CN205264699U - Energy -efficient LED filament - Google Patents
Energy -efficient LED filament Download PDFInfo
- Publication number
- CN205264699U CN205264699U CN201521133456.1U CN201521133456U CN205264699U CN 205264699 U CN205264699 U CN 205264699U CN 201521133456 U CN201521133456 U CN 201521133456U CN 205264699 U CN205264699 U CN 205264699U
- Authority
- CN
- China
- Prior art keywords
- led chip
- conductor
- circuit
- filament
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 230000005496 eutectics Effects 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides an energy -efficient LED filament, includes base plate, LED chip, the substrate surface is equipped with the circuit, the LED chip is connected on the circuit, break off mutually between the circuit, the LED chip is located between two adjacent circuits to with adjacent circuit connection, and mind -set both ends orientation equidistance reduces gradually in the distance follow base plate between the adjacent LED chip, the base plate both ends are equipped with the conductor, the LED chip passes through the metal wire to be connected with the conductor, still includes the sheetmetal, the sheetmetal includes connecting portion, assembly portion, assembly portion is equipped with the slot that corresponds with the conductor, assembly portion passes through slot and conductor fixed connection. The utility model discloses rationally set up the distance between the LED chip to improve the heat -sinking capability of filament, and then improved the ability of the real load power of filament, reached energy -concerving and environment -protective effect. Adopt the mode of pegging graft to be connected between sheetmetal and the base plate conductor and adopt eutectic solder to do further fixing, effectively improved the stability of junction.
Description
Technical field
The utility model relates to LED field, espespecially a kind of high-efficiency energy-saving LED filament.
Background technology
At present, the application of LED is more and more extensive, and LED is a kind of solid-state semiconductor devices that can be visible ray by electric energy conversion, and it can directly be converted into light electricity. The features such as that LED light source has is energy-conservation, long-lived, environmental protection, solid-state encapsulation, the LED filament lamp of prior art is not easy to accomplish to be greater than the lamp of 850lm, and its key is that the area of dissipation of filament is little, and LED chip can not be given full play to the ability of the bearing power of itself; LED filament is mainly by being fixed on chip on substrate by crystal-bonding adhesive, welding metal wire connects again, but metal wire can have influence on bright dipping, and existing LED filament is all the LED chip that arranges in substrate equal intervals, and the heat sending due to each LED chip is constant, heat between each LED chip is overlaying state, substantially concentrate on substrate medium position, now substrate middle part is in high heat state, heat skewness, cause power consumption too large, and energy-conservation not. Also have a lot of LED filaments in use, because heat radiation causes temperature higher not, and then make the junction between sheet metal and substrate softening, make the less stable of LED filament.
Utility model content
For addressing the above problem, the utility model provides that a kind of thermal diffusivity is good, the high-efficiency energy-saving LED filament of the high and low power consumption of stability.
For achieving the above object, the technical solution adopted in the utility model is: a kind of high-efficiency energy-saving LED filament, comprise substrate, LED chip, described substrate surface is provided with circuit, described LED chip is connected on circuit, between described circuit, disconnect mutually, described LED chip is located between two adjacent circuits, and be connected with adjacent circuit, and the distance between adjacent LED chip reduces to direction of both ends is equidistant gradually from substrate center, described substrate two ends are provided with conductor, described LED chip is connected with conductor by metal wire, also comprise sheet metal, described sheet metal comprises connecting portion, department of assembly, described department of assembly is provided with the slot corresponding with conductor, described department of assembly is fixedly connected with conductor by slot.
Particularly, described circuit comprises conductive silver layer, conducting wire, and described conductive silver layer connects by conducting wire.
Particularly, described conducting wire adopts transparent conductive material to make.
Particularly, between the department of assembly of described sheet metal and conductor, adopt that eutectic is soldered to be connect.
Particularly, described substrate is transparency carrier, and described substrate surface is coated with luminous bisque.
