CN203553161U - Upside-down mounting LED lamp strip - Google Patents
Upside-down mounting LED lamp strip Download PDFInfo
- Publication number
- CN203553161U CN203553161U CN201320614580.4U CN201320614580U CN203553161U CN 203553161 U CN203553161 U CN 203553161U CN 201320614580 U CN201320614580 U CN 201320614580U CN 203553161 U CN203553161 U CN 203553161U
- Authority
- CN
- China
- Prior art keywords
- led lamp
- lamp bar
- type electrode
- led chip
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Led Device Packages (AREA)
Abstract
The utility model discloses an upside-down mounting LED lamp strip comprising a glass circuit board, at least one LED chip and a protection layer, wherein the bottom of each LED chip is provided with an N-type electrode and a P-type electrode; the N-type electrode and the P-type electrode are respectively connected with one side of the glass circuit board; the protection layer is wrapped on the LED chip. The upside-down mounting LED lamp strip can fully utilize LED light source to realize omnibearing illumination; the glass circuit board is high in heat resistance, high temperature resistant, and high in radiation performance, thereby prolonging the service life of the LED lamp strip in certain level.
Description
Technical field
The utility model relates to LED field, relates in particular to a kind of flip LED lamp bar.
Background technology
Existing LED lamp bar, because the power density of LED chip is very high, this just needs the designer of LED chip device and producer to cooling system, to be optimized meter at aspects such as structure and materials.
Exploitation gradually along with high-power LED chip, for effectively discharging the hot technology that LED chip produces, be also developed thereupon, in order more to improve the radiating efficiency of LED chip, normally LED chip is encapsulated on a substrate, and this substrate is made by metal material conventionally, and by wire-bonded, realize the electrical connection of LED chip and substrate.
But therefore the poor thermal conductivity of formed insulating barrier on metal substrate, even if used metal substrate also cannot avoid the problem that thermal conductivity is low.And the wiring board of current LED lamp bar also great majority adopts PCB wiring boards, it does not have light transmission yet.Cannot accomplish that LED packaging body is omnibearing luminous.
Therefore, if the heat radiation of LED chip cannot normally realize, as a kind of LED chip of semiconductor device, because heat radiation wavelength changes, thereby the emission efficiency that produces yellowing phenomenon or light can reduce, and while at high temperature operating, the life-span of LED encapsulation may shorten, thereby to be improved be the core of encapsulating structure and technique to the structure that the heat that LED chip is produced dispels the heat.
Utility model content
The purpose of this utility model is to provide a kind of LED lamp bar of upside-down mounting, and it can realize the luminous in all directions of LED.
For achieving the above object, the utility model is by the following technical solutions:
A kind of LED lamp bar of upside-down mounting; it comprises: glass wiring board, and at least one LED chip and protective layer, wherein the bottom of each LED chip is provided with N-type electrode and P type electrode; described N-type electrode is connected with the one side of glass wiring board respectively with P type electrode, and described protective layer is wrapped on LED chip.
Preferably, described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located between each LED chip and protective layer.
Preferably, described N-type electrode and P type electrode respectively by scolder be connected, eutectic connects or die bond connects and is connected with the one side of glass wiring board.
Preferably, described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located on the another side of glass wiring board.
Preferably, the end face of described LED lamp bar is also provided with protector plate for glass, and described protective layer is filled in the place, gap between glass wiring board and protector plate for glass.
Preferably, described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located at respectively glass wiring board and protector plate for glass on the face of LED chip.
The utility model adopts above technical scheme, by LED chip is directly encapsulated on glass wiring board, relatively original LED chip need first be encapsulated on metal substrate, be encapsulated into again on PCB wiring board, saved processing step, provide cost savings, and can accomplish the omnibearing luminous of LED chip, improved the brightness of LED chip; Another glass wiring board has higher heat-resisting and heat-resisting quantity, has extended to a certain extent the useful life of LED lamp bar, and glass wiring board also has better heat dispersion simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment mono-;
Fig. 2 is the structural representation of the utility model embodiment bis-;
Fig. 3 is the structural representation of the utility model embodiment tri-;
Fig. 4 is the structural representation of the utility model embodiment tetra-.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, the utility model provides a kind of LED lamp bar of upside-down mounting, and it comprises: glass wiring board 1; Be located at the LED chip 2 in glass wiring board 1 one side, wherein the bottom of LED chip 2 is provided with N-type electrode 21 and P type electrode 22, and described N-type electrode 21 and P type electrode 22 are fixed in the one side of glass wiring board 1 by scolder 3 respectively; Protective layer 4: described protective layer 4 is wrapped on LED chip 2; Phosphor powder layer 6, described phosphor powder layer 6 is located between LED chip 2 and protective layer 4.The electrode of N-type described in the utility model 21 can also be connected by eutectic respectively with P type electrode 22 or die bond connection is connected with the one side of glass wiring board 1.
Embodiment bis-:
As shown in Figure 2, different from embodiment mono-, the LED lamp bar of embodiment bis-, its top at LED lamp bar is also provided with protector plate for glass 8, and described protective layer 4 is filled in the place, gap between glass wiring board 1 and glass protector plate for glass 8.
Embodiment tri-:
As shown in Figure 3, different from embodiment mono-, the phosphor powder layer 6 in embodiment tri-is arranged on glass wiring board 5 on the face of the LED chip of upside-down mounting.
Embodiment tetra-:
As shown in Figure 4; different from embodiment mono-is; LED lamp bar in embodiment tetra-; its top at LED lamp bar is also provided with a protector plate for glass 8; described protective layer 4 is filled in place, gap between glass wiring board 1 and protector plate for glass 8, and phosphor powder layer 6 is arranged on glass wiring board 1 and protector plate for glass 8 on the face of the LED chip of upside-down mounting.
The utility model is by adopting glass wiring board 1 and protector plate for glass 8, realized LED chip omnibearing luminous of upside-down mounting, the brightness that has improved the LED chip of upside-down mounting; Glass wiring board 1 has higher heat-resisting and heat-resisting quantity in addition, has extended to a certain extent the useful life of LED lamp bar.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (6)
1. the LED lamp bar of a upside-down mounting; it is characterized in that; comprise: glass wiring board; at least one LED chip and protective layer; wherein the bottom of each LED chip is provided with N-type electrode and P type electrode; described N-type electrode is connected with the one side of glass wiring board respectively with P type electrode, and described protective layer is wrapped on LED chip.
2. LED lamp bar according to claim 1, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located between LED chip and protective layer.
3. LED lamp bar according to claim 1, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located on the another side of glass wiring board.
4. LED lamp bar according to claim 1, is characterized in that: described N-type electrode and P type electrode respectively by scolder be connected, eutectic connects or die bond connects and is connected with the one side of glass wiring board.
5. LED lamp bar according to claim 1, is characterized in that: the end face of described LED lamp bar is also provided with protector plate for glass, and described protective layer is filled in the place, gap between glass wiring board and protector plate for glass.
6. LED lamp bar according to claim 5, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located at respectively glass wiring board and protector plate for glass on the face of LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320614580.4U CN203553161U (en) | 2013-09-30 | 2013-09-30 | Upside-down mounting LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320614580.4U CN203553161U (en) | 2013-09-30 | 2013-09-30 | Upside-down mounting LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553161U true CN203553161U (en) | 2014-04-16 |
Family
ID=50471241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320614580.4U Expired - Fee Related CN203553161U (en) | 2013-09-30 | 2013-09-30 | Upside-down mounting LED lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553161U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979462A (en) * | 2015-07-22 | 2015-10-14 | 厦门腾月光电科技有限公司 | 360-degree transparent LED glass and preparation method thereof |
-
2013
- 2013-09-30 CN CN201320614580.4U patent/CN203553161U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979462A (en) * | 2015-07-22 | 2015-10-14 | 厦门腾月光电科技有限公司 | 360-degree transparent LED glass and preparation method thereof |
| CN104979462B (en) * | 2015-07-22 | 2018-02-16 | 厦门腾月光电科技有限公司 | A kind of 360 degree of transparency LED glass and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20180930 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |