M440535 五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種照明模組，且特別是有關於一種 LED模組。 【先前技術】 發光二極體（Light-Emitting Diode，LED)屬於半導 體元件，其發光晶粒之材料主要使用m-v族化學元素之化 合物，例如磷化鎵（GaP)或砷化鎵（GaAs)，而其發光 原理是將電能轉換為光能。LED的壽命長達十萬小時以 上’且LED更具有反應速度快、體積小、省電、低污染、 高可靠度、適合量產等優點。 隨著能源節約及環境保護的需求，利用LED來建構 人們曰常生活中的照明燈具已經成為世界趨勢。 【新型内容】 本創作提供一種LED模組，其具有便於組裝的優點。 本創作提出一種LED模組，其包括底板以及至少一 個晶片配置於電路板（Chip on board ; COB )型LED封带。 COB型LED封裝設置於底板上。 依照本創作的一實施例所述，在上述之LED模魬中’ COB型LED封裝包括基板以及至少一個led晶片。; 晶片設置於基板上。 依照本創作的一實施例所述，在上述之LED模組中’ 3 M440535 C06型led封裴更包括透光保護層。透光保護層覆蓋於 LED晶片上。 依照本創作的一實施例所述，在上述之LED模組中， COB型LED #裝更包括營光粉。誉光粉摻雜於透光保護 層中。 依照本創作的一實施例所述，在上述之led模組中， COB型LED封裝更包括擋環。擋環設置於基板上且環繞 LED晶片。 依照本創作的一實施例所述’在上述之LED模組中，· 基板更包括圖案化凸起結構。圖案化凸起結構藉由對基板 進行圖案化所形成且環繞LED晶片。 依照本創作的一實施例所述’在上述之LED模組中， 底板的材料例如是金屬材料。 依照本創作的一實施例所述，在上述之LED模組中， 更包括導熱膠材，所述導熱膠材用以將C〇B型LED封裝 貼附於底板上。 依照本創作的一實施例所述，上述之LED模組可應 鲁 用於戶外燈具。 〜 依照本創作的一實施例所述，上述之LED模組可應 用於室内燈具。 ' 〜 基於上述’在本創作所提出之LED模組中，由於c0B 型LED封裝設置於底板上，因此具有便於組裝的優點。此 外’當LED模組具有多個C0B型LED封裝時，可使得 LED模組具有較高的發光功率’進而可以用於戶外燈具與 4 M440535 室内燈具的照明應用上。 舉實 【實施方式】 led模組的上視 圖1所續·示為本創作之—實施例之 示意圖。 • 請參照圖1，LED模組10包括底板100以及至少一 個COB型LED封裝11〇。底板1〇〇的材料可為金屬材料， 例如是銅或鋁。 COB型LED封裝11〇設置於底板1〇〇上。c〇B型led 封裝110包括基板120以及至少一個LED晶片13〇。基板 120設置於底板1〇〇上。基板12〇的材料例如是金屬材料 或陶瓷材料。 LED晶片130設置於基板12〇上。LED晶片13〇例如 Φ 是可以發出相同或不同顏色的LED光源。在圖i中，雖然 疋以繪示九個LED晶片130為例進行說明，然而COB型 LED封裝110所具有的LED晶片130的個數並不以限於 此。本領域技術人員可以視其實際產品的設計需求，並參 照本實施例之教示，而視其實際產品的設計需求來調整 COB型LED封裝110所具有的LED晶片130的數量。 此外，COB型LED封裝110更可選擇性地包括透光 保5蒦層140 ’透光保護層140覆蓋於LED晶片130上，而 可用以保護LED晶片130。透光保護層140的材料例如是 5 M440535 夕膠材料。 八另外，C〇B型LED封裝11〇更可選擇性地包括螢光 粉145，螢光粉145摻雜在透光保護層14〇中，並藉由螢 光粉145使得C〇B型LED封裝丨10可發出不同寬頻譜的 光。舉例來說，對於產生藍色光的LED晶片130而言，若 所採用的螢光粉145受藍光激發會產生黃光，則螢光粉145 發出的黃光會與LED晶片13〇所發出的藍光混合而產生白 光二且可藉由使用不同螢光粉145來產生具有不同色溫之 白光。在此，本創作不加以限制螢光粉145的材質，而螢 光粉145的材料可以是不同濃度的紅色螢光粉、綠色螢光 粉、藍色螢光粉。於其他實施例中，c〇B型[ED封裝11〇 亦可不摻雜螢光粉145。 另一方面，COB型LED封裝11〇更可選擇性地包括 檔環(擋膠結構)150 ’此擋環15〇設置於基板120上，且可 環繞所對應的COB型LED封裝11〇中所有的LED晶片 130。擔環150的功用在於維持透光保護層14〇覆蓋住LED 晶片130的範圍。然而，於其他實施例中，當使用表面張 力較大的材料來形成透光保護層14〇時，透光保護層140 較容易維持其覆蓋的範圍，因此可選擇性地使用擋環15〇。 再者，LED模組1〇更可選擇性地包括導熱膠材160， 用以將COB型LED封裝110貼附於底板1〇〇上。藉此， COB型LED封裝110在使用時所產生的熱量可藉由導熱 膠材160傳導至底板1〇〇以達到散熱的目的。在此實施例 中，雖然導熱膠材160的塗佈範圍是以小於基板120的面 6 M440535 積為例進行說明，但並不用以限制本 =積導熱膠材__圍亦可大於或等於基板： 除此之外，當LED模組10具有多個咖模电1〇時， 上增加電路設計(未繪示)，以將設置於底 ，:上的CQB型LED封裝11G進行紐連接。另外，M440535 V. New description: [New technical field] This creation is related to a lighting module, and in particular to an LED module. [Prior Art] A Light-Emitting Diode (LED) is a semiconductor component, and a material of a light-emitting die mainly uses a compound of a mv group chemical element such as gallium phosphide (GaP) or gallium arsenide (GaAs). The principle of illumination is to convert electrical energy into light energy. LEDs have a lifetime of more than 100,000 hours and LEDs have the advantages of fast response speed, small size, power saving, low pollution, high reliability, and suitable mass production. With the demand for energy conservation and environmental protection, the use of LEDs to construct lighting fixtures that people often live in has become a worldwide trend. [New Content] This creation provides an LED module that has the advantage of being easy to assemble. The present invention proposes an LED module comprising a bottom plate and at least one wafer disposed on a chip on board (COB) type LED sealing tape. The COB type LED package is disposed on the bottom plate. According to an embodiment of the present invention, in the above LED module, the 'COB type LED package includes a substrate and at least one led wafer. The wafer is placed on the substrate. According to an embodiment of the present invention, in the above LED module, the '3 M440535 C06 type led package further includes a light transmissive protective layer. The light transmissive protective layer covers the LED wafer. According to an embodiment of the present invention, in the above LED module, the COB type LED #Pack includes a camping powder. The light powder is doped in the light-transmissive protective layer. According to an embodiment of the present invention, in the above LED module, the COB type LED package further includes a retaining ring. The retaining ring is disposed on the substrate and surrounds the LED chip. According to an embodiment of the present invention, in the above LED module, the substrate further includes a patterned convex structure. The patterned bump structure is formed by patterning the substrate and surrounding the LED wafer. According to an embodiment of the present invention, in the above LED module, the material of the bottom plate is, for example, a metal material. According to an embodiment of the present invention, the LED module further includes a heat conductive adhesive material for attaching the C〇B type LED package to the bottom plate. According to an embodiment of the present invention, the LED module described above can be used for outdoor lighting. ~ In accordance with an embodiment of the present invention, the LED module described above can be applied to an indoor light fixture. ' ～ Based on the above-mentioned LED module proposed in the present invention, since the c0B type LED package is disposed on the bottom plate, it has the advantage of being easy to assemble. In addition, when the LED module has multiple C0B type LED packages, the LED module can have a higher luminous power, which can be used for lighting applications of outdoor lamps and 4 M440535 indoor lamps. [Embodiment] The top view of the LED module is shown in Fig. 1 and is a schematic view of an embodiment of the present invention. • Referring to Figure 1, the LED module 10 includes a backplane 100 and at least one COB type LED package 11A. The material of the bottom plate 1 may be a metal material such as copper or aluminum. The COB type LED package 11 is disposed on the bottom plate 1 . The c〇B type led package 110 includes a substrate 120 and at least one LED wafer 13A. The substrate 120 is disposed on the bottom plate 1〇〇. The material of the substrate 12 is, for example, a metal material or a ceramic material. The LED chip 130 is disposed on the substrate 12A. The LED chip 13 〇, for example, Φ is an LED light source that can emit the same or different colors. In FIG. 1, although nine LED chips 130 are illustrated as an example, the number of LED chips 130 included in the COB type LED package 110 is not limited thereto. Those skilled in the art can adjust the number of LED chips 130 of the COB type LED package 110 according to the design requirements of the actual product according to the design requirements of the actual product. In addition, the COB type LED package 110 further selectively includes a light-transmissive layer 140' of light-transmissive protective layer 140 overlying the LED wafer 130, and can be used to protect the LED wafer 130. The material of the light-transmitting protective layer 140 is, for example, 5 M440535 enamel material. In addition, the C〇B type LED package 11 〇 further optionally includes a phosphor powder 145, which is doped in the light transmissive protective layer 14〇, and the C〇B type