CN206685374U - A kind of high density frameworks of DFN3030 8 - Google Patents
A kind of high density frameworks of DFN3030 8 Download PDFInfo
- Publication number
- CN206685374U CN206685374U CN201720510244.3U CN201720510244U CN206685374U CN 206685374 U CN206685374 U CN 206685374U CN 201720510244 U CN201720510244 U CN 201720510244U CN 206685374 U CN206685374 U CN 206685374U
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- installation portion
- framework
- chip installation
- chip
- dfn3030
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- 238000009434 installation Methods 0.000 claims abstract description 92
- 238000005520 cutting process Methods 0.000 claims abstract description 66
- 230000007797 corrosion Effects 0.000 claims abstract description 40
- 238000005260 corrosion Methods 0.000 claims abstract description 40
- 241000276425 Xiphophorus maculatus Species 0.000 claims abstract description 4
- 210000003205 muscle Anatomy 0.000 claims description 47
- 238000000926 separation method Methods 0.000 claims description 12
- 238000005728 strengthening Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000012856 packing Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
It the utility model is related to a kind of semiconductor fabrication, more particularly to a kind of high density frameworks of DFN3030 8, rectangular frame including platy structure, multiple chip installation portions being adapted with the encapsulating structures of DFN3030 8 are set on framework, the chip installation portion is rectangle, and the long side of all chip installation portions and the long side of framework are arranged in parallel；On framework 8 pin grooves are correspondingly provided with each chip installation portion, the pin groove 4 is one group of symmetrical both sides for being arranged in chip installation portion and extends to chip installation portion edge, adjacent chip installation portion is symmetrical arranged, connect the pin groove of adjacent chips installation portion, the pin bottom land of connection is provided with half corrosion region in the groove of half corrosion.The framework connects the pin groove of adjacent chips installation portion, and sets half corrosion region, reduces Cutting Drag, and reasonable Arrangement pin groove location, the framework had not only been realized high-density arrangement chip but also have good cutting performance.
Description
Technical field
A kind of semiconductor fabrication is the utility model is related to, particularly a kind of DFN3030-8 high density framework.
Background technology
Semiconductor refers to material of the electric conductivity between conductor and insulator under normal temperature, its radio, television set with
And had a wide range of applications on thermometric, if diode is exactly the device using semiconductor fabrication.No matter sent out from science and technology or economy
From the perspective of exhibition, the importance of semiconductor is all very huge.
In the manufacturing process of semiconductor, typically semiconductor is integrated on lead frame, allows lead frame as collection
Into the chip carrier of circuit, electric loop is formed, serves the function served as bridge connected with outer lead.
More chip installation portions are arranged on framework, are always the generally pursuit of industry, but in face of chip package shape
Formula is DFN3030-8 chip installation portion, and its pin number is more, and the size of one single chip installation portion is big, the encapsulation to chip
Design with cutting technique and frame structure proposes higher requirement, to reach the arrangement demand of superchip.
But the Cutting Road between the chip installation portion arranged in available frame is incited somebody to action to not damage product when ensureing cutting
Being sized to for Cutting Road is bigger than normal, and be not easy to align when cutting, difficulty it is higher, be unfavorable for forming highdensity chip layout knot
Structure.
Utility model content
Goal of the invention of the present utility model is：For the Frame Design of existing DFN3030-8 packing forms, because of the encapsulation
The limitation of pin number and the Cutting Road design of form, can not realize and highdensity chip installation portion is arranged on framework
Problem, there is provided a kind of DFN3030-8 high density framework, the framework connect the pin groove of adjacent chips installation portion, and set half
Corrosion region, reduce Cutting Drag, and reasonable Arrangement pin groove location, the framework had not only been realized high-density arrangement chip but also have
Good cutting performance.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of DFN3030-8 high density framework, include the rectangular frame of platy structure, set on framework it is multiple with
The adaptable chip installation portion of DFN3030-8 encapsulating structures, the chip installation portion are rectangle, and the length of all chip installation portions
The long side of side and framework is arranged in parallel；8 pin grooves, the pin groove 4 are correspondingly provided with each chip installation portion on framework
It is individual to be one group of symmetrical both sides for being arranged in chip installation portion and extend to chip installation portion edge, adjacent chip installation portion pair
Claim to set, connect the pin groove of adjacent chips installation portion, the pin bottom land of connection is provided with half corrosion region in the groove of half corrosion.
8 pin grooves are divided into 4 one group of both sides for being symmetricly set on chip installation portion by the framework, save chip installation portion
Other both sides dimensional space, reach the purposes of more arrangement chip installation portions；In addition, adjacent chip installation portion is symmetrically set
Put, connect the pin groove of adjacent chips installation portion, and half corrosion region is set in the pin bottom land of connection, reduce Cutting Drag,
Reduce cutting difficulty, reduce cutting blade caloric value and framework caused by thermal stress, avoid the metal of adjacent product pin
Layering is produced between plastic packaging material, ensures product quality, the framework had not only been realized high-density arrangement chip but also had been cut with good
Cut performance.
As preferred scheme of the present utility model, half corrosion region is ellipsoidal structure in the groove, and is pacified with adjacent chips
Line is symmetrical arranged centered on Cutting Road center between dress portion.Half corrosion structure in the groove of ellipsoidal structure, make half corrosion in groove
Framework close to chip installation portion position is corroded less, while cutting operation is easy to, beneficial to the knot of chip installation portion in area
Structure is stable.
As preferred scheme of the present utility model, the side of pin groove is not set as vertical dowel in chip installation portion, institute
It is half corrosion structure to state vertical dowel, and hollow slots are arranged with the vertical centerline both sides of vertical dowel.It is arranged on perpendicular
To the hollow slots of dowel both sides, facility is provided for the follow-up positioning separation cutting of chip installation portion.
As preferred scheme of the present utility model, a circle side is provided between the frame of framework and the region of arrangement chip
Frame Cutting Road, including horizontal frame Cutting Road and vertical frame Cutting Road, the vertical frame Cutting Road are vertically set
Rectangular through slot, multiple I-shapeds are interval with rectangular through slot and connect muscle, for strengthening the structure of vertical frame Cutting Road.Vertical edges
The rectangular through slot of frame Cutting Road is easy to the cutting of frame and the region for disposing chip to separate, and the I-shaped set in rectangular through slot
Even muscle, in turn ensure that the bonding strength of frame.
As preferred scheme of the present utility model, multiple I-shapeds connect gap between muscle respectively with chip installation portion it
Between lateral connection muscle be correspondingly arranged.The operation for being easy to chip installation portion transverse cuts to position and cut.
As preferred scheme of the present utility model, the horizontal frame Cutting Road includes the spaced corrosion region of rectangle half
And rectangular through-hole, middle part is provided with rectangular through-hole and connects muscle, middle through-hole is provided with the corrosion region of rectangle half, the middle part leads to
Hole is vertically arranged and vertical dowel between chip installation portion is correspondingly arranged, and the middle part connects muscle and laterally set.
The corrosion region of rectangle half and middle through-hole are set on horizontal frame Cutting Road, and side is set between the corrosion region of rectangle half
Frame vertically cuts locating slot, and the vertical cutting locating slot between chip installation portion is corresponding, is easy to chip vertically to cut positioning,
Improve vertical cutting accuracy and cutting efficiency.
As preferred scheme of the present utility model, pin groove is additionally provided between pin groove and connects muscle, pin groove connect muscle and
It is vertical connect muscle junction and be provided with cross and connect muscle be attached.Pin groove connects the stability that muscle strengthens pin groove, and cross
Even the separation of chip installation portion and accurate cutting are easy in the setting of muscle, decrease the setting number that chip installation portion surrounding connects muscle
Amount, reduce chip warping phenomenon and produce.
As preferred scheme of the present utility model, the framework is provided with unit separation trough, and the unit separation trough is set
Portion in the frame, framework is divided into 2 chip mount units.Framework is increased operation rate in itself, reduces cost, will be traditional
More than 4 chip mount units of every framework are optimized for the design of 2 every, can have more on identical area on every framework
More chip mount units, improve stock utilization, reduce the cost of framework.
As preferred scheme of the present utility model, the lengths of frame is 250 ± 0.1mm, and width is 70 ± 0.05mm,
18 rows, 36 row chip installation portions are arranged with each chip mount unit.Framework has 2 chip mount units, each chip
Installation unit sets 18 rows, 36 row chip installation portions, i.e., 1296 chip installation portions is arranged on whole framework, relative to existing envelope
Dress form is that DFN3030-8 chip package portion improves arrangement quantity, is reached in the highdensity chip installation portion of frame arrangement
Purpose.
In summary, by adopting the above-described technical solution, the beneficial effects of the utility model are：
1st, the framework connects the pin groove of adjacent chips installation portion, and sets half corrosion region, reduces Cutting Drag, and close
Removing the work puts pin groove location, the framework had not only been realized high-density arrangement chip but also has good cutting performance；
2nd, half corrosion structure in the groove of ellipsoidal structure, half corrosion region in groove is made to the framework close to chip installation portion position
Corrosion is less, while cutting operation is easy to, beneficial to the Stability Analysis of Structures of chip installation portion；It is arranged on vertical dowel both sides
Hollow slots, facility is provided for the follow-up positioning separation cutting of chip installation portion；
3rd, the rectangular through slot of vertical frame Cutting Road is easy to frame and disposes the cutting separation in the region of chip, and in rectangle
The I-shaped set in groove connects muscle, in turn ensure that the bonding strength of frame；Rectangle half is set to corrode on horizontal frame Cutting Road
Area and middle through-hole, and set frame between the corrosion region of rectangle half and vertically cut locating slot, and it is perpendicular between chip installation portion
It is corresponding to cutting locating slot, it is easy to chip vertically to cut positioning, improves vertical cutting accuracy and cutting efficiency；
4th, framework has 2 chip mount units, and each chip mount unit sets 18 rows, 36 row chip installation portions, that is, existed
1296 chip installation portions are arranged on whole framework, are improved relative to the chip package portion that existing packing forms are DFN3030-8
Quantity is arranged, reaches the purpose in the highdensity chip installation portion of frame arrangement.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model DFN3030-8 high density frameworks.
Fig. 2 is the structural representation of one of chip mount unit in Fig. 1.
Fig. 3 is A portions enlarged diagram in Fig. 2.
The structural representation of one single chip installation portion in Fig. 4 Fig. 3.
Marked in figure：1- frameworks, 101- chip mount units, 2- unit separation troughs, 3- chip installation portions, 301- chips peace
Put area, 302- pin grooves, half corrosion region in 303- grooves, the vertical frame Cutting Roads of 4-, 401- I-shapeds connect muscle, the cutting of 5- transverse directions frame
Road, 501- rectangular through-holes connect muscle in the middle part of 5011-, the corrosion region of 502- rectangles half, 5021- middle through-holes, 6- lateral connection muscle,
601- pin grooves connect muscle, and 602- cross connects muscle, and the vertical dowels of 7-, the left hollow slots of 701-, the right hollow slots of 702-, 8-, which is fixed, to be connected
Muscle.
Embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.
Embodiment 1
As shown in Figures 1 to 4, the DFN3030-8 high density frameworks of the present embodiment, the rectangular frame 1 of platy structure is included,
Multiple chip installation portions 3 being adapted with DFN3030-8 encapsulating structures are set on framework 1, the chip installation portion 3 is rectangle,
And the long side of all chip installation portions 3 and the long side of framework 1 are arranged in parallel；It is corresponding with each chip installation portion 3 on framework 1 to set
There are 8 pin grooves 302, the pin groove 4 is one group of symmetrical both sides for being arranged in chip installation portion 3 and extends to chip peace
The edge of dress portion 3, adjacent chip installation portion 3 are symmetrical arranged, and connect the pin groove 302 of adjacent chips installation portion, connection is drawn
The bottom of pin groove 302 is provided with half corrosion region 303 in the groove of half corrosion.
In the present embodiment, as shown in Figure 3 and Figure 4, half corrosion region 303 is ellipsoidal structure in the groove, and with adjacent core
Line is symmetrical arranged centered on Cutting Road center between piece installation portion 3.Half corrosion structure in the groove of ellipsoidal structure, make half in groove
Corrosion region corrodes less, while cutting operation is easy to, beneficial to chip installation portion to the framework close to chip installation portion position
Stability Analysis of Structures.
