CN106098641B - A kind of integrated circuit package structure of heat dissipation - Google Patents

Abstract

The invention discloses a heat-dissipating integrated circuit package structure, in which a metal heat dissipation plate is fixed on an insulating carrier plate, a plurality of “back”-shaped heat dissipation frames are formed on the outer edge of the metal heat dissipation plate, and a metal heat dissipation plate is fixed in the middle of the metal heat dissipation plate. Rectangular bearing seat, the center of the bearing seat is formed with a rectangular placement hole, the integrated circuit chip is plugged and fixed in the placement hole of the bearing seat and leans against the metal heat dissipation plate; the metal heat dissipation plate is molded on the heat dissipation frame on the two opposite sides There are grooves, and extension plates are formed on the sides of the bearing seat. A set of extension plates opposite the bearing seat are plugged into the groove of the heat dissipation frame and formed with side plates. The side plates are fixed on the insulating carrier plate and against On the outer wall of the heat dissipation frame of the outer layer of the metal heat dissipation plate, another set of extension plates opposite to the bearing seat is plugged into the heat dissipation frame of the inner layer of the metal heat dissipation plate. The invention adopts the structure combining the metal heat dissipation plate with special shape and the package of the integrated circuit, so as to realize efficient heat dissipation during the operation of the integrated circuit.

Description

A heat dissipation integrated circuit packaging structure

Technical field:

The invention relates to the technical field of integrated circuits, and more specifically relates to a heat dissipation integrated circuit packaging structure.

Background technique:

The electronic industry continues to reduce the size of electronic components and increase the functions of electronic components, which makes the functions and complexity of integrated circuits continue to increase. This trend also drives the packaging technology of integrated circuit components to develop towards the direction of small size, high pin count and high electrical/thermal performance, and conforms to predetermined industrial standards. Since high-performance integrated circuit components generate higher heat, and the current small package technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on its small package structure to achieve efficient heat dissipation and prolong the use of integrated circuits life.

Invention content:

The purpose of the present invention is to address the deficiencies of the prior art and provide a heat dissipation integrated circuit packaging structure, which adds a heat dissipation structure to the integrated circuit packaging structure, thereby enabling efficient heat dissipation and indirectly prolonging the service life of the integrated circuit .

To achieve the above object, the technical scheme adopted in the present invention is as follows:

An integrated circuit packaging structure for heat dissipation, including an insulating carrier plate, a metal heat dissipation plate is fixed on the insulating carrier plate, several “back”-shaped heat dissipation frames are formed on the outer edge of the metal heat dissipation plate, and a metal heat dissipation plate is fixed in the middle of the metal heat dissipation plate. Rectangular bearing seat, the center of the bearing seat is formed with a rectangular placement hole, the integrated circuit chip is plugged and fixed in the placement hole of the bearing seat and leans against the metal heat dissipation plate; the metal heat dissipation plate is molded on the heat dissipation frame on the two opposite sides There are grooves, and extension plates are formed on the sides of the bearing seat. A set of extension plates opposite to the bearing seat are plugged into the groove of the heat dissipation frame and formed with side plates. The side plates are fixed on the insulating carrier and against the On the outer wall of the heat dissipation frame of the outer layer of the metal heat dissipation plate, another set of extension plates opposite to the bearing seat are plugged into the heat dissipation frame of the inner layer of the metal heat dissipation plate. A number of contacts are embedded and fixed on the bearing seats on both sides of the integrated circuit chip, and a number of pins are fixed on the side plates, and the pins are electrically connected to the contacts.

The bearing base is made of insulating material, and the pins and contacts on the bearing base are on the same two sides of the bearing base.

A plurality of contacts are molded on the upper end surface of the integrated circuit chip, and the contacts are electrically connected to the contacts on the bearing seat through wires.

The bottom surface of the extension plate on the side of the bearing seat is located in the same horizontal plane, and the bottom surface of the bearing seat is lower than the bottom surface of the extension plate.

A number of heat dissipation holes a are formed on the heat dissipation frame and the bearing seat on both sides of the metal heat dissipation plate.

The pins or contacts are linearly and evenly distributed on the bearing seat or the side plate.

The beneficial effect of the present invention is that: it adopts the combination structure of metal heat dissipation plate with special shape and integrated circuit package, realizes efficient heat dissipation during operation of integrated circuit, thereby prolonging the service life of integrated circuit.

Description of drawings:

Fig. 1 is the three-dimensional structural schematic diagram of the invention;

Fig. 2 is the structure schematic diagram of invention top view;

Fig. 3 is the structural schematic diagram of invention cross-section;

Fig. 4 is a structural schematic diagram of the inventive metal heat dissipation plate.

In the figure: 1. insulating carrier plate; 2. metal heat dissipation plate; 21. heat dissipation frame; 211. groove; 22. heat sink; 3. bearing seat; 31. placement hole; 32. extension plate; ; 4, contacts; 5, pins; 6, integrated circuit chip; 61, contacts; a, cooling holes.