LED is made by the phosphor powder 145. The package 丨 10 can emit light of a different broad spectrum. For example, for the LED chip 130 that generates blue light, if the fluorescent powder 145 used is excited by blue light to generate yellow light, the yellow light emitted by the phosphor powder 145 is mixed with the blue light emitted by the LED chip 13〇. White light 2 is produced and white light having different color temperatures can be produced by using different phosphors 145. Here, the present invention does not limit the material of the phosphor powder 145, and the material of the phosphor powder 145 may be different concentrations of red phosphor powder, green phosphor powder, and blue phosphor powder. In other embodiments, the c〇B type [ED package 11〇 may also be doped with the phosphor powder 145. On the other hand, the COB type LED package 11 〇 further optionally includes a retaining ring (blocking structure) 150 ′ which is disposed on the substrate 120 and can surround all of the corresponding COB type LED packages 11 . LED chip 130. The function of the duty ring 150 is to maintain the range in which the light-transmissive protective layer 14 is covered by the LED wafer 130. However, in other embodiments, when the light-transmitting protective layer 14 is formed using a material having a large surface tension, the light-transmitting protective layer 140 is easier to maintain the coverage thereof, and thus the retaining ring 15 可 can be selectively used. Furthermore, the LED module 1 〇 further optionally includes a thermal conductive adhesive 160 for attaching the COB-type LED package 110 to the bottom plate 1 . Thereby, the heat generated by the COB type LED package 110 during use can be conducted to the bottom plate 1 by the heat conductive adhesive 160 to achieve heat dissipation. In this embodiment, although the coating range of the thermal conductive adhesive 160 is described as an example of the surface of the substrate 120 which is smaller than the surface of the substrate 120, it is not limited to the thickness of the thermal conductive adhesive material. In addition, when the LED module 10 has a plurality of coffee makers, a circuit design (not shown) is added to connect the CQB type LED packages 11G disposed on the bottom. In addition,
=域^认貞相贴實際產品的料需求，可在底板 置(未目^⑽型LED封裝110的另-側上設置散熱裝 置（未、·日不）’以辅助C0B型LED封裝11〇進行散埶。苴 :片置的材料為金屬材料，散熱裝置例如是:屬散 ,，，、片成金屬散熱板。 值得-提的是，在圖1中，雖然是以繪示六個c〇B 里D封裝110為例進行說明，然而，LED模組1〇中c〇b 型LED封裝110的個數並不以限於此，只要LED模植1〇 具有至少-個COB型LED封裝丨i G即屬於賴造所主張= domain ^ 贞 贞 贞 实际 实际 实际 实际 实际 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞 贞Diffusion is carried out. 苴: The material of the sheet is made of metal material, and the heat dissipating device is, for example, a scatter, a, and a sheet metal heat sink. It is worth mentioning that, in Fig. 1, although six c are shown The D package 110 in the 〇B is taken as an example. However, the number of the c〇b type LED packages 110 in the LED module 1 is not limited thereto, as long as the LED module has at least one COB type LED package. i G belongs to the claim
的|&圍。柄域技術人貞可以視其實際產品的設計需求調 整COB型LED封裝110的數量。 基於上述實施例可知，在LED模組1〇中，由於c〇B 型LED封裝110設置於底板1〇〇上，因此LED模組1〇可 直接安裝於照明燈具上，且具有便於喊的優點。此外， 當LED模組1〇具有多個COB型LED封裝11〇時，可使 得LED模纽10具有較高的發光功率’進而可以用於戶外 燈具與室内燈具的照明應用上。 圖2所繪示為本創作之另一實施例之LED模組的上 7 M440535 視示意圖。 請同時參照圖1及圖2，圖2中的基板120更包括圖 案化凸起結構170。圖2的實施例與圖1的實施例的差異 在於：圖2的實施例是以圖案化凸起结構17〇來取代圖2 的實施例中的擋環15〇β圖案化凸起結構17〇是藉由對基 底120進行圖案化所形成，且可用以環繞所對應的c〇B 型LED封裝11〇中的所有LED晶片13〇。藉此，透光保 護層140可以藉由圖案化凸起結構17〇而維持透光保護層 140覆蓋住LED晶片13〇的範圍。此外，圖2中之LED 模組20的其他構件的材料、配置關係、用途與功效等與圖 1中之LED模組1〇的構件相似，故於此不再贅述。 同樣地’在LED模組20中，由於COB型LED封裝 110 δ又置於底板1〇〇上，因此led模組20具有便於組裝 的優點。此外’當LED模組20具有多個COB型LED封 裝110時，可使得LED模組2〇具有較高的發光功率進 而可以用於戶外燈具與室内燈具的照明應用上。 綜上所述’上述實施例至少具有下列優點： 1. 上述實施例所提出的LED模組具有便於組裝的優 點， 2. 當上述實施例所提出的LED模組具有多個c〇B型 LED封裝時，可使得LED模組具有較高的發光功率。 雖然本創作已以實施例揭露如上，然其並非用以限定 本創作，任何所屬技術領域中具有通常知識者，在不脫離 本創作之精神和範圍内’當可作些許之更動與潤飾，故本 M440535 創作之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1所繪示為本創作之一實施例之LED模組的上視 示意圖。 圖2所繪示為本創作之另一實施例之LED模組的上 視示意圖。 【主要元件符號說明】 10、20 : LED 模組 100 :底板 110 : COB 型 LED 封裝 120 :基板 130 : LED 晶片 140 :透光保護層 145 :螢光粉 150 :擋環 160 :導熱膠材 170 :圖案化凸起結構|& The handle technology technician can adjust the number of COB type LED packages 110 depending on the design requirements of their actual products. According to the above embodiment, in the LED module 1 , since the c〇B type LED package 110 is disposed on the bottom plate 1 , the LED module 1 can be directly mounted on the lighting fixture, and has the advantage of being easy to shout. . In addition, when the LED module 1 has a plurality of COB type LED packages 11 ,, the LED module 10 can have a high luminous power ‘, which can be used for lighting applications of outdoor lamps and indoor lamps. FIG. 2 is a schematic diagram of the upper 7 M440535 of the LED module according to another embodiment of the present invention. Referring to FIG. 1 and FIG. 2 simultaneously, the substrate 120 of FIG. 2 further includes a patterned protrusion structure 170. The difference between the embodiment of Fig. 2 and the embodiment of Fig. 1 is that the embodiment of Fig. 2 replaces the retaining ring 15〇β patterned raised structure 17 of the embodiment of Fig. 2 with a patterned raised structure 17〇. It is formed by patterning the substrate 120 and can be used to surround all of the LED chips 13 in the corresponding c〇B type LED package 11 . Thereby, the light-transmissive protective layer 140 can maintain the range of the light-transmitting protective layer 140 covering the LED chip 13 by patterning the bump structure 17?. In addition, the materials, arrangement relationships, uses, and functions of the other components of the LED module 20 in FIG. 2 are similar to those of the LED module 1A in FIG. 1, and thus will not be described herein. Similarly, in the LED module 20, since the COB type LED package 110 δ is placed on the substrate 1 ,, the LED module 20 has the advantage of being easy to assemble. In addition, when the LED module 20 has a plurality of COB type LED packages 110, the LED module 2 can have a higher luminous power and can be used for lighting applications of outdoor lamps and indoor lamps. In summary, the above embodiment has at least the following advantages: 1. The LED module proposed in the above embodiment has the advantage of being easy to assemble. 2. The LED module proposed in the above embodiment has a plurality of c〇B type LEDs. When packaged, the LED module can have a higher luminous power. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of this M440535 creation is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view of an LED module according to an embodiment of the present invention. FIG. 2 is a schematic top view of an LED module according to another embodiment of the present invention. [Main component symbol description] 10, 20: LED module 100: bottom plate 110: COB type LED package 120: substrate 130: LED chip 140: light-transmissive protective layer 145: fluorescent powder 150: retaining ring 160: thermal conductive adhesive 170 : patterned raised structure