CN103761929A - Silica-based unit board of LED display screen - Google Patents
Silica-based unit board of LED display screen Download PDFInfo
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- CN103761929A CN103761929A CN201410008719.XA CN201410008719A CN103761929A CN 103761929 A CN103761929 A CN 103761929A CN 201410008719 A CN201410008719 A CN 201410008719A CN 103761929 A CN103761929 A CN 103761929A
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Abstract
The invention relates to a silica-based unit board of an LED display screen. The silica-based unit board comprises an LED light emitting unit, a silica-based board unit, a circuit board unit and an electronic element unit. The LED light emitting unit is connected on the upper surface of the silica-based board unit, the lower surface of the silica-based board unit is connected with the upper surface of the circuit board unit, and the lower surface of the circuit board unit is connected with the electronic element unit. The LED light emitting unit is formed by LED pixel points which are distanced by 0.1-0.5mm, and each LED pixel point is composed of 1-3 LED light emitting individuals which are LED flip chips. The silica-based unit board of the LED display has the advantages of no packaging requirement, convenience in manufacturing, good radiating effect, small pixel distance and the like.
Description
Technical field
The present invention relates to a kind of LED display cell board, especially a kind of low tone is apart from the silica-based LED display cell board of pixel.
Background technology
At present, the achieved spacing pixel great majority of LED display cell board are on the market all at 4mm, and high-end spacing pixel energy is accomplished 2.5mm, and little spacing pixel can improve the display precision of display screen, makes the displaying contents of unit area more fine and smooth.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of without encapsulation, easy to make, pel spacing is little and the silica-based LED display cell board of good heat dissipation effect.
According to technical scheme provided by the invention, described silica-based LED display cell board, it comprises LED luminescence unit, silicon substrate unit, wiring board unit and electronic component unit, at the upper surface of silicon substrate unit, be connected with LED luminescence unit, the lower surface of silicon substrate unit is connected with the upper surface of wiring board unit, and the lower surface of wiring board unit is connected with electronic component unit; Described LED luminescence unit is comprised of LED pixel, and each LED pixel is comprised of the luminous individuality of 1 ~ 3 LEDs, and the luminous individuality of each LED is LED flip-chip, and the spacing of LED pixel is 0.1 ~ 0.5mm.
The direct upside-down mounting of the luminous individuality of each LED is on silicon substrate unit.
The material of described silicon substrate unit is silicon.
The material of described wiring board unit is glass mat or ceramic substrate.
The present invention has without advantages such as encapsulation, easy to make, good heat dissipation effect, pel spacing are little.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
This silica-based LED display cell board, it comprises LED luminescence unit 1, silicon substrate unit 2, wiring board unit 3 and electronic component unit 4, at the upper surface of silicon substrate unit 2, be connected with LED luminescence unit 1, the lower surface of silicon substrate unit 2 is connected with the upper surface of wiring board unit 3, and the lower surface of wiring board unit 3 is connected with electronic component unit 4; Described LED luminescence unit 1 is comprised of LED pixel, and each LED pixel is comprised of the luminous individuality of 1 ~ 3 LEDs, and the luminous individuality of each LED is LED flip-chip, and the spacing of LED pixel is 0.1 ~ 0.5mm.
The material of described silicon substrate unit 2 is silicon.
The material of described wiring board unit 3 is glass mat or ceramic substrate.
Upside-down mounting pad is arranged at the bottom of LED luminescence unit 1, and upside-down mounting pad, for being connected with silicon substrate unit 2, is realized electric and hot conduction;
The upper surface of silicon substrate unit 2 is chip face pad, and the upper surface of silicon substrate unit 2, for being connected with the upside-down mounting pad of LED luminescence unit 1, transferring to the electric and heat of LED luminescence unit 1 silicon substrate unit 2 and heat is shed; The lower surface of silicon substrate unit 2 is surface of circuit board pad, and it accepts electric that LED luminescence unit 1 connects, and by the electric wiring board unit 3 that feeds back to, the lower surface of silicon substrate unit 2 is for being connected with wiring board unit 3;
The upper surface of wiring board unit 3 is silica-based pad, for accepting required electric of LED luminescence unit 1, the lower surface of wiring board unit 3 is electronic component installed surface, for mounting of electronic component unit 4, realizes the electrical connection of electronic component unit 4 and LED luminescence unit 1.
