JP2007243056A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2007243056A
JP2007243056A JP2006066411A JP2006066411A JP2007243056A JP 2007243056 A JP2007243056 A JP 2007243056A JP 2006066411 A JP2006066411 A JP 2006066411A JP 2006066411 A JP2006066411 A JP 2006066411A JP 2007243056 A JP2007243056 A JP 2007243056A
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light
phosphor
emitting device
led chip
led chips
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Takao Hayashi
隆夫 林
Sakuo Kamata
策雄 鎌田
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device capable of suppressing the absorption of light radiated from a first phosphor in which an emission peak wavelength is at a low wavelength side by a second phosphor at a long-wavelength side in two kinds of phosphors having different luminescent colors. <P>SOLUTION: The light emitting device comprises: two LED chips 10a, 10b for radiating blue light; a packaging substrate 20 where both the LED chips 10a, 10b are packaged; and a sealing section 30 formed by a light-transmitting resin for sealing both the LED chips 10a, 10b. A first phosphor layer 41 made of a green phosphor that is a first phosphor for radiating light having color differing from the luminescent color of the LED chip 10a is laminated on a light extraction surface 11a in one LED chip 10a. A second phosphor layer 42 made of a red phosphor that is the second phosphor for radiating light at a wavelength that is longer than that of the first phosphor is laminated on a light extraction surface 11b in the other LED chip 10b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、LEDチップ(発光ダイオードチップ)を利用した発光装置に関するものである。   The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

従来から、LEDチップとLEDチップから放射された光によって励起されてLEDチップとは異なる発光色の光を放射する複数種の蛍光体とを組み合わせ所望の混色光(例えば、白色光)を得るようにした発光装置の研究開発が各所で行われている(例えば、特許文献1,2)。   Conventionally, a desired color mixture light (for example, white light) is obtained by combining an LED chip and a plurality of types of phosphors that are excited by light emitted from the LED chip and emit light having a light emission color different from that of the LED chip. Research and development of the light emitting device is performed in various places (for example, Patent Documents 1 and 2).

ここにおいて、上記特許文献1には、図2に示すように、青色光を放射するLEDチップ10と、透光性樹脂に粒子状の緑色蛍光体53’および粒子状の赤色蛍光体54’を分散させて形成された色変換部50’とを備えた発光装置1’が開示されている。   Here, in Patent Document 1, as shown in FIG. 2, an LED chip 10 that emits blue light, and a particulate green phosphor 53 ′ and a particulate red phosphor 54 ′ are provided on a translucent resin. A light emitting device 1 ′ including a color conversion unit 50 ′ formed in a dispersed manner is disclosed.

一方、上記特許文献2には、図3に示すように、LEDチップ10と、LEDチップ10が実装された実装基板20と、透光性樹脂に粒子状の赤色蛍光体54’を分散させて形成された第1の色変換層50a”および透光性樹脂に粒子状の緑色蛍光体53’を分散させて形成された第2の色変換層50b”を有する色変換部50‘’とを備えた発光装置1”が開示されている。要するに、図3に示した構成の発光装置1”の色変換部50”は、発光色の異なる2種類の蛍光体(緑色蛍光体53’、赤色蛍光体54’)のうち発光ピーク波長が長波長側にある蛍光体(つまり、赤色蛍光体54’)を含有する第1の色変換層50a”を、波長ピーク波長が低波長側にある蛍光体(つまり、緑色蛍光体53’)を含有する第2の色変換層50b”よりもLEDチップ10の光取り出し面11に近い側に設けてある。なお、図3に示した構成の発光装置1”は、実装基板20の一表面にLEDチップ10を収納する収納凹所20aが形成されており、LEDチップ10が収納凹所20aの内底面に対向する形でフリップチップ実装され、収納凹所20a内に色変換部50”が形成されている。
特開2003−133595号公報 特開2005−311136号公報
On the other hand, in Patent Document 2, as shown in FIG. 3, an LED chip 10, a mounting substrate 20 on which the LED chip 10 is mounted, and a particulate red phosphor 54 ′ are dispersed in a translucent resin. A first color conversion layer 50a ″ formed and a color conversion unit 50 ″ having a second color conversion layer 50b ″ formed by dispersing particulate green phosphor 53 ′ in a translucent resin. In short, the color conversion section 50 ″ of the light emitting device 1 ″ having the configuration shown in FIG. 3 includes two types of phosphors having different emission colors (green phosphor 53 ′, red). Among the phosphors 54 ′), the first color conversion layer 50a ″ containing the phosphor having the emission peak wavelength on the long wavelength side (that is, the red phosphor 54 ′) is converted into the fluorescence having the wavelength peak wavelength on the low wavelength side. Than the second color conversion layer 50b ″ containing the body (that is, the green phosphor 53 ′). The light emitting device 1 ″ having the configuration shown in FIG. 3 is provided with a housing recess 20a for housing the LED chip 10 on one surface of the mounting substrate 20. The LED chip 10 is flip-chip mounted so as to face the inner bottom surface of the storage recess 20a, and the color conversion portion 50 "is formed in the storage recess 20a.
JP 2003-133595 A JP 2005-31136 A

上述の図2に示した構成の発光装置1’では、色変換部50’の緑色蛍光体53’から放射される緑色光および赤色蛍光体54’から放射される赤色光が全方向に放射されるので、発光ピーク波長が低波長側の緑色蛍光体53’で変換された緑色光の一部が長波長側の赤色蛍光体54’に吸収(二次吸収)されて赤色光に変換されるので、LEDチップ10からの青色光を赤色蛍光体54’により直接赤色光に変換する場合に比べて赤色の発光効率が低くなるため、このような二次吸収を抑制することが望まれていた。   In the light emitting device 1 ′ having the configuration shown in FIG. 2 described above, the green light emitted from the green phosphor 53 ′ of the color converter 50 ′ and the red light emitted from the red phosphor 54 ′ are emitted in all directions. Therefore, a part of the green light converted by the green phosphor 53 ′ whose emission peak wavelength is the lower wavelength side is absorbed (secondary absorption) by the red phosphor 54 ′ on the long wavelength side and converted into red light. Therefore, since the red light emission efficiency is lower than when the blue light from the LED chip 10 is directly converted into red light by the red phosphor 54 ′, it is desired to suppress such secondary absorption. .

また、図3に示した構成の発光装置1”においても、第2の色変換層50b”の緑色蛍光体53’から放射される光が全方向に放射され、緑色蛍光体53’で変換された緑色光の一部が第1の色変換層50a”の赤色蛍光体54’に吸収(二次吸収)されてしまうので、二次吸収を抑制することが望まれていた。   Also in the light emitting device 1 ″ having the configuration shown in FIG. 3, light emitted from the green phosphor 53 ′ of the second color conversion layer 50b ″ is emitted in all directions and converted by the green phosphor 53 ′. Part of the green light is absorbed (secondary absorption) by the red phosphor 54 ′ of the first color conversion layer 50 a ″, so that it has been desired to suppress the secondary absorption.

本発明は上記事由に鑑みて為されたものであり、その目的は、発光色の異なる2種類の蛍光体のうち発光ピーク波長が低波長側にある第1の蛍光体から放射された光が長波長側の第2の蛍光体に吸収されるのを抑制することが可能な発光装置を提供することにある。   The present invention has been made in view of the above-mentioned reasons, and the object thereof is that light emitted from a first phosphor having an emission peak wavelength on the lower wavelength side among two types of phosphors having different emission colors. An object of the present invention is to provide a light emitting device capable of suppressing absorption by the second phosphor on the long wavelength side.

