-density packages array according to claim 1, it is characterised in that the pin of each packaging body is to adjacent
The distance of barrier rib of packaging body be less than one times of material thickness.
5. a kind of lead frame, it is characterised in that including multiple leadframes units, each leadframes unit includes one
Packaging area and multiple pins for protruding from the packaging area, two adjacent pins of each leadframes unit pass through
Barrier rib is connected, and the pin of each leadframes unit is separated each other with the barrier rib of adjacent leadframes unit.
6. lead frame according to claim 5, it is characterised in that the pin of two adjacent leadframes units is in fork
Finger-like is arranged, so that the pin portions of two adjacent leadframes units are overlapping.
7. lead frame according to claim 5, it is characterised in that the barrier rib of each leadframes unit
Distance to the packaging area is more than one times of material thickness, to allow outer barrier block to insert the barrier rib and the encapsulation
Between region.
8. lead frame according to claim 5, it is characterised in that the pin of each leadframes unit is to adjacent
The distance of barrier rib of leadframes unit be less than one times of material thickness.
9. a kind of encapsulation unit, including an encapsulation main body and multiple pins for protruding from the encapsulation main body, it is characterised in that
The vestige of excessive glue is removed on the exposed face of encapsulation main body between pin both sides and pin without external force.
10. encapsulation unit according to claim 9, it is characterised in that the pin both sides have a tangent plane, top surface is without cutting
Face.
11. encapsulation unit according to claim 10, it is characterised in that the lower edge of the tangent plane to the encapsulation main body
Distance be more than one times of material thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621455874.7U CN206388699U (en) | 2016-12-28 | 2016-12-28 | High-density packages body, lead frame and encapsulation unit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621455874.7U CN206388699U (en) | 2016-12-28 | 2016-12-28 | High-density packages body, lead frame and encapsulation unit |
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| CN206388699U true CN206388699U (en) | 2017-08-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684064A (en) * | 2016-12-28 | 2017-05-17 | 上海凯虹科技电子有限公司 | High-density packaging body, lead wire framework, packaging unit and packaging method |
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2016
- 2016-12-28 CN CN201621455874.7U patent/CN206388699U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106684064A (en) * | 2016-12-28 | 2017-05-17 | 上海凯虹科技电子有限公司 | High-density packaging body, lead wire framework, packaging unit and packaging method |
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