CN102201526A - Heat radiation support with integrated packaging - Google Patents
Heat radiation support with integrated packaging Download PDFInfo
- Publication number
- CN102201526A CN102201526A CN 201110126143 CN201110126143A CN102201526A CN 102201526 A CN102201526 A CN 102201526A CN 201110126143 CN201110126143 CN 201110126143 CN 201110126143 A CN201110126143 A CN 201110126143A CN 102201526 A CN102201526 A CN 102201526A
- Authority
- CN
- China
- Prior art keywords
- groove
- metal substrate
- radiation support
- cooling stand
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims description 15
- 238000005538 encapsulation Methods 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011030 bottleneck Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001808 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000002427 irreversible Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Abstract
The invention provides a heat radiation support with integrated packaging. The radiation support comprises a metal substrate, wherein as least a first groove is arranged on the metal substrate, at least a second groove used for carried out bonding on an LED chip is arranged within the first groove, and an insulting layer is on the surface of the metal substrate. The radiation support provided in the invention has advantages of simple structure, low cost, and good heat radiating effect. Besides, shape-preserving gluing packaging is allowed during the packaging, so that the color of emitted light has good uniformity and purity of the color of the emitted light is ensured.
Description
Technical field
The present invention relates to the cooling stand of a kind of cooling stand, particularly a kind of integrated encapsulation.
Background technology
Illumination is a human primary demand.Traditional incandescent lamp, Metal halogen lamp, fluorescent lamp etc. have existed and have developed for many years, and no matter high mature still is the cost aspect from light efficiency, has not all had the development space, and incandescent lamp is as poor efficiency illumination typical case representative, and being eliminated is irreversible inexorable trend.
LED illumination is as a kind of novel solid-state green illumination light source, and it is long to have a luminous efficiency height, life-span, advantages such as energy-conserving and environment-protective, the people's that are subjected to getting more and more concern.LED enter high brightness, high-power since, the heat-sinking capability difference is the main bottleneck that large-power light-emitting diodes faces.No matter be the chip manufacturing of upstream, the encapsulation in middle reaches, or the application in downstream are all in research heat dissipation problem, the bad direct length that influences its useful life of dispelling the heat.LED is applied to general lighting, and except that crossing heat dissipation problem, cost of manufacture is than the higher subject matter that also becomes its development of restriction.
Therefore, how to develop low cost, good heat dissipation effect, the LED lighting of long service life becomes problem demanding prompt solution.
Summary of the invention
Technical problem to be solved by this invention provides a kind of simple in structure, with low cost and integrated package support that heat dispersion is good.
The technical solution adopted in the present invention is: a kind of cooling stand of integrated encapsulation, comprise metal substrate, at least be provided with first groove on this metal substrate, be provided with at least the solid second brilliant groove of led chip in described first inside grooves, the surface of described metal substrate is provided with insulating barrier.
As most preferred embodiment of the present invention, the degree of depth of described first groove is greater than the degree of depth of second groove;
As most preferred embodiment of the present invention, described second groove is evenly distributed in first groove;
As most preferred embodiment of the present invention, described first groove is evenly distributed on the metal substrate;
As most preferred embodiment of the present invention, the shape difference of described a plurality of first grooves.
Compared with prior art, the cooling stand of the integrated encapsulation of the present invention has following beneficial effect at least: the integrated package cooling support of the present invention adopts the metal substrate that is provided with big or small groove shapes to replace conventional stent, and simple in structure, cost is lower; Compare with the traditional heat-dissipating device, this design directly is attached to chip and contains on the fluted metal substrate, has reached good heat-radiation effect; In addition, adopt the metal substrate that contains big or small groove shapes as support, can realize the encapsulation of conformal gluing during encapsulation, therefore the colour consistency of the light that is sent is good, has guaranteed the pure of glow color.
Description of drawings
Fig. 1 (a) and Fig. 1 (b) are the structure chart of cooling stand embodiment one of the present invention;
Fig. 2 (a) and Fig. 2 (b) are the structure chart of cooling stand embodiment two of the present invention;
Fig. 3 (a) and Fig. 3 (b) are the structure charts of cooling stand embodiment three of the present invention.
