CN203521476U - A LED packaging structure with high thermal conductivity - Google Patents

Abstract

The utility model provides a LED packaging structure with high heat conductivity, it is including base, plastic casing and LED chip, and the plastic casing sets up in the top of base, is provided with the installation through-hole that is used for installing the LED chip at the middle part of plastic casing, the base correspond to installation through-hole department be provided with the heat-conducting layer of being made by high heat conductivity insulation and heat dissipation material, the lower terminal surface and the base fixed connection of heat-conducting layer, the laminating of LED chip is at the up end of heat-conducting layer. Because the LED chip is directly attached to the upper surface of the heat conducting layer, the heat conducting path of the LED chip is extremely short, the heat resistance is obviously reduced, heat generated by the LED chip is effectively LED out and dissipated through the heat conducting layer, the stability and the reliability of the LED chip are greatly enhanced, the LED chip can continuously work for a long time under large current, the LED chip with higher power can be used, and the luminous flux of unit LED packaging is improved.

Description

A LED packaging structure with high thermal conductivity

technical field

The utility model relates to the technical field of LED packaging structures, in particular to an LED packaging structure with high thermal conductivity.

Background technique

The traditional LED light source generally fixes the LED chip on the PCB board, and then wires and seals the copper-clad area of the PCB board. Then the LED packaging structure of the light source mainly dissipates heat through the PCB board. In the prior art, there are The LED chip of some LED light sources is fixed on the metal base, and the heat generated by the LED chip is first transferred to the metal base, but the thermal conductivity of the PCB board and the metal base is relatively poor, resulting in poor overall heat dissipation. The heat generated by the LED chip cannot be quickly exported out of the package, and it is easy to generate heat accumulation, resulting in a large light decay and reducing the luminous efficiency, so that the LED cannot use a large current to prevent damage due to overheating.

Contents of the invention

The utility model provides an LED package structure with high heat conduction performance aiming at the problems of the prior art, which effectively improves the heat conduction and heat dissipation performance of the LED, and enables the LED to withstand greater current.

In order to solve the above technical problems, the utility model adopts the following technical solutions:

An LED packaging structure with high thermal conductivity, including a base, a plastic shell and an LED chip, the plastic shell is arranged above the base, and a mounting through hole for installing the LED chip is provided in the middle of the plastic shell, so The base is provided with a heat conduction layer made of high thermal conductivity insulating and heat-dissipating material corresponding to the installation through hole, the lower end surface of the heat conduction layer is fixedly connected to the base, and the LED chip is attached to the heat conduction layer. upper end face.

Preferably, the heat conducting layer is a diamond film, and the diamond film is hot-pressed and sintered on the base.

As another preference, the heat conduction layer is a CVD diamond heat conduction sheet or a graphite heat conduction sheet with high thermal conductivity and heat dissipation performance.

Wherein, several LED chips and gold wires are arranged on the heat conduction layer, and the several LED chips are connected in series or in parallel through the gold wires.

Further, the plastic casing is provided with two pins, and one end of the two pins is embedded in the installation through hole and is electrically connected with the LED chip.

Still further, the LED packaging structure further includes transparent packaging silicone, and the packaging silicone is filled in the installation through hole.

Wherein, a high-transparency glass plate is fixed above the plastic shell, and a phosphor layer is arranged on the inner side of the high-transparency glass plate.

Wherein, the base is a heat-conducting copper substrate or a PCB.

The beneficial effects of the utility model:

The utility model provides an LED packaging structure with high thermal conductivity. A heat conduction layer made of high thermal conductivity insulating and heat-dissipating material is arranged on the base. The lower end surface of the heat conduction layer is fixedly connected with the base, and the LED chip is bonded on the upper surface of the heat conducting layer. Since the LED chip is directly mounted on the upper surface of the heat conduction layer, the heat conduction path of the LED chip is extremely short, and the thermal resistance is significantly reduced. Therefore, the heat generated by the LED chip can be quickly and effectively exported from the working area and dissipated through the heat conduction layer. , the heat dissipation effect is good, so that the stability and reliability of the LED chip are greatly enhanced, and the LED chip can work continuously for a long time under high current, so that a higher power LED chip can be used, and the unit LED chip can be improved. Encapsulated luminous flux.

Description of drawings

FIG. 1 is a schematic cross-sectional structure diagram of the LED packaging structure described in the present invention.

Reference numerals in Figure 1 include:

1—base 2—plastic shell 3—LED chip

4—Thermal layer 5—Gold wire 6—Pin

7—high light transmittance glass plate.

Detailed ways

In order to facilitate the understanding of those skilled in the art, the utility model will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the implementation modes are not limitations of the utility model. Referring to Fig. 1, the utility model will be described in detail below in conjunction with the accompanying drawings. Position words such as upper and lower of the present utility model are all with Fig. 1 as reference standard.

The LED packaging structure with high thermal conductivity provided by the utility model includes a base 1, a plastic shell 2 and an LED chip 3. The plastic shell 2 is arranged above the base 1 and in the middle of the plastic shell 2. An installation through hole (not marked in the figure) for installing the LED chip 3 is provided, and the base 1 is provided with a heat conduction layer 4 made of a high thermal conductivity insulating and heat-dissipating material corresponding to the installation through hole, The lower end surface of the heat conduction layer 4 is fixedly connected with the base 1 , and the LED chip 3 is pasted on the upper end surface of the heat conduction layer 4 .

