CN102201526A - Heat radiation support with integrated packaging - Google Patents

Heat radiation support with integrated packaging Download PDF

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Publication number
CN102201526A
CN102201526A CN 201110126143 CN201110126143A CN102201526A CN 102201526 A CN102201526 A CN 102201526A CN 201110126143 CN201110126143 CN 201110126143 CN 201110126143 A CN201110126143 A CN 201110126143A CN 102201526 A CN102201526 A CN 102201526A
Authority
CN
China
Prior art keywords
groove
metal substrate
radiation support
cooling stand
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201110126143
Other languages
Chinese (zh)
Inventor
张方辉
梁田静
丁磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaanxi University of Science and Technology
Original Assignee
Shaanxi University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shaanxi University of Science and Technology filed Critical Shaanxi University of Science and Technology
Priority to CN 201110126143 priority Critical patent/CN102201526A/en
Publication of CN102201526A publication Critical patent/CN102201526A/en
Pending legal-status Critical Current

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Abstract

The invention provides a heat radiation support with integrated packaging. The radiation support comprises a metal substrate, wherein as least a first groove is arranged on the metal substrate, at least a second groove used for carried out bonding on an LED chip is arranged within the first groove, and an insulting layer is on the surface of the metal substrate. The radiation support provided in the invention has advantages of simple structure, low cost, and good heat radiating effect. Besides, shape-preserving gluing packaging is allowed during the packaging, so that the color of emitted light has good uniformity and purity of the color of the emitted light is ensured.

Description

A kind of cooling stand of integrated encapsulation
Technical field
The present invention relates to the cooling stand of a kind of cooling stand, particularly a kind of integrated encapsulation.
Background technology
Illumination is a human primary demand.Traditional incandescent lamp, Metal halogen lamp, fluorescent lamp etc. have existed and have developed for many years, and no matter high mature still is the cost aspect from light efficiency, has not all had the development space, and incandescent lamp is as poor efficiency illumination typical case representative, and being eliminated is irreversible inexorable trend.
LED illumination is as a kind of novel solid-state green illumination light source, and it is long to have a luminous efficiency height, life-span, advantages such as energy-conserving and environment-protective, the people's that are subjected to getting more and more concern.LED enter high brightness, high-power since, the heat-sinking capability difference is the main bottleneck that large-power light-emitting diodes faces.No matter be the chip manufacturing of upstream, the encapsulation in middle reaches, or the application in downstream are all in research heat dissipation problem, the bad direct length that influences its useful life of dispelling the heat.LED is applied to general lighting, and except that crossing heat dissipation problem, cost of manufacture is than the higher subject matter that also becomes its development of restriction.
Therefore, how to develop low cost, good heat dissipation effect, the LED lighting of long service life becomes problem demanding prompt solution.
Summary of the invention
Technical problem to be solved by this invention provides a kind of simple in structure, with low cost and integrated package support that heat dispersion is good.
The technical solution adopted in the present invention is: a kind of cooling stand of integrated encapsulation, comprise metal substrate, at least be provided with first groove on this metal substrate, be provided with at least the solid second brilliant groove of led chip in described first inside grooves, the surface of described metal substrate is provided with insulating barrier.
As most preferred embodiment of the present invention, the degree of depth of described first groove is greater than the degree of depth of second groove;
As most preferred embodiment of the present invention, described second groove is evenly distributed in first groove;
As most preferred embodiment of the present invention, described first groove is evenly distributed on the metal substrate;
As most preferred embodiment of the present invention, the shape difference of described a plurality of first grooves.
Compared with prior art, the cooling stand of the integrated encapsulation of the present invention has following beneficial effect at least: the integrated package cooling support of the present invention adopts the metal substrate that is provided with big or small groove shapes to replace conventional stent, and simple in structure, cost is lower; Compare with the traditional heat-dissipating device, this design directly is attached to chip and contains on the fluted metal substrate, has reached good heat-radiation effect; In addition, adopt the metal substrate that contains big or small groove shapes as support, can realize the encapsulation of conformal gluing during encapsulation, therefore the colour consistency of the light that is sent is good, has guaranteed the pure of glow color.
Description of drawings
Fig. 1 (a) and Fig. 1 (b) are the structure chart of cooling stand embodiment one of the present invention;
Fig. 2 (a) and Fig. 2 (b) are the structure chart of cooling stand embodiment two of the present invention;
Fig. 3 (a) and Fig. 3 (b) are the structure charts of cooling stand embodiment three of the present invention.
Embodiment
Embodiment one:
With reference to Figure 1 and Figure 2, the cooling stand of the integrated encapsulation of the present invention comprises metal substrate 1, is provided with first groove 2 on this metal substrate 1 at least, is provided with second groove 3 at least in described first groove 2 inside.
Described first groove 2 both can be used as reflector, can be used for installing reflector again, when being used for reflector is installed, and the quantity of the quantity of this first groove 2 and shape and reflector and form fit; Described second groove 3 is used for led chip solid brilliant, the quantity of the quantity of this second groove 3 and shape and chip and profile coupling.
In the present embodiment, described first groove 2 is two, and the shape difference, is respectively rectangle and circle.Described second groove 3 is evenly distributed in first groove 2, and the degree of depth of first groove 2 is greater than the degree of depth of second groove 3.
Embodiment two:
Please consult especially shown in Fig. 2 (a) and Fig. 2 (b), embodiment two is basic identical with the structure of embodiment one, and its difference is: in embodiment two, described first groove 2 is one, is circle, and described second groove 3 is one, is square structure.
Embodiment three:
Please consult especially shown in Fig. 3 (a) and Fig. 3 (b), embodiment three is basic identical with the structure of embodiment one, and its difference is: in embodiment three, described first groove 2 is one, is circular configuration, and described second groove 3 is two, be square structure, be evenly distributed in first groove 2.
The above only is one embodiment of the present invention, it or not whole or unique execution mode, the conversion of any equivalence that those of ordinary skills take technical solution of the present invention by reading specification of the present invention is claim of the present invention and contains.

