CN203456445U - Low-power diode package chip - Google Patents
Low-power diode package chip Download PDFInfo
- Publication number
- CN203456445U CN203456445U CN201320559286.8U CN201320559286U CN203456445U CN 203456445 U CN203456445 U CN 203456445U CN 201320559286 U CN201320559286 U CN 201320559286U CN 203456445 U CN203456445 U CN 203456445U
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- Prior art keywords
- rectangular shaped
- shaped rim
- low
- power diode
- package
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Abstract
The utility model discloses a low-power diode package chip. The package chip comprises at least two groups of package frames which are horizontally arranged and connected. The package frame includes a rectangular frame, and horizontal support strips and vertical support strips which uniformly divide the rectangular frame into a plurality of cells. At least one pair of upper pins and lower pins are uniformly arranged in the cell in the horizontal direction. The tail end of the upper pin and the tail end of the lower pin are symmetrically projected and having a gap therebetween. Positioning holes are disposed on the horizontal sides of the rectangular frame. The support strips are provided with glue inlets. According to the low-power diode package chip, the package of the diodes is compact, the length of the pins is shortened, and the number of rectangular frame is reduced, so that the material is fully used, and the cost is lowered; besides, a dicing saw is used, which is simple in technology, thereby saving manpower cost, and greatly improving the working efficiency.
Description
Technical field
The utility model relates to diode, relates in particular to a kind of low-power diode case chip.
Background technology
Along with the development of electronic technology, diode, as one of the most frequently used electronic component, is widely used in rectification circuit, detecting circuit, voltage stabilizing circuit and various modulation circuit.As low-power diode, packing forms is SOD-523, and most important in its encapsulation process is exactly low-power diode case chip, and the arrangement architecture of support and density directly affect package quality and the production cost of diode.
As shown in Figure 1, existing low-power diode case chip, the pin up and down 11,12 that in rectangular shaped rim 1, tail end protrudes is used in pairs, each junior unit Product jointing is between each upper and lower pin 11,12, this rectangular shaped rim 1 adopts the structure of two row's multiple rows, every four classify a unit as, and the distance of upper and lower pin and rectangular shaped rim 1 joint face is 46mm, and the spacing of two pairs of upper and lower pin arrangements is 9.2mm.Existing support rectangular shaped rim is many, and after diode package, waste material is more, causes material resource waste, and in rectangular shaped rim, the spacing of each junior unit product is too large, can not adopt scribing machine separated, can only, with the division of cutting die slices, cause operating efficiency to reduce.
Therefore, how to design a kind ofly can reduce waste of material, the simple low-power diode case chip of packaging technology is industry technical problem urgently to be resolved hurrily.
Utility model content
The utility model, in order to solve above-mentioned technical problem, proposes a kind of compact conformation, the simple low-power diode case chip of packaging technology.
The technical solution adopted in the utility model is, design a kind of low-power diode case chip, comprise: the package support of the transversely arranged connection of at least two groups, described package support comprises: horizontal evenly distributed at least one pair of upper pin and lower pin longitudinally arranging in rectangular shaped rim, the cross-brace bar that is a plurality of cells by described rectangular shaped rim even partition and longitudinal bracing bar, described cell, described upper pin and lower pin tail end be symmetrical to be protruded and is provided with gap, described rectangular shaped rim horizontal edge is provided with location hole, and described support bar is provided with glue feeding opening.
In an embodiment of the present utility model, four jiaos of described rectangular shaped rim are provided with chamfering, and the rectangular shaped rim chamfering of adjacent arrangement forms V-notch.
Compared with prior art, it is tightr that the utility model is arranged the encapsulation of diode, shortened the length of pin, reduced the setting of rectangular shaped rim, make full use of material and reduce costs, adding man-hour, adopting scribing machine to divide, technique is simple, saves labour turnover, and has greatly improved operating efficiency.
Accompanying drawing explanation
Below in conjunction with embodiment and accompanying drawing, the utility model is elaborated, wherein:
Fig. 1 is the structural representation of prior art;
Fig. 2 is structural representation of the present utility model;
Fig. 3 is the side view of a pair of upper pin of the present utility model and lower pin.
