CN206432253U - Semiconductor devices - Google Patents
Semiconductor devices Download PDFInfo
- Publication number
- CN206432253U CN206432253U CN201621409931.8U CN201621409931U CN206432253U CN 206432253 U CN206432253 U CN 206432253U CN 201621409931 U CN201621409931 U CN 201621409931U CN 206432253 U CN206432253 U CN 206432253U
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- CN
- China
- Prior art keywords
- function pin
- pin
- lining
- semiconductor devices
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000009413 insulation Methods 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of semiconductor devices, including lining base, chip, insulation firming body and the first function pin, the chip is on lining base, lining base and the first function pin are fixedly connected by the insulation firming body between lining base and the first function pin, are connected between the first function pin and chip by the first conductor, the lining base includes bottom and convex portion, the convex portion is located at the side of bottom, and higher than bottom, the first function pin is concordant with the bottom for serving as a contrast base.The semiconductor devices that the utility model is provided, good heat dissipation effect.
Description
Technical field
The utility model is related to technical field of semiconductors, specifically, is related to a kind of semiconductor devices.
Background technology
Semiconductor refers to object of the electric conductivity between conductor and insulator under normal temperature, because its electric conductivity can be controlled
System, scope is from insulator between conductor, and it has a wide range of applications in electronic technology field, Source Music, television set, calculating
Core cell and semiconductor among machine, mobile phone have extremely close association.
Existing semiconductor packages is generally single surface pasting class component metal bottom conductive and heat-conductive cooling encapsulation and one side
Plug-in unit class component metal bottom conductive and heat-conductive cooling encapsulation.Single surface pasting class component metal bottom conductive and heat-conductive cooling encapsulation is main
By metal bottom surface heat conduction and heat radiation, and sheet metal is carried by chip conducted to pcb board heat, heat is led into the electronics to periphery
Element, so that the service behaviour and efficiency of whole product are had influence on, and the easy affected by heat of chip, reach the service behaviour of chip
Less than optimal.One side plug-in unit class component metal bottom conductive and heat-conductive cooling encapsulation only has a face heat conduction and heat radiation, it is necessary to by additional
Fin does radiating treatment, easily causes the short circuit with fin.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor devices, good heat dissipation effect.
The technical scheme that semiconductor devices disclosed in the utility model is used is：A kind of semiconductor devices, including lining base,
Chip, insulation firming body and the first function pin, the chip is on lining base, and the insulation firming body is located at lining base and the first work(
Between energy pin, base will be served as a contrast and the first function pin is fixedly connected, connected between the first function pin and chip by the first conductor,
The lining base includes bottom and convex portion, and the convex portion is located at the side of bottom, and higher than bottom, the first function pin and lining base
Bottom it is concordant.
Preferably, the first function pin located at lining basal part side, the long side of the first function pin with
The bottom of lining base is oppositely arranged, and is connected between the first function pin and chip by more than two first conductors.
Preferably, semiconductor devices also includes the second function pin, and the second function pin is set with the first function pin
In the same side of lining basal part, the first function pin and the second function pin are separated and are fixedly connected by insulation firming body, described
Connected between second function pin and chip by the second conductor.
Preferably, semiconductor devices also include the 3rd function pin and the 4th function pin, the 3rd function pin and
4th function pin is located at the difference of lining basal part with the first function pin and the second function pin respectively located at the same side of lining basal part
Side, is separated and is fixedly connected by insulation firming body between the 3rd function pin, the 4th function pin and lining basal part, and the described 3rd
Function pin is connected with chip by the 3rd conductor, and the 4th function pin is connected by the 4th conductor, and the convex portion includes first
Convex portion and the second convex portion.
Preferably, the first function pin, the second function pin, the 3rd function pin, the 4th function pin and lining substrate
The thickness in portion is identical, the first function pin, the second function pin, the 3rd function pin and the 4th function pin bottom surface with lining substrate
The bottom surface in portion is concordant.
Preferably, the lining base, the first function pin, the second function pin, the 3rd function pin, the 4th function pin, crystalline substance
Piece and insulation firming body composition cube.
Preferably, the convex portion is provided with several, and the first function pin is located therein between two convex portions.
Preferably, the insulation firming body solidify to form for epoxide resin material.
Preferably, the convex portion is provided with buckling surface.
The beneficial effect of semiconductor devices disclosed in the utility model is：The lining base includes bottom and convex portion, described convex
Portion is located at the side of bottom, and higher than bottom, the conduction of base section heat is come up, dissipated by air above by lining base convex portion
Hair, good heat dissipation effect, and avoid the heat for serving as a contrast basal part from assembling in chip.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment semiconductor device one；
Fig. 2 is Fig. 1 structure schematic diagram；
Fig. 3 is the part-structure schematic diagram of the utility model embodiment semiconductor device one；
Fig. 4 is the structural representation of the utility model embodiment semiconductor device two；
Fig. 5 is Fig. 4 structure schematic diagram.
Embodiment
The utility model is further elaborated and illustrated with reference to specific embodiment and Figure of description：
Embodiment one：It refer to Fig. 1-3, a kind of semiconductor devices, including lining base 10, insulation firming body 20, the first function
Pin 30, the second function pin 40 and chip 70.
The lining base 10 includes bottom 11 and convex portion 12, and the convex portion 12 is located at the side of bottom 11, and higher than bottom 11,
The convex portion 11 includes buckling surface.The first function pin 30, the second function pin 40 are identical with the thickness of bottom 11, and described first
The function pin 40 of function pin 30 and second is located at the same side of lining basal part 11,40 points of the first function pin 30 and the second function pin
Not just to lining basal part 11, and it is concordant with lining basal part 11, and the first function pin 30 is identical with the width of the second function pin 40,
The first function pin 30 and the second function pin 40 are also concordant in width, and the first function pin 30 is strip, and it is grown
Side is just to lining basal part 11.
