CN106969276A - Flexible LED filament and LED - Google Patents
Flexible LED filament and LED Download PDFInfo
- Publication number
- CN106969276A CN106969276A CN201710332122.4A CN201710332122A CN106969276A CN 106969276 A CN106969276 A CN 106969276A CN 201710332122 A CN201710332122 A CN 201710332122A CN 106969276 A CN106969276 A CN 106969276A
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- Prior art keywords
- flexible
- led filament
- base board
- led
- flexible base
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- 230000004888 barrier function Effects 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 63
- 229910052751 metal Inorganic materials 0.000 claims description 63
- 239000004065 semiconductor Substances 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 15
- 230000001105 regulatory effect Effects 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000006071 cream Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 9
- 238000001816 cooling Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
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- 239000000084 colloidal system Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 206010023126 Jaundice Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000008246 gaseous mixture Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/345—Current stabilisation; Maintaining constant current
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
- H05B45/56—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving measures to prevent abnormal temperature of the LEDs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a kind of flexible LED filament and LED, belong to LED filament field.The flexible LED filament includes flexible base board, multiple LED chips, insulating barrier, fluorescent glue and line layer, the flexible base board includes luminous component and radiator portion, by the way that the distance between two neighboring described LED chip in multiple LED chips is gradually reduced along the center of luminous component to the direction at the two ends of luminous component, so as to reduce the heat when flexible LED filament is used in the middle part of luminous component, furthermore, the heat of the flexible LED filament luminous component can further be shed by the radiator portion in flexible base board, and then improve the ability of the heat-sinking capability of flexible LED filament and the pay(useful) load of the flexible LED filament, the effect of energy-conserving and environment-protective is reached.
Description
Technical field
The present invention relates to LED filament field, in particular to a kind of flexible LED filament and LED.
Background technology
Light emitting diode (LightingEmittingDiode, abbreviation LED) filament is that multiple LED chips are connected to fix
On the glass substrate, then overmold completion is carried out.The LED ball similar to incandescent lamp form can be produced with LED filament to steep
Lamp, i.e. LED filament lamp, LED filament lamp can realize 360 degree it is all-round luminous.LED filament light fixture have the form similar to incandescent lamp and
Distribution curve flux, is the optimal light source of replacement incandescent lamp truly.
Existing LED is poor due to LED filament heat-sinking capability, the wattage very little of LED.Even if it is small again that LED wattage is done,
The heat that can not be shed is accumulated on LED filament for a long time, can also cause the colloid in LED chip to expand, stretching LED chip
Welding gold thread causes gold thread break, and LED chip power-off does not work, so that the problem of causing LED dead lamp.
Also, existing LED filament is all to set LED chip at equal intervals on substrate, is sent due to each LED chip
Heat is constant, and heat between each LED chip is in overlaying state, the heterogeneity phantom of LED filament in it is middle it is high gradually to
Two ends reduce, i.e. heat distribution is very uneven, portion position in a substrate in baseset.The height of substrate medium position during use
Heat, the LED chip light decay degree for easily causing centre position is big, or even failure, and the jaundice of middle part colloid, and temperature is higher in addition
The internal stress of corresponding generation is bigger, so as to can cause easy broken string of metal wire of temperature eminence etc..The heat of same whole substrate
Field distribution is uneven, and the LED chip attenuation degree of diverse location can be caused to differ, and diverse location colloid degree of aging not
One, cause product to produce color and float, brightness, color etc. are inconsistent, or even cause product electrically bad and failure.
The content of the invention
It is an object of the invention to provide a kind of flexible LED filament and LED, to improve above mentioned problem.
What embodiments of the invention were realized in：
A kind of flexible LED filament, the flexible LED filament includes flexible base board, multiple LED chips, insulating barrier, fluorescent glue
And line layer, the flexible base board include radiator portion and luminous component, the luminous component of the flexible base board it is relative
The insulating barrier is provided with two sides, is provided with the line layer, the line layer and is provided with each insulating barrier
The fluorescent glue is coated with the multiple LED chip, the multiple LED chip, the line layer two ends are respectively arranged with just
Electrode and negative electrode, the line layer include the conducting line segment being sequentially arranged at intervals along the line layer length direction, each described
LED chip is arranged between the adjacent conducting line segment, makes the multiple LED chip being cascaded in the positive electrode and institute
The distance between formation conducting loop between negative electrode, and two neighboring described LED chip are stated along the luminous of the flexible base board
The direction at partial center to the two ends of the luminous component is gradually reduced.