Embodiment
Embodiment one:
With reference to Figure 1 and Figure 2, the cooling stand of the integrated encapsulation of the present invention comprises metal substrate 1, is provided with first groove 2 on this metal substrate 1 at least, is provided with second groove 3 at least in described first groove 2 inside.
Described first groove 2 both can be used as reflector, can be used for installing reflector again, when being used for reflector is installed, and the quantity of the quantity of this first groove 2 and shape and reflector and form fit; Described second groove 3 is used for led chip solid brilliant, the quantity of the quantity of this second groove 3 and shape and chip and profile coupling.
In the present embodiment, described first groove 2 is two, and the shape difference, is respectively rectangle and circle.Described second groove 3 is evenly distributed in first groove 2, and the degree of depth of first groove 2 is greater than the degree of depth of second groove 3.
Embodiment two:
Please consult especially shown in Fig. 2 (a) and Fig. 2 (b), embodiment two is basic identical with the structure of embodiment one, and its difference is: in embodiment two, described first groove 2 is one, is circle, and described second groove 3 is one, is square structure.
Embodiment three:
Please consult especially shown in Fig. 3 (a) and Fig. 3 (b), embodiment three is basic identical with the structure of embodiment one, and its difference is: in embodiment three, described first groove 2 is one, is circular configuration, and described second groove 3 is two, be square structure, be evenly distributed in first groove 2.
The above only is one embodiment of the present invention, it or not whole or unique execution mode, the conversion of any equivalence that those of ordinary skills take technical solution of the present invention by reading specification of the present invention is claim of the present invention and contains.
Claims (5)
1. the cooling stand of an integrated encapsulation, it is characterized in that: comprise metal substrate (1), on this metal substrate (1), has first groove (2) at least, at inner second groove (3) that is provided with at least the solid crystalline substance of led chip of described first groove (2), the surface of described metal substrate (1) is provided with insulating barrier.
2. the cooling stand of integrated encapsulation as claimed in claim 1, it is characterized in that: the degree of depth of described first groove (2) is greater than the degree of depth of second groove (3).
3. the cooling stand of integrated encapsulation as claimed in claim 1 or 2, it is characterized in that: described second groove (3) is evenly distributed in first groove (2).
4. the cooling stand of integrated encapsulation as claimed in claim 1 or 2, it is characterized in that: described first groove (3) is evenly distributed on the metal substrate.
5. the cooling stand of integrated encapsulation as claimed in claim 3 is characterized in that: the shape difference of described a plurality of first grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110126143 CN102201526A (en) | 2011-05-16 | 2011-05-16 | Heat radiation support with integrated packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110126143 CN102201526A (en) | 2011-05-16 | 2011-05-16 | Heat radiation support with integrated packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102201526A true CN102201526A (en) | 2011-09-28 |
Family
ID=44662040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110126143 Pending CN102201526A (en) | 2011-05-16 | 2011-05-16 | Heat radiation support with integrated packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102201526A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437270A (en) * | 2011-12-09 | 2012-05-02 | 陕西科技大学 | Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof |
| CN113224219A (en) * | 2021-05-10 | 2021-08-06 | 珠海市宏科光电子有限公司 | Manufacturing method of intelligent full-color-mixing COB light source |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2755786Y (en) * | 2004-10-14 | 2006-02-01 | 金利精密工业股份有限公司 | Radiating stand structure of LED |
| KR20110002560A (en) * | 2009-07-02 | 2011-01-10 | 최진선 | Block for footway and the making method |
-
2011
- 2011-05-16 CN CN 201110126143 patent/CN102201526A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2755786Y (en) * | 2004-10-14 | 2006-02-01 | 金利精密工业股份有限公司 | Radiating stand structure of LED |
| KR20110002560A (en) * | 2009-07-02 | 2011-01-10 | 최진선 | Block for footway and the making method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437270A (en) * | 2011-12-09 | 2012-05-02 | 陕西科技大学 | Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof |
| CN113224219A (en) * | 2021-05-10 | 2021-08-06 | 珠海市宏科光电子有限公司 | Manufacturing method of intelligent full-color-mixing COB light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| C06 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| C10 | Entry into substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110928 |
|
| C12 | Rejection of a patent application after its publication |