CN105627125A - Large-chip LED lamp filament and large-chip LED lamp filament bulb - Google Patents
Large-chip LED lamp filament and large-chip LED lamp filament bulb Download PDFInfo
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- CN105627125A CN105627125A CN201610140178.5A CN201610140178A CN105627125A CN 105627125 A CN105627125 A CN 105627125A CN 201610140178 A CN201610140178 A CN 201610140178A CN 105627125 A CN105627125 A CN 105627125A
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- led filament
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses a large-chip LED lamp filament and a large-chip LED lamp filament bulb. The large-chip LED lamp filament comprises an LED lamp filament module (1.2) and electric connecting terminals (1.3) at the two ends. The LED lamp filament module (1.2) is formed in the manner that an LED lighting large chip (420) comprising a plurality of lines of LED chip arrays and a plurality of rows of LED chip arrays is clipped into a strip-shaped or block-shaped structure comprising one or more lines of LED chip sets. A packaging layer is arranged outside the LED lamp filament module (1.2) and is made of a transparent material or a transparent material into which fluorescent powder is added. According to the LED lamp filament, the light emitting rate of an LED can be increased, and the heat dissipation efficiency can be improved. According to the LED lamp filament bulb, the limitation that an existing LED lighting lamp needs a radiator can be avoided, a large-power LED lamp filament lamp light source can be achieved, a light source of an existing large-power lighting product can be directly replaced, and lamps do not need to be replaced.
Description
Technical field
The present invention relates to a kind of large chip LED filament and large chip LED filament bulb, belong to technical field of LED illumination.
Background technology
LED semiconductor lighting is as a new generation's lighting engineering, have photoelectric conversion rate height, light source direction is easily controlled, illumination time period and mode is easily controlled, have five incomparable big power savings advantages of other existing lighting engineering such as higher power factor under color rendering properties of light source height, appropriate design, is subject to the favor of global investor and vigorously supporting of national governments. Although LED illumination is paid attention to, then also there are problems in popularization process, first, LED illumination lamp is integrated more, lacks replaceable standard light source; Secondly, even if adopting GB GB1406 series lamp holder to make LED/light source, being cannot realize light modulation to run substantially, and also not possessing the protective functions such as waterproof simultaneously, range of application is narrower; Moreover, emitting semiconductor is that four sides is luminous under the triggering of electricity, but in practical application, LED chip is encapsulated on an opaque substrate mostly, and the bright dipping of semi-conductor half is blocked and is converted to heat, and luminous efficiency is low.
In recent years has there is the LED filament lamp adopting transparent bar-type substrate in market, has conformed to the ultimate principle that semiconductor lighting four sides is luminous, but its applied power is also relatively lower, is generally no more than 10W; And not possessing water-proof function, range of application relative narrower, these defects greatly constrain promoting the use of of LED illumination.
The preferred embodiments that existing LED filament makes binds LED chip thereon by substrate bonding of bar shaped sapphire, it should be noted that on the one hand LED chip through attachment bonding after, refraction of light loss is relatively big, and photoelectric transformation efficiency reduces more.
Summary of the invention
It is an object of the present invention to provide a kind of large chip LED filament and large chip LED filament bulb. The LED filament of the present invention is possible not only to the light emission rate improving LED, and can carry high cooling efficiency; The LED filament bulb of the present invention can break away from the restriction that existing LED illumination lamp needs scatterer, can realize the LED filament lamp source of bigger power, can directly substitute the light source of existing high-power illumination product, and without the need to changing light fixture.
The technical scheme of the present invention: a kind of large chip LED filament, being characterized in: the electric connection terminal comprising LED filament module and two ends, described LED filament module is cut into the strip including a line or many row LED chip group or lumphy structure (every a line LED chip group consists of series connection form) multiple LED chip or LEDPN knot by the LED illumination large chip comprising multiple lines and multiple rows LED chip array; Being provided with encapsulated layer outside LED filament module, described encapsulated layer adds fluorescent material by transparent material or transparent material and forms.