請求項1の発明は、発光色が同じであって並んで配置された2つのLEDチップと、両LEDチップを封止する透光性樹脂により形成された封止部とを備え、一方のLEDチップの光取り出し面に、当該光取り出し面から出射した光によって励起されて一方のLEDチップの発光色とは異なる色の光を放射する第1の蛍光体からなる第1の蛍光体層が積層され、他方のLEDチップの光取り出し面に、当該光取り出し面から出射した光によって励起されて第1の蛍光体よりも長波長の光を放射する第2の蛍光体からなる第2の蛍光体層が積層されてなることを特徴とする。   The invention of claim 1 includes two LED chips having the same emission color and arranged side by side, and a sealing portion formed of a translucent resin that seals both LED chips, and one LED A first phosphor layer made of a first phosphor that is excited by light emitted from the light extraction surface and emits light of a color different from the emission color of one LED chip is stacked on the light extraction surface of the chip. And a second phosphor comprising a second phosphor that emits light having a longer wavelength than the first phosphor upon being excited by light emitted from the light extraction surface of the other LED chip. It is characterized in that layers are laminated.

この発明によれば、発光色の異なる第1の蛍光体および第2の蛍光体それぞれからなる第1の蛍光体層と第2の蛍光体層とが各別に2つのLEDチップの光取り出し面に積層されているので、発光色の異なる2種類の蛍光体のうち発光ピーク波長が低波長側にある第1の蛍光体から放射された光が長波長側の第2の蛍光体に吸収されるのを抑制することが可能になる。   According to the present invention, the first phosphor layer and the second phosphor layer each made of the first phosphor and the second phosphor having different emission colors are separately provided on the light extraction surfaces of the two LED chips. Since they are stacked, light emitted from the first phosphor having the emission peak wavelength on the lower wavelength side among the two types of phosphors having different emission colors is absorbed by the second phosphor on the longer wavelength side. Can be suppressed.

請求項2の発明は、請求項1の発明は、前記各LEDチップが青色光を放射する青色LEDチップであり、前記第1の蛍光体が緑色光を放射する緑色蛍光体、前記第2の蛍光体が赤色光を放射する赤色蛍光体であることを特徴とする。   According to a second aspect of the present invention, in the first aspect of the present invention, each of the LED chips is a blue LED chip that emits blue light, and the first phosphor emits green light, the second phosphor. The phosphor is a red phosphor that emits red light.

この発明によれば、一方の青色LEDチップからの光が緑色蛍光体により直接緑色光に変換されるとともに、他方の青色LEDチップからの光が赤色蛍光体により直接赤色光に変換されることとなり、緑色蛍光体から放射された緑色光が赤色蛍光体に吸収されるのを抑制することができる。   According to this invention, light from one blue LED chip is directly converted to green light by the green phosphor, and light from the other blue LED chip is directly converted to red light by the red phosphor. The green light emitted from the green phosphor can be suppressed from being absorbed by the red phosphor.

請求項3の発明は、請求項1または請求項2の発明において、前記封止部は、多数の粒子状の光拡散材を含有していることを特徴とする。   According to a third aspect of the present invention, in the first or second aspect of the present invention, the sealing portion contains a number of particulate light diffusing materials.

この発明によれば、前記封止部から出射される混色光の色むらを低減することができる。   According to this invention, the color unevenness of the mixed color light emitted from the sealing portion can be reduced.

請求項1の発明では、発光色の異なる2種類の蛍光体のうち発光ピーク波長が低波長側にある第1の蛍光体から放射された光が長波長側の第2の蛍光体に吸収されるのを抑制することが可能になるという効果がある。   In the invention of claim 1, light emitted from the first phosphor having the emission peak wavelength on the low wavelength side among the two types of phosphors having different emission colors is absorbed by the second phosphor on the long wavelength side. There is an effect that it is possible to suppress the occurrence.

