CN201934985U - LED (light-emitting diode) lamp - Google Patents

LED (light-emitting diode) lamp Download PDF

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Publication number
CN201934985U
CN201934985U CN2010206792798U CN201020679279U CN201934985U CN 201934985 U CN201934985 U CN 201934985U CN 2010206792798 U CN2010206792798 U CN 2010206792798U CN 201020679279 U CN201020679279 U CN 201020679279U CN 201934985 U CN201934985 U CN 201934985U
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China
Prior art keywords
led lamp
led
ceramic substrate
lamp
substrate
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Expired - Fee Related
Application number
CN2010206792798U
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Chinese (zh)
Inventor
黄友民
刘宝妃
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SHANGHAI FREC ELECTRIC Co Ltd
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SHANGHAI FREC ELECTRIC Co Ltd
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Priority to CN2010206792798U priority Critical patent/CN201934985U/en
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The utility model discloses an LED lamp. The LED lamp comprises a heat-radiating element, a light bulb, a driving element, a plurality of LED light sources and a ceramic substrate; and LED light sources are arranged on the ceramic substrate. By adopting the structure that the LED light sources are connected with the heat-radiating element through the ceramic substrate, the problems that the conventional substrates have bad heat-conducting capability and the electricity leakage is easily caused are effectively solved, so that the LED junction temperature is reduced and the service life of the LEDs is effectively prolonged; and meanwhile, since the ceramic material has good insulation, the electricity leakage is avoided and the safety of the lamp is enhanced.