The beneficial effects of the utility model are: the utility model rationally arranges the distance between LED chip, reduce the heat at middle part when LED filament uses, make the heat of whole piece LED filament distribute more even, thereby improve the heat-sinking capability of filament, and then improved the ability of the pay(useful) load power of filament, reach the effect of energy-conserving and environment-protective. Adopt conducting wire to adopt transparent conductive material to make, LED chip bright dipping is not stopped, maximum possible increases chip and gets light rate, adopts the mode of pegging graft to be connected between sheet metal and substrate conductor, eutectic weldering work is further fixing with adopting, and has effectively improved the stability of junction.
Brief description of the drawings
Fig. 1 is Facad structure schematic diagram of the present utility model.
Fig. 2 is side structure schematic diagram of the present utility model.
Fig. 3 is the structural representation of the utility model substrate.
Drawing reference numeral explanation: 1. substrate; 11. conductors; 2.LED chip; 3. circuit; 31. conductive silver layers; 32. conducting wires; 4. metal wire; 5. sheet metal; 51. connecting portions; 52. departments of assembly; 6. luminous bisque.
Detailed description of the invention
Refer to shown in Fig. 1-3, the utility model is about a kind of high-efficiency energy-saving LED filament, comprise substrate 1, LED chip 2, described substrate 1 surface is provided with circuit 3, described LED chip 2 is connected on circuit 3, between described circuit 3, disconnect mutually, described LED chip 2 is located between two adjacent circuits 3, and be connected with adjacent circuit 3, and the mind-set direction of both ends from substrate 1 of the distance between adjacent LED chip 2 is equidistant to be reduced gradually, described substrate 1 two ends are provided with conductor 11, 2, described LED core is connected with conductor 11 by metal wire 4, also comprise sheet metal 5, described sheet metal 5 comprises connecting portion 51, department of assembly 52, described department of assembly 52 is provided with the slot corresponding with conductor 11, described department of assembly 52 is fixedly connected with conductor 11 by slot.
Compared with prior art, the utility model rationally arranges the distance between LED chip 2, reduce the heat at middle part when LED filament uses, make the heat of whole piece LED filament distribute more even, thereby improve the heat-sinking capability of filament, and then improved the ability of the pay(useful) load power of filament, reach the effect of energy-conserving and environment-protective. Between sheet metal 5 and substrate 1 conductor 11, adopt the mode of pegging graft to be connected, effectively improved the stability of junction.
Particularly, described circuit 3 comprises conductive silver layer 31, conducting wire 32, and described conductive silver layer 31 connects by conducting wire 32.
Particularly, described conducting wire 32 adopts transparent conductive material to make.
Adopt such scheme, conducting wire 32 adopts transparent conductive material to make, and LED chip 2 bright dippings are not stopped, maximum possible increases LED chip 2 and gets light rate.
Particularly, between the department of assembly 52 of described sheet metal 5 and conductor 11, adopt that eutectic is soldered to be connect.
Adopt such scheme, adopt eutectic weldering to do further fixing, improve the fastness of junction.
Particularly, described substrate 1 is transparency carrier 1, and described substrate 1 surface is coated with luminous bisque 6.
Below by specific embodiment, the utility model is further described.
This specific embodiment substrate 1 surface is provided with circuit 3, LED chip 2 is connected on circuit 3, this circuit 3 is made up of conductive silver layer 31, conducting wire 32, between circuit 3, disconnect mutually, LED chip 2 is located between two adjacent circuits 3, and is connected with the conductive silver layer 31 of adjacent circuit 3 by tin cream, and conducting wire 32 adopts transparent conductive material to make as electrically conducting transparent ink, LED chip 2 bright dippings are not stopped, maximum possible increases LED chip 2 and gets light rate; Substrate 1 two ends are provided with conductor 11, and LED chip 2 is connected with conductor 11 by metal wire 4, adopt the mode of pegging graft to be connected between sheet metal 5 and substrate 1 conductor 11, and use eutectic weldering further fixing, improve stability and the fastness of junction. On this specific embodiment substrate 1, be arranged with odd number LED chip 2, and distance between adjacent LED chip 2 reduces to direction of both ends is equidistant gradually from the LED chip 2 at substrate 1 center, effectively improve the radiating effect of filament, thereby improve the stability of filament.
Above embodiment is only that preferred embodiment of the present utility model is described; not scope of the present utility model is limited; do not departing under the prerequisite of the utility model design spirit; various distortion and improvement that the common engineers and technicians in this area make the technical solution of the utility model, all should fall in the definite protection domain of claims of the present utility model.
Claims (5)
1. a high-efficiency energy-saving LED filament, comprise substrate, LED chip, described substrate surface is provided with circuit, described LED chip is connected on circuit, it is characterized in that: between described circuit, disconnect mutually, described LED chip is located between two adjacent circuits, and be connected with adjacent circuit, and the distance between adjacent LED chip reduces to direction of both ends is equidistant gradually from substrate center, described substrate two ends are provided with conductor, described LED chip is connected with conductor by metal wire, also comprise sheet metal, described sheet metal comprises connecting portion, department of assembly, described department of assembly is provided with the slot corresponding with conductor, described department of assembly is fixedly connected with conductor by slot.
2. a kind of high-efficiency energy-saving LED filament according to claim 1, is characterized in that: described circuit comprises conductive silver layer, conducting wire, and described conductive silver layer connects by conducting wire.
3. a kind of high-efficiency energy-saving LED filament according to claim 2, is characterized in that: described conducting wire adopts transparent conductive material to make.
4. a kind of high-efficiency energy-saving LED filament according to claim 1, is characterized in that: between the department of assembly of described sheet metal and conductor, adopt that eutectic is soldered to be connect.
5. a kind of high-efficiency energy-saving LED filament according to claim 1, is characterized in that: described substrate is transparency carrier, and described substrate surface is coated with luminous bisque.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521133456.1U CN205264699U (en) | 2015-12-30 | 2015-12-30 | Energy -efficient LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521133456.1U CN205264699U (en) | 2015-12-30 | 2015-12-30 | Energy -efficient LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205264699U true CN205264699U (en) | 2016-05-25 |
Family
ID=56006209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521133456.1U Expired - Fee Related CN205264699U (en) | 2015-12-30 | 2015-12-30 | Energy -efficient LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205264699U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298751A (en) * | 2016-08-24 | 2017-01-04 | 江西联创光电科技股份有限公司 | A kind of LED filament |
| CN106969276A (en) * | 2017-05-11 | 2017-07-21 | 四川鋈新能源科技有限公司 | Flexible LED filament and LED |
| CN107036054A (en) * | 2017-05-27 | 2017-08-11 | 重庆新天阳照明科技股份有限公司 | A kind of LED lamp panel for being printed with electrically conductive ink, the manufacture craft of LED lamp panel and refrigerator integrated LED lamp |
-
2015
- 2015-12-30 CN CN201521133456.1U patent/CN205264699U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298751A (en) * | 2016-08-24 | 2017-01-04 | 江西联创光电科技股份有限公司 | A kind of LED filament |
| CN106298751B (en) * | 2016-08-24 | 2018-11-20 | 江西联创光电科技股份有限公司 | A kind of LED filament |
| CN106969276A (en) * | 2017-05-11 | 2017-07-21 | 四川鋈新能源科技有限公司 | Flexible LED filament and LED |
| CN107036054A (en) * | 2017-05-27 | 2017-08-11 | 重庆新天阳照明科技股份有限公司 | A kind of LED lamp panel for being printed with electrically conductive ink, the manufacture craft of LED lamp panel and refrigerator integrated LED lamp |
| CN107036054B (en) * | 2017-05-27 | 2023-05-12 | 重庆新天阳照明科技股份有限公司 | LED lamp panel printed with conductive ink, manufacturing process of LED lamp panel and integrated LED lamp for refrigerator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170607 Address after: Baoan District Xixiang street Shenzhen city Guangdong province 518000 Nanchang community port channel beside the oyster industry logistics park A Building 5 floor (gate 2) Patentee after: SHENZHEN LIANSHANG PHOTOELECTRIC CO.,LTD. Address before: Ssangyong Village second 417600 Lang Xinhua County of Hunan Province Town Village Group No. 008 Patentee before: Dai Peng |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160525 |