CN105070703A - Rectifier bridge packaging structure with high heat radiating performance - Google Patents
Rectifier bridge packaging structure with high heat radiating performance Download PDFInfo
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- CN105070703A CN105070703A CN201510417956.6A CN201510417956A CN105070703A CN 105070703 A CN105070703 A CN 105070703A CN 201510417956 A CN201510417956 A CN 201510417956A CN 105070703 A CN105070703 A CN 105070703A
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- rectifier bridge
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- sealed body
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Abstract
The invention provides a rectifier bridge packaging structure with high heat radiating performance. The rectifier bridge packaging structure comprises a plastic packaging member. The plastic packaging member comprises an upper plastic packaging member and a lower plastic packaging member. Two pins are respectively leaded out of two opposite side surfaces of the lower plastic packaging member symmetrically. Each pin has a U-shaped structure. Each pin comprises an upper horizontal pin, a vertical pin and a lower horizontal pin. The upper horizontal pin is partially embedded into the plastic packaging member. The lower horizontal pin is arranged below the lower packaging member. According to the rectifier bridge packaging structure, each pin is designed to a U-shaped member. On condition that the rectifier bridge packaging structure is compatible with most similar packages, the rectifier bridge packaging structure has a good heat radiation effect so that the packaged product has a lower thermal resistance. The heat radiation effect is improved. Furthermore the occupied area of a PCB is reduced for about 30%. The power density (W/mm<2>) of the package is improved by about 5% than a previous MBF. The rectifier bridge packaging structure is more suitable for miniature application on circuits of energy-saving lamp, LED lamp, charger, etc.
Description
Technical field
The present invention relates to a kind of rectifier bridge encapsulating structure of high heat dispersion, belong to semiconductor microelectronic technology field.
Background technology
Along with the development in the fields such as mobile informatiom product, household electronic products and green illumination, for its supporting electronic product has used the Important Components such as rectifier bridge, diode, voltage-stabiliser tube in a large number, and " light, thin, little, close " of this kind of device products is had higher requirement; High-caliber microminiature plastic package structure, not only represents industry technology level, and to miniaturization, the higher power density of rear class product, high reliability, high security etc. require most important; The rectifier diode product that in current semiconductor components and devices, use amount is maximum, also develop towards integrated direction, the rectifier bridge packaging having installed four diodes with easy to install and use, power density is high, take that pcb board area is little, reliability high, be widely used in some high-end products.
The components and parts of this type of surface encapsulation being representative with surface mount rectifier bridge, on the basis moving towards miniaturization, owing to being subject to structural limitations, heat dissipation problem is but more and more difficult to solve, its power density is difficult to reach designing requirement, and under normal temperature condition natural heat dissipation environment, its dissipation power is maximum only has 1.2W.Therefore need a kind of rectifier bridge encapsulating structure of high heat dispersion, solve contradiction that is miniaturized and power.
Summary of the invention
The present invention, in order to overcome the deficiency of following technology, provides a kind of rectifier bridge encapsulating structure of high heat dispersion, and this structure can improve radiating effect and the power density of rectifier bridge, and considerably reduces the area of pcb board.
terminological interpretation:
1, SMT:SurfaceMountTechnology, surface mounting technology.
2, MBF encapsulation: be suitable for surface-pasted a kind of semiconductor components and devices packing forms, there is gull-shaped pin configuration.
the present invention overcomes the technical scheme that its technical problem adopts:
A rectifier bridge encapsulating structure for high heat dispersion, comprises plastic-sealed body, and plastic-sealed body comprises plastic-sealed body and lower plastic-sealed body, and the side that lower plastic-sealed body two is relative is symmetrical respectively draws 2 pins; Described pin is " U " shape structure, and pin comprises horizontal pin, vertical pins and lower horizontal pin, and upper horizontal pin portions is embedded in plastic-sealed body, and lower horizontal pin is positioned at the below of lower plastic-sealed body.
Preferred according to the present invention, the bottom surface of described lower plastic-sealed body is provided with 4 grooves placing lower horizontal pin.
Preferred according to the present invention, described lower horizontal pin portions protrudes from outside groove, and leaves space between the upper surface of lower horizontal pin and the upper surface of groove.
Preferred according to the present invention, the length D of described plastic-sealed body is 4.5mm-5.0mm, width E is 3.6mm-4.1mm, thickness A is 1.2mm-1.6mm.
Preferred according to the present invention, the width e of described pin is 0.5mm-0.8mm, thickness c is 0.15mm-0.22mm, and the spacing d between two pins of same side is 2.3mm-2.7mm; The length a of vertical pins is 0.8mm-1.0mm, and the length b of lower horizontal pin is 0.7mm-0.95mm.