As shown in Figure 1, the LED chip 3 is directly attached to the upper surface of the heat conduction layer 4, so that the heat conduction path of the LED chip 3 is extremely short, and the thermal resistance is significantly reduced. Therefore, the heat conduction layer 4 can quickly and effectively place the LED chip The heat generated by 3 is exported and dissipated from the working area, and the heat dissipation effect is good, so that the stability and reliability of the LED chip 3 are greatly enhanced, and the LED chip 3 can work continuously for a long time under high current, so it can Using higher power LED chips 3 increases the luminous flux per unit LED package.

In this embodiment, preferably, the heat conduction layer 4 is a diamond film, and the diamond film is hot-pressed and sintered on the base 1 . As another embodiment, as another preference, the heat conduction layer 4 is a CVD diamond heat conduction sheet or a graphite heat conduction sheet with high heat conduction and heat dissipation performance. The installation through hole of the utility model can be set in a circular or square or square or pentagonal or hexagonal or other geometric shapes, the size can be set according to the LED packaging structure, diamond film, CVD diamond heat conducting sheet or graphite heat conducting The size of the sheet can be made according to the shape and size of the installation through hole. The thickness of the diamond film, CVD diamond heat conduction sheet or graphite heat conduction sheet is 0.1mm ~ 1mm, and its thermal conductivity is 400 W/m·K ~ 2000 W/m· K.

In this embodiment, several LED chips 3 and gold wires 5 are arranged on the heat conducting layer 4 , and the several LED chips 4 are connected in series or in parallel through the gold wires 5 . Further, the plastic shell 3 is provided with two pins 6 , one end of the two pins 6 is embedded in the installation through hole and electrically connected with the LED chip 3 . Still further, the LED packaging structure also includes transparent packaging silicone (not shown in the figure), and the packaging silicone is filled in the installation through hole. After the LED chips 4 are connected by gold wires 5 , they are electrically connected to the pin 6 , and then filled and fixed by encapsulating silica gel, so as to prevent the short circuit between the LED chips 3 and the LED chips 3 .

In this embodiment, a high-transmittance glass plate 7 is fixed above the plastic housing 2 , and a phosphor layer (not shown in the figure) is disposed on the inner side of the high-transparency glass plate 7 . The high light-transmitting glass plate 7 can make the light output of the LED more uniform, thereby making the illumination of the entire LED product more uniform, and further improving the lighting quality. The fluorescent powder layer increases the color of the light and improves the viewing effect of the viewer.

Wherein, the base 1 is a heat-conducting copper substrate or a PCB. The base 1 used in this embodiment is a thermally conductive copper substrate, and the thermally conductive copper substrate also has an excellent effect of heat conduction and heat dissipation. Copper substrates radiate out quickly. As another preference, the base 1 is a PCB board, and the PCB board is provided with circuits, component holes, fastening holes, metallized holes, etc., which is convenient for integration and connection, and its price is cheap, which can reduce production costs.

The above content is only a preferred embodiment of the present utility model. For those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation and scope of application. The content of this specification should not be understood as Limitations on the Invention.

Claims (8)

1. A LED packaging structure with high thermal conductivity, including a base, a plastic shell and an LED chip, the plastic shell is arranged above the base, and a through hole for installing the LED chip is provided in the middle of the plastic shell , it is characterized in that: the base is provided with a heat conduction layer made of high thermal conductivity insulating and heat dissipation material corresponding to the installation through hole, the lower end surface of the heat conduction layer is fixedly connected with the base, and the LED chip Attached to the upper surface of the heat conduction layer. 2 . The LED packaging structure with high thermal conductivity according to claim 1 , wherein the thermal conductivity layer is a diamond film, and the diamond film is hot-pressed and sintered on the base. 3 . 3. A LED packaging structure with high thermal conductivity according to claim 1, characterized in that: the heat conduction layer is a CVD diamond heat conduction sheet or a graphite heat conduction sheet with high heat conduction and heat dissipation performance. 4. A LED packaging structure with high thermal conductivity according to claim 1, characterized in that: several LED chips and gold wires are arranged on the heat-conducting layer, and the several LED chips are connected in series through gold wires or in parallel. 5. A LED packaging structure with high thermal conductivity according to claim 4, characterized in that: said plastic housing is provided with two pins, one end of said two pins is embedded in the installation through hole and It is electrically connected with the LED chip. 6 . The LED packaging structure with high thermal conductivity according to claim 4 or 5 , characterized in that it further comprises transparent packaging silica gel, and the packaging silica gel is filled in the installation through hole. 6 . 7. The LED packaging structure with high thermal conductivity according to claim 1, characterized in that: a high-transmittance glass plate is fixed on the top of the plastic shell, and a fluorescent light is arranged on the inner side of the high-transparency glass plate. powder layer. 8. The LED packaging structure with high thermal conductivity according to claim 1, wherein the base is a thermally conductive copper substrate or a PCB.