In above-mentioned large chip LED filament, described LED illumination large chip is that light-emitting semiconducting material generates through directly long crystalline substance on LED illumination large chip substrate, is seamless connectivity between light-emitting semiconducting material and chip substrate; Described LED illumination large chip substrate adopts transparent alumina (monocrystalline or polycrystalline) material and substrate back not to establish metallic reflector, and the light towards substrate that semi-conductor can be made to produce directly passes through chip substrate externally outer spilling, makes chip heating minimum; Or described LED illumination large chip substrate adopts silicon single crystal or single crystal silicon carbide materials, after chip generates heat, invisible heat wavelength circle produced is in infrared rays wave band, and infrared rays wave energy directly through silicon single crystal or monocrystalline silicon carbide injection, makes chip have good heat conductivility.
In aforesaid large chip LED filament, described LED filament module or flip chip bonding are connected on the transparent panel being provided with circuit.
In aforesaid large chip LED filament, the two ends of described transparent panel by terminal support be welded and fixed hole directly with terminal support welding and bonding, transparent cover plate encapsulates with the gap employing transparent material around LED filament module and electric connection terminal.
In aforesaid large chip LED filament, described LED filament module is the lumphy structure comprising many row LED chip group, and transparent panel is provided with the electric connection line of the every LED load segmentation node of row LED chip group of multiple connection.
Use the large chip LED filament bulb that aforementioned large chip LED filament builds, it is characterized in: comprise the lamp adapter assembly that band drives assembly, lamp adapter assembly is connected on bulb housing (described bulb housing is integrated and blows out or be formed by connecting with material or different material by multistage), wire support is set in bulb housing, wire support is provided with multiple electrical connecting wire connecting driving assembly, electrical connecting wire is connected with LED filament, described LED filament two ends are provided with the electric connection terminal of conductive and heat-conductive, and LED filament is connected with electrical connecting wire by electric connection terminal.
In aforesaid large chip LED filament bulb, wherein a kind of concrete scheme is: described electrical connecting wire is in the form of a ring around wire support, and it is formed with 2 to 3 layers of ring-type conductor loop, being evenly equipped with LED filament between two layers of adjacent ring-type conductor loop, the two ends of each LED filament are connected with the ring-type conductor loop of different layers respectively.
In aforesaid large chip LED filament bulb, described ring-type conductor loop is provided with two insulation spacer sleeves and wire is isolated into multi-segment structure, every section connects driving assembly respectively, such that it is able to LED filament load segmentation is formed multi-stage series load, the node of each section of load has all been connected on driving assembly, power factor and the power frequency of LED filament bulb can be improve, be conducive to the lifting of LED filament bulb lighting quality. With three layers of ring-type conductor loop, it is preferred version that each ring-type conductor loop is separated into two ends.
In aforesaid large chip LED filament bulb, another kind of concrete scheme is: be provided with two terminal supports being connected on electrical connecting wire in described bulb housing, being provided with multiple LED filament between two terminal supports, described LED filament both sides electrically connect as one by the terminal support of electric connection terminal and conductive and heat-conductive. Described terminal support is close to bulb housing, and the heat on LED filament is arrived on bulb housing by conduction pattern, and bulb housing is heated becomes thermal radiation body, can to bulb housing external irradiation invisible heat.
In aforesaid large chip LED filament bulb, described LED filament is provided with multiple load segment node, and the segmentation node of each LED filament is connected with driving assembly by many one electrical connecting wires.
In aforesaid large chip LED filament bulb, described lamp adapter assembly comprises lamp bracket, and lamp bracket adopts hollow structure, for placing described driving assembly; Lamp bracket arranges threaded electric connector male, 4 contact pins are established in male, connect power supply and the dimming control signal of electrically end respectively, electric connector male and lamp bracket are structure as a whole, lamp bracket main body adopts helicitic texture and arranges locating slot, locating slot installation direction is consistent with bulb direction of illumination, fixes whole LED filament bulb by supporting set screw nut; One end that lamp bracket is connected with bulb housing is the round table-like ring structure being provided with outstanding threaded body.
Compared with prior art, the large chip LED filament of the present invention is without the need to arranging LED chip substrate, each light direction of LED can be made not interrupted, particularly the appearing of infra-red heat ray, substantially increase light extraction efficiency, and the present invention utilizes electrical connecting wire that the LED filament being provided with electric connection terminal carries out the fixing of various moulding, and the heat conduction being very advantageous in LED filament is on other assembly, be conducive to being formed thermal radiation body assembly together with other thermal radiation assembly, it be beneficial to LED filament and lower the temperature in the way of thermal radiation.
