TW201403870A - Light emitting diode element and manufacturing mathod thereof - Google Patents

Abstract

A light emitting diode element includes a substrate, a light emitting diode die, a transmitting adhesive and a fluorescent plate. An upper surface of the substrate has a barricading part. The light emitting diode die is disposed on the upper surface and placed within the barricading part. The transmitting adhesive covers the light emitting diode die. The fluorescent plate is located on the barricading part and the transmitting adhesive.

Description

Light-emitting diode element and packaging method thereof

The present invention relates to a light-emitting element and a method of fabricating the same, and more particularly to a light-emitting diode and a method of fabricating the same.

The Light Emitting Diode (LED) is a semiconductor component, and it is mainly used as an indicator light, a traffic sign, and a signboard. With the advent of white light-emitting diodes, they have begun to be used in lighting equipment such as flashlights, lights, and even general indoor and outdoor lighting bulbs or tubes. The light-emitting diode mainly converts electric energy into light energy through a semiconductor compound to achieve a light-emitting effect, and thus has characteristics such as long life, low power consumption, and high conversion efficiency. The package body of the light-emitting diode is made of epoxy resin or silicone resin, so it has the advantage of being easily broken, and the light-emitting diode is a very small light source, so Cooperate with the miniaturization of various application equipment.

Conventionally, a method of fabricating a white light-emitting diode element is generally performed by using a blue light-emitting diode grain to excite a yellow Yttrium Aluminum Garnet (YAG) phosphor powder, which is a mixture of the aforementioned yellow phosphor powder in a ring. An epoxy resin or a ruthenium resin is internally formed, and an epoxy resin and a ruthenium resin mixed with a yellow phosphor powder are formed on the blue light-emitting diode crystal grains by a dispensing method, and the blue light-emitting diode crystal grains are coated to make the blue light. Part of the blue light emitted by the light-emitting diode grains excites the yellow phosphor and produces a yellow light. When the yellow light is mixed with other portions of the blue light emitted by the blue light emitting diode crystal, white light is generated.

However, when the yellow fluorescent powder is mixed inside the epoxy resin or the enamel resin, the yellow fluorescent powder is liable to precipitate, so that the white light emitting diode has problems such as poor light mixing effect and uneven color temperature. In addition, the high temperature generated when the blue light emitting diode grain is lit causes the yellow fluorescent powder to deteriorate and deteriorate, thereby causing a problem of severe color shift of the white light emitting diode element.

In view of the foregoing, it is an object of the present invention to provide a light emitting diode device, wherein a fluorescent film of the light emitting diode element is disposed on a light transmissive rubber coated with a light emitting diode die. This can avoid problems such as poor light mixing, uneven color temperature, and aging of the fluorescent powder.

The invention further provides a method for packaging a light-emitting diode component, which is formed by previously forming a light-transmitting adhesive material covering the light-emitting diode crystal grains before the fluorescent sheet is disposed, so as to avoid direct contact of the fluorescent film. Light-emitting diode grains.

In order to achieve the above object, the present invention provides a light emitting diode device, the light emitting diode device comprising a substrate, a light emitting diode die, a light transmissive material, and a phosphor; an upper surface of the substrate The light-emitting diode is disposed on the upper surface and is located inside the range surrounded by the retaining wall portion, and the transparent adhesive material covers the light-emitting diode die, and the fluorescent film is located The retaining wall portion and the transparent adhesive material.

The invention further provides a method for packaging a light-emitting diode component, the package method comprising: a) providing a substrate, a barrier portion is formed on an upper surface of the substrate; b) providing a light-emitting diode die on the substrate ; c) providing a light-transmissive glue material in the retaining wall portion and covering the light-emitting diode die; d) providing a fluorescent sheet on the light-transmitting adhesive.

The light-emitting diode component of the present invention is arranged on the light-transmitting adhesive material covering the crystal grain of the light-emitting diode, so that the mixing of the fluorescent powder can be avoided. The problem of uneven light and uneven color temperature; and, in the case where the fluorescent sheet directly contacts the high temperature generated when the light-emitting diode crystal is lit, the aging is accelerated.

FIG. 1 is a cross-sectional view showing a packaging process of a method for packaging a light-emitting diode element according to a first embodiment of the present invention. As shown in FIG. A, a substrate 110 is first provided. The substrate 110 may be a ceramic substrate, an aluminum substrate, or a copper substrate, which has good heat conduction or heat dissipation effects. One of the upper surfaces 112 of the substrate 110 forms an annular wall portion 114 having a predetermined height h. In the present embodiment, the retaining wall portion 114 and the substrate 110 are both made of a ceramic material. In actual implementation, the retaining wall portion 114 and the substrate 110 may be made of different materials.

