CN105529320A - Surface mounting power device packaging structure with embedded cooling fin - Google Patents
Surface mounting power device packaging structure with embedded cooling fin Download PDFInfo
- Publication number
- CN105529320A CN105529320A CN201610046289.XA CN201610046289A CN105529320A CN 105529320 A CN105529320 A CN 105529320A CN 201610046289 A CN201610046289 A CN 201610046289A CN 105529320 A CN105529320 A CN 105529320A
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- China
- Prior art keywords
- pin
- plastic
- power device
- sealed body
- fin
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a surface mounting power device packaging structure with an embedded cooling fin. The surface mounting power device packaging structure comprises a plastic package body, wherein a pin is arranged in the package body and extends out of the package body, and the upper surface of a part, which is positioned in the plastic package body, of the pin is provided with the cooling fin. Under the situation that the appearance of a surface mounting power device is not changed, the cooling fin is embedded into the surface mounting power device packaging structure, a cooling effect is improved under the situation that most similar packaging is guaranteed to be compatible, and a packaged product is low in thermal resistance. Compared with other packaging ways of the same overall dimension, the surface mounting power device packaging structure reduces stable state thermal resistance by about 5%, reduces transient thermal resistance by about 50%, improves the power density (W/mm<2>) of packaging by about 12%, and improves the reliability of the device.
Description
Technical field
The present invention relates to a kind of surface mount power device packaging structure of embedded fin, belong to semiconductor microelectronic technology field, packaging appearance is mainly suitable for the high power density encapsulation of surface mount semiconductor power device.
Background technology
Along with the development in the fields such as mobile informatiom product, household electronic products and green illumination, for its supporting electronic product has used the Important Components such as heavy-duty diode, rectifier bridge, voltage-stabiliser tube in a large number, and " light, thin, little, close " of this kind of device products is had higher requirement; The small-sized plastic package structure of high power density, not only represents industry technology level, and to miniaturization, the higher power density of rear class product, high reliability, high security etc. require most important; The rectifier diode product that in current semiconductor components and devices, use amount is maximum, also towards high power density future development, takies that pcb board area is little, reliability high, is widely used in some high-end products.
The components and parts of surface mount power package are on the basis moving towards miniaturization, owing to being subject to structural limitations, heat dissipation problem is but more and more outstanding, its power density is difficult to reach designing requirement, under normal temperature condition natural heat dissipation environment, its dissipation power is maximum only has about 1-2W, and instantaneous power is also greatly affected, and therefore needs a kind of surface mount diode encapsulating structure had heat radiating fins, solve contradiction that is miniaturized and power, and can not overall dimension be affected.
Summary of the invention
The present invention is in order to overcome the deficiency of above technology, and provide a kind of embedded fin surface attachment power device packaging structure, this encapsulating structure effectively can improve radiating effect and the power density of the surface mount power devices such as diode.
the present invention overcomes the technical scheme that its technical problem adopts:
A surface mount power device packaging structure for embedded fin, comprises plastic-sealed body, is provided with pin and pin extend out to outside plastic-sealed body in plastic-sealed body, and the upper surface that described pin is positioned at plastic-sealed body part is provided with fin.
Preferred according to the present invention, described pin comprises shape and is bending and returns the left pin of bag-like and right pin, the part that left pin and right pin are positioned at the outer two ends of plastic-sealed body is symmetrical, the part that described left pin is positioned at plastic-sealed body is arranged at the below that right pin is positioned at the part of plastic-sealed body, and fin is arranged at the upper surface that right pin is positioned at plastic-sealed body part.
Preferred according to the present invention, the size of described fin is not more than the size that right pin is positioned at plastic-sealed body part.
Preferred according to the present invention, described fin is copper, aluminium or aluminium oxide, is highly heat-conductive material.
Preferred according to the present invention, described pin material is copper, and pin thickness is 0.14mm-0.35mm, and its surface is coated with pure tin, and tin thickness is 0.005mm-0.03mm.
the invention has the beneficial effects as follows:
1, the present invention is not when changing surface mount power device profile, embedded fin, when ensureing compatible most of similar encapsulation, improve radiating effect, the product encapsulated is made to have lower thermal resistance, steady state heat resistance comparatively with other packing forms of overall dimension reduces about 5%, and transient thermal resistance reduces about 50%, the power density (W/mm of encapsulation
2) dress raising about 12%, improve the reliability of device.
2, package interior of the present invention adopts sandwich structure, and embedded fin and pin adopt soldering or high heat conduction, high-temperature plastic adhesion, and have fabulous radiating effect, especially anti-pulse power (or electric current) impact capacity increases substantially.
3, encapsulation of the present invention is applicable to the products such as high-power diode chip, voltage-stabiliser tube chip, rectifier diode, Schottky chip and VS, can meet the miniaturized high power density encapsulation of rear class product.
Accompanying drawing explanation
Fig. 1 is main TV structure schematic diagram of the present invention.
Fig. 2 is side-looking structural representation of the present invention.
Fig. 3 is plan structure schematic diagram of the present invention.
In figure, 1, plastic-sealed body, 2, pin, 21, left pin, 22, right pin, 3, fin.
Embodiment
Better understand the present invention for the ease of those skilled in the art, be described in further details below in conjunction with the drawings and specific embodiments to the present invention, following is only exemplary do not limit protection scope of the present invention.
As Figure 1-3, the surface mount power device packaging structure of embedded fin of the present invention, comprises plastic-sealed body 1, and its length is 4.5mm-8.6mm, width is 3.5mm-6.5mm, thickness is 2.0mm-3.5mm, pin 2 is provided with and pin extend out to outside plastic-sealed body in plastic-sealed body, pin 2 can conduct electricity and can also realize heat radiation, its material is copper, pin thickness is 0.14mm-0.35mm, its surface is coated with pure tin, tin thickness is 0.005mm-0.03mm, described pin 2 comprises shape and is left pin 21 and the right pin 22 that bag-like is returned in bending, the part that left pin and right pin are positioned at the outer two ends of plastic-sealed body is symmetrical, the part that described left pin 21 is positioned at plastic-sealed body is arranged at the below that right pin 22 is positioned at the part of plastic-sealed body, the upper surface that right pin 22 is positioned at plastic-sealed body part is provided with fin 3, fin 3 is high hot material, comprise copper, aluminium or aluminium oxide, the equal and opposite in direction of fin 3 or be slightly less than the size that right pin 22 is positioned at plastic-sealed body part, soldering or high heat conduction is adopted between fin 3 and pin 2, high-temperature plastic adhesion, there is fabulous radiating effect, especially anti-pulse power (or electric current) impact capacity increases substantially.In addition, power device inside adopts sandwich structure, and upper and lower pad adopts the metallurgical bonding method welding of a class, makes hot-fluid loop shorter, and can two-wayly dispel the heat.
When adopting copper radiating rib, high temperature tinol directly can be adopted to weld, and synchronously can carry out with chips welding, heat-transfer effect is good, and production efficiency is high; When adopting aluminium radiator fin, first carry out surface oxidation and coldly cover copper technology, then adopting high temperature tin cream to weld with pin; When adopting aluminium oxide ceramics fin, first prepared surface metallization, adopts palladium-silver slurry high-temperature firing, then adopts high temperature tin cream to weld with pin.Known, the embedded fin of the present invention is not be simply embedded in plastic-sealed body by fin, but will take different processing modes and different welding methods according to the difference of the structure of device and fin material.
The surface mount power device packaging structure of embedded fin of the present invention, when ensureing compatible most of similar encapsulation, improve radiating effect, the product encapsulated is made to have lower thermal resistance, steady state heat resistance comparatively with other packing forms of overall dimension reduces about 5%, transient thermal resistance reduces about 50%, the power density (W/mm of encapsulation
2) dress raising about 12%, improve the reliability of device.
Above only describes general principle of the present invention and preferred implementation, those skilled in the art can make many changes and improvements according to foregoing description, and these changes and improvements should belong to protection scope of the present invention.
Claims (5)
1. the surface mount power device packaging structure of an embedded fin, comprise plastic-sealed body (1), be provided with pin (2) in plastic-sealed body and pin extend out to outside plastic-sealed body, it is characterized in that: the upper surface that described pin (2) is positioned at plastic-sealed body part is provided with fin (3).
2. encapsulating structure according to claim 1, it is characterized in that: described pin (2) comprises shape and is left pin (21) and the right pin (22) that bag-like is returned in bending, the part that left pin and right pin are positioned at the outer two ends of plastic-sealed body is symmetrical, the part that described left pin (21) is positioned at plastic-sealed body is arranged at the below that right pin (22) is positioned at the part of plastic-sealed body, and fin (3) is arranged at the upper surface that right pin (22) is positioned at plastic-sealed body part.
3. encapsulating structure according to claim 1 and 2, is characterized in that: the size of described fin (3) is not more than the size that right pin (22) is positioned at plastic-sealed body part.
4. encapsulating structure according to claim 1, is characterized in that: described fin (3) is copper, aluminium or aluminium oxide.
5. encapsulating structure according to claim 1, is characterized in that: described pin (2) material is copper, and pin thickness is 0.14mm-0.35mm, and its surface is coated with pure tin, and tin thickness is 0.005mm-0.03mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610046289.XA CN105529320A (en) | 2016-01-25 | 2016-01-25 | Surface mounting power device packaging structure with embedded cooling fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610046289.XA CN105529320A (en) | 2016-01-25 | 2016-01-25 | Surface mounting power device packaging structure with embedded cooling fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105529320A true CN105529320A (en) | 2016-04-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610046289.XA Pending CN105529320A (en) | 2016-01-25 | 2016-01-25 | Surface mounting power device packaging structure with embedded cooling fin |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263094A (en) * | 2011-08-14 | 2011-11-30 | 绍兴旭昌科技企业有限公司 | Non-interconnected multi-chip package diode |
| CN102437140A (en) * | 2010-09-08 | 2012-05-02 | 文科泰克控股公司 | Power semiconductor module having sintered metal connections and production method |
| CN104465594A (en) * | 2014-11-21 | 2015-03-25 | 朱艳玲 | Rectification component with embedded cooling fins and manufacturing method thereof |
| CN204257703U (en) * | 2014-12-06 | 2015-04-08 | 滨海治润电子有限公司 | A kind of diode being convenient to dispel the heat |
| CN105070703A (en) * | 2015-07-16 | 2015-11-18 | 山东晶导微电子有限公司 | Rectifier bridge packaging structure with high heat radiating performance |
| CN205508811U (en) * | 2016-01-25 | 2016-08-24 | 山东晶导微电子有限公司 | Surface mounting power device packaging structure of high heat dissipating ability |
-
2016
- 2016-01-25 CN CN201610046289.XA patent/CN105529320A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437140A (en) * | 2010-09-08 | 2012-05-02 | 文科泰克控股公司 | Power semiconductor module having sintered metal connections and production method |
| CN102263094A (en) * | 2011-08-14 | 2011-11-30 | 绍兴旭昌科技企业有限公司 | Non-interconnected multi-chip package diode |
| CN104465594A (en) * | 2014-11-21 | 2015-03-25 | 朱艳玲 | Rectification component with embedded cooling fins and manufacturing method thereof |
| CN204257703U (en) * | 2014-12-06 | 2015-04-08 | 滨海治润电子有限公司 | A kind of diode being convenient to dispel the heat |
| CN105070703A (en) * | 2015-07-16 | 2015-11-18 | 山东晶导微电子有限公司 | Rectifier bridge packaging structure with high heat radiating performance |
| CN205508811U (en) * | 2016-01-25 | 2016-08-24 | 山东晶导微电子有限公司 | Surface mounting power device packaging structure of high heat dissipating ability |
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Application publication date: 20160427 |
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