CN203517379U - Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates - Google Patents
Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates Download PDFInfo
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- CN203517379U CN203517379U CN201320550906.1U CN201320550906U CN203517379U CN 203517379 U CN203517379 U CN 203517379U CN 201320550906 U CN201320550906 U CN 201320550906U CN 203517379 U CN203517379 U CN 203517379U
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Abstract
The utility model relates to a lamp bulb based on inversely-installed LED chips and transparent ceramic substrates. The lamp bulb comprises a lampshade, a positive electrode contact, a lamp base, a heat conducting column, a radiating body, a positive electrode wire and a negative electrode wire, and is characterized in that connecting parts are arranged at the lower end of the heat conducting column, the transparent ceramic substrates are installed on the outer-side planes of the connecting parts, 10-80-degree angles are formed between the transparent ceramic substrates and the horizontal plane, the front faces of the transparent ceramic substrates are provided with circuit layers, the inversely-installed LED chips are packaged on the circuit layers, and the circuit layers are respectively connected with the positive electrode wire and the negative electrode wire. The connecting parts, the heat conducting column and the radiating body are of an integrated structure, so that the heat conducting effect is good; eutectic soldering is adopted for the transparent ceramic substrates and the connecting parts, so that installation is firm, and heat transmission is good; the slant design of the transparent ceramic substrates is adopted, so that the light emitting angle is larger; due to the fact that the transparent ceramic substrates are transparent, LEDs can emit light in all directions, and high-efficiency light emitting is achieved; light-emitting bodies can further be manufactured to be in different shapes, and the lamp bulb is attractive.
Description
Technical field
The utility model belongs to LED lighting apparatus field, specifically relates to a kind of bulb based on flip LED chips and crystalline ceramics substrate, and bulb can omnibearing luminous illumination.
Background technology
LED is as a kind of novel green light source, owing to having, energy-saving and environmental protection, extra long life, volume are little, fast response time, light efficiency is high and luminescent spectrum and the controlled unrivaled advantage of the more high conventional light source of colorfulness that makes of energy gap, has become the high-technology field that 21 century has development prospect most.
Flip LED chips is compared with packed LED chip, flip LED chips has good heat sinking function and luminous efficiency, have the advantages such as low-voltage, high brightness, high reliability, high saturation current density, aspect of performance has larger advantage, has better development prospect.
The heat radiating package substrate material that existing flip LED chips is used, generally adopts metallic aluminium, high heat-conducting plastic or ceramic material.Ceramic material has good insulating, thermal conductivity is high, infrared emittance is large, the coefficient of expansion is low feature, is widely used in the heat sink material of packaged chip.But, the ceramic material that LED chip circuit substrate used adopts at present mainly contains the potteries such as 96 aluminium oxide, AlN, LTCC, and these potteries are all opaque, for LED plane or class planar design light source, cause LED lamp lighting angle limited, generally 120 °～165 ° left and right.Flip LED chips luminous be each to, chip front side, the back side and each side have light to send.And the light that above-mentioned traditional ceramic substrate cannot send chip back extracts, this part light can finally be converted into heat by refraction, transmitting, absorption.Not only reduce light efficiency, and caused the temperature of chip to raise gradually, caused light output efficiency and the life-span of chip.
China utility model (applying date 2012-11-16, notification number 202972633U) a kind of encapsulating structure that utilizes crystalline ceramics COB substrate to realize comprehensive LED illumination is disclosed, " comprising: bulb (1), cathode contact (11), screw socket (12), heating column (2), positive wire (3), cathode wire (4) characterized by further comprising crystalline ceramics COB substrate (5), this crystalline ceramics COB substrate (5) is connected with heating column (2), positive wire (3), cathode wire (4) respectively." heat dispersion of this structure is bad, when using powerful flip LED chips, its heat dissipation problem can be more outstanding.