Preferred according to the present invention, described pin is the copper of electroplating surfaces with tin.
the invention has the beneficial effects as follows:
1, pin is designed to " U " shape structure by the present invention, on compatible market when most of similar encapsulation, there is good radiating effect, the product encapsulated is made to have lower thermal resistance, while raising radiating effect, the area taking pcb board is also made to reduce about 30%, the power density (W/mm of encapsulation
2) MBF than before improves about 5%, is more suitable for the miniaturized application of the circuit such as electricity-saving lamp, LED, charger.
2, plastic-sealed body of the present invention is square, can encapsulate 4 diode chip for backlight unit simultaneously, composition rectifier bridge, the larger sized chip of encapsulation can be allowed, maximumly reach 56mil, improve the tolerance of encapsulation further, make maximum chip package dimension close to the level of wafer-level package.
3, the present invention is in power device integra-tion application, can substitute 4 diode chip for backlight unit products composition bridge rectifiers, easy to install and use and cost-saving.
4, rectifier bridge very thin thickness of the present invention, can meet the miniaturization of rear class product, ultrathin requirement.
Accompanying drawing explanation
Fig. 1 is main TV structure schematic diagram of the present invention.
Fig. 2 is plan structure schematic diagram of the present invention.
Fig. 3 is side-looking structural representation of the present invention.
Fig. 4 of the present inventionly looks up structural representation.
Fig. 5 is A lead frame structure schematic diagram of the present invention.
Fig. 6 is B lead frame structure schematic diagram of the present invention.
Fig. 7 is the structural representation that A and B lead frame of the present invention is combined to form rectifier bridge.
In figure, 1, plastic-sealed body, 2, pin, 11, upper plastic-sealed body, 12, lower plastic-sealed body, 21, upper horizontal pin, 22, vertical pins, 23, lower horizontal pin, 121, groove.
Embodiment
Better understand the present invention for the ease of those skilled in the art, be described in further details below in conjunction with the drawings and specific embodiments to the present invention, following is only exemplary do not limit protection scope of the present invention.
The rectifier bridge encapsulating structure of high heat dispersion of the present invention, first, as shown in Figure 5,6, tin cream is applied respectively in the chip bearing district of A lead frame and B lead frame, respectively put 2 diode chip for backlight unit, wherein A lead frame and B lead frame are copper framework, and diode chip for backlight unit is 25mil-56mil.
Then, be pressed together on by B lead frame on A lead frame, weld with the metallurgical bonding method of a class rectifier bridge comprising 4 diode chip for backlight unit obtained as shown in Figure 7, described A/B lead frame is structure as a whole, and without film dancing, makes hot-fluid loop shorter, and can two-wayly dispel the heat.
Be positioned over by rectifier bridge in lower plastic-sealed body 12, side symmetrical 2 pins 2 of drawing A lead frame and B lead frame respectively that two of lower plastic-sealed body 12 are relative, described pin 2 is the copper of electroplating surfaces with tin, is then covered on lower plastic-sealed body 12 by upper plastic-sealed body 11 again.
By 4 pin 2 downward bendings, form " U " shape structure, namely pin 2 comprises horizontal pin 21, vertical pins 22 and lower horizontal pin 23, as shown in Figure 1, described horizontal pin 21 is that part is embedded in plastic-sealed body, lower horizontal pin 23 is positioned in the groove 121 of lower plastic-sealed body 12 bottom surface, as shown in Figure 4, but part protrudes from outside groove 121, and leave space between the upper surface of lower horizontal pin 23 and the upper surface of groove 121, that is, lower horizontal pin 23 is not contacted with groove 121.
Preferably, as shown in Figure 2,3, the length D of plastic-sealed body 1 of the present invention is 4.7mm, width E is 3.8mm, thickness A is 1.4mm; The width e of pin 2 is 0.6mm, thickness c is 0.15-0.2mm, and the spacing d between two pins of same side is 2.5mm; The length a of vertical pins 22 is 0.9mm, and the length b of lower horizontal pin 23 is 0.8mm.
Pin is designed to " U " shape structure by the present invention, on compatible market when most of similar encapsulation, there is good radiating effect, the product encapsulated is made to have lower thermal resistance, while raising radiating effect, the area taking pcb board is also made to reduce about 30%, the power density (W/mm of encapsulation
2) MBF than before improves about 5%, be more suitable for the miniaturized application of the circuit such as electricity-saving lamp, LED, charger, meet the miniaturization of rear class product, ultrathin requirement.