(実施形態1)
本実施形態の発光装置1は、図1に示すように、発光色が同じ2つのLEDチップ10a,10bと、両LEDチップ10a,10bが実装された矩形板状の実装基板20と、実装基板20における両LEDチップ10a,10bの実装面側で両LEDチップ10a,10bを封止する透光性樹脂により形成された封止部30とを備え、一方のLEDチップ10aの光取り出し面11aに、当該光取り出し面11aから出射した光によって励起されてLEDチップ10aの発光色とは異なる色の光を放射する第1の蛍光体からなる第1の蛍光体層41が積層され、他方のLEDチップ10bの光取り出し面11bに、当該光取り出し面11bから出射した光によって励起されて第1の蛍光体よりも長波長の光を放射する第2の蛍光体からなる第2の蛍光体層42が積層されている。なお、実装基板20には、各LEDチップ10a,10bへの給電用の導体パターン(図示せず)が形成されている。ここにおいて、各LEDチップ10a,10bは、実装基板20の一表面側において互いに近接する形で並んで配置されている。
(Embodiment 1)
As shown in FIG. 1, the light emitting device 1 of the present embodiment includes two LED chips 10a and 10b having the same emission color, a rectangular plate-like mounting board 20 on which both LED chips 10a and 10b are mounted, and a mounting board. 20 on the mounting surface side of both LED chips 10a and 10b, and a sealing portion 30 formed of a light-transmitting resin that seals both LED chips 10a and 10b, and on the light extraction surface 11a of one LED chip 10a. A first phosphor layer 41 made of a first phosphor that is excited by light emitted from the light extraction surface 11a and emits light of a color different from the emission color of the LED chip 10a is laminated, and the other LED The light extraction surface 11b of the chip 10b is made of a second phosphor that is excited by light emitted from the light extraction surface 11b and emits light having a longer wavelength than the first phosphor. Phosphor layer 42 of 2 are laminated. The mounting substrate 20 is formed with a conductive pattern (not shown) for feeding power to the LED chips 10a and 10b. Here, the LED chips 10a and 10b are arranged side by side so as to be close to each other on the one surface side of the mounting substrate 20.

各LEDチップ10a,10bは、青色光を放射するGaN系青色LEDチップであり、結晶成長用基板の主表面側にGaN系化合物半導体材料により形成されて例えばダブルへテロ構造を有する積層構造部からなる発光部がエピタキシャル成長法(例えば、MOVPE法など)により成長されたものであり、アノード電極およびカソード電極を有している。なお、上述の結晶成長用基板としては、例えば、サファイア基板や、サファイア基板に比べて格子定数や結晶構造がGaNに近く且つ導電性を有するn形のSiC基板などを採用すればよい。なお、実装基板20へのLEDチップ10a,10bの実装形態は特に限定するものではなく、フェースダウンで実装してもよいし、フェースアップで実装してもよい。また、各LEDチップ10a,10bと実装基板20との線膨張率差が比較的大きい場合には、両LEDチップ10a,10bを、各LEDチップ10a,10bと実装基板20との線膨張率の差に起因して各LEDチップ10a,10bに働く応力を緩和するサブマウント部材を介して実装基板20に実装するようにしてもよい。ここで、サブマウント部材は、各LEDチップ10a,10bごとに1つずつ設けてもよいが、両LEDチップ10a,10bに対して1つだけ設けるようにした方が部品点数の削減および発光装置1全体の小型化の点で有利である。   Each of the LED chips 10a and 10b is a GaN-based blue LED chip that emits blue light, and is formed of a GaN-based compound semiconductor material on the main surface side of the crystal growth substrate and has, for example, a stacked structure portion having a double hetero structure. The light emitting portion is grown by an epitaxial growth method (for example, MOVPE method) and has an anode electrode and a cathode electrode. As the above-mentioned crystal growth substrate, for example, a sapphire substrate, an n-type SiC substrate having a lattice constant or crystal structure close to that of GaN and having conductivity as compared with the sapphire substrate may be employed. Note that the mounting form of the LED chips 10a and 10b on the mounting substrate 20 is not particularly limited, and may be mounted face-down or face-up. Further, when the difference in linear expansion coefficient between the LED chips 10a, 10b and the mounting substrate 20 is relatively large, the LED chips 10a, 10b are connected to the linear expansion coefficient between the LED chips 10a, 10b and the mounting substrate 20. You may make it mount in the mounting substrate 20 through the submount member which relieve | moderates the stress which acts on each LED chip 10a, 10b resulting from a difference. Here, one submount member may be provided for each of the LED chips 10a and 10b. However, if only one submount member is provided for the LED chips 10a and 10b, the number of components can be reduced and the light emitting device can be provided. This is advantageous in terms of miniaturization of the whole.