Detailed ways:

Embodiment: As shown in Figures 1 to 4, a heat-dissipating integrated circuit packaging structure includes an insulating carrier 1, a metal heat dissipation plate 2 is fixed on the insulating carrier 1, and several " "back"-shaped heat dissipation frame 21, the middle of the metal heat dissipation plate 2 is fixed with a rectangular bearing seat 3, and the center of the bearing seat 3 is formed with a rectangular placement hole 31, and the integrated circuit chip 6 is plugged and fixed in the placement hole of the bearing seat 3 31 and against the metal cooling plate 2; grooves 211 are formed on the cooling frames 21 on opposite sides of the metal cooling plate 2, extension plates 32 are formed on the sides of the bearing seat 3, and the bearing base 3 is opposite to each other. A set of extension plates 32 are plugged into the groove 211 of the heat dissipation frame 21 and formed with side plates 33 , the side plates 33 are fixed on the insulating carrier plate 1 and lean against the outer wall of the heat dissipation frame 21 on the outer layer of the metal heat dissipation plate 2 On the top, another group of extension plates 32 opposite to the bearing seat 3 is plugged into the heat dissipation frame 21 of the inner layer of the metal heat dissipation plate 2, and a number of heat dissipation fins 22 are formed on the heat dissipation frame 21 of the inner layer of the metal heat dissipation plate 2; A number of contacts 4 are embedded and fixed on the bearing seats 3 on both sides of the chip 6 , and a number of pins 5 are fixed on the side plate 33 , and the pins 5 and the contacts 4 are electrically connected.

The bearing base 3 is made of insulating material, and the pins 5 and contacts 4 on the bearing base 3 are on the same two sides of the bearing base 3 .

Several contacts 61 are formed on the upper surface of the integrated circuit chip 6 , and the contacts 61 are electrically connected to the contacts 4 on the carrier 3 through wires.

The bottom surface of the extension plate 32 on the side of the bearing seat 3 is located in the same horizontal plane, and the bottom surface of the bearing seat 3 is lower than the bottom surface of the extension plate 32 .

A number of heat dissipation holes a are formed on the heat dissipation frame body 21 on both sides of the metal heat dissipation plate 2 and the bearing seat 3 .

The pins 5 or contacts 4 are linearly and evenly distributed on the bearing seat 3 or the side plate 33 respectively.

Working principle: the present invention is a packaging structure for integrated circuits, which adds a metal heat sink 2 to increase heat dissipation, and sets a multi-layer "back"-shaped heat dissipation frame 21 and heat sink 22 on the metal heat sink 2 to improve heat dissipation. Efficiency, at the same time, the heat dissipation hole a is opened, and the bearing seat 3 of its packaging structure does not block the heat dissipation channel of the heat dissipation frame 21 of the "back" shape structure, so as to realize air circulation and efficient heat dissipation.

Claims (6)

1. A heat-dissipating integrated circuit packaging structure, comprising an insulating carrier (1), is characterized in that: the insulating carrier (1) is fixed with a metal heat dissipation plate (2), and the outer edge of the metal heat dissipation plate (2) is formed with Several "back"-shaped heat dissipation frames (21), the middle of the metal heat dissipation plate (2) are fixed with a rectangular bearing seat (3), and the center of the bearing seat (3) is formed with a rectangular placement hole (31). The circuit chip (6) is plugged and fixed in the placement hole (31) of the bearing seat (3) and leans against the metal heat dissipation plate (2); Grooves (211) are formed, extension plates (32) are formed on the sides of the bearing seat (3), and a set of extension plates (32) opposite to the bearing seat (3) are plugged into the heat dissipation frame (21). The groove (211) is formed with a side plate (33), the side plate (33) is fixed on the insulating carrier plate (1) and leans against the outer wall of the heat dissipation frame (21) on the outer layer of the metal heat dissipation plate (2) , another group of extension plates (32) opposite to the bearing seat (3) are plugged into the heat dissipation frame (21) of the inner layer of the metal heat dissipation plate (2), and the heat dissipation frame (21) of the inner layer of the metal heat dissipation plate (2) ) are formed with a number of cooling fins (22); a number of contacts (4) are embedded and fixed on the bearing seats (3) on both sides of the integrated circuit chip (6), and a number of pins (5) are fixed on the side plate (33). The pin (5) is electrically connected with the contact point (4). 2. A heat-dissipating integrated circuit packaging structure according to claim 1, characterized in that: the carrier (3) is made of insulating material, and the pins (5) and contacts (4) on the carrier (3) are in the On the same two sides of bearing seat (3). 3. A heat-dissipating integrated circuit packaging structure according to claim 1, characterized in that: a plurality of contacts (61) are formed on the upper end surface of the integrated circuit chip (6), and the contacts (61) pass through wires It is electrically connected with the contact point (4) on the bearing seat (3). 4. A heat-dissipating integrated circuit packaging structure according to claim 1, characterized in that: the bottom surface of the extension plate (32) on the side of the carrying seat (3) is located in the same horizontal plane, and the bottom surface of the carrying seat (3) The bottom surface is lower than the bottom surface of the extension plate (32). 5. A heat-dissipating integrated circuit packaging structure according to claim 1, characterized in that: the heat-dissipating frame (21) and the bearing seat (3) on both sides of the metal heat-dissipating plate (2) are formed with several Cooling holes (a). 6. A heat-dissipating integrated circuit package structure according to claim 1, characterized in that: said pins (5) or contacts (4) are linearly and evenly distributed on the bearing seat (3) or side plate (33 )superior.