CN209515655U - IDF type lead frame structure and IDF type lead frame assembly - Google Patents
IDF type lead frame structure and IDF type lead frame assembly Download PDFInfo
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- CN209515655U CN209515655U CN201920318914.0U CN201920318914U CN209515655U CN 209515655 U CN209515655 U CN 209515655U CN 201920318914 U CN201920318914 U CN 201920318914U CN 209515655 U CN209515655 U CN 209515655U
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Abstract
The utility model is suitable for technical field of semiconductor encapsulation, provide a kind of IDF type lead frame structure and IDF type lead frame assembly, IDF type lead frame structure includes upper installation unit group and lower installation unit group, upper installation unit group includes multiple upper installation units arranged side by side, lower installation unit group includes multiple lower installation units arranged side by side, the upper pin of each upper installation unit is inserted into the gap of the lower pin of lower installation unit, is equipped with location hole in upper heat sink and lower heat sink.The IDF type lead frame structure, general frame is designed to two rows, the upper pin of each upper installation unit is inserted into the gap of the lower pin of lower installation unit, and then IDF matrix structure is formed, and then the quantity of the installation unit of unit area can be increased, improve lead frame material utilization rate, production cost can be reduced, overall volume is smaller, can relative reduction electronic product volume, meet the small size demand of electronic product on the market.
Description
Technical field
The utility model belongs to technical field of semiconductor encapsulation, and in particular to arrives a kind of IDF type lead frame structure and IDF
Type lead frame assembly.
Background technique
Chip package is a kind of technology for being packaged the plastics of integrated circuit insulation or ceramic material, not only acts as peace
It puts, fix, sealing, protecting the effect of chip and increased thermal conductivity energy, but also being to link up the chip interior world and external circuit
Bridge.Transistor outline package, English are abbreviated as TO (Transistor Outline).TO-220 is current high-power crystal
Pipe, middle small scale integrated circuit etc. frequently with the direct insertion packing forms of one kind, can generally draw 3,5 or 7 and draw
Foot, the pin spacing of standard TO-220 encapsulation are 2.54mm.For opposite SOT, SOP encapsulation, due to its thermal diffusivity and high power
Characteristic has irreplaceable advantage, is widely used in high-power electronic product.For now, single TO-220 encapsulation
Relatively common, the manufacture difficulty and packaging technology difficulty of single row configuration are all very low, and Technical comparing is mature, but single row configuration
TO-220 encapsulates that its production cost is higher, and volume is larger, it is difficult to meet the needs of electronic product small now.
Utility model content
The purpose of the utility model is to overcome the TO-220 of above-mentioned single row configuration in the prior art to encapsulate its production cost
Higher, volume is larger, it is difficult to meet the deficiency of the needs of electronic product small now, provide a kind of IDF type lead
Frame structure.
The utility model is realized in this way: IDF type lead frame structure comprising upper installation unit group and lower installation
Unit group, the upper installation unit group include multiple upper installation units arranged side by side, and the lower installation unit group includes multiple
Lower installation unit arranged side by side, wherein the upper installation unit includes upper heat sink, the island Shang Ji and upper pin, under described
Installation unit includes lower heat sink, the island Xia Ji and lower pin, described in the upper pin insertion of each upper installation unit
In the gap of the lower pin of lower installation unit, location hole is equipped in the upper heat sink and the lower heat sink.
As a preferred embodiment of the utility model, between each upper pin and the adjacent lower pin between
Away from for 1.27mm.
As a preferred embodiment of the utility model, between each upper pin and the adjacent upper pin between
Away from for 2.54mm；Spacing between each lower pin and the adjacent lower pin is 2.54mm.
As a preferred embodiment of the utility model, the upper installation unit includes described in 3 or 5 or 7
Upper pin, corresponding, the lower installation unit includes 3 or 5 or 7 lower pins.
As a preferred embodiment of the utility model, multiple upper heat sinks are made of one piece, it is multiple it is described under
Heat sink is made of one piece.
The utility model additionally provides a kind of IDF type lead frame assembly comprising substrate and IDF as described above
Type lead frame structure, wherein the IDF type lead frame structure is set on the substrate.
As a preferred embodiment of the utility model, in the adjacent upper installation unit and the adjacent lower peace
Be arranged at intervals with injection molding channel between dress unit, each injection molding channel be perfused the upper installation unit of adjacent thereto two and
Two lower installation units.