In preferred embodiments of the present invention, the radiator portion of the flexible base board is along perpendicular to the flexible base board
Direction be disposed with the first conducting metal, semiconductor, the second conducting metal, insulator, it is first conducting metal, described
Second conducting metal is connected with the semi-conductor electricity respectively.
In preferred embodiments of the present invention, the semiconductor includes multiple P poles semiconductor and multiple N poles semiconductor, institute
State multiple P poles semiconductor and the multiple N poles semiconductor is evenly spaced in first conducting metal and second conductive gold
Between category.
In preferred embodiments of the present invention, adjacent P poles semiconductor and N poles semiconductor passes through described first
Conducting metal is connected in series with second conducting metal.
In preferred embodiments of the present invention, the two ends of each P poles semiconductor connect first conductive gold respectively
Category and second conducting metal, the two ends of each N poles semiconductor connect first conducting metal and described the respectively
Two conducting metals, the multiple P poles semiconductor and the multiple N poles semiconductor are staggered.
In preferred embodiments of the present invention, the length direction of the luminous component of the flexible base board along the flexible base board
Multiple fixing holes are arranged at intervals with by pre-determined distance.
In preferred embodiments of the present invention, the positive electrode in the multiple fixing hole with being located at the flexible base board
The fixing hole of one end overlap, the other end positioned at the flexible base board in the negative electrode and the multiple fixing hole
A fixing hole overlap.
In preferred embodiments of the present invention, the flexible base board is provided at both ends with corrugated metal terminal, Mei Gesuo
The one end for stating metal terminal is connected by tin cream with the line layer of the flexible base board, and each the metal terminal is another
Hold for connecting external drive power supply.
A kind of LED, the LED includes stem, cell-shell, lamp holder, driving power supply and flexible LED filament, the driving
Power supply is arranged in the lamp holder, and the driving power supply is coupled with the flexible LED filament, and the flexible LED filament is connected to
On the stem, the stem is installed in the lamp holder, the cell-shell and lamp holder formation internal cavity, the flexibility
LED filament and stem are respectively positioned in the internal cavity.
In preferred embodiments of the present invention, the driving power supply includes the power supply circuit being sequentially connected and control circuit,
The power supply circuit is connected with external input power, and the control circuit is connected with the flexible LED filament；The control circuit
Including wireless transceiver circuit, process circuit and brightness regulating circuit, the wireless transceiver circuit is used to receive user terminal transmission
Brightness regulation control instruction, the wireless transceiver circuit is connected with the process circuit, the process circuit and the power supply
Circuit is connected, and the process circuit is also connected with the brightness regulating circuit, the brightness regulating circuit and the flexible LED lamp
Silk connection.
The beneficial effect of the embodiment of the present invention is：
The embodiment of the present invention provides a kind of flexible LED filament and LED, and the flexible base board of the flexible LED filament includes hair
Light part and radiator portion, by by the distance between two neighboring described LED chip in multiple LED chips along the flexibility
The direction at the center of the luminous component of substrate to the two ends of the luminous component is gradually reduced, so as to reduce the flexible LED lamp
Heat of silk when using in the middle part of luminous component so that the heat distribution of whole piece flexible LED filament is more uniform, furthermore, by
The radiator portion of the flexible base board can further shed the heat of the flexible LED filament luminous component, and then improve soft
The heat-sinking capability of property LED filament and the ability of the pay(useful) load of the flexible LED filament, have reached the effect of energy-conserving and environment-protective.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be attached to what is used required in embodiment
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore is not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is a kind of structural representation of flexible LED filament provided in an embodiment of the present invention；
Fig. 2 is a kind of structural representation of flexible base board luminous component provided in an embodiment of the present invention；
Fig. 3 is the structural representation of another flexible base board luminous component provided in an embodiment of the present invention；
Fig. 4 is a kind of structural representation of the radiator portion of flexible base board provided in an embodiment of the present invention；
Fig. 5 is refer to, Fig. 5 is a kind of structural representation of metal terminal provided in an embodiment of the present invention；
Fig. 6 is a kind of structural representation of LED provided in an embodiment of the present invention；
Fig. 7 is a kind of structured flowchart of driving power supply provided in an embodiment of the present invention；
Fig. 8 is a kind of circuit theory diagrams of brightness regulating circuit provided in an embodiment of the present invention.
