CN206834172U - A kind of SOT26 high density framework - Google Patents
A kind of SOT26 high density framework Download PDFInfo
- Publication number
- CN206834172U CN206834172U CN201720739565.0U CN201720739565U CN206834172U CN 206834172 U CN206834172 U CN 206834172U CN 201720739565 U CN201720739565 U CN 201720739565U CN 206834172 U CN206834172 U CN 206834172U
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- chip
- framework
- installation portion
- sot26
- high density
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Abstract
It the utility model is related to technical field of manufacturing semiconductors, more particularly to a kind of SOT26 high density framework, framework including rectangular sheet structure, multiple chip installation portions being adapted with SOT26 encapsulating structures are provided with framework, multiple row chip unit is arranged on framework, multiple rows of chip installation portion is set in each column chip unit, often row sets 3 chip installation portions, 2 chip placing areas are provided with each chip installation portion, are additionally provided with pin weld zone, the pin weld zone is that pressure-sizing compacting forms.The framework forms pin weld zone pressure-sizing compacting, bonding wire efficiency and bonding wire quality are improved, traditional 2 chip installation portions of single arrangement are adjusted to 3, and 2 chip placing areas are set in one single chip installation portion, chip layout amount is improved, stock utilization is improved, saves production cost.
Description
Technical field
A kind of semiconductor fabrication is the utility model is related to, particularly a kind of SOT26 high density framework.
Background technology
Semiconductor refers to material of the electric conductivity between conductor and insulator under normal temperature, is that existing electronic product is conventional
A kind of device, the characteristics of during due to the dimensional characteristic of single semiconductor product and its use, half is aided in frequently with lead frame
The production of conductor chip.
The major function of lead frame is that the carrier of mechanical support is provided for chip, as connecting chip inside and outside conducting medium
Circuit and form pathway for electrical signals, and heat caused by chip operation is together outwards distributed with package casing, it is logical to form radiating
Road, it is a kind of electrical connection that chip internal circuits exit and outer lead are realized by means of bonding gold wire, is formed and electrically returned
The key structure part on road, it is required for using lead frame in most semiconductor integrated blocks, is weight in electronics and information industry
The basic material wanted.
Chip package form is SOT26 chip installation portion, and the size after the encapsulation of its one single chip installation portion is：2.9*
1.6mm, pin be 6, the size of one single chip installation portion is larger, in face of the problem of be how the knot of design chips installation portion
Configuration formula, so that more chip installation portions can be arranged on the framework matrix of identical size, to reach more preferable stock utilization
It is cost-effective.
Utility model content
Goal of the invention of the present utility model is：For packing forms be SOT26 chip installation portion, how design chips
The structure type of installation portion, to arrange the technical problem of more products on the framework of identical size, there is provided a kind of SOT26 is high
Density framework, the framework form pin weld zone pressure-sizing compacting, improve bonding wire efficiency and bonding wire quality, will be traditional single
2 chip installation portions of arrangement are adjusted to 3, and 2 chip placing areas are set in one single chip installation portion, improve chip layout
Amount, improve stock utilization, save production cost.
To achieve these goals, the technical solution adopted in the utility model is：
A kind of SOT26 high density framework, include the framework of rectangular sheet structure, multiple and SOT26 is provided with framework and is sealed
The adaptable chip installation portion of assembling structure, multiple row chip unit is arranged on framework, multiple rows of core is set in each column chip unit
Piece installation portion, 3 chip installation portions of often row's setting, each chip installation portion is interior to be provided with 2 chip placing areas, is additionally provided with pin weldering
Area is met, the pin weld zone is that pressure-sizing compacting forms.
The pin weld zone formed using pressure-sizing compacting, is made its region area bigger, surface more smooth, weldering can be greatly improved
Line efficiency and bonding wire quality, improve qualification rate and the reliability of product；And by traditional each column chip unit 2 cores of single arrangement
Piece installation portion is designed as arranging 3 chip installation portions, packaging efficiency lifting 30%, and saves the use of plastics and correlative, drops
Low production cost, at the same it is more energy efficient；
And traditional each chip installation portion lining is designed 1 chip placing area and is designed as placing 2 cores by the framework
Piece settlement, can be greatly improved can encapsulating products species, realize the encapsulation of more high-end complex devices.
As preferred scheme of the present utility model, in each chip unit, connect between the adjacent chips installation portion with row
There is support space bar, the chip installation portion of both sides is provided with installation portion reinforcement, and is connected with framework.It is same in same column chip unit
Support space bar is set between the adjacent chips installation portion of row, i.e., by supporting space bar respectively to connect the chip installation portion of both sides
Pick up and, be adapted to the demand that 3 chip installation portions are put with arrangement, ensure stability.
As preferred scheme of the present utility model, the pin weld zone is arranged between 2 chip placing areas, in chip
The side of settlement also is provided with pin weld zone, and the pin weld zone of side is arranged in the same side portion of chip installation portion.
Pin weld zone is arranged between chip placing area and the same side portion of chip installation portion, frame space is saved, is cloth
Put more chip installation portions and condition is provided.
As preferred scheme of the present utility model, 3 pin weld zones are provided between 2 chip placing areas.Will
The pin weld zone of half is arranged between 2 chip placing areas.
As preferred scheme of the present utility model, the pin weld zone is connected with pin extension muscle, and pin extension muscle prolongs
Chip installation portion is stretched out, the pin extension muscle in chip installation portion is provided with blocking solution groove, for stopping that external environment condition water rises
Into plastic-sealed body.
As preferred scheme of the present utility model, the blocking solution groove is V-groove.Pad and plastic-sealed body junction design blocking solution
Groove, it can effectively stop that external environment condition water rises and enter plastic-sealed body, strengthen the moisture sensitivity and adaptability of product, ensure product
Quality.
As preferred scheme of the present utility model, the size in each chip placing area is 0.97mmx0.9mm.
As preferred scheme of the present utility model, a length of 300 ± 0.01mm of the framework, a width of 93 ± 0.01mm,
24 row chip units are arranged on framework, each column chip unit is provided with 18 row's chip installation portions.
Most Frame Designs are width x length 180mm-50mm, 31mm-73mm in industry at present, and design efficiency is not high, and
Each unit places a chips, and product is limited big；Traditional frame size is increased, to be adapted to each column chip unit
Same arrangement put the topology requirements of 3 chip installation portions, understood after COMPREHENSIVE CALCULATING, the framework can arrange 1296 chips installations
Portion, 2592 chips can be arranged, substantially increase framework matrix material utilization rate, increase 20%-25% utilization rate, reduce into
This.
In summary, by adopting the above-described technical solution, the beneficial effects of the utility model are：
1st, the framework forms pin weld zone pressure-sizing compacting, bonding wire efficiency and bonding wire quality is improved, by traditional list
Arrangement puts 2 chip installation portions and is adjusted to 3, and 2 chip placing areas are set in one single chip installation portion, improves chip cloth
The amount of putting, improve stock utilization, save production cost；
2nd, it is spaced in same column chip unit with support space bar is set between the adjacent chips installation portion of row by supporting
Plate respectively connects the chip installation portion of both sides, is adapted to the demand that 3 chip installation portions are put with arrangement, ensures stable
Property；
3rd, pad and plastic-sealed body junction design blocking solution groove, can effectively stop that external environment condition water rises and enter plastic-sealed body, increase
The moisture sensitivity and adaptability of strong product, ensure product quality；
4th, the framework is increased traditional frame size, and 3 cores are put to be adapted to the same arrangement of each column chip unit
The topology requirement of piece installation portion, understand after COMPREHENSIVE CALCULATING, the framework can arrange 1296 chip installation portions, can arrange 2592
Chip, framework matrix material utilization rate is substantially increased, increases 20%-25% utilization rate, reduces cost.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model SOT26 high density frameworks.
Fig. 2 is the partial enlarged drawing in A portions in Fig. 1.
Fig. 3 is the structural representation of one single chip installation portion in Fig. 2.
Fig. 4 is the structural representation of blocking solution groove in Fig. 3.
Marked in figure：1- frameworks, 2- chip units, 21- chip installation portions, 211- chip placings area, the welding of 212- pins
Area, 22- installation portion reinforcements, 23- pins extension muscle, 231- blocking solution grooves, 24- support space bars, 3- unit slot segmentations, 4- positioning
Hole.
Embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.
Embodiment 1
As shown in Figures 1 to 4, the SOT26 high density frameworks of the present embodiment, the framework 1 of rectangular sheet structure is included, in frame
Frame 1 is provided with multiple chip installation portions 21 being adapted with SOT26 encapsulating structures, and multiple row chip unit is arranged on framework 1
2, multiple rows of chip installation portion 21 is set in each column chip unit 2, often row sets 3 chip installation portions 21, each chip installation portion
2 chip placing areas 211 are provided with 21, are additionally provided with pin weld zone 212, the pin weld zone 212 is that pressure-sizing compacting forms.
As shown in figure 1, unit slot segmentation 3 or positioning hole 4 are provided between multiple row chip unit 2, the unit segmentation
Groove 3 is parallel with the short side of framework 1 and arranged for interval.
The pin weld zone formed using pressure-sizing compacting, is made its region area bigger, surface more smooth, weldering can be greatly improved
Line efficiency and bonding wire quality, improve qualification rate and the reliability of product；And by traditional each column chip unit 2 cores of single arrangement
Piece installation portion is designed as arranging 3 chip installation portions, packaging efficiency lifting 30%, and saves the use of plastics and correlative, drops
Low production cost, at the same it is more energy efficient；
And traditional each chip installation portion lining is designed 1 chip placing area and is designed as placing 2 cores by the framework
Piece settlement, can be greatly improved can encapsulating products species, realize the encapsulation of more high-end complex devices.
Further, in each chip unit 2, support space bar is connected between the adjacent chips installation portion 21 with row
24, the chip installation portion 21 of both sides is provided with installation portion reinforcement 22, and is connected with framework 1.In same column chip unit with row's
Support space bar is set between adjacent chips installation portion, i.e., by supporting space bar respectively to connect the chip installation portion of both sides
Come, be adapted to the demand that 3 chip installation portions are put with arrangement, ensure stability.