The large chip LED filament bulb of the present invention can utilize each assembly in bulb housing as thermal radiation body assembly, the radiationless net heat radiator assembly area blocked that can provide enough big to control bulb internal temperature and makes the medial temperature on thermal radiation body assembly become nearly junction temperature of chip to balance the heat of LED filament generation as far as possible, and then reduces the junction temperature of chip on LED filament by heat radiation principle. Traditional basic concept that LED illumination lamp needs scatterer broken away from by the LED filament bulb of the present invention, and this LED filament lamp product can directly substitute the light source of existing high-power illumination product, and without the need to changing light fixture, LED illumination application will be made to attain a new height. Through reality test, utilize the method for the present invention can accomplish 200LM/W, even higher bulb finished product light source.
Accompanying drawing explanation
Fig. 1 is the large chip LED filament bulb cutaway view of the present invention;
Fig. 2 is the large chip LED filament bulb cutaway view of 2 layers of ring-type conductor loop of the present invention;
Fig. 3 is the large chip LED filament bulb cutaway view of 3 layers of ring-type conductor loop of the present invention;
Fig. 4 is the filament layout drawing of Fig. 3 large chip LED filament bulb of the present invention;
Fig. 5 is the wire support figure of Fig. 3 large chip LED filament bulb of the present invention;
Fig. 6 is the ring-type conductor loop schematic diagram of the electrical connecting wire of band of the present invention insulation spacer sleeve;
Fig. 7 is a kind of large chip LED filament bulb cutaway view adopting terminal support of the present invention;
Fig. 8 is the large chip LED filament bulb cutaway view being connected to LED load node of the present invention;
Fig. 9 is a kind of large chip LED filament bulb (jogged terminal end support) cutaway view adopting terminal support of the present invention;
Figure 10 is the LED filament LED illumination large chip segmentation schematic diagram of the present invention;
Figure 11 is the LED filament cut-away view of the present invention;
Figure 12 be the present invention with the LED filament cut-away view of transparent panel
Figure 13 is the LED filament module figure of the coupling end submounts of the present invention;
Figure 14 is the LED filament assembly finished figure of the present invention;
Figure 15 is the LED filament assembly finished figure of the widened end submounts of the present invention;
The LED filament assembly finished figure of the employing sheet filament of Figure 16 the present invention;
Figure 17 is the lamp adapter assembly structural representation of the present invention.
Being labeled as in accompanying drawing: 1-LED filament assembly, 1.1-LED filament, 1.2-LED filament module, 1.2.1-filament module substrate, 1.2.2-transparent panel, 1.3-electric connection terminal, 1.4-terminal support, 1.7-is welded and fixed hole, 1.8-electric connection line, 2-lamp adapter assembly, 2.5-lamp bracket, the electric connector male that 2.6-is threaded, 2.7-contact pin, 2.8-locating slot, 2.9-set screw nut, 3-drives assembly, 4.1-wire support, 4.2-electrical connecting wire, 6-bulb housing, 7.6-insulate spacer sleeve, 7.7-stiffening web, 420-LED throws light on integrated large chip, 420.1-large chip end electrode, 420.2-LED load segment electrical connection place.
Embodiment
Below in conjunction with drawings and Examples, the present invention is further illustrated, but not as the foundation that the present invention is limited.
Embodiment. Large chip LED filament 1.1, comprise the electric connection terminal 1.3 at LED filament module 1.2 and two ends, described LED filament module 1.2 is cut into the strip including a line or many row LED chip group or lumphy structure, as shown in FIG. 10 and 11. LED filament module 1.2 comprises the series connection of the LED chip group on transparent filament module substrate 1.2.1 and filament module substrate 1.2.1; Being provided with encapsulated layer outside LED filament module 1.2, described encapsulated layer adds fluorescent material by transparent material or transparent material and forms, see Figure 14.
Described LED illumination large chip 420 is that light-emitting semiconducting material generates through directly long crystalline substance on LED illumination large chip substrate, is seamless connectivity between light-emitting semiconducting material and chip substrate; Described LED illumination large chip substrate adopts transparent alumina (monocrystalline or polycrystalline) material and substrate back not to establish metallic reflector, and the light towards substrate that semi-conductor can be made to produce directly passes through chip substrate externally outer spilling, makes chip heating minimum; Or described LED illumination large chip substrate adopts silicon single crystal or single crystal silicon carbide materials, after chip generates heat, invisible heat wavelength circle produced is in infrared rays wave band, and infrared rays wave energy directly through silicon single crystal or monocrystalline silicon carbide injection, makes chip have good heat conductivility.
Described LED filament module 1.2 flip chip bonding is connected on the transparent panel (1.2.2) being provided with circuit, as shown in figure 12. During transparent panel 1.2.2 use glass, be conducive to improving the effect appearing invisible heat, when throwing light on especially for plant husbandry.
The two ends of described transparent panel 1.2.2 are directly welded with terminal support 1.4 and bonding by the hole 1.7 that is welded and fixed of on terminal support 1.4, as shown in figure 13. Gap around transparent cover plate 1.2.2 and LED filament module 1.2 and electric connection terminal 1.3 or terminal support 1.4 adopts transparent material encapsulation, as shown in figure 14. For being conducive to heat trnasfer, the electric connecting terminal subdivision near terminal support can appropriateness be widened or the process of falling fillet, as shown in figure 15.
Described LED filament module 1.2 is the lumphy structure comprising many row LED chip group, and transparent panel 1.2.2 is provided with the electric connection line 1.8 of the every LED load segmentation node of row LED chip group of multiple connection, as shown in figure 16.
A kind of large chip LED filament bulb, as shown in Figure 1: comprise the lamp adapter assembly 2 that band drives assembly 3, lamp adapter assembly 2 is connected on bulb housing 6, described bulb housing 6 is integrated to be blown out or is formed by connecting with material or different material by multistage, wire support 4.1 is set in bulb housing 6, wire support 4.1 is provided with multiple electrical connecting wire 4.2 connecting driving assembly 3, electrical connecting wire 4.2 is connected with LED filament 1.1, described LED filament 1.1 two ends are provided with the electric connection terminal 1.3 of conductive and heat-conductive, and LED filament 1.1 is connected with electrical connecting wire 4.2 by electric connection terminal 1.3.
Described electrical connecting wire 4.2 in the form of a ring around wire support 4.1, and can be formed with 2 to 3 layers of ring-type conductor loop, is evenly equipped with LED filament 1.1 between two layers of adjacent ring-type conductor loop, and the two ends of each LED filament 1.1 are connected with the ring-type conductor loop of different layers respectively. As shown in Figure 2, the LED filament bulb of 3 layers of ring-type conductor loop is as shown in Fig. 3,4 and 5 for the LED filament bulb of 2 layers of ring-type conductor loop.
Described ring-type conductor loop is provided with two insulation spacer sleeves 7.6 and wire is isolated into multi-segment structure, as shown in Figure 6, every section connects driving assembly 3 respectively, such that it is able to LED filament load segmentation is formed multi-stage series load, the node of each section of load has all been connected on driving assembly 3, power factor and the power frequency of LED filament bulb can be improve, be conducive to the lifting of LED filament bulb lighting quality. With three layers of ring-type conductor loop, it is preferred version that each ring-type conductor loop is separated into two ends.
Large chip LED filament bulb can also structure as shown in figures 7 and 9: be provided with two terminal supports 1.4 being connected on electrical connecting wire 4.2 in described bulb housing 6, being provided with multiple LED filament 1.1 between two terminal support 1.4 supports, described LED filament 1.1 both sides electrically connect as one by the terminal support 1.4 of electric connection terminal 1.3 with conductive and heat-conductive. Terminal support 1.4, LED filament 1.1 and electric connection terminal 1.3 form LED filament assembly 1 jointly.
Described LED filament 1.1 is provided with multiple load segment node, and the segmentation node of each LED filament 1.1 is connected with driving assembly 3 by many one electrical connecting wires 4.2, as shown in Figure 8. Described terminal support 1.4 is close to bulb housing 6, and the heat on LED filament 1.1 is arrived on bulb housing 6 by conduction pattern, and bulb housing 6 is heated becomes thermal radiation body, can to bulb housing 6 external irradiation invisible heat.
Wherein, LED illumination large chip is the application number based on the present inventor's earlier application is the LED illumination large chip in 201410214077.9 patent applications.
Fill the rare gas element of high thermal conductivity coefficient in bulb housing 6, make the heat in bulb housing 6 by the temperature on the balanced thermal radiation body assembly of conduction and convection form, also can the part heat on thermal radiation body assembly is delivered on bulb housing simultaneously; Described bulb housing 6 is integrated blows out or divides a multistage to be formed by connecting with material or different material.
Described driving assembly, it can be the driving power supply that the method being 201410211945.8 and 201410214074.5 Chinese patent application based on the present inventor's application number makes, it is that LED load is divided 1��6 section drive, higher power-efficient (being greater than 99%) can be obtained, only in this way when LED bulb power is higher, could place driving power supply in lamp adapter assembly, to such an extent as to there will not be and overheated make power work instability. Otherwise, when bulb power is bigger, lamp adapter assembly externally cannot fall apart except the heat driving power supply to send; Based on this power supply scheme, possesses light modulation function with the LED bulb that the present invention builds with low cost or cost free.
Described lamp adapter assembly can be as shown in figure 17, comprise lamp bracket 2.5 and electrical connection terminal, electrical connection terminal can be the electric connector in 201210253574.0 Chinese patent application based on the present inventor's application number, electric connector and lamp bracket 2.5 are structure as a whole, the lamp bracket 2.5 being connected with bulb housing adopts helicitic texture and arranges locating slot 2.8, locating slot is located at bulb direction of illumination first, is fixed on the universal installation interface support of bulb by set screw nut 2.9 by bulb; Assembly 3 is driven to be placed in lamp bracket 2.5. Bringing significant result of use like this, its power connector end of all lamp adapter assemblies based on national standard pattern is exposed structure, can not waterproof, it is necessary to do waterproofing design on light fixture. And the structure formation of the present patent application is simple and practical, making LED bulb possess water-proof function, make light fixture not need to consider waterproof like this, light fixture cost can much slower. Described lamp adapter assembly pattern and size can based on GB/T1406(1406.1��1406.5) series standard, but for wherein having the lamp holder scheme of 4 needle constructions when not changing its rule, then wherein dim signal access be will be defined as by 2 pins, signal pin and signal pin namely increased; Whole bulb is made to have light modulation function like this, when signal level changes at 0��5VDC, the brightness of bulb is from maximum luminance variation to zero luminance, realize controlling to the brightness of bulb by modes such as light-operated, acoustic control, period control and infrared inductions, be conducive to the present invention is applied to all kinds of place needing light modulation, during especially for plant husbandry or road lighting, reach the object of high energy saving.
Claims (11)
1. a large chip LED filament, it is characterized in that: the electric connection terminal (1.3) comprising LED filament module (1.2) and two ends, described LED filament module (1.2) is cut into the strip or lumphy structure that include a line or many row LED chip group; LED filament module is provided with encapsulated layer outside (1.2), and described encapsulated layer is made up of transparent material or the transparent material that with the addition of fluorescent material.
2. large chip LED filament according to claim 1, it is characterized in that: described LED illumination large chip (420) is that light-emitting semiconducting material generates through directly long crystalline substance on LED illumination large chip substrate, is seamless connectivity between light-emitting semiconducting material and chip substrate; Described LED illumination large chip substrate adopts transparent Indium aluminum and substrate back not to establish metallic reflector, and the light towards substrate that semi-conductor can be made to produce directly passes through chip substrate externally outer spilling, makes chip heating minimum; Or described LED illumination large chip substrate adopts silicon single crystal or single crystal silicon carbide materials, after chip generates heat, invisible heat wavelength circle produced is in infrared rays wave band, and infrared rays wave energy directly through silicon single crystal or monocrystalline silicon carbide injection, makes chip have good heat conductivility.
3. large chip LED filament according to claim 1, it is characterised in that: described LED filament module (1.2) flip chip bonding is connected on the transparent panel (1.2.2) being provided with circuit.
4. large chip LED filament according to claim 3, it is characterized in that: the two ends of described transparent panel (1.2.2) by (1.4) on terminal support be welded and fixed hole (1.7) directly with terminal support (1.4) welding and bonding, transparent panel (1.2.2) and LED filament module (1.2) and electric connection terminal (1.3) gap around adopts transparent material to encapsulate.
5. large chip LED filament according to claim 4, it is characterized in that: described LED filament module (1.2) is the lumphy structure comprising many row LED chip group, transparent panel (1.2.2) is provided with the electric connection line (1.8) of the every LED load segmentation node of row LED chip group of multiple connection.
6. use the large chip LED filament bulb that the LED filament described in claim 1 to 5 any claim builds, it is characterized in that: comprise the lamp adapter assembly (2) that band drives assembly (3), lamp adapter assembly (2) is connected on bulb housing (6), wire support (4.1) is set in bulb housing (6), wire support (4.1) is provided with multiple electrical connecting wire (4.2) connecting driving assembly (3), electrical connecting wire (4.2) is connected with LED filament (1.1), described LED filament (1.1) two ends are provided with the electric connection terminal (1.3) of conductive and heat-conductive, LED filament (1.1) is connected with electrical connecting wire (4.2) by electric connection terminal (1.3).
7. large chip LED filament bulb according to claim 6, it is characterized in that: described electrical connecting wire (4.2) is in the form of a ring around wire support (4.1), and it is formed with 2 to 3 layers of ring-type conductor loop, being evenly equipped with LED filament (1.1) between two layers of adjacent ring-type conductor loop, the two ends of each LED filament (1.1) are connected with the ring-type conductor loop of different layers respectively.
8. large chip LED filament bulb according to claim 7, it is characterized in that: described ring-type conductor loop is provided with two insulation spacer sleeve (7.6) and wire is isolated into multi-segment structure, every section connects driving assembly (3) respectively, such that it is able to LED filament load segmentation is formed multi-stage series load, the node of each section of load has all been connected on driving assembly (3), power factor and the power frequency of LED filament bulb can be improve, be conducive to the lifting of LED filament bulb lighting quality.
9. large chip LED filament bulb according to claim 6, it is characterized in that: in described bulb housing (6), be provided with two terminal supports (1.4) being connected on electrical connecting wire (4.2), being provided with multiple LED filament (1.1) between two terminal support (1.4) supports, described LED filament (1.1) both sides electrically connect as one by the terminal support (1.4) of electric connection terminal (1.3) with conductive and heat-conductive; Described terminal support (1.4) is close to bulb housing (6), and the heat on LED filament (1.1) is arrived on bulb housing (6) by conduction pattern, and bulb housing (6) is heated becomes thermal radiation body, can to bulb housing (6) external irradiation invisible heat.
10. large chip LED filament bulb according to claim 9, it is characterized in that: described LED filament (1.1) is provided with multiple load segment node, the segmentation node of each LED filament (1.1) is connected with driving assembly (3) by many one electrical connecting wires (4.2).
11. large chip LED filament bulbs according to claim 6, it is characterised in that: described lamp adapter assembly (2) comprises lamp bracket (2.5), and lamp bracket (2.5) adopts hollow structure, for placing described driving assembly (3); Lamp bracket (2.5) arranges threaded electric connector male (2.6), 4 contact pins (2.7) are established in male, connect power supply and the dimming control signal of electrically end respectively, electric connector male (2.6) and lamp bracket (2.5) are structure as a whole, lamp bracket (2.5) main body adopts helicitic texture and arranges locating slot (2.8), locating slot (2.8) installation direction is consistent with bulb direction of illumination, by the fixing whole LED filament bulb of supporting set screw nut (2.9); One end that lamp bracket (2.5) is connected with bulb housing (6) is the round table-like ring structure being provided with outstanding threaded body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610140178.5A CN105627125A (en) | 2016-03-11 | 2016-03-11 | Large-chip LED lamp filament and large-chip LED lamp filament bulb |
| PCT/CN2017/075875 WO2017152829A1 (en) | 2016-03-11 | 2017-03-07 | Thermal radiation heat-dissipation type led light bulb and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610140178.5A CN105627125A (en) | 2016-03-11 | 2016-03-11 | Large-chip LED lamp filament and large-chip LED lamp filament bulb |
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| CN105627125A true CN105627125A (en) | 2016-06-01 |
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Cited By (5)
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| CN105889777A (en) * | 2016-06-03 | 2016-08-24 | 浙江九阳光电有限公司 | LED G9 lamp with high luminous efficiency |
| CN106641780A (en) * | 2016-11-15 | 2017-05-10 | 浙江阳光美加照明有限公司 | LED photovoltaic panel and LED gas-filled lamp applying same |
| WO2017152829A1 (en) * | 2016-03-11 | 2017-09-14 | 贵州光浦森光电有限公司 | Thermal radiation heat-dissipation type led light bulb and application thereof |
| WO2020254130A1 (en) * | 2019-06-18 | 2020-12-24 | Signify Holding B.V. | Lighting device with light-emitting filaments |
| CN113175628A (en) * | 2020-10-13 | 2021-07-27 | 光纤设计公司 | LED bulb |
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