Utility model content
The purpose of this utility model is to provide a kind of bulb based on based on flip LED chips and crystalline ceramics substrate, this bulb can be stereo luminous in all directions, the shape of the filament of the imitative tengsten lamp of illuminator shape picture, the perfect heat-dissipating of while bulb, and crystalline ceramics substrate and heating column fixation, heat-transfer effect is good.
For achieving the above object, the utility model is to realize by following technical scheme.
The utility model is to provide a kind of bulb based on flip LED chips and crystalline ceramics substrate, comprise lampshade, cathode contact, screw socket, heating column, heat radiator body, positive wire and cathode conductor, wherein, the lower end of described heating column is provided with connecting portion, on the outer side plane of connecting portion, crystalline ceramics substrate is installed, crystalline ceramics substrate becomes 10～80 degree angles with level, the front of described crystalline ceramics substrate is provided with line layer, on line layer, be packaged with flip LED chips, line layer is connected with cathode conductor with positive wire respectively.
In the bulb of the following stated, connecting portion, heat radiator body on described heating column, heating column are structure as a whole, and adopt aluminium or the copper product of good heat conductivity to make, and under integrative-structure, there is no contact point, have avoided contact point to conduct heat uneven, affect whole heat-conducting effect.
In the bulb of the following stated, described connecting portion is 2～4, and a crystalline ceramics substrate is installed on each connecting portion.Described crystalline ceramics substrate is to be welded and fixed on the connecting portion that is arranged on heating column by eutectic, utilizes eutectic welding to have good heat-conducting effect.
In above-described bulb, wherein, the line layer on described crystalline ceramics substrate is silver slurry line layer or copper base line layer.Described flip LED chips welds by ashbury metal or eutectic welding is encapsulated on the line layer on crystalline ceramics substrate.On flip LED chips, also utilize fluorophor to encapsulate, illuminator can be made to live the bar shaped state of the filament of incandescent lamp bulb when luminous, can also make other shape.
Further, described crystalline ceramics substrate is trapezoidal or leg-of-mutton thin-slab structure, it is provided with anodal wiring hole, negative pole wiring hole and heating column installing hole, and wherein anodal wiring hole, negative pole wiring hole determine according to wire aperture, and starches line layer or copper base line layer circuit UNICOM with silver.
The beneficial effects of the utility model are: the integrative-structure of connecting portion, heating column and heat radiator body, makes heat-conducting effect better; Crystalline ceramics substrate and connecting portion adopt eutectic welding, install firmly and conduct heat; Crystalline ceramics substrate inclined design, lighting angle is larger; Crystalline ceramics substrate transparent, makes the LED can be omnibearing luminous, realizes high efficiency light-emitting, and illuminator can also be made different shapes, more attractive in appearance.
Accompanying drawing explanation
Fig. 1 is the bulb stereochemical structure diagram of the utility model embodiment.
Fig. 2 is the structure front view of the bulb in Fig. 1.
Fig. 3 is the structural base view of the bulb in Fig. 1.
Fig. 4 is that bulb in Fig. 3 is along the cross section view of A-A face.
Fig. 5 is the front view of the crystalline ceramics substrate of the bulb in Fig. 1.
Fig. 6 is that crystalline ceramics substrate in Fig. 5 is along the cross section view of B-B face.
The specific embodiment
Below in conjunction with accompanying drawing and specific embodiment, the technical solution of the utility model is elaborated.
Shown in Fig. 1, in the bulb of the present embodiment, comprise transparent lampshade 1, cathode contact 2, screw socket 3, heat radiator body 40, heating column 41 and crystalline ceramics substrate 5, also comprise positive wire not shown in FIG. and cathode conductor, positive wire two ends are connected with the anodal wiring hole 51 of cathode contact 2 and crystalline ceramics substrate 5 respectively, and the two ends of cathode conductor are connected with the negative pole wiring hole 52 of screw socket 3 and crystalline ceramics substrate 5 respectively.