Icon：200-LED lamps；210- cell-shells；220- stems；230- lamp holders；240- driving power supplies；242- power supply circuits；
244- controls circuit；2442- wireless transceiver circuits；2444- process circuits；2446- brightness regulating circuits；100- flexible LED lamps
Silk；110- flexible base boards；112- metal terminals；114- apertures；120- luminous components；121- insulating barriers；122- line layers；
Many fixing holes of 1221-；1222- conducting line segments；Many LED chips of 123-；124- fluorescent glues；130- radiator portions；132- first
Conducting metal；134- semiconductors；The conducting metals of 136- second；138- insulators.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.The present invention implementation being generally described and illustrated herein in the accompanying drawings
The component of example can be arranged and designed with a variety of configurations.
Therefore, the detailed description of embodiments of the invention below to providing in the accompanying drawings is not intended to limit claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiment in the present invention, this area is common
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it further need not be defined and explained in subsequent accompanying drawing.
In the description of the invention, it is necessary to explanation, term " " center ", " on ", " under " etc. instruction orientation or position
Relation is or the orientation or position that the invention product is usually put when using based on orientation shown in the drawings or position relationship
Relation, is for only for ease of the description present invention and simplifies description, rather than indicate or imply that the device or element of meaning must have
There is specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " the
One ", " second ", " the 3rd " etc. are only used for distinguishing description, and it is not intended that indicating or implying relative importance.
In the description of the invention, in addition it is also necessary to explanation, unless otherwise clearly defined and limited, term " setting ",
" coupling ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or one
Connect body；Can be mechanical connection or electrical connection；Can be joined directly together, can also be indirect by intermediary
It is connected, can is the connection of two element internals.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
Other features and advantages of the present invention will be illustrated in subsequent specification, also, partly be become from specification
It is clear that or being understood by implementing the embodiment of the present invention.The purpose of the present invention and other advantages can be by being write
Specifically noted structure is realized and obtained in specification, claims and accompanying drawing.
Fig. 1 is refer to, Fig. 1 is a kind of structural representation of flexible LED filament 100 provided in an embodiment of the present invention, described
Flexible LED filament 100 includes flexible base board 110, multiple LED chips 123, insulating barrier 121, fluorescent glue 124 and line layer 122.
The flexible base board 110 includes radiator portion 130 and luminous component 120, and the basic luminous component 120 of the flexibility is for being sent out
The insulating barrier 121 is provided with light, and the opposing sides of the basic luminous component 120 of the flexibility, each insulating barrier
The line layer 122 is provided with 121, the multiple LED chip 123 is provided with each line layer 122, it is the multiple
The fluorescent glue 124 is coated with LED chip 123, so that the flexible LED filament 100 can be by fluorescent glue 124 from flexible base
The two sides of plate 110 lights simultaneously.
Wherein, the flexible base board 110 can be transparent flexible base board 110, or the flexibility of coloured high printing opacity
Substrate 110, its material can be polyimides, and the advantage of polyimides is with good mechanical performance, very high resistance to irradiation
Performance and dielectric properties etc..It is any that flexible base board 110 may be such that the flexible LED filament 100 can be bent to any angle
Shape, the flexible LED filament 100 also can normal luminous, improve the sight and aesthetic property of LED.
In addition, in the present embodiment, the insulating barrier 121 uses printing opacity or transparent flexible material, flexible base board 110
Using transparent flexible substrate 110 so that the light of multiple LED chips 123 can pass through the insulating barrier 121, so as to realize the flexibility
360 degree of LED filament 100 light.As a kind of embodiment, the insulating barrier 121 can use flexible thin-film material, example
Such as, polyalkylene imine film, polyalkylene imine film is in yellow transparent, is made by pyromellitic acid anhydride with diphenyldiamine, with protrusion
High temperature resistant, radiation hardness, resistant to chemical etching and electrical insulation capability, can for a long time be used in 250~280 DEG C of air.
