CN206432261U - A kind of plastic package lead frame of total incapsulation form - Google Patents
A kind of plastic package lead frame of total incapsulation form Download PDFInfo
- Publication number
- CN206432261U CN206432261U CN201720136793.9U CN201720136793U CN206432261U CN 206432261 U CN206432261 U CN 206432261U CN 201720136793 U CN201720136793 U CN 201720136793U CN 206432261 U CN206432261 U CN 206432261U
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- lead frame
- radiating
- scale
- inner groovy
- radiating scale
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Abstract
A kind of plastic package lead frame of total incapsulation form disclosed in the utility model, constituted by multiple lead frame units are single, it is connected with each other between each lead frame unit by dowel, lead frame unit includes fin and terminal pin, fin and terminal pin junction are bended, the top of the fin includes more than one piece of radiating scale, and each radiating scale is in " C " shape structure, and the opening of radiating scale is in the same direction, spacing is identical between two neighboring radiating scale, " V " shape inner groovy is provided with the head position of radiating scale at each, the length of the " V " shape inner groovy " V " shape inner groovy is identical with radiating Length of the scale, and the " V " shape inner groovy on each radiating scale is on same horizontal linear, positioning hole is provided with lead frame unit.The utility model can improve the isolation effect with the external world, realize good sealing.
Description
Technical field
The utility model is related to a kind of manufacturing technology field of semiconductor electronic component, particularly a kind of total incapsulation form
Plastic package lead frame.
Background technology
Lead frame, as the chip carrier of integrated circuit, is that one kind realizes that chip internal circuits draw by means of bonding gold wire
Go out end and the electrical connection of outer lead, form the key structure part of electric loop, it serves the bridge connected with outer lead
Effect, is required for using lead frame in most semiconductor integrated blocks, and lead frame is important in electronics and information industry
Basic material.But the plastic package lead frame radiating effect of current total incapsulation form is poor, and fin is structure as a whole, and leads
Overall production cost is caused to improve.
Utility model content
The purpose of this utility model is to provide a kind of good heat dissipation effect, reduction to solve above-mentioned the deficiencies in the prior art
A kind of plastic package lead frame of total incapsulation form of production cost.
To achieve these goals, the plastic package lead frame of a kind of total incapsulation form designed by the utility model, by many
It is connected with each other between the individual single composition of lead frame unit, each lead frame unit by dowel, lead frame unit includes fin
And terminal pin, fin and terminal pin junction bend, and the top of the fin includes more than one piece of radiating scale, and often
One radiating scale be in " C " shape structure, and radiating scale opening in the same direction, it is two neighboring radiating scale between spacing phase
Together, " V " shape inner groovy, the " V " shape inner groovy " V " shape inner groovy are provided with the head position of radiating scale at each
Length with radiating Length of the scale it is identical, and each radiating scale on " V " shape inner groovy on same horizontal linear,
Lead frame unit is provided with positioning hole.
In order to further improve radiating effect, the back of the radiating scale is evenly distributed with radiating projection.
Preferably, the thickness of the radiating scale and terminal pin is 0.6 ± 0.01mm.
In order to further improve radiating effect, thermal vias is provided with radiating scale, the back of the thermal vias is set
There is turnup structure.
A kind of plastic package lead frame for total incapsulation form that the utility model is obtained, this framework is total incapsulation form, radiating
Piece top includes polylith radiating scale, and the terminal pin of both sides is connected with the radiating scale on top by fin bottom, saved
The production cost of fin, and radiating scale is " C " structure and setting radiating bulge-structure is finally improved on radiating scale
Radiating effect, while setting " V " shape inner groovy in the end of radiating scale so that plastic package lead frame plastic packaging in plastic packaging
Material can be deep into " V " shape inner groovy, finally improved the isolation effect with the external world, realized good sealing.
Brief description of the drawings
Fig. 1 is that the present embodiment provides a kind of positive structure schematic of the plastic package lead frame of total incapsulation form；
Fig. 2 is that the present embodiment provides a kind of structure schematic diagram of the plastic package lead frame of total incapsulation form；
Fig. 3 is along the part sectioned view at A-A in Fig. 1.
In reference：1. lead frame unit；2. fin；3. terminal pin；2-1. radiating scales；2-2. radiatings are raised；
2-3. thermal vias；4. " V " shape inner groovy；5. positioning hole.
Embodiment
The utility model is further illustrated with reference to the accompanying drawings and examples.