In the present invention, LED luminescence unit 1 is non-encapsulation type LED flip-chip, and directly upside-down mounting, on silicon substrate unit 2, when solving heat radiation, has been dwindled pel spacing revolutionaryly.Its composition can be following any collocation, but is not limited to following collocation:
1, LED luminescence unit 1 is red, green, blue combination, can be also red, green, blue, combine in vain, also can be red, green, blue, Huang, orange, arbitrary single color chip such as yellowish green;
2, LED luminescence unit 1 is all flip-chip;
3, the direct upside-down mounting of LED luminescence unit 1 is on silica-based flaggy 2;
4, silicon substrate unit 2 materials are silicon;
5, because whole module size is little, the packing forms of its drive IC is chosen as CSP form;
Assembling process of the present invention is as follows:
First LED luminescence unit 1 is passed through to the upside-down mounting of FLIP CHIP technology on silicon substrate unit 2;
Again electronic component unit 4 is welded in to the lower surface of wiring board unit 3 by Reflow Soldering processing procedure;
Finally the silicon substrate unit of the good LED luminescence unit 1 of upside-down mounting 2 and the wiring board unit 3 that has welded electronic component unit 4 are carried out again to Reflow Soldering (temperature of Reflow Soldering can not higher than the fusing point of upside-down mounting scolder), assembling completes.
In the present invention, what light source adopted is flip LED luminescence unit 1, and the electric output of LED luminescence unit 1 is upside-down mounting pad, without gold thread, connects, and directly upside-down mounting is welded on silicon substrate unit 2;
Substrate adopts silicon substrate unit 2, and its coefficient of heat conductivity is high, and because of itself insulation, its integral heat sink ability is than aluminium base and copper base and Yan Gengyou;
Because its light source is the direct upside-down mounting of chip, saved encapsulation procedure, its heat radiation better simultaneously, LED luminescence unit 1 spacing can be accomplished than there being the less of encapsulation, at present, the minimum LED pixel interval of the aobvious panel module main flow of LED is on the market 2.5mm, and LED pixel interval of the present invention may diminish to 0.1 ~ 0.5mm.
Silica-based LED display cell board of the present invention adopts the chip FLIPCHIP making technology without encapsulation, make LED pixel interval reach 0.1 ~ 0.5mm, because spacing is dwindled, the integrated level of luminescence unit improves, the heat dissipation capacity of its unit area increases, so adopt silicon substrate unit 2 to dispel the heat as substrate, then process and the photoelectric functional of realizing LED display cell board being connected of wiring board unit 3.
Non-encapsulation type light source refers to that chip used need not package support and process for filling colloid into, and directly upside-down mounting is on silicon substrate unit 2.
Claims (4)
1. a silica-based LED display cell board, it is characterized in that: it comprises LED luminescence unit (1), silicon substrate unit (2), wiring board unit (3) and electronic component unit (4), at the upper surface of silicon substrate unit (2), be connected with LED luminescence unit (1), the lower surface of silicon substrate unit (2) is connected with the upper surface of wiring board unit (3), and the lower surface of wiring board unit (3) is connected with electronic component unit (4); Described LED luminescence unit (1) is comprised of LED pixel, and each LED pixel is comprised of the luminous individuality of 1 ~ 3 LEDs, and the luminous individuality of each LED is LED flip-chip, and the spacing of LED pixel is 0.1 ~ 0.5mm.
2. silica-based LED display cell board as claimed in claim 1, is characterized in that: the direct upside-down mounting of the luminous individuality of each LED is on silicon substrate unit (2).
3. silica-based LED display cell board as claimed in claim 1, is characterized in that: the material of described silicon substrate unit (2) is silicon.