Fig. 2 is refer to, Fig. 2 is a kind of structural representation of the luminous component 120 of flexible base board 110 provided in an embodiment of the present invention
Figure.The two ends of line layer 122 are respectively arranged with positive electrode and negative electrode, for being connected with external drive power supply, the circuit
Layer 122 includes the conducting line segment 1222 being sequentially arranged at intervals along the length direction of line layer 122, and each LED chip is set
It is connected between the adjacent conducting line segment 1222 and with conducting line segment 1222, the multiple LED chip 123 being cascaded is existed
Form conducting loop between the positive electrode and the negative electrode, and the distance between two neighboring described LED chip is along described
The direction at the center of the luminous component 120 of flexible base board 110 to the two ends of the luminous component 120 is gradually reduced.
It should be noted that each LED chip is provided between two neighboring conducting line segment 1222, and it is two neighboring
The center of luminous component 120 of the distance between the described LED chip along the flexible base board 110 is to the luminous component 120
The direction at two ends is gradually reduced, so, the length of each conducting line segment 1222 is different, for example, close to the luminous component of flexible base board 110
The length of conducting line segment 1222 of 120 center position is most long, and the length of remaining conducting line segment 1222 is to the two ends of luminous component 120
It is gradually reduced, so that luminous component of the distance between the two neighboring described LED chip along the flexible base board 110
The direction at 120 center to the two ends of the luminous component 120 is gradually reduced, and is used so as to reduce the flexible LED filament 100
When the middle part of luminous component 120 heat so that the heat distribution of whole piece flexible LED filament 100 is more uniform, improves high flexibility
The heat-sinking capability of LED filament 100.
Fig. 3 is refer to, Fig. 3 shows for the structure of another luminous component 120 of flexible base board 110 provided in an embodiment of the present invention
It is intended to.For the ease of the various uses for illuminating occasions in practice of flexible LED filament 100, in the illuminating part of the flexible base board 110
120 are divided to be additionally provided with multiple fixing holes 1221, the positive electricity by pre-determined distance interval along the length direction of the flexible base board 110
Pole is overlapped with a fixing hole of one end positioned at the flexible base board 110 in the multiple fixing hole 1221, the negative electricity
Pole is overlapped with a fixing hole of the other end positioned at the flexible base board 110 in the multiple fixing hole 1221.In reality
In use, fixing hole can be directly installed on illuminating bracket, can be bent between each fixing hole it is angled so that more
Plus facilitate the use of flexible LED filament 100 in practice.
For example, can along flexibility substrate length direction, set in the luminous component 120 of flexible base board 110 by pre-determined distance
Seven fixing holes are equipped with, can be six parts by multiple 123 points of LED chips, the LED chip of each part is arranged on two fixing holes
Between, in the distance between the center two adjacent LEDs chip of luminous component 120 than larger, thus, reduce this
Heat in the middle part of when flexible LED filament 100 is used so that the heat distribution of whole piece flexible LED filament 100 is more uniform, improves
The heat-sinking capability of flexible LED filament 100, and then improve the ability of the pay(useful) load of flexible LED filament 100, reach section
The effect of energy environmental protection.
Fig. 1 is continued referring to, in addition, the radiator portion 130 of the flexible base board 110 is used for further to the flexible LED
Filament 100 is radiated, the radiator portion 130 of the flexible base board 110 along the direction perpendicular to the flexible base board 110 successively
It is provided with the first conducting metal 132, semiconductor 134, the second conducting metal 136, insulator 138, first conducting metal
132nd, second conducting metal 136 is electrically connected with the semiconductor 134 respectively.
It is the first conducting metal 132, semiconductor 134 set gradually from the outwardly direction of flexible base board 110, second leads
Electric metal 136, insulator 138.Wherein, the first conducting metal 132, semiconductor 134, the second conducting metal 136 and insulator 138
Length it is identical with the length of the radiator portion 130 of flexible base board 110.The radiating of the radiator portion 130 uses cooling piece
Realize, the radiator portion 130 is as the cold end of cooling piece, and outermost insulator 138 is used as the hot junction of cooling piece, the cooling piece
Cold end and hot junction do not fit, the semiconductor 134 of uniform interphase distribution is provided with the middle of cold end and hot junction.
Specifically, refer to Fig. 4, Fig. 4 is a kind of radiator portion 130 of flexible base board 110 provided in an embodiment of the present invention
Structural representation, the semiconductor 134 include multiple P poles semiconductors 134 and multiple N poles semiconductor 134, the multiple P
Pole semiconductor 134 and the multiple N poles semiconductor 134 are evenly spaced in first conducting metal 132 and the described second conduction
Between metal 136, adjacent P poles semiconductor 134 and N poles semiconductor 134 by first conducting metal 132 with
Second conducting metal 136 is connected in series, that is to say, that the P poles with arrangement are provided with the middle of cold end and hot junction and are partly led
Body 134 and N poles semiconductor 134 and it is pressed on cold end outer surface and hot junction inner surface and partly leads P poles semiconductor 134 and N poles
The two ends of the first conducting metal 132 and the second conducting metal 136 that body 134 is connected, P poles semiconductor 134 and N poles semiconductor 134
It is cross-linked respectively by the first conducting metal 132 and the second conducting metal 136.
For example, if P poles semiconductor 134 and N poles semiconductor 134 have 5 respectively, the uniform alternate cold end for being distributed in cooling piece
Between hot junction, the first conducting metal 132 and the second conducting metal 136 have connected P poles semiconductor 134 and N poles semiconductor 134
Come.
It should be noted that the radiator portion 130 of the flexible base board 110, the first conducting metal 132, semiconductor 134,
Two conducting metals 136 and insulator 138 use integrated formed structure, are easy to the support of flexible LED filament 100 to process, can also prevent
Only the support of flexible LED filament 100 vulcanizes, and adds the reliability of flexible LED filament 100.
In addition, the luminous component 120 of the flexible base board 110 and the length ratio of radiator portion 130 could be arranged to 1:1,
Certainly, the ratio of luminous component 120 and radiator portion 130 is not limited to 1:1, in actual design, can arbitrarily it be adjusted to as needed
Arbitrary proportion, such as ratio of luminous component 120 and radiator portion 130 are 2:1, the length of luminous component 120 increase, brightness increases
Plus.
In actual applications, the luminous component 120 of the flexible LED filament 100 can down be set, that is, towards lamp holder
Direction set, radiator portion 130 sets upward, and the LED chip of luminous component 120 produces heat because, luminous component 120
As the design of LED chip sheds a part of heat, but most of heat still can not shed quickly, so
Most heat is located at the latter half of flexible LED filament 100, that is, luminous component 120 so that the flexible LED filament 100
Top and the bottom produce the temperature difference, so that heat is transmitted from bottom to top, then the heat of flexible LED filament 100 can be accumulated in flexible LED lamp
The cooling piece of semiconductor 134 of the upper part, i.e. radiator portion 130 of the radiator portion 130, at this moment flexible LED filament 100 of silk 100
Start to play a role, top half heat is exported into insulator 138 from interior outward, is thus easy to heat to shed
.
In addition, refer to Fig. 5, Fig. 5 is a kind of structural representation of metal terminal 112 provided in an embodiment of the present invention, institute
The two ends for stating flexible base board 110 are additionally provided with corrugated metal terminal 112, and corrugated metal terminal 112 can do physical connection,
One end of each metal terminal 112 is be bonded with the line layer 122 of the flexible base board 110 by tin cream, Mei Gesuo
The other end for stating metal terminal 112 can be used for connection external drive power supply.
Wherein, the metal terminal 112 is provided with aperture 114 with the contact position of flexible base board 110, so that tin cream is molten
Metal terminal 112 can be covered after change so that metal terminal 112 is fitted closer with the flexible base board 110.
Fig. 6 is refer to, Fig. 6 is a kind of structural representation of LED 200 provided in an embodiment of the present invention, the LED
200 include stem 220, cell-shell 210, lamp holder 230, driving power supply 240 and described flexible LED filament 100, the driving power supply
240 are arranged in the lamp holder 230, and the driving power supply 240 is coupled with the flexible LED filament 100, the flexible LED lamp
Silk 100 is connected on the stem 220, and the stem 220 is installed in the lamp holder 230, the cell-shell 210 and the lamp holder
230 form internal cavity, and the flexible LED filament 100 and stem 220 are respectively positioned in the internal cavity.
Wherein, in the present embodiment, the flexible LED filament 100 is made of flexible base board 110, then can pass through metal
Silk is fixed on the stem 220 with arbitrary shape, for example, pentalpha, and triangle etc. is variously-shaped, can appoint as needed
Meaning is set, or the flexible LED filament 100 can have certain toughness, can not also can be bent to and appointed by wire fixation
Meaning shape.Vacuum sealing between cell-shell 210 and stem 220, constitutes a vacuum-packed cavity, and the chamber is filled with high heat conduction
Rate low viscosity gas, heat transfer and convection current of the heat produced when flexible LED filament 100 can be worked through the gas are again through cell-shell
210 dissipate.The gas can be helium, hydrogen or helium hydrogen gaseous mixture, and its air pressure is 50-1520Torr at room temperature.
In addition, the driving power supply 240 is used for driving the flexible LED filament 100 to light, also, the driving power supply 240
It can be connected with above-mentioned metal terminal 112, or be directly connected to circuit layer 122, so as to be carried out to the flexible LED filament 100
Brightness regulation.
Fig. 7 is refer to, Fig. 7 is a kind of structured flowchart of driving power supply 240 provided in an embodiment of the present invention, the driving electricity
Source 240 includes the power supply circuit 242 being sequentially connected and control circuit 244, and the power supply circuit 242 connects with external input power
Connect, the control circuit 244 is connected with the flexible LED filament 100；The control circuit 244 includes wireless transceiver circuit
2442nd, process circuit 2444 and brightness regulating circuit 2446, the wireless transceiver circuit 2442 are used to receive user terminal transmission
Brightness regulation control instruction, the wireless transceiver circuit 2442 is connected with the process circuit 2444, the process circuit
2444 are connected with the power supply circuit 242, and the process circuit 2444 is also connected with the brightness regulating circuit 2446, described bright
Degree regulation circuit 2446 is connected with the flexible LED filament 100.
Wherein, external input power is 220V household electricities, and wireless transceiver circuit 2442 is used to receive user terminal transmission
Brightness regulation control instruction, the wireless transceiver circuit 2442 can be the wireless transmitter such as bluetooth, WIFI, wireless receiving and dispatching electricity
Understand the control instruction after the brightness regulation control instruction that user terminal is sent is obtained and be sent to process circuit 2444, institute in road 2442
State 2444 pairs of the process circuit brightness regulation control instruction to parse by communications protocol, then output control waveform is to described
Brightness regulating circuit 2446, this controls waveform to be current signal, and brightness regulating circuit 2446 is used to enter the current signal of input
Row adjustment, so as to control output current size, then, is exported to LED drive circuit, so as to control power output, is adjusted with this
The luminosity of flexible LED filament 100.
Fig. 8 is refer to, Fig. 8 is a kind of circuit theory diagrams of brightness regulating circuit 2446 provided in an embodiment of the present invention, institute
Stating brightness regulating circuit 2446 includes triode Q1, potentiometer RX, constant-current driven chip U1, battery BT, controlling switch K1, too
Positive energy cell panel SR, diode D1, first resistor R1, second resistance R2,3rd resistor R3 and the 4th resistance R4, constant current driving core
Piece U1 VDD pins connect battery BT positive pole, and LED pins connect the negative pole of multiple LED chips 123, multiple LED chips 123
Positive pole connects battery BT positive pole, and battery BT positive output lines are in series with controlling switch K1 in road, lights or puts out for controlling
Go out multiple LED chips 123.A potentiometer RX stationary contact connects battery BT positive pole, another stationary contact point with movable contact
Constant-current driven chip U1 ISET pins and triode Q1 colelctor electrode, constant-current driven chip U1 GND pin and three poles are not connect
Pipe Q1 emitter stage is grounded respectively, and triode Q1 base stage connects solar panel SR positive pole, and solar panel SR's is negative
Pole and battery BT negative pole are grounded respectively.
Wherein, triode Q1 manages for NPN, constant-current driven chip U1 model CN5611.
The size of current of input constant-current driven chip U1 ISET pins is adjusted by adjusting potentiometer RX resistance, is entered
And the output current of LED pins is controlled, so as to adjust the brightness of multiple LED chips 123, potentiometer RX resistance is adjusted to simulation
Amount adjustment, can be continuously adjusted to the brightness of multiple LED chips 123, to meet demand of the user to light environment.
First resistor R1 termination battery BT positive pole, an another termination potentiometer RX stationary contact is touched with dynamic
Point, a second resistance R2 termination potentiometer RX another stationary contact, another termination triode Q1 colelctor electrode.First resistor
R1 and second resistance R2 has partial pressure effect.
3rd resistor R3 termination solar panel SR positive pole, the other end connects triode Q1 base stage and the respectively
Four resistance R4 one end, the 4th resistance R4 other end ground connection.By adjusting R3 and/or R4, triode Q1 conductings can be adjusted
When solar panel SR need the voltage that exports.
Diode D1 positive pole connects solar panel SR positive pole, and diode D1 negative pole connects battery BT positive pole,
Diode D1 can effectively prevent reversed charges of the battery BT to solar panel SR.
In summary, the embodiment of the present invention provides a kind of flexible LED filament and LED, the flexible base of the flexible LED filament
Plate includes luminous component and radiator portion, by by the distance between the two neighboring LED chip in multiple LED chips edge
The direction at the center of the luminous component of the flexible base board to the two ends of the luminous component is gradually reduced, and reduces the flexibility
Heat when LED filament is used in the middle part of luminous component so that the heat distribution of whole piece flexible LED filament is more uniform, furthermore, lead to
The radiator portion crossed in the flexible base board can further shed the heat of the flexible LED filament luminous component, and then improve
The ability of the pay(useful) load of the heat-sinking capability of flexible LED filament and the flexible LED filament, has reached the effect of energy-conserving and environment-protective
Really.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of flexible LED filament, it is characterised in that the flexible LED filament includes flexible base board, multiple LED chips, insulation
Layer, fluorescent glue and line layer, the flexible base board include radiator portion and luminous component, the illuminating part of the flexible base board
The insulating barrier is provided with the opposing sides divided, the line layer, the line layer are provided with each insulating barrier
On be provided with the multiple LED chip, the multiple LED chip and be coated with the fluorescent glue, the line layer two ends difference
Positive electrode and negative electrode are provided with, the line layer includes the conducting line segment being sequentially arranged at intervals along the line layer length direction,
Each LED chip is arranged between the adjacent conducting line segment, make the multiple LED chip that is cascaded it is described just
The distance between conducting loop, and two neighboring described LED chip are formed between electrode and the negative electrode along the flexible base
The direction at the center of the luminous component of plate to the two ends of the luminous component is gradually reduced.
2. flexible LED filament according to claim 1, it is characterised in that the radiator portion edge of the flexible base board
The first conducting metal, semiconductor, the second conducting metal, insulator, institute are disposed with perpendicular to the direction of the flexible base board
The first conducting metal, second conducting metal is stated to be connected with the semi-conductor electricity respectively.
3. flexible LED filament according to claim 2, it is characterised in that the semiconductor include multiple P poles semiconductor and
Multiple N poles semiconductor, the multiple P poles semiconductor and the multiple N poles semiconductor are evenly spaced in first conducting metal
Between second conducting metal.
4. flexible LED filament according to claim 3, it is characterised in that adjacent P poles semiconductor and the N poles
Semiconductor is connected in series by first conducting metal with second conducting metal.
5. flexible LED filament according to claim 4, it is characterised in that the two ends of each P poles semiconductor connect respectively
First conducting metal and second conducting metal are connect, the two ends of each N poles semiconductor connect described first respectively
Conducting metal and second conducting metal, the multiple P poles semiconductor and the multiple N poles semiconductor are staggered.
6. flexible LED filament according to claim 1, it is characterised in that the luminous component of the flexible base board is described in
The length direction of flexible base board is arranged at intervals with multiple fixing holes by pre-determined distance.
7. flexible LED filament according to claim 6, it is characterised in that in the positive electrode and the multiple fixing hole
The fixing hole of one end positioned at the flexible base board overlap, be located at institute in the negative electrode and the multiple fixing hole
A fixing hole for stating the other end of flexible base board is overlapped.
8. flexible LED filament according to claim 1, it is characterised in that the two ends of the flexible base board are provided with ripple
Shape wave metal terminal, one end of each metal terminal is connected by tin cream with the line layer of the flexible base board, often
The other end of the individual metal terminal is used to connect external drive power supply.
9. a kind of LED, it is characterised in that the LED includes stem, cell-shell, lamp holder, driving power supply and claim 1-8
Any described flexible LED filament, the driving power supply is arranged in the lamp holder, the driving power supply and the flexible LED
Filament is coupled, and the flexible LED filament is connected on the stem, and the stem is installed in the lamp holder, the cell-shell with
The lamp holder formation internal cavity, the flexible LED filament and stem are respectively positioned in the internal cavity.
10. LED according to claim 9, it is characterised in that the driving power supply includes the power supply circuit being sequentially connected
With control circuit, the power supply circuit is connected with external input power, and the control circuit is connected with the flexible LED filament；
The control circuit includes wireless transceiver circuit, process circuit and brightness regulating circuit, and the wireless transceiver circuit is used to receive
The brightness regulation control instruction that user terminal is sent, the wireless transceiver circuit is connected with the process circuit, the processing electricity
Road is connected with the power supply circuit, and the process circuit is also connected with the brightness regulating circuit, the brightness regulating circuit with
The flexible LED filament connection.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710332122.4A CN106969276A (en) | 2017-05-11 | 2017-05-11 | Flexible LED filament and LED |
| PCT/CN2017/088321 WO2018205341A1 (en) | 2017-05-11 | 2017-06-14 | Flexible led lamp filament and led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710332122.4A CN106969276A (en) | 2017-05-11 | 2017-05-11 | Flexible LED filament and LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106969276A true CN106969276A (en) | 2017-07-21 |
Family
ID=59331402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710332122.4A Pending CN106969276A (en) | 2017-05-11 | 2017-05-11 | Flexible LED filament and LED |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106969276A (en) |
| WO (1) | WO2018205341A1 (en) |
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| CN108155280A (en) * | 2017-12-15 | 2018-06-12 | 广东昭信照明科技有限公司 | A kind of LED filament and its manufacturing method |
| CN108194852A (en) * | 2017-12-06 | 2018-06-22 | 浙江亿米光电科技有限公司 | A kind of LED flexibility filaments of charged |
| CN108488639A (en) * | 2018-03-19 | 2018-09-04 | 佛山电器照明股份有限公司 | A kind of LED light source and the LED bulb based on the LED light source |
| CN109323135A (en) * | 2018-10-24 | 2019-02-12 | 浙江鼎鑫工艺品有限公司 | A kind of filament of integrated control chip and LED wafer |
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|---|---|---|---|---|
| CN110388612B (en) * | 2019-07-02 | 2024-04-12 | 浙江阳光美加照明有限公司 | Color temperature-adjustable LED filament strip and LED filament lamp using same |
| CN113932169B (en) * | 2021-08-04 | 2024-09-13 | 崇义县精亿灯饰制品有限公司 | LED strip lamp and expansion structure thereof |
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Also Published As
| Publication number | Publication date |
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| WO2018205341A1 (en) | 2018-11-15 |
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Effective date of registration: 20210111 Address after: No.1, Xingye North Road, Yanjiang District, Ziyang City, Sichuan Province Applicant after: Sichuan Kelin Optoelectronic Technology Co.,Ltd. Address before: 610000 in Jintang Industrial Park, Jintang County, Chengdu City, Sichuan Province Applicant before: SICHUAN WUXIN ENERGY SOURCES SCIENCE Co.,Ltd. |
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Application publication date: 20170721 |