Further, it is described as shown in figure 3, not setting the side of pin groove 302 in chip installation portion 3 as vertical dowel 7
Vertical dowel 7 is half corrosion structure, is arranged with hollow slots in the vertical centerline both sides of vertical dowel 7, that is, is respectively
Left hollow slots 701 and right hollow slots 702.The hollow slots of vertical dowel both sides are arranged on, are the follow-up positioning of chip installation portion
Separation cutting provides facility.
In the present embodiment, as shown in Figures 2 and 3, a circle is provided between the frame of framework 1 and the region of arrangement chip
Frame Cutting Road, including horizontal frame Cutting Road 5 and vertical frame Cutting Road 4, the vertical frame Cutting Road 4 is vertically to set
The rectangular through slot put, multiple I-shapeds are interval with rectangular through slot and connect muscle 401, for strengthening the knot of vertical frame Cutting Road 4
Structure.The rectangular through slot of vertical frame Cutting Road is easy to the cutting of frame and the region for disposing chip to separate, and in rectangular through slot
The I-shaped of setting connects muscle, in turn ensure that the bonding strength of frame.
Further, multiple I-shapeds connect gap between muscle 401 lateral connection between chip installation portion 3 respectively
Muscle 6 is correspondingly arranged.The operation for being easy to chip installation portion transverse cuts to position and cut.
Further, the horizontal frame Cutting Road 5 includes the spaced corrosion region 502 of rectangle half and rectangular through-hole
501, middle part is provided with rectangular through-hole 501 and connects muscle 5011, middle through-hole 5021, institute are provided with the corrosion region 502 of rectangle half
State that middle through-hole 5021 is vertically arranged and vertical dowel 7 between chip installation portion 3 is correspondingly arranged, the middle part connects muscle
5011 are laterally set.As shown in Figure 3, two rectangular through-holes 501 are arranged at intervals for one group with the corrosion region 502 of rectangle half.
The corrosion region of rectangle half and middle through-hole are set on horizontal frame Cutting Road, and side is set between the corrosion region of rectangle half
Frame vertically cuts locating slot, and the vertical cutting locating slot between chip installation portion is corresponding, is easy to chip vertically to cut positioning,
Improve vertical cutting accuracy and cutting efficiency.
Further, pin groove is additionally provided between pin groove 302 and connects muscle 601, connected muscle 601 in pin groove and vertically connect
The junction of muscle 7, which is provided with cross and connects muscle 602, to be attached, and pin groove connects muscle 601 and cross connects muscle 602 and forms lateral connection
Muscle 6, lateral connection muscle 6 interlock, chip installation portion 3 are surrounded anyhow with vertical dowel 7.Pin groove connects muscle and strengthens pin groove
Stability, and the separation of chip installation portion and accurate cutting are easy in the setting that cross connects muscle, decrease chip installation portion four
Week connects the setting quantity of muscle, reduces chip warping phenomenon and produces.
In summary, the framework of the present embodiment connects the pin groove of adjacent chips installation portion, and sets half corrosion region, subtracts
Small Cutting Drag, and reasonable Arrangement pin groove location, the framework had not only been realized high-density arrangement chip but also there is good cutting
Performance.
Embodiment 2
As shown in Figures 1 to 4, the DFN3030-8 high density framework according to embodiment 1, set on the framework 1 of the present embodiment
There is unit separation trough 2, the unit separation trough 2 is arranged on the middle part of framework 1, framework 1 is divided into 2 chip mount units 101.
Framework is increased operation rate in itself, reduces cost, and traditional more than 4 chip mount units of every framework are optimized for into 2 every
Design, can have more chip mount units on every framework on identical area, improve stock utilization, reduce framework
Cost.
Further, the length of framework 1 is 250 ± 0.1mm, and width is 70 ± 0.05mm, is installed in each chip single
18 rows, 36 row chip installation portions 3 are arranged with member 101.Framework has 2 chip mount units, and each chip mount unit is set
18 rows, 36 row chip installation portions are put, i.e., 1296 chip installation portions are arranged on whole framework, are relative to existing packing forms
DFN3030-8 chip package portion improves arrangement quantity, reaches the purpose in the highdensity chip installation portion of frame arrangement.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. a kind of DFN3030-8 high density framework, it is characterised in that the rectangular frame including platy structure, set on framework more
The individual chip installation portion being adapted with DFN3030-8 encapsulating structures, the chip installation portion are rectangle, and all chip installation portions
Long side and framework long side be arranged in parallel；On framework 8 pin grooves, the pin are correspondingly provided with each chip installation portion
Groove 4 is one group of symmetrical both sides for being arranged in chip installation portion and extends to chip installation portion edge, adjacent chip installation portion
It is symmetrical arranged, connects the pin groove of adjacent chips installation portion, the pin bottom land of connection is provided with half corrosion region in the groove of half corrosion.