4. silica-based LED display cell board as claimed in claim 1, is characterized in that: the material of described wiring board unit (3) is glass mat or ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410008719.XA CN103761929A (en) | 2014-01-08 | 2014-01-08 | Silica-based unit board of LED display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410008719.XA CN103761929A (en) | 2014-01-08 | 2014-01-08 | Silica-based unit board of LED display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103761929A true CN103761929A (en) | 2014-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410008719.XA Pending CN103761929A (en) | 2014-01-08 | 2014-01-08 | Silica-based unit board of LED display screen |
Country Status (1)
| Country | Link |
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| CN (1) | CN103761929A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106097912A (en) * | 2016-08-05 | 2016-11-09 | 环视先进数字显示无锡有限公司 | The manufacture method of a kind of micron of LED glass substrate display module and display module |
| CN109448566A (en) * | 2018-09-27 | 2019-03-08 | 上海天马微电子有限公司 | Display panel and display device |
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| CN2836144Y (en) * | 2005-08-04 | 2006-11-08 | 丁会杰 | Staggered LED display unit |
| CN101713508A (en) * | 2009-11-10 | 2010-05-26 | 福建泉州世光照明科技有限公司 | Intelligently adjustable-color temperature LED lamp |
| CN101997074A (en) * | 2010-07-30 | 2011-03-30 | 晶科电子（广州）有限公司 | LED (Light Emitting Diode) surface patch type encapsulating structure based on silicon base plate and encapsulating method thereof |
| US20120225509A1 (en) * | 2010-03-02 | 2012-09-06 | Tsmc Solid State Lighting Ltd. | LED Flip-Chip Package Structure with Dummy Bumps |
| CN102931330A (en) * | 2012-11-12 | 2013-02-13 | 中国科学院半导体研究所 | Preparation method of LED (light-emitting diode) flat-panel display unit |
| CN103296174A (en) * | 2013-05-03 | 2013-09-11 | 华中科技大学 | Wafer level packaging structure, method and product for LED flip chip |
| CN203799590U (en) * | 2014-01-08 | 2014-08-27 | 江苏新广联绿色照明工程有限公司 | Silicon-based LED display screen unit board |
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2014
- 2014-01-08 CN CN201410008719.XA patent/CN103761929A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2836144Y (en) * | 2005-08-04 | 2006-11-08 | 丁会杰 | Staggered LED display unit |
| CN101713508A (en) * | 2009-11-10 | 2010-05-26 | 福建泉州世光照明科技有限公司 | Intelligently adjustable-color temperature LED lamp |
| US20120225509A1 (en) * | 2010-03-02 | 2012-09-06 | Tsmc Solid State Lighting Ltd. | LED Flip-Chip Package Structure with Dummy Bumps |
| CN101997074A (en) * | 2010-07-30 | 2011-03-30 | 晶科电子（广州）有限公司 | LED (Light Emitting Diode) surface patch type encapsulating structure based on silicon base plate and encapsulating method thereof |
| CN102931330A (en) * | 2012-11-12 | 2013-02-13 | 中国科学院半导体研究所 | Preparation method of LED (light-emitting diode) flat-panel display unit |
| CN103296174A (en) * | 2013-05-03 | 2013-09-11 | 华中科技大学 | Wafer level packaging structure, method and product for LED flip chip |
| CN203799590U (en) * | 2014-01-08 | 2014-08-27 | 江苏新广联绿色照明工程有限公司 | Silicon-based LED display screen unit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106097912A (en) * | 2016-08-05 | 2016-11-09 | 环视先进数字显示无锡有限公司 | The manufacture method of a kind of micron of LED glass substrate display module and display module |
| CN106097912B (en) * | 2016-08-05 | 2019-01-25 | 环视先进数字显示无锡有限公司 | The manufacturing method and display module of a kind of micron of LED glass substrate display module |
| CN109448566A (en) * | 2018-09-27 | 2019-03-08 | 上海天马微电子有限公司 | Display panel and display device |
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| C53 | Correction of patent of invention or patent application | ||
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Address after: 214192 Wuxi, Xishan, Xishan Economic Development Zone, North Road, unity, No. 18, No. Applicant after: JIANGSU XGL OPTOELECTRONICS CO., LTD. Address before: 214192 Wuxi, Xishan, Xishan Economic Development Zone, North Road, unity, No. 18, No. Applicant before: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO., LTD. |
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Free format text: CORRECT: APPLICANT; FROM: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO., LTD. TO: JIANGSU XINGUANGLIAN OPTOELECTRONIC CO., LTD. |
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Application publication date: 20140430 |