Claims (5)

1. the cooling stand of an integrated encapsulation, it is characterized in that: comprise metal substrate (1), on this metal substrate (1), has first groove (2) at least, at inner second groove (3) that is provided with at least the solid crystalline substance of led chip of described first groove (2), the surface of described metal substrate (1) is provided with insulating barrier.
2. the cooling stand of integrated encapsulation as claimed in claim 1, it is characterized in that: the degree of depth of described first groove (2) is greater than the degree of depth of second groove (3).
3. the cooling stand of integrated encapsulation as claimed in claim 1 or 2, it is characterized in that: described second groove (3) is evenly distributed in first groove (2).
4. the cooling stand of integrated encapsulation as claimed in claim 1 or 2, it is characterized in that: described first groove (3) is evenly distributed on the metal substrate.
5. the cooling stand of integrated encapsulation as claimed in claim 3 is characterized in that: the shape difference of described a plurality of first grooves.
CN 201110126143 2011-05-16 2011-05-16 Heat radiation support with integrated packaging Pending CN102201526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110126143 CN102201526A (en) 2011-05-16 2011-05-16 Heat radiation support with integrated packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110126143 CN102201526A (en) 2011-05-16 2011-05-16 Heat radiation support with integrated packaging

Publications (1)

Publication Number Publication Date
CN102201526A true CN102201526A (en) 2011-09-28

Family

ID=44662040

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201110126143 Pending CN102201526A (en) 2011-05-16 2011-05-16 Heat radiation support with integrated packaging

Country Status (1)

Country Link
CN (1) CN102201526A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102437270A (en) * 2011-12-09 2012-05-02 陕西科技大学 Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof
CN113224219A (en) * 2021-05-10 2021-08-06 珠海市宏科光电子有限公司 Manufacturing method of intelligent full-color-mixing COB light source

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2755786Y (en) * 2004-10-14 2006-02-01 金利精密工业股份有限公司 Radiating stand structure of LED
KR20110002560A (en) * 2009-07-02 2011-01-10 최진선 Block for footway and the making method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2755786Y (en) * 2004-10-14 2006-02-01 金利精密工业股份有限公司 Radiating stand structure of LED
KR20110002560A (en) * 2009-07-02 2011-01-10 최진선 Block for footway and the making method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102437270A (en) * 2011-12-09 2012-05-02 陕西科技大学 Heat radiating bracket for integrated packing of light emitting diode (LED) and preparation method thereof
CN113224219A (en) * 2021-05-10 2021-08-06 珠海市宏科光电子有限公司 Manufacturing method of intelligent full-color-mixing COB light source

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SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20110928

C12 Rejection of a patent application after its publication