2. DFN3030-8 high density framework according to claim 1, it is characterised in that half corrosion region is ellipse in the groove
Circular configuration, and line is symmetrical arranged centered on the Cutting Road center between adjacent chips installation portion.
3. DFN3030-8 high density framework according to claim 2, it is characterised in that do not set pin in chip installation portion
The side of groove is vertical dowel, and the vertical dowel is half corrosion structure, in the vertical centerline both sides of vertical dowel
It is arranged with hollow slots.
4. DFN3030-8 high density framework according to claim 1, it is characterised in that in the frame and arrangement core of framework
A circle frame Cutting Road, including horizontal frame Cutting Road and vertical frame Cutting Road are provided between the region of piece, it is described vertical
Frame Cutting Road is the rectangular through slot vertically set, and multiple I-shapeds are interval with rectangular through slot and connect muscle, for strengthening erecting
To the structure of frame Cutting Road.
5. DFN3030-8 high density framework according to claim 4, it is characterised in that multiple I-shapeds connect between muscle
Lateral connection muscle of the gap respectively between chip installation portion be correspondingly arranged.
6. DFN3030-8 high density framework according to claim 5, it is characterised in that the horizontal frame Cutting Road bag
The spaced corrosion region of rectangle half and rectangular through-hole are included, middle part is provided with rectangular through-hole and connects muscle, in the corrosion region of rectangle half
Interior to be provided with middle through-hole, the middle through-hole is vertically arranged and vertical dowel between chip installation portion is correspondingly arranged, institute
State middle part and connect muscle laterally setting.
7. DFN3030-8 high density framework according to claim 3, it is characterised in that be additionally provided with and draw between pin groove
Pin groove connects muscle, pin groove connect muscle and it is vertical connect muscle junction and be provided with cross and connect muscle be attached.
8. the DFN3030-8 high density frameworks according to one of claim 1-7, it is characterised in that the chip installation portion
Multiple fixed even muscle are provided with including chip placing area and pin groove, between adjacent chip installation portion to be connected.
9. DFN3030-8 high density framework according to claim 1, it is characterised in that the framework is provided with unit point
Separate slot, the unit separation trough are arranged on frame mid portion, and framework is divided into 2 chip mount units.
10. DFN3030-8 high density framework according to claim 9, it is characterised in that the lengths of frame be 250 ±
0.1mm, width are 70 ± 0.05mm, and 18 rows, 36 row chip installation portions are arranged with each chip mount unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720510244.3U CN206685374U (en) | 2017-05-10 | 2017-05-10 | A kind of high density frameworks of DFN3030 8 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720510244.3U CN206685374U (en) | 2017-05-10 | 2017-05-10 | A kind of high density frameworks of DFN3030 8 |
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| Publication Number | Publication Date |
|---|---|
| CN206685374U true CN206685374U (en) | 2017-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720510244.3U Active CN206685374U (en) | 2017-05-10 | 2017-05-10 | A kind of high density frameworks of DFN3030 8 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346454A (en) * | 2018-11-08 | 2019-02-15 | 嘉盛半导体(苏州)有限公司 | Leadframe strip, method for packaging semiconductor, semiconductor package and its unit |
-
2017
- 2017-05-10 CN CN201720510244.3U patent/CN206685374U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346454A (en) * | 2018-11-08 | 2019-02-15 | 嘉盛半导体(苏州)有限公司 | Leadframe strip, method for packaging semiconductor, semiconductor package and its unit |
| CN109346454B (en) * | 2018-11-08 | 2023-12-15 | 嘉盛半导体(苏州)有限公司 | Lead frame strip, semiconductor packaging method, semiconductor packaging structure and unit thereof |
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