上述の封止部30は、透光性樹脂としてシリコーン樹脂を採用しており、凸レンズ状の形状に形成されている。ここにおいて、封止部30には、多数の粒子状の光拡散材32が分散されている(要するに、封止部30は、多数の粒子状の光拡散材32を含有している)。なお、封止部30の材料である透光性樹脂は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂などを採用してもよい。また、光拡散材32の材料としては、例えば、上記透光性樹脂とは屈折率の異なる透明なガラスや、Au,Agなどの金属を採用すればよい。   The above-described sealing portion 30 employs a silicone resin as a translucent resin and is formed in a convex lens shape. Here, a number of particulate light diffusing materials 32 are dispersed in the sealing portion 30 (in short, the sealing portion 30 contains a number of particulate light diffusing materials 32). The translucent resin that is the material of the sealing portion 30 is not limited to the silicone resin, and for example, an acrylic resin or an epoxy resin may be employed. In addition, as the material of the light diffusing material 32, for example, transparent glass having a refractive index different from that of the light transmitting resin or a metal such as Au or Ag may be employed.

第1の蛍光体層41の材料である第1の蛍光体としては、LEDチップ10aから放射された光によって励起されて緑色光を放射する粒子状の緑色蛍光体を採用し、第2の蛍光体層42の材料である第2の蛍光体としては、LEDチップ10bから放射された光によって励起されて赤色光を放射する赤色蛍光体を採用している。したがって、本実施形態の発光装置1は、一方のLEDチップ10aから放射され第1の蛍光体層41を透過した青色光と、第1の蛍光体層41の緑色蛍光体から放射された緑色光と、他方のLEDチップ10bから放射され第2の蛍光体層42を透過した青色光と、第2の蛍光体層42の赤色蛍光体から放射された赤色光とが封止部30の表面である光出射面31から出射されることとなり、白色光を得ることができる。   As the first phosphor that is the material of the first phosphor layer 41, a particulate green phosphor that is excited by the light emitted from the LED chip 10a and emits green light is adopted, and the second phosphor. As the second phosphor that is a material of the body layer 42, a red phosphor that is excited by light emitted from the LED chip 10b and emits red light is employed. Therefore, the light-emitting device 1 of the present embodiment has blue light emitted from one LED chip 10a and transmitted through the first phosphor layer 41, and green light emitted from the green phosphor of the first phosphor layer 41. The blue light emitted from the other LED chip 10b and transmitted through the second phosphor layer 42 and the red light emitted from the red phosphor of the second phosphor layer 42 are on the surface of the sealing unit 30. The light is emitted from a certain light emission surface 31, and white light can be obtained.

以上説明した本実施形態の発光装置1では、第1の蛍光体である緑色蛍光体からなる第1の蛍光体層41と第2の蛍光体である赤色蛍光体からなる第2の蛍光体層42とが各別に2つのLEDチップ10a,10bの光取り出し面11a,11bに積層されているので、一方の青色LEDチップ10aからの光が緑色蛍光体により直接緑色光に変換されるとともに、他方の青色LEDチップからの光が赤色蛍光体により直接赤色光に変換されることとなり、緑色蛍光体から放射された緑色光が赤色蛍光体に吸収されるのを抑制することができるから、従来の青色LEDチップと緑色蛍光体と赤色蛍光体とを組み合わせた発光装置に比べて演色性の高い白色光を得ることが可能となる。また、本実施形態の発光装置1では、封止部30が多数の粒子状の光拡散材32を含有しているので、封止部30の光出射面31から出射される混色光の色むらを低減することができる。   In the light emitting device 1 of the present embodiment described above, the first phosphor layer 41 made of the green phosphor that is the first phosphor and the second phosphor layer made of the red phosphor that is the second phosphor. 42 are stacked on the light extraction surfaces 11a and 11b of the two LED chips 10a and 10b separately, so that the light from one blue LED chip 10a is directly converted into green light by the green phosphor, and the other Since the light from the blue LED chip is directly converted into red light by the red phosphor, the green light emitted from the green phosphor can be prevented from being absorbed by the red phosphor. It is possible to obtain white light having high color rendering properties as compared with a light emitting device in which a blue LED chip, a green phosphor, and a red phosphor are combined. Further, in the light emitting device 1 of the present embodiment, since the sealing portion 30 contains a large number of particulate light diffusing materials 32, the color unevenness of the mixed color light emitted from the light emitting surface 31 of the sealing portion 30. Can be reduced.

なお、本実施形態の発光装置1を照明器具の光源として利用する場合には、例えば、複数の発光装置1を回路基板や放熱板や器具本体などに適宜並べて実装すればよい。また、上述の実装基板20の平面サイズを大きくして、1枚の実装基板20に2つのLEDチップ10a,10bの組を複数組実装し、各組ごとに両蛍光体層41,42および封止部30を設けるようにしてもよい。   In addition, when using the light-emitting device 1 of this embodiment as a light source of a lighting fixture, what is necessary is just to arrange | position the some light-emitting devices 1 side by side on a circuit board, a heat sink, an instrument main body, etc. suitably. Further, by increasing the planar size of the mounting board 20 described above, a plurality of sets of two LED chips 10a and 10b are mounted on one mounting board 20, and both phosphor layers 41 and 42 and sealing are provided for each group. A stop 30 may be provided.

実施形態の発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device of embodiment. 従来例を示す発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device which shows a prior art example. 他の従来例を示す概略断面図である。It is a schematic sectional drawing which shows another prior art example.

符号の説明Explanation of symbols

1 発光装置
10a,10b LEDチップ
11a,11b 光取り出し面
20 実装基板
30 封止部
31 光出射面
32 光拡散材
41 第1の蛍光体層
42 第2の蛍光体層
DESCRIPTION OF SYMBOLS 1 Light-emitting device 10a, 10b LED chip 11a, 11b Light extraction surface 20 Mounting board 30 Sealing part 31 Light emission surface 32 Light diffusing material 41 1st fluorescent substance layer 42 2nd fluorescent substance layer

Claims (3)

発光色が同じであって並んで配置された2つのLEDチップと、両LEDチップを封止する透光性樹脂により形成された封止部とを備え、一方のLEDチップの光取り出し面に、当該光取り出し面から出射した光によって励起されて一方のLEDチップの発光色とは異なる色の光を放射する第1の蛍光体からなる第1の蛍光体層が積層され、他方のLEDチップの光取り出し面に、当該光取り出し面から出射した光によって励起されて第1の蛍光体よりも長波長の光を放射する第2の蛍光体からなる第2の蛍光体層が積層されてなることを特徴とする発光装置。   Equipped with two LED chips having the same emission color and arranged side by side, and a sealing portion formed of a translucent resin that seals both LED chips, on the light extraction surface of one LED chip, A first phosphor layer made of a first phosphor that is excited by light emitted from the light extraction surface and emits light of a color different from the emission color of one LED chip is laminated, and the other LED chip A second phosphor layer made of a second phosphor that is excited by light emitted from the light extraction surface and emits light having a longer wavelength than the first phosphor is laminated on the light extraction surface. A light emitting device characterized by the above. 前記各LEDチップが青色光を放射する青色LEDチップであり、前記第1の蛍光体が緑色光を放射する緑色蛍光体、前記第2の蛍光体が赤色光を放射する赤色蛍光体であることを特徴とする請求項1記載の発光装置。   The LED chips are blue LED chips that emit blue light, the first phosphor is a green phosphor that emits green light, and the second phosphor is a red phosphor that emits red light. The light-emitting device according to claim 1. 前記封止部は、多数の粒子状の光拡散材を含有していることを特徴とする請求項1または請求項2記載の発光装置。
The light emitting device according to claim 1, wherein the sealing portion contains a number of particulate light diffusing materials.
JP2006066411A 2006-03-10 2006-03-10 Light emitting device Pending JP2007243056A (en)