Claims (6)
1. the rectifier bridge encapsulating structure of a high heat dispersion, comprise plastic-sealed body (1), plastic-sealed body comprises plastic-sealed body (11) and lower plastic-sealed body (12), lower plastic-sealed body (12) two relative sides are symmetrical respectively draws 2 pins (2), it is characterized in that: described pin (2) is " U " shape structure, pin (2) comprises horizontal pin (21), vertical pins (22) and lower horizontal pin (23), upper horizontal pin (21) part is embedded in plastic-sealed body, and lower horizontal pin (23) is positioned at the below of lower plastic-sealed body.
2. the rectifier bridge encapsulating structure of high heat dispersion according to claim 1, is characterized in that: the bottom surface of described lower plastic-sealed body (12) is provided with 4 grooves (121) of placing lower horizontal pin.
3. the rectifier bridge encapsulating structure of high heat dispersion according to claim 2, it is characterized in that: described lower horizontal pin (23) part protrudes from groove (121) outward, and leaves space between the upper surface of the upper surface of lower horizontal pin (23) and groove (121).
4. the rectifier bridge encapsulating structure of high heat dispersion according to claim 1, is characterized in that: the length D of described plastic-sealed body (1) is 4.5mm-5.0mm, width E is 3.6mm-4.1mm, thickness A is 1.2mm-1.6mm.
5. the rectifier bridge encapsulating structure of the high heat dispersion according to claim 1 or 4, it is characterized in that: the width e of described pin (2) is 0.5mm-0.8mm, thickness c is 0.15mm-0.22mm, and the spacing d between two pins of same side is 2.3mm-2.7mm; The length a of vertical pins (22) is 0.8mm-1.0mm, and the length b of lower horizontal pin (23) is 0.7mm-0.95mm.
6. the rectifier bridge encapsulating structure of high heat dispersion according to claim 1, is characterized in that: the copper that described pin (2) is electroplating surfaces with tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510417956.6A CN105070703A (en) | 2015-07-16 | 2015-07-16 | Rectifier bridge packaging structure with high heat radiating performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510417956.6A CN105070703A (en) | 2015-07-16 | 2015-07-16 | Rectifier bridge packaging structure with high heat radiating performance |
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| Publication Number | Publication Date |
|---|---|
| CN105070703A true CN105070703A (en) | 2015-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510417956.6A Pending CN105070703A (en) | 2015-07-16 | 2015-07-16 | Rectifier bridge packaging structure with high heat radiating performance |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529320A (en) * | 2016-01-25 | 2016-04-27 | 山东晶导微电子有限公司 | Surface mounting power device packaging structure with embedded cooling fin |
| CN110265366A (en) * | 2019-06-14 | 2019-09-20 | 山东元捷电子科技有限公司 | A kind of bridge heap diode with high-cooling property |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201369681Y (en) * | 2009-03-16 | 2009-12-23 | 常州银河电器有限公司 | Paster bridge rectifier |
| CN102263094A (en) * | 2011-08-14 | 2011-11-30 | 绍兴旭昌科技企业有限公司 | Non-interconnected multi-chip package diode |
| CN203277366U (en) * | 2013-06-05 | 2013-11-06 | 上海凝睿电子科技有限公司 | J-shaped surface-mounted pin circuit module |
| CN204792772U (en) * | 2015-07-16 | 2015-11-18 | 山东晶导微电子有限公司 | U -shaped pin rectifier bridge packaging structure |
-
2015
- 2015-07-16 CN CN201510417956.6A patent/CN105070703A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201369681Y (en) * | 2009-03-16 | 2009-12-23 | 常州银河电器有限公司 | Paster bridge rectifier |
| CN102263094A (en) * | 2011-08-14 | 2011-11-30 | 绍兴旭昌科技企业有限公司 | Non-interconnected multi-chip package diode |
| CN203277366U (en) * | 2013-06-05 | 2013-11-06 | 上海凝睿电子科技有限公司 | J-shaped surface-mounted pin circuit module |
| CN204792772U (en) * | 2015-07-16 | 2015-11-18 | 山东晶导微电子有限公司 | U -shaped pin rectifier bridge packaging structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105529320A (en) * | 2016-01-25 | 2016-04-27 | 山东晶导微电子有限公司 | Surface mounting power device packaging structure with embedded cooling fin |
| CN110265366A (en) * | 2019-06-14 | 2019-09-20 | 山东元捷电子科技有限公司 | A kind of bridge heap diode with high-cooling property |
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Application publication date: 20151118 |