With reference to Fig. 2, Fig. 3, shown in Fig. 4, for increasing heat-transfer effect, heating column 41 is structure as a whole with heat radiator body 40, adopt aluminium or the copper product of good heat-transfer to make, lower end at heating column, on cylinder side wall 410, be provided with uniformly three connecting portions 42, connecting portion 42 is structure as a whole with heating column 41, material is identical, the outer side plane 420 outward-dipping certain angles in top of each connecting portion, a crystalline ceramics substrate 5 is installed on side plane 420 outside, make crystalline ceramics substrate become 30～60 degree angles with level, the present embodiment is selected 60 degree, can make the vertical light-emitting angle of bulb reach 300 degree, horizontal lighting angle is 360 degree.
In order to make to conduct heat soon between crystalline ceramics substrate and connector, crystalline ceramics substrate is welded and fixed on the connecting portion that is arranged on heating column by eutectic.
Shown in Fig. 5, Fig. 6, crystalline ceramics substrate is trapezoidal thin-slab structure, the back side is welded on the connecting portion of heating column, front is provided with line layer 53, line layer is silver slurry line layer or copper base line layer, it on line layer, is flip LED chips 54, by ashbury metal, weld or eutectic welding is encapsulated on the line layer on crystalline ceramics substrate, wherein all flip LED chips are connected into one or more circuit mutually, on flip LED chips, also adopt fluorophor 55 to encapsulate, fluorophor can also be made to live the bar shaped state of the filament light-emitting of incandescent lamp bulb.Crystalline ceramics substrate is provided with three holes, i.e. anodal wiring hole 51, negative pole wiring hole 52 and heating column installing hole 56, wherein anodal wiring hole, negative pole wiring hole determine according to wire aperture, and with silver slurry line layer or copper base line layer circuit UNICOM.Heating column installing hole is used for making eutectic welding effect better.
Above embodiment is preferred embodiment of the present utility model; the utility model is not limited to above-described embodiment; for those of ordinary skills; the any apparent change of doing on the basis that does not deviate from the utility model know-why, all belongs to the protection domain of design of the present utility model and claims.
Claims (7)
1. the bulb based on flip LED chips and crystalline ceramics substrate, comprise lampshade, cathode contact, screw socket, heating column, heat radiator body, positive wire and cathode conductor, it is characterized in that: the lower end of described heating column is provided with connecting portion, on the outer side plane of connecting portion, crystalline ceramics substrate is installed, crystalline ceramics substrate becomes 10～80 degree angles with level, the front of described crystalline ceramics substrate is provided with line layer, on line layer, be packaged with flip LED chips, line layer is connected with cathode conductor with positive wire respectively.
2. the bulb based on flip LED chips and crystalline ceramics substrate according to claim 1, is characterized in that: described connecting portion is 2～4, and a crystalline ceramics substrate is installed on each connecting portion.
3. the bulb based on flip LED chips and crystalline ceramics substrate according to claim 2, is characterized in that: described crystalline ceramics substrate is welded and fixed on the connecting portion that is arranged on heating column by eutectic.
4. the bulb based on flip LED chips and crystalline ceramics substrate according to claim 1, is characterized in that: described flip LED chips welds by ashbury metal or eutectic welding is encapsulated on the line layer on crystalline ceramics substrate.
5. according to the bulb based on flip LED chips and crystalline ceramics substrate described in claim 1 or 4, it is characterized in that: the line layer on described crystalline ceramics substrate is silver slurry line layer or copper base line layer.
6. according to the bulb based on flip LED chips and crystalline ceramics substrate described in claim 1 or 4, it is characterized in that: described crystalline ceramics substrate is trapezoidal or leg-of-mutton thin-slab structure, be provided with anodal wiring hole, negative pole wiring hole and heating column installing hole, wherein anodal wiring hole, negative pole wiring hole determine according to wire aperture, and starch line layer or copper base line layer circuit UNICOM with silver.
7. the bulb based on flip LED chips and crystalline ceramics substrate according to claim 1 and 2, is characterized in that: connecting portion, heat radiator body on described heating column, heating column are structure as a whole, and adopts aluminium or copper product to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320550906.1U CN203517379U (en) | 2013-09-05 | 2013-09-05 | Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320550906.1U CN203517379U (en) | 2013-09-05 | 2013-09-05 | Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates |
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| Publication Number | Publication Date |
|---|---|
| CN203517379U true CN203517379U (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320550906.1U Expired - Fee Related CN203517379U (en) | 2013-09-05 | 2013-09-05 | Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104048204A (en) * | 2014-07-10 | 2014-09-17 | 宋勇飞 | LED light source and manufacturing method thereof |
| CN104393145A (en) * | 2014-10-21 | 2015-03-04 | 江苏稳润光电有限公司 | Ceramic-substrate-contained white-light LED with low thermal resistance and high brightness |
| CN105627166A (en) * | 2014-10-31 | 2016-06-01 | 上海博恩世通光电股份有限公司 | Large-angle light-emitting lighting emitting diode (LED) bulb lamp |
| WO2016090580A1 (en) * | 2014-12-10 | 2016-06-16 | 远东科技大学 | Multi-directional light-emitting and heat-dissipating plate and lamp |
| CN108870314A (en) * | 2018-07-02 | 2018-11-23 | 深圳大道半导体有限公司 | Car headlight device |
| WO2019149551A1 (en) | 2018-02-01 | 2019-08-08 | Signify Holding B.V. | Squeezed profile to support lighting |
-
2013
- 2013-09-05 CN CN201320550906.1U patent/CN203517379U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104048204A (en) * | 2014-07-10 | 2014-09-17 | 宋勇飞 | LED light source and manufacturing method thereof |
| CN104393145A (en) * | 2014-10-21 | 2015-03-04 | 江苏稳润光电有限公司 | Ceramic-substrate-contained white-light LED with low thermal resistance and high brightness |
| CN105627166A (en) * | 2014-10-31 | 2016-06-01 | 上海博恩世通光电股份有限公司 | Large-angle light-emitting lighting emitting diode (LED) bulb lamp |
| WO2016090580A1 (en) * | 2014-12-10 | 2016-06-16 | 远东科技大学 | Multi-directional light-emitting and heat-dissipating plate and lamp |
| WO2019149551A1 (en) | 2018-02-01 | 2019-08-08 | Signify Holding B.V. | Squeezed profile to support lighting |
| CN111670321A (en) * | 2018-02-01 | 2020-09-15 | 昕诺飞控股有限公司 | Extruded profile for supporting lighting |
| US11131429B2 (en) | 2018-02-01 | 2021-09-28 | Signify Holding B.V. | Squeezed profile to support lighting |
| CN108870314A (en) * | 2018-07-02 | 2018-11-23 | 深圳大道半导体有限公司 | Car headlight device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANDONG JINGTAIXING PHOTOELECTRIC TECHNOLOGY CO., Free format text: FORMER OWNER: SHENZHEN ZHIXUNDA PHOTOELECTRIC TECHNOLOGY CO., LTD. Effective date: 20141010 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518057 SHENZHEN, GUANGDONG PROVINCE TO: 271208 TAIAN, SHANDONG PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20141010 Address after: 271208 Xintai Economic Development Zone, Shandong, Tai'an Patentee after: SHANDONG PROSPEROUS STAR OPTOELECTRONICS Co.,Ltd. Address before: 518057 B, B404-406 building, Shenzhen Research Institute, Shenzhen District, Nanshan District hi tech Zone, Guangdong, China Patentee before: SHENZHEN WISDOW REACHES INDUSTRY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 |
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| CF01 | Termination of patent right due to non-payment of annual fee |