As a preferred embodiment of the utility model, between the upper installation unit of each injection molding channel two sides
Spacing be 12.675mm；Spacing between the lower installation unit of each injection molding channel two sides is 13.945mm.
As a preferred embodiment of the utility model, each upper installation unit and the adjacent not set injection molding
Spacing between the upper installation unit of the side of runner is 12.675mm；Each lower installation unit is not set with adjacent
Setting the spacing between the upper installation unit of the side of the injection molding channel is 12.675mm.
As a preferred embodiment of the utility model, the length of the substrate is 240.8mm, and the width of the substrate is
47.142mm, the quantity of the upper installation unit are 20, and the quantity of the lower installation unit is 20.
A kind of IDF type lead frame structure (being directed to TO-220 packing forms) provided by the utility model, relative to
General frame is designed to two rows by the prior art, the IDF type lead frame structure, each upper installation unit it is described on
Pin is inserted into the gap of the lower pin of the lower installation unit, and then forms IDF matrix structure, and then can increase unit
The quantity of the installation unit of area improves lead frame material utilization rate, can reduce production cost, and overall volume is smaller, can phase
To the volume for reducing electronic product, meet the small size demand of electronic product on the market.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is this
Some embodiments of utility model, for those of ordinary skill in the art, without creative efforts, also
Other drawings may be obtained according to these drawings without any creative labor.
Following drawings are only intended to schematically illustrate and explain the present invention, does not limit the model of the utility model
It encloses.
Fig. 1 is the structural schematic diagram of IDF type lead frame structure provided by the embodiment of the utility model；
Fig. 2 is the structural schematic diagram of IDF type lead frame assembly provided by the embodiment of the utility model；
Part drawing reference numeral explanation:
100, IDF type lead frame structure；
100a, upper installation unit group；
110, upper installation unit；
111, upper heat sink；112, the island Shang Ji；113, upper pin；111a, location hole；
100b, lower installation unit group；
120, lower installation unit；
121, lower heat sink；122, the island Xia Ji；123, lower pin；
200, IDF type lead frame assembly；
210, substrate；220, injection molding channel.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
Embodiment
Referring to Fig. 1, present embodiments providing a kind of IDF type lead frame structure 100 (is directed to the encapsulation side TO-220
Formula) comprising upper installation unit group 100a and lower installation unit group 100b, upper installation unit group 100a include multiple setting side by side
The upper installation unit 110 set, lower installation unit group 100b include multiple lower installation units 120 arranged side by side, wherein upper installation
Unit 110 includes upper heat sink 111, the island Shang Ji 112 (can be used for chip)) and upper pin 113, lower installation unit 120
Including lower heat sink 121, the island Xia Ji 122 and lower pin 123, the lower installation of the insertion of upper pin 113 of each upper installation unit 110
In the gap of the lower pin 123 of unit 120, being equipped with location hole 111a in upper heat sink 111 and lower heat sink 121 (can be risen
To positioning action).
Among the above, it is to be understood that in the present embodiment, the structure phase of upper installation unit 110 and lower installation unit 120
Together, description merely for convenience herein is named it in the present embodiment respectively and is distinguish.
Among the above, specifically, the IDF type lead frame structure 100, is designed to two rows for general frame, each upper installation
The upper pin 113 of unit 110 is inserted into the gap of the lower pin 123 of lower installation unit 120, and then forms IDF matrix structure, into
And the quantity of the installation unit of unit area can be increased, lead frame material utilization rate is improved, production cost, whole body can be reduced
Product is smaller, can relative reduction electronic product volume, meet the small size demand of electronic product on the market.
Spacing as a preferred embodiment of the utility model, between each upper pin 113 and adjacent lower pin 123
A is 1.27mm.
Spacing as a preferred embodiment of the utility model, between each upper pin 113 and adjacent upper pin 113
B is 2.54mm；Each lower spacing B between pin 123 and adjacent lower pin 123 is 2.54mm.
Among the above, specifically, i.e. so that spacing B between upper pin 113 and adjacent upper pin 113 and it is each under draw
Size of the spacing B with the single lead frame of market between foot 123 and adjacent lower pin 123 is consistent, with convenient
The application of the IDF type lead frame structure 100.
As a preferred embodiment of the utility model, upper installation unit 110 includes 3 or 5 or 7 upper pins
113, corresponding, lower installation unit 120 includes 3 or 5 or 7 lower pins 123.