Embodiment：
As shown in Figure 1-Figure 3, a kind of plastic package lead frame of total incapsulation form provided in the present embodiment, is drawn by multiple
It is connected with each other between the single composition of wire frame unit 1, each lead frame unit 1 by dowel, lead frame unit 1 includes fin 2
With terminal pin 3, fin 2 and the junction of terminal pin 3 are bended, and the top of its fin 2 includes more than one piece of radiating squama
Piece 2-1, and each radiating scale 2-1 is in " C " shape structure, and radiating scale 2-1 opening in the same direction, it is two neighboring to dissipate
Spacing is identical between hot scale 2-1, and " V " shape inner groovy 4, institute are provided with radiating scale 2-1 head position at each
The length for stating " V " shape inner groovy " V " shape inner groovy 4 is identical with radiating scale 2-1 length, and on each radiating scale 2-1
" V " shape inner groovy 4 is provided with positioning hole 5 on same horizontal linear in lead frame unit 1.Each dissipates in the present embodiment
Backing 2 is provided with 4 radiating scale 2-1.
In order to further improve radiating effect, the back of the radiating scale 2-1 is evenly distributed with radiating projection 2-2.
Preferably, the thickness of the radiating scale 2-1 and terminal pin 3 is 0.6 ± 0.01mm.
In order to further improve radiating effect, thermal vias 2-3, the thermal vias 2-3 are provided with radiating scale 2-1
Back be provided with turnup structure.
The plastic package lead frame uses total incapsulation form, and fin 2 top includes polylith and radiated scale 2-1, and both sides are drawn
Stitch 3 is connected by the bottom of fin 2 with the radiating scale 2-1 on top, has saved the production cost of fin 2, and radiating squama
Piece 2-1 is " C " structure and radiating projection 2-2 structure is set on radiating scale 2-1, finally improves radiating effect, together
When in radiating scale 2-1 end, " V " shape inner groovy 4 is set so that capsulation material can be deep in plastic packaging for the plastic package lead frame
Enter into " V " shape inner groovy 4, finally improve the isolation effect with the external world, realize good sealing.
Claims (4)
1. a kind of plastic package lead frame of total incapsulation form, is constituted, each lead frame unit by multiple lead frame units (1) are single
(1) it is connected with each other between by dowel, lead frame unit (1) includes fin (2) and terminal pin (3), fin (2) and draws
Stitch (3) junction is bended, it is characterized in that：The top of the fin (2) includes more than one piece of radiating scale (2-1), and
Each radiating scale (2-1) be in " C " shape structure, and radiating scale (2-1) opening in the same direction, two neighboring radiating squama
Spacing is identical between piece (2-1), and " V " shape inner groovy (4) is provided with the head position of radiating scale (2-1) at each,
The length of the " V " shape inner groovy " V " shape inner groovy (4) is identical with radiating scale (2-1) length, and each radiating scale
" V " shape inner groovy (4) on (2-1) is provided with positioning hole (5) on same horizontal linear in lead frame unit (1).
2. a kind of plastic package lead frame of total incapsulation form according to claim 1, it is characterized in that：The radiating scale
It is raised (2-2) that the back of (2-1) is evenly distributed with radiating.
3. a kind of plastic package lead frame of total incapsulation form according to claim 1, it is characterized in that：The radiating scale
The thickness of (2-1) and terminal pin (3) is 0.6 ± 0.01mm.
4. a kind of plastic package lead frame of total incapsulation form according to claim 1, it is characterized in that：In radiating scale (2-
1) thermal vias (2-3) is provided with, the back of the thermal vias (2-3) is provided with turnup structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720136793.9U CN206432261U (en) | 2017-02-15 | 2017-02-15 | A kind of plastic package lead frame of total incapsulation form |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720136793.9U CN206432261U (en) | 2017-02-15 | 2017-02-15 | A kind of plastic package lead frame of total incapsulation form |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206432261U true CN206432261U (en) | 2017-08-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720136793.9U Active CN206432261U (en) | 2017-02-15 | 2017-02-15 | A kind of plastic package lead frame of total incapsulation form |
Country Status (1)
| Country | Link |
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| CN (1) | CN206432261U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807327A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of full closed insulated lead frame with free switching function |
-
2017
- 2017-02-15 CN CN201720136793.9U patent/CN206432261U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807327A (en) * | 2018-05-02 | 2018-11-13 | 泰州友润电子科技股份有限公司 | A kind of full closed insulated lead frame with free switching function |
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