CN203799590U - Silicon-based LED display screen unit board - Google Patents

Silicon-based LED display screen unit board Download PDF

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Publication number
CN203799590U
CN203799590U CN201420009033.8U CN201420009033U CN203799590U CN 203799590 U CN203799590 U CN 203799590U CN 201420009033 U CN201420009033 U CN 201420009033U CN 203799590 U CN203799590 U CN 203799590U
Authority
CN
China
Prior art keywords
unit
led
silicon substrate
silicon
led display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420009033.8U
Other languages
Chinese (zh)
Inventor
周锋
华利生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU XGL OPTOELECTRONICS CO., LTD.
Original Assignee
JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING Co Ltd filed Critical JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING Co Ltd
Priority to CN201420009033.8U priority Critical patent/CN203799590U/en
Application granted granted Critical
Publication of CN203799590U publication Critical patent/CN203799590U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a silicon-based LED display screen unit board which comprises an LED light-emitting unit, a silicon substrate unit, a circuit board unit and an electronic element unit. The upper surface of the silicon substrate unit is connected with the LED light-emitting unit, the lower surface of the silicon substrate unit is connected with the upper surface of the circuit board unit, and the lower surface of the circuit board unit is connected with the electronic element unit; the LED light-emitting unit is formed by LED pixel points, each pixel point is formed by 1-3 LED luminophors, each LED luminophor is an LED flip chip, and the distance between every two LED pixel points is 0.1-0.5 mm. The silicon-based LED display screen unit board has the advantages of being free of encapsulation, convenient to manufacture, good in heat dissipation effect, small in pixel spacing and the like.

Description

Silica-based LED display cell board
Technical field
The utility model relates to a kind of LED display cell board, and especially a kind of low tone is apart from the silica-based LED display cell board of pixel.
Background technology
At present, the achieved spacing pixel great majority of LED display cell board are on the market all at 4mm, and high-end spacing pixel energy is accomplished 2.5mm, and little spacing pixel can improve the display precision of display screen, makes the displaying contents of unit area more fine and smooth.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provide a kind of without encapsulation, easy to make, pel spacing is little and the silica-based LED display cell board of good heat dissipation effect.
The technical scheme providing according to the utility model, described silica-based LED display cell board, it comprises LED luminescence unit, silicon substrate unit, wiring board unit and electronic component unit, upper surface in silicon substrate unit is connected with LED luminescence unit, the lower surface of silicon substrate unit is connected with the upper surface of wiring board unit, and the lower surface of wiring board unit is connected with electronic component unit; Described LED luminescence unit is comprised of LED pixel, and each LED pixel is comprised of the luminous individuality of 1 ~ 3 LEDs, and the luminous individuality of each LED is LED flip-chip, and the spacing of LED pixel is 0.1 ~ 0.5mm.
The direct upside-down mounting of the luminous individuality of each LED is on silicon substrate unit.
The material of described silicon substrate unit is silicon.
The material of described wiring board unit is glass mat or ceramic substrate.
The utlity model has without advantages such as encapsulation, easy to make, good heat dissipation effect, pel spacing are little.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with specific embodiment, the utility model is described in further detail.
This silica-based LED display cell board, it comprises LED luminescence unit 1, silicon substrate unit 2, wiring board unit 3 and electronic component unit 4, upper surface in silicon substrate unit 2 is connected with LED luminescence unit 1, the lower surface of silicon substrate unit 2 is connected with the upper surface of wiring board unit 3, and the lower surface of wiring board unit 3 is connected with electronic component unit 4; Described LED luminescence unit 1 is comprised of LED pixel, and each LED pixel is comprised of the luminous individuality of 1 ~ 3 LEDs, and the luminous individuality of each LED is LED flip-chip, and the spacing of LED pixel is 0.1 ~ 0.5mm.
The material of described silicon substrate unit 2 is silicon.
The material of described wiring board unit 3 is glass mat or ceramic substrate.
Upside-down mounting pad is arranged at the bottom of LED luminescence unit 1, and upside-down mounting pad, for being connected with silicon substrate unit 2, is realized electric and hot conduction;
The upper surface of silicon substrate unit 2 is chip face pad, and the upper surface of silicon substrate unit 2, for being connected with the upside-down mounting pad of LED luminescence unit 1, transferring to the electric and heat of LED luminescence unit 1 silicon substrate unit 2 and heat is shed; The lower surface of silicon substrate unit 2 is surface of circuit board pad, and it accepts electric that LED luminescence unit 1 connects, and by the electric wiring board unit 3 that feeds back to, the lower surface of silicon substrate unit 2 is for being connected with wiring board unit 3;
The upper surface of wiring board unit 3 is silica-based pad, for accepting required electric of LED luminescence unit 1, the lower surface of wiring board unit 3 is electronic component installed surface, for mounting of electronic component unit 4, realizes the electrical connection of electronic component unit 4 and LED luminescence unit 1.
In the utility model, LED luminescence unit 1 is non-encapsulation type LED flip-chip, and directly upside-down mounting, on silicon substrate unit 2, when solving heat radiation, has been dwindled pel spacing revolutionaryly.Its composition can be following any collocation, but is not limited to following collocation:
1, LED luminescence unit 1 is red, green, blue combination, can be also red, green, blue, combination in vain, also can be red, green, blue, Huang, orange, arbitrary single color chip such as yellowish green;
2, LED luminescence unit 1 is all flip-chip;
3, the direct upside-down mounting of LED luminescence unit 1 is on silica-based flaggy 2;
4, silicon substrate unit 2 materials are silicon;
5, because whole module size is little, the packing forms of its drive IC is chosen as CSP form;
Assembling process of the present utility model is as follows:
First LED luminescence unit 1 is passed through to the upside-down mounting of FLIP CHIP technology on silicon substrate unit 2;
Again electronic component unit 4 is welded in to the lower surface of wiring board unit 3 by Reflow Soldering processing procedure;
Finally the silicon substrate unit of the good LED luminescence unit 1 of upside-down mounting 2 and the wiring board unit 3 that has welded electronic component unit 4 are carried out again to Reflow Soldering (temperature of Reflow Soldering can not higher than the fusing point of upside-down mounting scolder), assembling completes.
In the utility model, what light source adopted is flip LED luminescence unit 1, and the electric output of LED luminescence unit 1 is upside-down mounting pad, without gold thread, connects, and directly upside-down mounting is welded on silicon substrate unit 2;
Substrate adopts silicon substrate unit 2, and its coefficient of heat conductivity is high, and because of itself insulation, its integral heat sink ability is than aluminium base and copper base and Yan Gengyou;
Because its light source is the direct upside-down mounting of chip, saved encapsulation procedure, its heat radiation better simultaneously, LED luminescence unit 1 spacing can be accomplished than there being the less of encapsulation, at present, the minimum LED pixel interval of the aobvious panel module main flow of LED is on the market 2.5mm, and LED pixel interval of the present utility model may diminish to 0.1 ~ 0.5mm.
Silica-based LED display cell board of the present utility model adopts the chip FLIPCHIP making technology without encapsulation, make LED pixel interval reach 0.1 ~ 0.5mm, because spacing is dwindled, the integrated level of luminescence unit improves, the heat dissipation capacity of its unit area increases, so adopt silicon substrate unit 2 to dispel the heat as substrate, then process and the photoelectric functional of realizing LED display cell board being connected of wiring board unit 3.
Non-encapsulation type light source refers to that chip used need not package support and process for filling colloid into, and directly upside-down mounting is on silicon substrate unit 2.

Claims (4)

1. a silica-based LED display cell board, it is characterized in that: it comprises LED luminescence unit (1), silicon substrate unit (2), wiring board unit (3) and electronic component unit (4), upper surface in silicon substrate unit (2) is connected with LED luminescence unit (1), the lower surface of silicon substrate unit (2) is connected with the upper surface of wiring board unit (3), and the lower surface of wiring board unit (3) is connected with electronic component unit (4); Described LED luminescence unit (1) is comprised of LED pixel, and each LED pixel is comprised of the luminous individuality of 1 ~ 3 LEDs, and the luminous individuality of each LED is LED flip-chip, and the spacing of LED pixel is 0.1 ~ 0.5mm.
2. silica-based LED display cell board as claimed in claim 1, is characterized in that: the direct upside-down mounting of the luminous individuality of each LED is on silicon substrate unit (2).
3. silica-based LED display cell board as claimed in claim 1, is characterized in that: the material of described silicon substrate unit (2) is silicon.
4. silica-based LED display cell board as claimed in claim 1, is characterized in that: the material of described wiring board unit (3) is glass mat or ceramic substrate.
CN201420009033.8U 2014-01-08 2014-01-08 Silicon-based LED display screen unit board Expired - Fee Related CN203799590U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420009033.8U CN203799590U (en) 2014-01-08 2014-01-08 Silicon-based LED display screen unit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420009033.8U CN203799590U (en) 2014-01-08 2014-01-08 Silicon-based LED display screen unit board

Publications (1)

Publication Number Publication Date
CN203799590U true CN203799590U (en) 2014-08-27

Family

ID=51381787

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420009033.8U Expired - Fee Related CN203799590U (en) 2014-01-08 2014-01-08 Silicon-based LED display screen unit board

Country Status (1)

Country Link
CN (1) CN203799590U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103761929A (en) * 2014-01-08 2014-04-30 江苏新广联绿色照明工程有限公司 Silica-based unit board of LED display screen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103761929A (en) * 2014-01-08 2014-04-30 江苏新广联绿色照明工程有限公司 Silica-based unit board of LED display screen

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: JIANGSU XINGUANGLIAN OPTOELECTRONIC CO., LTD.

Free format text: FORMER NAME: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO., LTD.

CP03 Change of name, title or address

Address after: 214192 Wuxi, Xishan, Xishan Economic Development Zone, North Road, unity, No. 18, No.

Patentee after: JIANGSU XGL OPTOELECTRONICS CO., LTD.

Address before: 214192 Wuxi, Xishan Province Economic Development Zone, North Road, unity, No. 18, No.

Patentee before: JIANGSU XINGUANGLIAN GREEN LIGHTING ENGINEERING CO., LTD.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140827

Termination date: 20210108

CF01 Termination of patent right due to non-payment of annual fee