Embodiment
As shown in Figure 2, the low-power diode case chip that the utility model one embodiment proposes, comprise: the package support of the transversely arranged connection of at least two groups, package support comprises: rectangular shaped rim 1, the cross-brace bar that is a plurality of cells by described rectangular shaped rim even partition 13 and longitudinal bracing bar 14, horizontal evenly distributed at least one pair of upper pin 11 and lower pin 12 longitudinally arranging in cell, upper pin 11 and lower pin 12 tail ends are symmetrical to be protruded and is provided with gap, diode package is on upper pin 11 and lower pin 12, rectangular shaped rim 1 horizontal edge is provided with location hole 15, 1 four jiaos of rectangular shaped rim are provided with chamfering, the rectangular shaped rim chamfering of adjacent arrangement forms V-notch, support bar 13 is provided with glue feeding opening 131.In the present embodiment, support bar 2 is 12 cells by rectangle frame even partition, horizontal evenly distributed four pairs of upper pins 11 and lower pin 12 in cell, be provided with two groups of transversely arranged connections of package support, in practical application, can change transversely arranged package support quantity and the size of cell according to the size of the size of production lot and diode package, also can will roll and form cylinder by the transversely arranged low-power diode case chip that forms of N package support, add man-hour, case chip is pulled out from cylinder, and processing cuts off cylinder by case chip after processing.
As shown in Figure 3, upper pin 11 is bent into relative zigzag with lower pin 12, upper pin 11 is provided with the first flanging 111 and the first crimp 112 that forms Z-shaped two vertical edges, the thickness of the first flanging 111 is that 1.27mm, length are that 2.5mm, width are 4.5mm, and the thickness of the first crimp 112 is that 1.27mm, width are 3mm; Lower pin 12 is provided with formation the second flanging 121 of Z-shaped two vertical edges and the thickness of the second crimp 122, the second flangings 121 is that 1.27mm, length are that 4mm, width are 4.5mm, and the thickness of the second crimp 122 is that 1.27mm, width are 3mm; Wherein, the first flanging 111 and the second flanging 121 are in same plane, the first crimp 112 and the second crimp 122 and rectangular shaped rim 1 are in same plane, width is that the opposite face of the first flanging 111 and the second flanging 121 is provided with gap, the relative gap of the first flanging 111 and the second flanging 121 is 0.8mm, the first crimp 112 and the second crimp 122 are 20mm with the joint face distance of cell, the width that is cell is 20mm, the upper pin 11 of four couples of arranging in cell and the spacing of lower pin 12 are 13mm, and the length of cell is 57mm.It is tightr that the utility model is arranged the encapsulation of diode, shortened the length of pin, reduced the setting of rectangular shaped rim, make full use of material and reduce costs, adding man-hour, adopting scribing machine to divide, technique is simple, saves labour turnover, and has greatly improved operating efficiency.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (2)
1. a low-power diode case chip, it is characterized in that comprising: the package support of the transversely arranged connection of at least two groups, described package support comprises: rectangular shaped rim (1), the cross-brace bar (13) that is a plurality of cells by described rectangular shaped rim even partition and longitudinal bracing bar (14), horizontal evenly distributed at least one pair of upper pin (11) and lower pin (12) longitudinally arranging in described cell, described upper pin (11) and lower pin (12) tail end be symmetrical to be protruded and is provided with gap, described rectangular shaped rim (1) horizontal edge is provided with location hole (15), described support bar (13) is provided with glue feeding opening (131).
2. low-power diode case chip as claimed in claim 1, is characterized in that, (1) four jiao of described rectangular shaped rim is provided with chamfering, and the rectangular shaped rim chamfering of adjacent arrangement forms V-notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320559286.8U CN203456445U (en) | 2013-09-10 | 2013-09-10 | Low-power diode package chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320559286.8U CN203456445U (en) | 2013-09-10 | 2013-09-10 | Low-power diode package chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203456445U true CN203456445U (en) | 2014-02-26 |
Family
ID=50136302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320559286.8U Expired - Lifetime CN203456445U (en) | 2013-09-10 | 2013-09-10 | Low-power diode package chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203456445U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766857A (en) * | 2015-03-25 | 2015-07-08 | 安徽中威光电材料有限公司 | LED high-density support structure |
-
2013
- 2013-09-10 CN CN201320559286.8U patent/CN203456445U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766857A (en) * | 2015-03-25 | 2015-07-08 | 安徽中威光电材料有限公司 | LED high-density support structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SICHUAN FUMEIDA MICRO-ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SHENZHEN FUMEIDA HARDWARE CO., LTD. Effective date: 20150825 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150825 Address after: 629200 Hedong Road, Shehong Economic Development Zone, Sichuan, Suining, China, No. 88 Patentee after: SICHUAN FUMEIDA MICROELECTRONIC CO.,LTD. Address before: 518000 Shenzhen Province, Baoan District manhole street, the streets of the Democratic Industrial Park, No. 2 Patentee before: SHENZHEN FUMEIDA HARDWARE Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20140226 |
|
| CX01 | Expiry of patent term |