CN202205411U - Patch-type LED (Light Emitting Diode) display module - Google Patents
Patch-type LED (Light Emitting Diode) display module Download PDFInfo
- Publication number
- CN202205411U CN202205411U CN2011202999835U CN201120299983U CN202205411U CN 202205411 U CN202205411 U CN 202205411U CN 2011202999835 U CN2011202999835 U CN 2011202999835U CN 201120299983 U CN201120299983 U CN 201120299983U CN 202205411 U CN202205411 U CN 202205411U
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- CN
- China
- Prior art keywords
- substrate
- led
- led chip
- patch
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a patch-type LED (Light Emitting Diode) display module which comprises a base plate and an LED lamp panel, wherein the LED lamp panel is arranged on the base plate; the LED lamp panel consists of a PCB (Printed Circuit Board) and LED light sources arrayed on the PCB; an LED chip, a substrate and an epoxy resin are packaged in a surface pasting manner, thereby forming the LED light source; the substrate is a metal substrate; the LED chip is welded on the substrate in a patch form; the LED chip is mounted on the upper surface of the substrate in a patch form; the LED chip is electrically connected to the substrate; and instead of ceramics, metal or metal alloy is taken as a material for packaging the substrate, and the substrate serves as an anode layer of an anode of the LED chip, thereby greatly improving the radiating property of a packaging module.
Description
Technical field
The utility model belongs to technical field of electronic components, relates to a kind of adopting surface mounted LED and shows module.
Background technology
The adopting surface mounted LED module is a kind of form of the encapsulation of LED module, is characterized in that the connection of electricity comes from the bottom of substrate.Now, the baseplate material of SMD packing forms mainly is a pottery, as alundum (Al or aluminium nitride.But alundum (Al low price heat conductivility is poor, and the aluminium nitride good heat conductivity still costs an arm and a leg.Simultaneously, be applied to illumination market along with led light source is increasing, the client needs higher amount of light, and amount of light is high more, and then corresponding thermal value is high more.In order to keep the operate as normal of chip, the heat dispersion of SMD encapsulation must be fine, sometimes even with aluminium nitride also do not reach requirement.So having LED high heat dispersion, low-cost substrate, research shows that module is an important problem.
The utility model content
The utility model technical matters to be solved provides a kind of adopting surface mounted LED and shows module, and the material of its substrate is the metal or alloy material, and substrate itself can increase substantially the heat dispersion of encapsulation module as the anode layer that connects the led chip anode.
The technical solution of utility model is following:
A kind of adopting surface mounted LED shows module, comprises base plate and LED lamp plate; Said LED lamp plate is arranged on the base plate, and the LED lamp plate is formed by the PCB circuit board with by the led light source that array is arranged on the PCB circuit board; Said led light source adopts the surface mount mode to encapsulate by led chip, substrate and epoxy resin and forms; Said substrate is a metal substrate, and said led chip is SMD to be welded on the substrate.
Substrate is metal substrate or alloy substrate.
Beneficial effect:
The utility model adopting surface mounted LED shows module, and the material of its substrate is metal or alloy material rather than pottery, and substrate itself can increase substantially the heat dispersion of encapsulation module as the anode layer that connects the led chip anode.
Description of drawings
Fig. 1 is that the utility model adopting surface mounted LED shows the module synoptic diagram.
1 is led chip among the figure, and 2 is substrate, and 3 is the PCB circuit board, and 4 is base plate, and 5 is epoxy resin layer.
Embodiment
Below will combine accompanying drawing and specific embodiment that the utility model is explained further details:
As shown in Figure 1, a kind of adopting surface mounted LED shows module, comprises base plate and LED lamp plate; Said LED lamp plate is arranged on the base plate, and the LED lamp plate is formed by the PCB circuit board with by the led light source that array is arranged on the PCB circuit board; Said led light source adopts the surface mount mode to encapsulate by led chip, substrate and epoxy resin and forms; Said substrate is a metal substrate, and said led chip is SMD to be welded on the substrate.
Through metal or metal alloy rather than pottery, as the base plate for packaging material, substrate itself can increase substantially the heat dispersion of encapsulation module as the anode layer that connects the led chip anode.
The material of base plate for packaging is copper, aluminium, aldary or aluminium alloy.
Claims (2)
1. an adopting surface mounted LED shows module, it is characterized in that, comprises base plate and LED lamp plate; Said LED lamp plate is arranged on the base plate, and the LED lamp plate is formed by the PCB circuit board with by the led light source that array is arranged on the PCB circuit board; Said led light source adopts the surface mount mode to encapsulate by led chip, substrate and epoxy resin and forms; Said substrate is a metal substrate, and said led chip is SMD to be welded on the substrate.
2. adopting surface mounted LED as claimed in claim 1 shows module, it is characterized in that said substrate is an alloy substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202999835U CN202205411U (en) | 2011-08-17 | 2011-08-17 | Patch-type LED (Light Emitting Diode) display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202999835U CN202205411U (en) | 2011-08-17 | 2011-08-17 | Patch-type LED (Light Emitting Diode) display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202205411U true CN202205411U (en) | 2012-04-25 |
Family
ID=45969520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202999835U Expired - Fee Related CN202205411U (en) | 2011-08-17 | 2011-08-17 | Patch-type LED (Light Emitting Diode) display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202205411U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969433A (en) * | 2012-12-06 | 2013-03-13 | 上海顿格电子贸易有限公司 | LED (Light-Emitting Diode) wafer modularized packaging process |
| WO2016077992A1 (en) * | 2014-11-18 | 2016-05-26 | 何素华 | Led module group |
-
2011
- 2011-08-17 CN CN2011202999835U patent/CN202205411U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969433A (en) * | 2012-12-06 | 2013-03-13 | 上海顿格电子贸易有限公司 | LED (Light-Emitting Diode) wafer modularized packaging process |
| WO2016077992A1 (en) * | 2014-11-18 | 2016-05-26 | 何素华 | Led module group |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Huacai Opto-electronics Co., Ltd. Document name: Notification of Termination of Patent Right |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120425 Termination date: 20140817 |
|
| EXPY | Termination of patent right or utility model |