WO2016077992A1

WO2016077992A1 - Led module group

Info

Publication number: WO2016077992A1
Application number: PCT/CN2014/091405
Authority: WO
Inventors: 何素华
Original assignee: 何素华
Priority date: 2014-11-18
Filing date: 2014-11-18
Publication date: 2016-05-26
Also published as: CN205424533U

Abstract

An LED module group, comprising: a substrate (1) and at least two SMD LEDs (21) disposed on the substrate (1), chip groups (2) composed of several SMD LEDs (21) disposed at different locations on the substrate (1), and a thermal insulation layer (3) arranged with respect to part of or all of the chip groups (2) is disposed between the substrate (1) and the SMD LEDs (21). The chip groups (2) are each at different locations on the substrate (1), and heat is conducted via the thermal insulation layer (3) between the chip groups (2) such that the temperature on the substrate (1) is balanced, thus ensuring an improved service life of the LED module group.

Description

LED module

Technical field

The present application relates to the field of light emitting diodes, and in particular, to an LED module.

Background technique

With the improvement of light-emitting diode (LED) light efficiency and cost reduction, high-efficiency white LEDs have gradually replaced traditional indoor light sources such as incandescent lamps and fluorescent lamps, and extended to outdoor lighting applications, such as street lamps and gardens. Lights, tunnel lights, etc. LED packages are also being developed from single-chip LED packages to multi-chip LED integrated packages and wafer-level integrated packages. Chip on Board (COB) LED products in multi-chip LED integrated package are mainly used in indoor bulbs and outdoor lighting.

The structure of the existing COB LED product is mainly to set an LED chip placement area on the heat-conducting substrate, and the LED chip placement area is applied to the closed area of the LED chip containing the LED chip, and the fluorescent chip is formed on the LED chip formed by the dam and then baked. COB LED. The thermally conductive substrate may be a metal substrate or a ceramic substrate or a silicon substrate. The LED chips may be disposed in series or in series and in parallel in the LED chip placement area. The heat conductive substrate may be formed in a circular shape or a square shape, and the shape thereof may be produced as needed.

The chip-type LED of the above COB LED product is placed in the center of the heat-conducting substrate in a concentrated manner, and the temperature distribution of the heat-conducting substrate is uneven, and the junction temperature of the chip-type LED in the center portion is high, which affects the life of the COB LED.

Summary of the invention

The present application aims to solve at least one of the above technical problems to some extent.

The present application provides an LED module, comprising: a substrate and at least two chip LEDs disposed on the substrate, wherein the chip-type LEDs are arranged in different positions on the substrate, the substrate A thermally conductive insulating layer disposed on part or all of the chip set is disposed between the chip LEDs.

Further, the chipset includes 2n of the patch LEDs, and n is a positive integer.

Further, the chipset includes 2, 4 or 8 of the patch LEDs.

Further, the thermally conductive insulating layer is made of graphene, alumina thermal conductive rubber or boron nitride thermal conductive rubber material.

Further, the chip LEDs in the chipset are connected in series.

Further, the chip sets are connected in parallel.

Further, the chip LED is assembled with the substrate by eutectic soldering or flip chip soldering.

Further, the chipset is evenly distributed on the substrate.

Further, the patch LED has a forward voltage of 3 volts.

The beneficial effects of the application are:

By providing an LED module, comprising: a substrate and at least two chip LEDs disposed on the substrate, the plurality of chip-type LEDs forming a chipset distributed at different positions on the substrate, the substrate and the substrate A thermally conductive insulating layer disposed on part or all of the chip sets is disposed between the chip-type LEDs. In this way, the chip sets are respectively placed at different positions on the substrate, and the heat conduction between the chip sets is performed by the thermal conductive layer to balance the temperature on the substrate, thereby ensuring the service life of the LED module.

DRAWINGS

FIG. 1 is a schematic structural view of an LED module according to an embodiment of the present application.

[Corrected in accordance with Rule 91 26.12.2014]
2 is a cross-sectional view of an LED module according to an embodiment of the present application.

detailed description

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative, and are not to be construed as limiting.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position of indications such as "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. It is not to be construed as limiting the application.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

In the present application, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature is "above", "above" and "above" the second feature The first feature is directly above and above the second feature, or merely indicates that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.

The present application will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1-2, the embodiment provides an LED module, which can be integrated with a bulb, a signal light or a display screen to provide illumination, signal indication or display functions.

The LED module mainly includes: a substrate 1 and at least two chip LEDs 21 disposed on the substrate 1. The plurality of chip LEDs 21 are arranged on the substrate 1 at different positions, and between the substrate 1 and the chip LED 21 A thermally conductive insulating layer 3 disposed in part or all of the chipset 2 is provided. Typically, the chipset can integrate 1, 2, 3, 4, 5 or more SMD LEDs.

In this way, the chip sets are respectively placed at different positions on the substrate, and the heat conduction between the chip sets is performed by the thermal conductive layer to balance the temperature on the substrate, thereby ensuring the service life of the LED module.

As a preferred embodiment, the chipset 2 may include 2n patch LEDs 21, n being

positive integers

1, 2, 3...N. In particular, the chipset can include 2, 4 or 8 patch LEDs.

The heat conductive insulating layer 3 may be made of a material such as graphene, alumina heat conductive rubber or boron nitride heat conductive rubber.

As an embodiment, the chip LEDs in the chipset are connected in series, and the chipsets are connected in parallel. Of course, other connection forms may also be used, such as parallel connection between the chipset and the group, and the series and components in the chipset are connected in series.

The chip type LED 21 is assembled with the substrate 1 by eutectic soldering or flip chip bonding. The substrate 1 may be a substrate having a circular or elliptical shape or a square shape.

To further increase the uniformity of temperature, as a preferred embodiment, the chip set is evenly distributed on the substrate.

In general, the forward voltage of the chip LED is 3 volts. Of course, other forward voltage values can be used according to actual conditions.

In the description of the present specification, reference is made to the descriptions of the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" The specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

The above content is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the present application is not limited to the description. For those of ordinary skill in the art to which the present application pertains, Under the premise of applying for ideas, you can also make some simple deductions or substitutions.

Claims

An LED module comprising: a substrate; and at least two chip LEDs disposed on the substrate, wherein the plurality of the chip-type LEDs form a chipset distributed at different positions on the substrate, A thermally conductive insulating layer disposed on part or all of the chipset is disposed between the substrate and the SMD LED.
The LED module of claim 1 wherein said chipset comprises 2n said patch LEDs and n is a positive integer.
The LED module of claim 2 wherein said chip set comprises 2, 4 or 8 of said patch LEDs.
The LED module according to claim 1, wherein the thermally conductive insulating layer is made of graphene, alumina thermal conductive rubber or boron nitride thermal conductive rubber material.
The LED module of claim 1 wherein said patch LEDs in said chip set are connected in series.
The LED module of claim 1 wherein said chip sets are connected in parallel.
The LED module according to claim 1, wherein the SMD LED is assembled to the substrate by a eutectic soldering or a flip chip bonding.
The LED module of claim 1 wherein said chip set is evenly distributed over said substrate.
The LED module of claim 1 wherein said patch LED has a forward voltage of 3 volts.