Among the above, specifically, as shown in Figure 1, the quantity of the above pin 113 of the present embodiment is 3 and lower pin 123
Quantity is 3 for example, in practice, the quantity of upper pin 113 and lower pin 123 be also possible to it is other, such as 5 or
7 etc., herein with no restrictions.
As a preferred embodiment of the utility model, multiple upper heat sinks 111 are made of one piece, multiple lower heat sinks
121 are made of one piece.
Among the above, as shown in Figure 1, specifically, multiple upper heat sinks 111 are made of one piece, multiple lower heat sinks 121 1
It is body formed to form, it can conveniently upper heat sink 111 and lower heat sink 121 manufacture, reduce production cost, radiate in raising
The total quality of plate 111 and lower heat sink 121.
The utility model embodiment additionally provides a kind of IDF type lead frame assembly 200 comprising substrate 210 and such as
Above-mentioned IDF type lead frame structure 100, wherein IDF type lead frame structure 100 is set on substrate 210.
Among the above, specifically, institute of the IDF type lead frame assembly 200 including IDF type lead frame structure 100 is active
Energy and effect, specifically refer to foregoing teachings, this will not be repeated here.
As a preferred embodiment of the utility model, in adjacent upper installation unit 110 and adjacent lower installation list
Injection molding channel 220 is arranged at intervals between member 120, the upper installation unit 110 of adjacent thereto two is perfused in each injection molding channel 220
And two lower installation units 120.
Among the above, specifically, each injection molding channel 220, which can be perfused under two upper installation units 110 and two, installs list
Member 120, compared with single lead frame structure, saves the quantity of injection molding channel 220, improving plastics utilization rate (can be improved
1/5th to one third).
As a preferred embodiment of the utility model, between the upper installation unit 110 of each 220 two sides of injection molding channel
Spacing C is 12.675mm；Spacing C between the lower installation unit 120 of each 220 two sides of injection molding channel is 13.945mm.
As a preferred embodiment of the utility model, each upper installation unit 110 and adjacent not set injection molding channel
Space D between the upper installation unit 110 of 220 side is 12.675mm；Each lower installation unit 120 with it is adjacent not set
Space D between the lower installation unit 120 of the side of injection molding channel 220 is 12.675mm.
Among the above, i.e., spacing C is 1.27mm bigger than space D, can be setting 220 reserved space of injection molding channel.
As a preferred embodiment of the utility model, the length of substrate 210 is 240.8mm, and the width of substrate 210 is
47.142mm, the quantity of upper installation unit 110 are 20, and the quantity of lower installation unit 120 is 20.
It among the above, can be 240.8mm in length and width is specifically, using IDF type lead frame structure 100
20 upper installation units 110 and 20 lower installation units 120, an equal amount of substrate are set on the substrate 210 of 47.142mm
210 settable more installation units.
In conclusion a kind of IDF type lead frame structure provided by the utility model, compared with the existing technology, the IDF type
General frame is designed to two rows by lead frame structure, and the upper pin of each upper installation unit is inserted into the lower peace
In the gap for filling the lower pin of unit, and then IDF matrix structure is formed, and then the installation unit of unit area can be increased
Quantity improves lead frame material utilization rate, can reduce production cost, overall volume is smaller, can relative reduction electronic product
Volume meets the small size demand of electronic product on the market.
Unless otherwise defined, the technical term or scientific term that the utility model uses are should be belonging to the utility model
The ordinary meaning that personage in field with general technical ability is understood." first ", " second " used in the utility model and
Similar word is not offered as any sequence, quantity or importance, and is used only to distinguish different component parts.Equally,
"one", the similar word such as " one " or "the" do not indicate that quantity limits yet, but indicates that there are at least one." comprising " or
The similar word such as "comprising" means that the element or object that occur before the word cover the element for appearing in the word presented hereinafter
Perhaps object and its equivalent and be not excluded for other elements or object.The similar word such as " connection " or " connected " not limits
It due to physics or mechanical connection, but may include electrical connection, it is either direct or indirect."upper",
"lower", "left", "right" etc. are only used for indicating relative positional relationship, and after the absolute position for being described object changes, then this is opposite
Positional relationship may also correspondingly change.
Level in the utility model, the geometry sites such as vertical, concentric, only restriction ideally, is examined
The multiple actual conditions for considering technology, machining accuracy and cost and technical effect, in this field, deviation 5% is all allowed,
It and is also the actual conditions that the present invention limits geometry site.
There is the following to need to illustrate simultaneously:
(1) unless otherwise defined, in the embodiments of the present invention and attached drawing, same label represents same meaning.
(2) in the utility model embodiment attached drawing, the structure being related to the utility model embodiment is related only to, other
Structure, which can refer to, to be commonly designed.
(3) for clarity, in the attached drawing for describing the embodiments of the present invention, the thickness quilt in layer or region
Amplification.It is appreciated that when the element of such as layer, film, region or substrate etc is referred to as being located at "above" or "below" another element,
The element " direct " can be located at "above" or "below" another element, or may exist intermediary element.
(4) in the absence of conflict, the feature in the same embodiment of the utility model and different embodiment can phase
Mutually combination.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modification, equivalent replacement or improvement etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (10)
1.IDF type lead frame structure, which is characterized in that including upper installation unit group and lower installation unit group, the upper peace
Filling unit group includes multiple upper installation units arranged side by side, and the lower installation unit group includes multiple lower installations arranged side by side
Unit, wherein the upper installation unit includes upper heat sink, the island Shang Ji and upper pin, and the lower installation unit includes lower dissipates
The upper pin of hot plate, the island Xia Ji and lower pin, each upper installation unit is inserted into the described of the lower installation unit
In the gap of lower pin, location hole is equipped in the upper heat sink and the lower heat sink.
2. IDF type lead frame structure as described in claim 1, which is characterized in that each upper pin and adjacent institute
Stating the spacing between lower pin is 1.27mm.
3. IDF type lead frame structure as described in claim 1, which is characterized in that each upper pin and adjacent institute
Stating the spacing between pin is 2.54mm；Spacing between each lower pin and the adjacent lower pin is
2.54mm。
4. IDF type lead frame structure as described in claim 1, which is characterized in that the upper installation unit include 3 or
The 5 or 7 upper pins, corresponding, the lower installation unit includes 3 or 5 or 7 lower pins.
5. IDF type lead frame structure as described in claim 1, which is characterized in that multiple upper heat sinks are integrally formed
It forms, multiple lower heat sinks are made of one piece.
6.IDF type lead frame assembly, which is characterized in that including substrate and IDF according to any one of claims 1 to 5
Type lead frame structure, wherein the IDF type lead frame structure is set on the substrate.
7. IDF type lead frame assembly as claimed in claim 6, which is characterized in that the adjacent upper installation unit with
And injection molding channel is arranged at intervals between the adjacent lower installation unit, two institutes adjacent thereto are perfused in each injection molding channel
State installation unit and two lower installation units.
8. IDF type lead frame assembly as claimed in claim 7, which is characterized in that the institute of each injection molding channel two sides
Stating the spacing between installation unit is 12.675mm；Between between the lower installation unit of each injection molding channel two sides
Away from for 13.945mm.
9. IDF type lead frame assembly as claimed in claim 8, which is characterized in that each upper installation unit with it is adjacent
The not set injection molding channel side the upper installation unit between spacing be 12.675mm；Each lower installation
Spacing between the upper installation unit of the side of unit and the adjacent not set injection molding channel is 12.675mm.
10. the IDF type lead frame assembly as described in any one of claim 6-9, which is characterized in that the length of the substrate
For 240.8mm, the width of the substrate is 47.142mm, and the quantity of the upper installation unit is 20, the lower installation unit
Quantity be 20.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920318914.0U CN209515655U (en) | 2019-03-11 | 2019-03-11 | IDF type lead frame structure and IDF type lead frame assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920318914.0U CN209515655U (en) | 2019-03-11 | 2019-03-11 | IDF type lead frame structure and IDF type lead frame assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209515655U true CN209515655U (en) | 2019-10-18 |
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ID=68187305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920318914.0U Active CN209515655U (en) | 2019-03-11 | 2019-03-11 | IDF type lead frame structure and IDF type lead frame assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209515655U (en) |
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2019
- 2019-03-11 CN CN201920318914.0U patent/CN209515655U/en active Active
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| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: 518000 The whole building on the first floor of the factory building of Xinhao Second Industrial Zone, Xintian Community, Fuhai Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Xinzhantong Electronics Co., Ltd. Address before: 518000 the whole building on the first floor of building B1 in Xinhao second industrial zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XINZHANTONG ELECTRONICS CO.,LTD. |