Further, the pin weld zone 212 is arranged between 2 chip placing areas 211, in chip placing area 211
Side also be provided with pin weld zone 212, and the pin weld zone 212 of side is arranged in the same side of chip installation portion 21
Portion.Pin weld zone is arranged between chip placing area and the same side portion of chip installation portion, frame space is saved, is
Arrange that more chip installation portions provide condition.
Specifically, 3 pin weld zones 212 are provided between 2 chip placing areas 211 in the present embodiment.I.e. by one
Half pin weld zone is arranged between 2 chip placing areas.
Embodiment 2
As shown in Figures 1 to 4, the SOT26 high density frameworks according to embodiment 1, the pin weld zone 212 are connected with
Pin extends muscle 23, and pin extension muscle 23 extends chip installation portion 21, the pin extension muscle in chip installation portion 21
23 are provided with blocking solution groove 231, enter plastic-sealed body for stopping that external environment condition water rises.
Further, the blocking solution groove 231 is V-groove.Pad and plastic-sealed body junction design blocking solution groove, can effectively hinder
Gear external environment condition water, which rises, enters plastic-sealed body, strengthens the moisture sensitivity and adaptability of product, ensures product quality.
In the present embodiment, the size in each chip placing area 212 is 0.97mmx0.9mm.
Embodiment 3
As shown in figure 1, the SOT26 high density frameworks according to embodiment 1 or embodiment 2, the framework 1 it is a length of
300 ± 0.01mm, a width of 93 ± 0.01mm, are disposed with 24 row chip units 2 on framework 1, and each column chip unit 2 is provided with 18 rows
Chip installation portion 21.
Most Frame Designs are width x length 180mm-50mm, 31mm-73mm in industry at present, and design efficiency is not high, and
Each unit places a chips, and product is limited big；Traditional frame size is increased, to be adapted to each column chip unit
Same arrangement put the topology requirements of 3 chip installation portions, understood after COMPREHENSIVE CALCULATING, the framework can arrange 1296 chips installations
Portion, 2592 chips can be arranged, substantially increase framework matrix material utilization rate, increase 20%-25% utilization rate, reduce into
This.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (8)
1. a kind of SOT26 high density framework, including the framework of rectangular sheet structure, multiple and SOT26 is provided with framework and is encapsulated
The adaptable chip installation portion of structure, it is characterised in that multiple row chip unit is arranged on framework, is set in each column chip unit
Multiple rows of chip installation portion, 3 chip installation portions of often row's setting, each chip installation portion is interior to be provided with 2 chip placing areas, is additionally provided with
Pin weld zone, the pin weld zone are that pressure-sizing compacting forms.
2. SOT26 high density framework according to claim 1, it is characterised in that in each chip unit, with the phase of row
Support space bar is connected between adjacent chip installation portion, the chip installation portion of both sides is provided with installation portion reinforcement, and connects with framework
Connect.
3. SOT26 high density framework according to claim 1, it is characterised in that the pin weld zone is arranged on 2 cores
Between piece settlement, pin weld zone also is provided with the side in chip placing area, and the pin weld zone of side is arranged in chip
The same side portion of installation portion.
4. SOT26 high density framework according to claim 3, it is characterised in that be provided between 2 chip placing areas
3 pin weld zones.
5. SOT26 high density framework according to claim 3, it is characterised in that the pin weld zone is connected with pin and prolonged
Muscle is stretched, and pin extension muscle extends chip installation portion, the pin extension muscle in chip installation portion is provided with blocking solution groove, uses
Into plastic-sealed body in being stopped external environment condition water.
6. SOT26 high density framework according to claim 5, it is characterised in that the blocking solution groove is V-groove.
7. SOT26 high density framework according to claim 1, it is characterised in that each the size in chip placing area is
0.97mmx0.9mm。
8. the SOT26 high density frameworks according to one of claim 1-7, it is characterised in that a length of the 300 of the framework ±
0.01mm, a width of 93 ± 0.01mm, are arranged in 24 row chip units on framework, and each column chip unit is installed provided with 18 row's chips
Portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720739565.0U CN206834172U (en) | 2017-06-23 | 2017-06-23 | A kind of SOT26 high density framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720739565.0U CN206834172U (en) | 2017-06-23 | 2017-06-23 | A kind of SOT26 high density framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206834172U true CN206834172U (en) | 2018-01-02 |
Family
ID=60777908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720739565.0U Active CN206834172U (en) | 2017-06-23 | 2017-06-23 | A kind of SOT26 high density framework |
Country Status (1)
| Country | Link |
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| CN (1) | CN206834172U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807327A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of full closed insulated lead frame with free switching function |
| CN108807328A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type 220D8 lead frames convenient for plastic packaging demoulding |
-
2017
- 2017-06-23 CN CN201720739565.0U patent/CN206834172U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807327A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of full closed insulated lead frame with free switching function |
| CN108807328A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of overloading type 220D8 lead frames convenient for plastic packaging demoulding |
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