Next, a circuit layer 120 is disposed on the upper surface 112, and the circuit layer 120 is fabricated using a material having good electrical conductivity. In the present embodiment, the circuit layer 120 can be made of, but not limited to, copper-plated silver or copper-plated nickel.

Finally, a light emitting diode die 130 is disposed on the circuit layer 120. The LED die 120 is disposed inside the range surrounded by the retaining wall portion 114 and electrically connected to the circuit layer 120. The LED die 130 may be disposed on the circuit layer 120 by silver paste, eutectic soldering, or flip chip soldering, and electrically connected to the circuit layer 120. Of course, the LED die 130 can also be electrically connected to the circuit layer 120 through at least one bonding wire (not shown). In addition, in the embodiment, the overall height of the LED die 130 is not higher than the preset height h of the retaining wall portion 114.

As shown in FIG. 24B, a light-transmitting adhesive material 140 is disposed inside the range surrounded by the retaining wall portion 114, and the light-transmitting adhesive material 140 covers the light-emitting diode die 120. The retaining wall portion 114 is mainly used to provide a limiting effect to prevent the transparent adhesive material 140 from overflowing. In this embodiment, the height of the light-transmitting adhesive 140 is substantially equal to the predetermined height h of the retaining wall portion 114, that is, the height of the transparent adhesive 140 is not higher than the retaining wall portion 114. The preset height h. The light transmissive adhesive 140 may be an epoxy, a silicone resin, an acrylic resin or other colloid having good light transmission properties and an insulating effect.

As shown in FIG. C, a fluorescent sheet 150 is disposed on the retaining wall portion 114 and the transparent adhesive material 140. The fluorescent sheet 150 is a sheet-like phosphor formed by mixing a phosphor with a light-transmitting material and by a dry pressing method, a unidirectional solidification method, an injection molding method, a doctor blade molding method, or an extrusion molding method. A portion of the light emitted by the light-emitting diode die 130 is converted into a wavelength-converted light by a wavelength conversion of the phosphor powder on the phosphor plate 150 when passing through the phosphor sheet 150; the wavelength-converted light system A desired light is generated by mixing with other portions of the light emitted by the LED die 130.

As shown in FIG. D, a package 160 is formed to cover the substrate 110, the circuit layer 120, and the fluorescent sheet 150. The package body 160 can be formed into a substantially hemispherical shape by using a resin or other colloid having good light transmission properties, thereby improving the light extraction efficiency of the light emitting diode element. In actual implementation, the shape and shape of the package 160 can be adjusted to meet the required optical output.

Therefore, the first LED E shows the light-emitting diode element proposed in the first embodiment of the present invention. Referring to the second and third figures, the second and third figures are an exploded perspective view and a perspective view of the LED component of the first embodiment of the present invention. The LED component includes a substrate 110, a circuit layer 120, a light emitting diode die 130, a light transmissive material 140, a phosphor sheet 150, and a package body 160.

The upper surface 112 of the substrate 110 is formed with the retaining wall portion 114. As shown in the second figure, the retaining wall portion 114 of the present embodiment is substantially D-shaped on the upper surface 112 of the substrate 110, and the block The wall portion 114 may be directly formed on the upper surface 112 of the substrate 110, or the barrier portion 114 may be made of a material different from the substrate 110, and bonded to the substrate 110 by an adhesive. Upper surface 112. The retaining wall portion 114 has the predetermined height h.

The circuit layer 120 is disposed on the upper surface 112 of the substrate 110. In this embodiment, the circuit layer 120 is formed in the region enclosed by the retaining wall portion 114 and outside the region surrounded by the retaining wall portion 114. In actual implementation, the circuit layer 120 can be adjusted according to actual requirements and restrictions. The set position of the circuit layer 120. The circuit layer 120 is made of a material having good electrical conductivity such as copper-nickel silver or copper-nickel-gold.

The light emitting diode die 130 is disposed on the upper surface 112 of the substrate 110 and is located within a region surrounded by the retaining wall portion 114. Next, the LED die 130 is electrically connected to the circuit layer 120; the LED die 130 may be a flip-chip form of a light-emitting diode die and electrically connected to the circuit in a flip chip mounting manner. The layer 120, or the LED die 130, may also be a light-emitting diode die in the form of a horizontal electrode or a vertical electrode, and electrically connected to the wire by at least one bonding wire (not shown). Circuit layer 120.

The light-transmitting adhesive material 140 is disposed in a region surrounded by the retaining wall portion 114 and covers the light-emitting diode die 130, and the light-transmitting adhesive material 140 is disposed at a height smaller than the retaining wall portion 114. The preset height h. The light-transmitting adhesive 140 is a colloid having good light transmission properties and high insulation effect, such as epoxy resin, enamel resin or acrylic resin.

The illuminating sheet 150 is disposed on the damper portion 114 and the transparent varnish 140 so that the illuminating diode die 130 and the transparent varnish 140 are located between the substrate 110 and the luminescent sheet 150. The phosphor sheet 150 is used for wavelength conversion with a portion of the light emitted by the LED die 130 and generates a wavelength converted light. In the embodiment, the fluorescent sheet 150 has a substantially D shape and is disposed on the retaining wall portion 114 in alignment.

The package body 160 covers the upper surface 112 of the substrate 110, the circuit layer 120 and the phosphor sheet 150, and forms a substantially convex arc-shaped light-emitting surface 162, thereby improving the light-collecting of the light-emitting diode element. effectiveness. The package body 160 is formed by using a colloid having a good light transmission property and a high insulation effect, for example, a resin, by molding or the like.

In summary, the light-emitting diode device of the present invention is disposed on the light-transmitting adhesive material 140 covering the light-emitting diode die 130, so that the conventional The problem of uneven light mixing and uneven color temperature caused by precipitation of the phosphor powder; and the fact that the fluorescent sheet 150 directly contacts the high temperature generated when the light-emitting diode crystal 130 is lit and accelerates aging can be avoided.

4 and 5 are respectively an exploded cross-sectional view and a combined cross-sectional view of a light-emitting diode element according to a second embodiment of the present invention. The LED device includes a substrate 210, a circuit layer 220, a light emitting diode die 230, a light transmissive material 240, a phosphor sheet 250, and a package 260.

The upper surface 212 of the substrate 210 has a ring-shaped retaining wall portion 214. In the embodiment, the retaining wall portion 214 and the substrate 210 are integrally formed. In actual implementation, the retaining wall portion 214 can be used. The substrate 210 is made of a different material and bonded to the upper surface 212 of the substrate 210 by an adhesive. The retaining wall portion 214 has a predetermined height h.

The circuit layer 220 is located on the upper surface 212, and the circuit layer 221 is fabricated using a material having electrical conductivity, such as metal. In this embodiment, the circuit layer 220 is disposed on the upper surface 212 of the substrate 210 on both sides of the retaining wall portion 214. The actual implementation is not limited thereto.

The LED die 230 is disposed on the upper surface 212 and electrically connected to the circuit layer 220. In this embodiment, the height of the LED die 230 is greater than the predetermined height h of the retaining wall portion 214. The LED die 230 can be disposed on the circuit layer 220 by using silver paste, eutectic soldering or flip chip soldering, and is electrically connected to the circuit layer 220.

The light-transmitting adhesive material 240 covers the light-emitting diode die 230. The light-transmitting adhesive material 240 is a colloid having a good light-transmitting property and an insulating effect, and the light emitted by the light-emitting diode die 230 can pass. In the embodiment, the light-transmitting adhesive 240 is disposed at a height greater than the predetermined height h of the retaining wall portion 214.

The lower surface 252 of the fluorescent sheet 250 has a protruding portion 254. The lower surface 252 of the fluorescent sheet 250 is attached to the transparent adhesive material 240, and the protruding portion 254 is abutted against the retaining wall. The portion 214 is disposed between the substrate 210 and the fluorescent sheet 250 and covers the light emitting diode die 230. The phosphor sheet 250 is wavelength-converted with a portion of the light emitted by the light-emitting diode die 230 to generate a wavelength-converted light that is mixed with other portions of the light emitted by the light-emitting diode die 230. After generating a demand light.

The package body 260 covers the upper surface 212 of the substrate 210, the circuit layer 220, and the phosphor sheet 250, and forms a substantially convex arc-shaped light-emitting surface 262. The light-emitting surface 262 can effectively improve light extraction efficiency. And the angle of light.

When the LED component is actually fabricated, the substrate 210 must first be provided, and the barrier portion 214 is formed on the upper surface 212 of the substrate 210. Next, the circuit layer 220 is disposed on the upper surface 212. Then, the LED die 230 is disposed on the circuit layer 220 and electrically connected to the circuit layer 220. Thereafter, the light-transmitting adhesive 240 is disposed in a region surrounded by the retaining wall portion 214 and covers the light-emitting diode die 230. Then, the fluorescent sheet 250 is disposed on the transparent adhesive material 240. The lower surface 252 of the fluorescent sheet 250 has the protruding portion 254. The protruding portion 254 abuts against the retaining wall portion 214 and enables The light-transmitting adhesive 240 and the light-emitting diode die 230 are located between the substrate 210 and the fluorescent sheet 250. Finally, the package body 260 is formed to cover the upper surface 212 of the substrate 210, the circuit layer 220 and the fluorescent sheet 250.

In summary, the light-emitting diode device of the present invention is disposed on the light-transmitting adhesive material 240 covering the light-emitting diode die 230, so that the conventional The problem of uneven light mixing and uneven color temperature caused by precipitation of the phosphor powder; and the fact that the fluorescent sheet 250 directly contacts the high temperature generated when the light-emitting diode crystal 230 is turned on and accelerates aging can be avoided.

However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect.

110, 210. . . Substrate

112, 212. . . Upper surface

114,214. . . Retaining wall

120, 220. . . Circuit layer

130, 230. . . Light-emitting diode grain

140, 240. . . Light-transmissive glue

150, 250. . . Fluorescent film

160, 260. . . Package

162, 262. . . Glossy surface

252. . . lower surface

254. . . Protrusion

1A to 1D are cross-sectional views showing a packaging process of a method of packaging a light-emitting diode element according to a first embodiment of the present invention.

The second figure is an exploded perspective view of a light emitting diode element according to a first embodiment of the present invention.

The third figure is a perspective assembled view of the light emitting diode element of the first embodiment of the present invention.

The fourth figure is an exploded cross-sectional view of a light-emitting diode element of a second embodiment of the present invention.

Fig. 5 is a sectional view showing the combination of the light-emitting diode elements of the second embodiment of the present invention.

110. . . Substrate

112. . . Upper surface

114. . . Retaining wall

120. . . Circuit layer

130. . . Light-emitting diode grain

140. . . Light-transmissive glue

150. . . Fluorescent film

160. . . Package

162. . . Glossy surface

Claims (12)

A light emitting diode element comprising:
a substrate having an upper wall surface having a retaining wall portion;
a light emitting diode die disposed on the upper surface and located inside a range surrounded by the retaining wall portion;
a light-transmitting rubber material covering the light-emitting diode crystal grains;
A phosphor sheet is disposed on the retaining wall portion and the transparent adhesive material such that the light emitting diode die and the transparent adhesive material are located between the substrate and the fluorescent sheet. The light emitting diode device of claim 1, further comprising a circuit layer disposed on the upper surface of the substrate, the light emitting diode die electrically connected to the circuit layer. The light emitting diode device of claim 2, further comprising a package covering the upper surface of the substrate, the phosphor sheet and the circuit layer. The light-emitting diode component of claim 3, wherein the package has a substantially convex arc-shaped light-emitting surface. The light-emitting diode component of claim 1, wherein the retaining wall portion has a predetermined height, and the light-transmitting adhesive material has a set height substantially equal to the predetermined height. The light-emitting diode component of claim 1, wherein the retaining wall portion has a predetermined height, and the light-transmitting adhesive material has a set height greater than the predetermined height. The illuminating diode device of claim 6, wherein the illuminating sheet has a protruding portion that abuts against the retaining wall portion. The light-emitting diode element according to claim 1, wherein the retaining wall portion is substantially D-shaped, and the fluorescent sheet is substantially D-shaped and disposed at the retaining wall portion. A method for packaging a light emitting diode component, comprising:
a) providing a substrate, one of the upper surface of the substrate is formed with a retaining wall portion;
b) disposing a light emitting diode die on the substrate;
c) disposing a light-transmitting adhesive material inside the range surrounded by the retaining wall portion and covering the light-emitting diode die;
d) setting a fluorescent sheet on the transparent adhesive material; The method for packaging a light-emitting diode according to claim 8 of the patent application, after the step a, further comprises:
A circuit layer is formed on the upper surface. The method for packaging a light-emitting diode according to claim 9 of the patent application, after the step d, further comprises a step:
e) forming a package covering the upper surface of the substrate and the phosphor sheet. The packaged wind method of the light-emitting diode according to the eighth aspect of the invention, wherein the fluorescent sheet has a protruding portion, the protruding portion abuts against the retaining wall portion to make the light-emitting diode die and The light transmissive glue is located between the substrate and the phosphor sheet.