Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of without encapsulation, easy to make, pel spacing is little and the silica-based LED display cell board of good heat dissipation effect.
According to technical scheme provided by the invention, described silica-based LED display cell board, it comprises LED luminescence unit, silicon substrate unit, wiring board unit and electronic component unit, at the upper surface of silicon substrate unit, be connected with LED luminescence unit, the lower surface of silicon substrate unit is connected with the upper surface of wiring board unit, and the lower surface of wiring board unit is connected with electronic component unit; Described LED luminescence unit is comprised of LED pixel, and each LED pixel is comprised of the luminous individuality of 1 ~ 3 LEDs, and the luminous individuality of each LED is LED flip-chip, and the spacing of LED pixel is 0.1 ~ 0.5mm.
The direct upside-down mounting of the luminous individuality of each LED is on silicon substrate unit.
The material of described silicon substrate unit is silicon.
The material of described wiring board unit is glass mat or ceramic substrate.
The present invention has without advantages such as encapsulation, easy to make, good heat dissipation effect, pel spacing are little.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
This silica-based LED display cell board, it comprises LED luminescence unit 1, silicon substrate unit 2, wiring board unit 3 and electronic component unit 4, at the upper surface of silicon substrate unit 2, be connected with LED luminescence unit 1, the lower surface of silicon substrate unit 2 is connected with the upper surface of wiring board unit 3, and the lower surface of wiring board unit 3 is connected with electronic component unit 4; Described LED luminescence unit 1 is comprised of LED pixel, and each LED pixel is comprised of the luminous individuality of 1 ~ 3 LEDs, and the luminous individuality of each LED is LED flip-chip, and the spacing of LED pixel is 0.1 ~ 0.5mm.
The material of described silicon substrate unit 2 is silicon.
The material of described wiring board unit 3 is glass mat or ceramic substrate.
Upside-down mounting pad is arranged at the bottom of LED luminescence unit 1, and upside-down mounting pad, for being connected with silicon substrate unit 2, is realized electric and hot conduction;
The upper surface of silicon substrate unit 2 is chip face pad, and the upper surface of silicon substrate unit 2, for being connected with the upside-down mounting pad of LED luminescence unit 1, transferring to the electric and heat of LED luminescence unit 1 silicon substrate unit 2 and heat is shed; The lower surface of silicon substrate unit 2 is surface of circuit board pad, and it accepts electric that LED luminescence unit 1 connects, and by the electric wiring board unit 3 that feeds back to, the lower surface of silicon substrate unit 2 is for being connected with wiring board unit 3;
The upper surface of wiring board unit 3 is silica-based pad, for accepting required electric of LED luminescence unit 1, the lower surface of wiring board unit 3 is electronic component installed surface, for mounting of electronic component unit 4, realizes the electrical connection of electronic component unit 4 and LED luminescence unit 1.
In the present invention, LED luminescence unit 1 is non-encapsulation type LED flip-chip, and directly upside-down mounting, on silicon substrate unit 2, when solving heat radiation, has been dwindled pel spacing revolutionaryly.Its composition can be following any collocation, but is not limited to following collocation:
1, LED luminescence unit 1 is red, green, blue combination, can be also red, green, blue, combine in vain, also can be red, green, blue, Huang, orange, arbitrary single color chip such as yellowish green;
2, LED luminescence unit 1 is all flip-chip;
3, the direct upside-down mounting of LED luminescence unit 1 is on silica-based flaggy 2;
4, silicon substrate unit 2 materials are silicon;
5, because whole module size is little, the packing forms of its drive IC is chosen as CSP form;
Assembling process of the present invention is as follows:
First LED luminescence unit 1 is passed through to the upside-down mounting of FLIP CHIP technology on silicon substrate unit 2;
Again electronic component unit 4 is welded in to the lower surface of wiring board unit 3 by Reflow Soldering processing procedure;
Finally the silicon substrate unit of the good LED luminescence unit 1 of upside-down mounting 2 and the wiring board unit 3 that has welded electronic component unit 4 are carried out again to Reflow Soldering (temperature of Reflow Soldering can not higher than the fusing point of upside-down mounting scolder), assembling completes.
In the present invention, what light source adopted is flip LED luminescence unit 1, and the electric output of LED luminescence unit 1 is upside-down mounting pad, without gold thread, connects, and directly upside-down mounting is welded on silicon substrate unit 2;
Substrate adopts silicon substrate unit 2, and its coefficient of heat conductivity is high, and because of itself insulation, its integral heat sink ability is than aluminium base and copper base and Yan Gengyou;
Because its light source is the direct upside-down mounting of chip, saved encapsulation procedure, its heat radiation better simultaneously, LED luminescence unit 1 spacing can be accomplished than there being the less of encapsulation, at present, the minimum LED pixel interval of the aobvious panel module main flow of LED is on the market 2.5mm, and LED pixel interval of the present invention may diminish to 0.1 ~ 0.5mm.
Silica-based LED display cell board of the present invention adopts the chip FLIPCHIP making technology without encapsulation, make LED pixel interval reach 0.1 ~ 0.5mm, because spacing is dwindled, the integrated level of luminescence unit improves, the heat dissipation capacity of its unit area increases, so adopt silicon substrate unit 2 to dispel the heat as substrate, then process and the photoelectric functional of realizing LED display cell board being connected of wiring board unit 3.
Non-encapsulation type light source refers to that chip used need not package support and process for filling colloid into, and directly upside-down mounting is on silicon substrate unit 2.