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Cited By (8)

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Publication number Priority date Publication date Assignee Title
JP2010034184A (en) * 2008-07-28 2010-02-12 Citizen Electronics Co Ltd Light-emitting device
JP2010129583A (en) * 2008-11-25 2010-06-10 Citizen Electronics Co Ltd Lighting fixture
JP2011096739A (en) * 2009-10-27 2011-05-12 Panasonic Electric Works Co Ltd Light-emitting device
CN102569608A (en) * 2010-12-15 2012-07-11 三星Led株式会社 Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device
WO2014091539A1 (en) * 2012-12-10 2014-06-19 株式会社エルム Light emitting apparatus, led illumination apparatus, and method for manufacturing phosphor-containing film piece used in light-emitting apparatus
CN104302407A (en) * 2012-05-25 2015-01-21 奥斯兰姆奥普托半导体有限责任公司 Method for producing optoelectronic components and device for producing optoelectronic components
US20170133560A1 (en) * 2014-06-25 2017-05-11 Koninklijke Philips N.V. Packaged wavelength converted light emitting device
US10424562B2 (en) 2014-12-16 2019-09-24 Citizen Electronics Co., Ltd. Light emitting device with phosphors

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034184A (en) * 2008-07-28 2010-02-12 Citizen Electronics Co Ltd Light-emitting device
JP2010129583A (en) * 2008-11-25 2010-06-10 Citizen Electronics Co Ltd Lighting fixture
JP2011096739A (en) * 2009-10-27 2011-05-12 Panasonic Electric Works Co Ltd Light-emitting device
CN102569608A (en) * 2010-12-15 2012-07-11 三星Led株式会社 Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device
US9893247B2 (en) 2010-12-15 2018-02-13 Samsung Electronics Co., Ltd. Light-emitting device including phosphorus layer covering side surfaces of substrate and light-emitting device package including the same
CN104302407A (en) * 2012-05-25 2015-01-21 奥斯兰姆奥普托半导体有限责任公司 Method for producing optoelectronic components and device for producing optoelectronic components
CN105164823A (en) * 2012-12-10 2015-12-16 株式会社Elm Light emitting apparatus, led illumination apparatus, and method for manufacturing phosphor-containing film piece used in light-emitting apparatus
WO2014091539A1 (en) * 2012-12-10 2014-06-19 株式会社エルム Light emitting apparatus, led illumination apparatus, and method for manufacturing phosphor-containing film piece used in light-emitting apparatus
US20170133560A1 (en) * 2014-06-25 2017-05-11 Koninklijke Philips N.V. Packaged wavelength converted light emitting device
US10998473B2 (en) * 2014-06-25 2021-05-04 Lumileds Llc Packaged wavelength converted light emitting device
US10424562B2 (en) 2014-12-16 2019-09-24 Citizen Electronics Co., Ltd. Light emitting device with phosphors
US11342312B2 (en) 2014-12-16 2022-05-24 Citizen Electronics Co., Ltd. Light emitting element with particular phosphors
US11756939B2 (en) 2014-12-16 2023-09-12 Citizen Electronics Co., Ltd. Light emitting element with particular phosphors

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