The chip 70 passes through four first conductors 80 and the first work(located at the surface of bottom 11 of lining base 10, the chip 70
Energy pin 30 is connected, and the chip 70 is connected by the second conductor 90 with the second function pin 40.Then the first function pin 30 and lining base 10
During conducting, the electric current that passes through is big, and the insulation firming body 20 is made up of epoxide resin material, and the insulation firming body 20 is located at the
One function pin 30, the second function pin 40 and lining base 10 between, by the first function pin 30, the second function pin 40 and lining base 10 mutually every
From and it is fixed, the insulation firming body 20, the first function pin 30, the second function pin 40 and lining base 10 constitute cuboid.
The conduction of the partial heat of bottom 11 is come up in the convex portion 12 of the lining base 10, is distributed by air above, radiating effect
It is really good, and avoid serving as a contrast the bottom 11 of base 10 all or most heats are conducted to chip, the temperature of chip will be caused too high and
Influence its function.
Embodiment two：It refer to Fig. 4 and Fig. 5, a kind of semiconductor devices, including lining base 10, insulation firming body 20, the first work(
Can pin 30, the second function pin 40, the 3rd function pin 50, the 4th function pin 60 and chip.
The lining base 10 includes bottom 11, the first convex portion 12 and the second convex portion 13, the convex portion of the first convex portion 12 and second
13 are respectively arranged on the both sides of bottom 11, and the first function pin 30, the second function pin 40 are located at one end of bottom 11, the described 3rd
The function pin 60 of function pin 50 and the 4th is located at the other end of bottom 11.
The chip is connected with the first function pin 30 by the first conductor, led by second located at lining basal part 11 surface
Body is connected with the second function pin 40, is connected by the 3rd conductor with the 3rd function pin 50, passes through the 4th conductor and the 4th function pin
60 connections.
The heat conduction of bottom 11 is come up in the convex portion 13 of first convex portion 12 and second, is discharged into air, kept away
The bottom 11 for exempting to serve as a contrast base 10 conducts whole or most heats to chip, causes the temperature of chip too high and influences its work(
Energy.
Finally it should be noted that above example is only illustrating the technical solution of the utility model, rather than to this reality
With the limitation of novel protected scope, although being explained with reference to preferred embodiment to the utility model, this area it is general
Lead to it will be appreciated by the skilled person that can be modified to the technical solution of the utility model or equivalent substitution, without departing from this
The spirit and scope of utility model technical scheme.
Claims (9)
1. a kind of semiconductor devices, including lining base, chip, insulation firming body and the first function pin, the chip are located on lining base,
Lining base and the first function pin are fixedly connected, first work(by the insulation firming body between lining base and the first function pin
The connection of the first conductor can be passed through between pin and chip, it is characterised in that the lining base includes bottom and convex portion, and the convex portion is located at
The side of bottom, and higher than bottom, the first function pin is concordant with the bottom for serving as a contrast base.
2. semiconductor devices as claimed in claim 1, it is characterised in that the first function pin is located at the one of lining basal part
Side, the long side of the first function pin is oppositely arranged with serving as a contrast the bottom of base, and two are passed through between the first function pin and chip
The first conductor connection above.
3. semiconductor devices as claimed in claim 2, it is characterised in that also including the second function pin, the second function pin
With the first function pin located at the same side of lining basal part, the first function pin and the second function pin separated by insulation firming body and
It is fixedly connected, is connected between the second function pin and chip by the second conductor.
4. semiconductor devices as claimed in claim 3, it is characterised in that also including the 3rd function pin and the 4th function pin, institute
The 3rd function pin and the 4th function pin are stated located at the same side of lining basal part, is located at respectively with the first function pin and the second function pin
The not homonymy of basal part is served as a contrast, is separated between the 3rd function pin, the 4th function pin and lining basal part by insulation firming body and solid
Fixed connection, the 3rd function pin is connected with chip by the 3rd conductor, and the 4th function pin is connected by the 4th conductor, institute
Stating convex portion includes the first convex portion and the second convex portion.
5. semiconductor devices as claimed in claim 4, it is characterised in that the first function pin, the second function pin, the 3rd work(
Can pin, the 4th function pin it is identical with the thickness of lining basal part, the first function pin, the second function pin, the 3rd function pin and the
The bottom surface of four function pin is concordant with serving as a contrast the bottom surface of basal part.
6. semiconductor devices as claimed in claim 5, it is characterised in that the lining base, the first function pin, the second function pin,
3rd function pin, the 4th function pin, chip and insulation firming body composition cube.
7. semiconductor devices as claimed in claim 2, it is characterised in that the convex portion is provided with several, first function
Pin is located therein between two convex portions.
8. the semiconductor devices as described in claim any one of 1-7, it is characterised in that the insulation firming body is epoxy resin
Material solidification is formed.
9. the semiconductor devices as described in claim any one of 1-7, it is characterised in that the convex portion is provided with buckling surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621409931.8U CN206432253U (en) | 2016-12-21 | 2016-12-21 | Semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621409931.8U CN206432253U (en) | 2016-12-21 | 2016-12-21 | Semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206432253U true CN206432253U (en) | 2017-08-22 |
Family
ID=59587091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621409931.8U Active CN206432253U (en) | 2016-12-21 | 2016-12-21 | Semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206432253U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783753A (en) * | 2016-12-21 | 2017-05-31 | 伍昭云 | Semiconductor devices |
-
2016
- 2016-12-21 CN CN201621409931.8U patent/CN206432253U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783753A (en) * | 2016-12-21 | 2017-05-31 | 伍昭云 | Semiconductor devices |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |