CN204792772U - U -shaped pin rectifier bridge packaging structure - Google Patents
U -shaped pin rectifier bridge packaging structure Download PDFInfo
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- CN204792772U CN204792772U CN201520515944.2U CN201520515944U CN204792772U CN 204792772 U CN204792772 U CN 204792772U CN 201520515944 U CN201520515944 U CN 201520515944U CN 204792772 U CN204792772 U CN 204792772U
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Abstract
The utility model discloses a U -shaped pin rectifier bridge packaging structure, including the plastic -sealed body, the plastic -sealed body includes plastic -sealed body and lower plastic -sealed body, and 2 pins are drawn forth to two relative sides of lower plastic -sealed body symmetry respectively, the pin is " U " shape structure, and the pin is including the pin of improving level, perpendicular pin and horizontal pin down, and in the pin part of improving level was inlayed and is located the plastic -sealed body, lower horizontal pin lay in the below of plastic -sealed body down. The utility model discloses become pin design " U " shape structure, under the circumstances of most of similar encapsulation on compatible market, have good radiating effect for the product of encapsulation has lower thermal resistance, and when improving the radiating effect, it is about 30% still to make the area that takies the PCB board reduce, and power density (Wmm2) the MBF than before of encapsulation improves probably 5%, more is fit for the miniaturized of circuit such as electricity -saving lamp, LED lamp, charger and uses.
Description
Technical field
The utility model relates to a kind of U-shaped pin rectifier bridge encapsulating structure, belongs to semiconductor microelectronic technology field.
Background technology
Along with the development in the fields such as mobile informatiom product, household electronic products and green illumination, for its supporting electronic product has used the Important Components such as rectifier bridge, diode, voltage-stabiliser tube in a large number, and " light, thin, little, close " of this kind of device products is had higher requirement; High-caliber microminiature plastic package structure, not only represents industry technology level, and to miniaturization, the higher power density of rear class product, high reliability, high security etc. require most important; The rectifier diode product that in current semiconductor components and devices, use amount is maximum, also develop towards integrated direction, the rectifier bridge packaging having installed four diodes with easy to install and use, power density is high, take that pcb board area is little, reliability high, be widely used in some high-end products.
The components and parts of this type of surface encapsulation being representative with surface mount rectifier bridge, on the basis moving towards miniaturization, owing to being subject to structural limitations, heat dissipation problem is but more and more difficult to solve, its power density is difficult to reach designing requirement, and under normal temperature condition natural heat dissipation environment, its dissipation power is maximum only has 1.2W.Therefore need a kind of U-shaped pin rectifier bridge encapsulating structure, solve contradiction that is miniaturized and power.
Utility model content
The utility model is in order to overcome the deficiency of following technology, and provide a kind of U-shaped pin rectifier bridge encapsulating structure, this structure can improve radiating effect and the power density of rectifier bridge, and considerably reduces the area of pcb board.
terminological interpretation:
1, SMT:SurfaceMountTechnology, surface mounting technology.
2, MBF encapsulation: be suitable for surface-pasted a kind of semiconductor components and devices packing forms, there is gull-shaped pin configuration.
the utility model overcomes the technical scheme that its technical problem adopts:
A kind of U-shaped pin rectifier bridge encapsulating structure, comprise plastic-sealed body, plastic-sealed body comprises plastic-sealed body and lower plastic-sealed body, and the side that lower plastic-sealed body two is relative is symmetrical respectively draws 2 pins; Described pin is " U " shape structure, and pin comprises horizontal pin, vertical pins and lower horizontal pin, and upper horizontal pin portions is embedded in plastic-sealed body, and lower horizontal pin is positioned at the below of lower plastic-sealed body.
Preferred according to the utility model, the bottom surface of described lower plastic-sealed body is provided with 4 grooves placing lower horizontal pin.
Preferred according to the utility model, described lower horizontal pin portions protrudes from outside groove, and leaves space between the upper surface of lower horizontal pin and the upper surface of groove.
Preferred according to the utility model, the length D of described plastic-sealed body is 4.5mm-5.0mm, width E is 3.6mm-4.1mm, thickness A is 1.2mm-1.6mm.
Preferred according to the utility model, the width e of described pin is 0.5mm-0.8mm, thickness c is 0.15mm-0.22mm, and the spacing d between two pins of same side is 2.3mm-2.7mm; The length a of vertical pins is 0.8mm-1.0mm, and the length b of lower horizontal pin is 0.7mm-0.95mm.
Preferred according to the utility model, described pin is the copper of electroplating surfaces with tin.
the beneficial effects of the utility model are:
1, pin is designed to " U " shape structure by the utility model, on compatible market when most of similar encapsulation, there is good radiating effect, the product encapsulated is made to have lower thermal resistance, while raising radiating effect, the area taking pcb board is also made to reduce about 30%, the power density (W/mm of encapsulation
2) MBF than before improves about 5%, is more suitable for the miniaturized application of the circuit such as electricity-saving lamp, LED, charger.
2, plastic-sealed body of the present utility model is square, can encapsulate 4 diode chip for backlight unit simultaneously, composition rectifier bridge, the larger sized chip of encapsulation can be allowed, maximumly reach 56mil, improve the tolerance of encapsulation further, make maximum chip package dimension close to the level of wafer-level package.
3, the utility model is in power device integra-tion application, can substitute 4 diode chip for backlight unit products composition bridge rectifiers, easy to install and use and cost-saving.
4, rectifier bridge very thin thickness of the present utility model, can meet the miniaturization of rear class product, ultrathin requirement.
Accompanying drawing explanation
Fig. 1 is main TV structure schematic diagram of the present utility model.
Fig. 2 is plan structure schematic diagram of the present utility model.
Fig. 3 is side-looking structural representation of the present utility model.
Fig. 4 of the present utility modelly looks up structural representation.
Fig. 5 is A lead frame structure schematic diagram of the present utility model.
Fig. 6 is B lead frame structure schematic diagram of the present utility model.
Fig. 7 is the structural representation that A and B lead frame of the present utility model is combined to form rectifier bridge.
In figure, 1, plastic-sealed body, 2, pin, 11, upper plastic-sealed body, 12, lower plastic-sealed body, 21, upper horizontal pin, 22, vertical pins, 23, lower horizontal pin, 121, groove.
Embodiment
Better understand the utility model for the ease of those skilled in the art, be described in further details below in conjunction with the drawings and specific embodiments to the utility model, following is only exemplary do not limit protection range of the present utility model.
U-shaped pin rectifier bridge encapsulating structure of the present utility model, first, as shown in Figure 5,6, tin cream is applied respectively in the chip bearing district of A lead frame and B lead frame, respectively put 2 diode chip for backlight unit, wherein A lead frame and B lead frame are copper framework, and diode chip for backlight unit is 25mil-56mil.
Then, be pressed together on by B lead frame on A lead frame, weld with the metallurgical bonding method of a class rectifier bridge comprising 4 diode chip for backlight unit obtained as shown in Figure 7, described A/B lead frame is structure as a whole, and without film dancing, makes hot-fluid loop shorter, and can two-wayly dispel the heat.
Be positioned over by rectifier bridge in lower plastic-sealed body 12, side symmetrical 2 pins 2 of drawing A lead frame and B lead frame respectively that two of lower plastic-sealed body 12 are relative, described pin 2 is the copper of electroplating surfaces with tin, is then covered on lower plastic-sealed body 12 by upper plastic-sealed body 11 again.
By 4 pin 2 downward bendings, form " U " shape structure, namely pin 2 comprises horizontal pin 21, vertical pins 22 and lower horizontal pin 23, as shown in Figure 1, described horizontal pin 21 is that part is embedded in plastic-sealed body, lower horizontal pin 23 is positioned in the groove 121 of lower plastic-sealed body 12 bottom surface, as shown in Figure 4, but part protrudes from outside groove 121, and leave space between the upper surface of lower horizontal pin 23 and the upper surface of groove 121, that is, lower horizontal pin 23 is not contacted with groove 121.
Preferably, as shown in Figure 2,3, the length D of the utility model plastic-sealed body 1 is 4.7mm, width E is 3.8mm, thickness A is 1.4mm; The width e of pin 2 is 0.6mm, thickness c is 0.15-0.2mm, and the spacing d between two pins of same side is 2.5mm; The length a of vertical pins 22 is 0.9mm, and the length b of lower horizontal pin 23 is 0.8mm.
Pin is designed to " U " shape structure by the utility model, on compatible market when most of similar encapsulation, there is good radiating effect, the product encapsulated is made to have lower thermal resistance, while raising radiating effect, the area taking pcb board is also made to reduce about 30%, the power density (W/mm of encapsulation
2) MBF than before improves about 5%, be more suitable for the miniaturized application of the circuit such as electricity-saving lamp, LED, charger, meet the miniaturization of rear class product, ultrathin requirement.
Claims (6)
1. a U-shaped pin rectifier bridge encapsulating structure, comprise plastic-sealed body (1), plastic-sealed body comprises plastic-sealed body (11) and lower plastic-sealed body (12), lower plastic-sealed body (12) two relative sides are symmetrical respectively draws 2 pins (2), it is characterized in that: described pin (2) is " U " shape structure, pin (2) comprises horizontal pin (21), vertical pins (22) and lower horizontal pin (23), upper horizontal pin (21) part is embedded in plastic-sealed body, and lower horizontal pin (23) is positioned at the below of lower plastic-sealed body.
2. U-shaped pin rectifier bridge encapsulating structure according to claim 1, is characterized in that: the bottom surface of described lower plastic-sealed body (12) is provided with 4 grooves (121) of placing lower horizontal pin.
3. U-shaped pin rectifier bridge encapsulating structure according to claim 2, it is characterized in that: described lower horizontal pin (23) part protrudes from groove (121) outward, and leaves space between the upper surface of the upper surface of lower horizontal pin (23) and groove (121).
4. U-shaped pin rectifier bridge encapsulating structure according to claim 1, is characterized in that: the length D of described plastic-sealed body (1) is 4.5mm-5.0mm, width E is 3.6mm-4.1mm, thickness A is 1.2mm-1.6mm.
5. the U-shaped pin rectifier bridge encapsulating structure according to claim 1 or 4, is characterized in that: the width e of described pin (2) is 0.5mm-0.8mm, thickness c is 0.15mm-0.22mm, and the spacing d between two pins of same side is 2.3mm-2.7mm; The length a of vertical pins (22) is 0.8mm-1.0mm, and the length b of lower horizontal pin (23) is 0.7mm-0.95mm.
6. U-shaped pin rectifier bridge encapsulating structure according to claim 1, is characterized in that: the copper that described pin (2) is electroplating surfaces with tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520515944.2U CN204792772U (en) | 2015-07-16 | 2015-07-16 | U -shaped pin rectifier bridge packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520515944.2U CN204792772U (en) | 2015-07-16 | 2015-07-16 | U -shaped pin rectifier bridge packaging structure |
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| Publication Number | Publication Date |
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| CN204792772U true CN204792772U (en) | 2015-11-18 |
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| CN201520515944.2U Active CN204792772U (en) | 2015-07-16 | 2015-07-16 | U -shaped pin rectifier bridge packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070703A (en) * | 2015-07-16 | 2015-11-18 | 山东晶导微电子有限公司 | Rectifier bridge packaging structure with high heat radiating performance |
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2015
- 2015-07-16 CN CN201520515944.2U patent/CN204792772U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105070703A (en) * | 2015-07-16 | 2015-11-18 | 山东晶导微电子有限公司 | Rectifier bridge packaging structure with high heat radiating performance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 273100 No. 166 Chunqiu East Road, Qufu City, Jining City, Shandong Province Patentee after: Shandong crystal guided microelectronic Limited by Share Ltd Address before: 273100 Taiwan City Industrial Park, Qufu City, Jining, Shandong. Patentee before: Shandong Jing Dao Microtronics A/S |