Description

The LED lamp
Technical field
The utility model relates to a kind of lamp that is used to throw light on, particularly a kind of lamp that adopts LED as light source.
Background technology
The whole world all is faced with the energy starved problem at present.The electric light that wherein is widely used in lighting field has just consumed the electric energy of quite a few.Nowadays, the lamp that is used for indoor or outdoors illumination mostly is incandescent lamp or fluorescent lamp.Incandescent lamp is as traditional illuminating lamp, though low price, electro-optical efficiency is very low, and caloric value is big, and service life is very short, only has about 1000 hours.Though power saving fluorescent lamp is than incandescent lamp superior performance in addition, the life-span can reach about 6000 hours usually, and it contains poisonous and harmful elements such as mercury, thereby still exists the life-span to lack, be unfavorable for shortcomings such as environmental protection partially.
Thereby along with science and technology development, LED (light emitting diode) has advantages such as volume is little, energy consumption is low, luminous intensity is high, the life-span is long, environmental protection as a kind of emerging lighting source, has outstanding energy-saving effect.Therefore adopt the LED element to continue to bring out on the market as the lamp of light source.
Because the electric energy that is consumed during LED work, a part is converted into the luminous energy of high brightness, and major part then can change into heat energy, so LED can produce a large amount of heats.And this part heat is if untimely distributing can be caused the unusual rising of LED junction temperature.When the LED junction temperature surpassed certain value, serious decay can appear in LED luminous intensity and life-span, even causes permanent damage, and this has just shortened the service life of LED greatly.
Thereby a lot of LED lamps all have radiator on the market, but the substrate 1 that radiator is connected with led light source in the prior art as shown in Figure 1 is composited by bottom aluminium sheet 11 and insulating barrier 12, wherein be printed with lead and the pad that is used to connect and weld led light source on insulating barrier 12 surfaces, and be connected with led light source 2 with pad by described lead, bottom aluminium sheet 11 is connected with radiator.During led light source work, the heat that sends is transmitted on the aluminium sheet 11 of bottom by insulating barrier 12, is transmitted on the radiator by bottom aluminium sheet 11 again, thereby heat is distributed.
Yet, because insulating barrier 12 has very low thermal conductivity, though bottom aluminium sheet 11 has very high thermal conductivity, but described insulating barrier 12 makes the thermal conductivity of substrate 1 integral body reduce greatly, its bulk thermal conductivity is only about 3W/ (m.K), thereby the heat that causes LED to produce can not well conduct, thereby makes the LED junction temperature reach higher temperature, cause brightness to decay fast, had a strong impact on the service life of LED.In addition since the industrial frequency withstand voltage value of insulating barrier 12 only about 100V-1000V, and thinner thickness and thickness evenness are poor, cause the dielectric strength of insulating barrier 12 lower, thereby cause the generation of leaking electricity easily.
The utility model content
The technical problems to be solved in the utility model is in order to overcome substrate poor thermal conductivity and electric leakage easily in the LED lamp of the prior art, thereby reduced the defective in LED service life, a kind of LED lamp is provided, described LED lamp passes through to use ceramic substrate, thereby has also reached good thermal conductivity in the problem that has solved easy electric leakage.
The utility model solves above-mentioned technical problem by following technical proposals:
The utility model provides a kind of LED lamp, comprises a heat dissipation element, a lamp holder and some led light sources, is characterized in that described LED lamp also comprises a ceramic substrate, and wherein said led light source is arranged on the described ceramic substrate.
Preferably, described LED lamp also comprises a driving element, and wherein said ceramic substrate, heat dissipation element and described lamp holder connect successively, and described led light source, driving element and described lamp holder are electrically connected successively.
Preferably, described heat dissipation element comprises a substrate placement seat and some fin, described substrate placement seat comprises a substrate placement surface and a fin placement surface, and wherein said substrate placement surface engages with described ceramic substrate, and described fin placement surface is provided with described fin.
Preferably, described substrate placement surface and described ceramic substrate are chimeric.
Preferably, described substrate placement surface has a concave surface, and described substrate placement surface is chimeric by described concave surface and described ceramic substrate.
Preferably, also be coated with a Heat Conduction Material between the substrate placement surface of described substrate placement seat and the described ceramic substrate.
Preferably, described Heat Conduction Material is thermal grease conduction, heat-conducting glue or heat-conducting cream.
Preferably, the substrate placement surface of described substrate placement seat also is connected with described ceramic substrate by some securing members.
Preferably, described securing member is bolt or screw.
Preferably, described LED lamp also comprises a lampshade, and described lampshade is connected with described heat dissipation element, and coats described ceramic substrate.
Preferably, described lampshade is connected with described heat dissipation element gummed.
Preferably, the material of described lampshade is glass or plastics.
Preferably, described led light source is single led or led array or led module.
Preferably, described lamp holder is spirally connected and/or glues together with described heat dissipation element and is connected.
Preferably, described ceramic substrate also comprises some leads, and described lead is arranged on the described ceramic substrate, and described led light source is electrically connected with described driving element by described lead.
Preferably, described ceramic substrate also comprises the some pads that are connected with described lead, and described pad is arranged on the described ceramic substrate, and described led light source is fixedly set on the described ceramic substrate by described pad.
Preferably, the material of described ceramic substrate is aluminium oxide or aluminium nitride.
Preferably, the material of described heat dissipation element is aluminium, aluminium alloy or pottery.
Preferably, described heat dissipation element has a hollow cavity, the described hollow cavity described driving element that is used to pack into.
Positive progressive effect of the present utility model is:
LED lamp of the present utility model connects led light source and heat dissipation element by ceramic substrate, the poor thermal conductivity of conventional substrate and the problem of leaking electricity have easily effectively been solved, thereby reduced the LED junction temperature, thereby effectively prolonged the service life of LED, and because ceramic good insulation performance, guaranteed that lamp can not leak electricity, and has improved the security performance of lamp.
Description of drawings
Fig. 1 is the structural representation of substrate in the LED lamp in the prior art.
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of first embodiment of LED lamp of the present utility model.
Fig. 3 is the overall structure schematic diagram of first embodiment of LED lamp of the present utility model.
Fig. 4 is the STRUCTURE DECOMPOSITION schematic diagram of second embodiment of LED lamp of the present utility model.
Fig. 5 is the overall structure schematic diagram of second embodiment of LED lamp of the present utility model.
The specific embodiment
Provide the utility model preferred embodiment below in conjunction with accompanying drawing, to describe the technical solution of the utility model in detail.
First embodiment:
Figure 2 shows that the STRUCTURE DECOMPOSITION schematic diagram of LED lamp of the present utility model, wherein said LED lamp comprises that a lamp holder 1, a heat dissipation element 2, are provided with ceramic substrate 3, a driving element 4 and the lampshade 5 of LED.
Lamp holder 1 adopts the lamp holder of E27 form in the utility model, and promptly described lamp holder 1 is spun and glues together with round plastic pipe 12 by the circular metal shell 11 that meets the E27 standard thread and forms, and described round plastic pipe 12 bottoms are provided with screw thread, are used for spinning with heat dissipation element 2.Those skilled in the art can adopt the lamp holder of other kinds or form according to the needs of actual or concrete lamp.
Heat dissipation element 2 is made by aluminium, aluminium alloy or ceramic material in the utility model, this is because aluminium and aluminium alloy have good performance of heat dissipation, its thermal conductivity is not less than 170W/ (m.K), and it is in light weight, cost is low, and those skilled in the art can also adopt other Heat Conduction Material to make heat dissipation element 2 with requiring according to the actual needs.Described heat dissipation element 2 comprises a circular aluminium sheet 22, is vertically installed in the hollow aluminum pipe 23 on the circular aluminium sheet 22, and described circular aluminium sheet 22 has constituted the substrate placement seat that is used to be provided with ceramic substrate 3 with hollow aluminum pipe 23.Those skilled in the art can adopt other structure to realize the substrate placement seat with requiring according to the actual needs.The outer circumference surface of described hollow aluminum pipe 23 is vertically installed with one group of fin 21, described fin 21 also with circular 22 vertical connections of aluminium sheet.Those skilled in the art can be as required and requirement, adopts the fin of other shapes, structure and quantity and can fin be set in the substrate placement seat with other form and structure according to the structure of substrate placement seat.One end opening of described hollow aluminum pipe 23, madial wall are provided with screw thread and are used for spinning with lamp holder 1.Those skilled in the art can be as required with require to adopt different connected modes, for example gummed etc. connects lamp holder 1 and heat dissipation element 2.Described circular aluminium sheet 22 also has a recessed disk 221, the form fit of described disk 221 and ceramic substrate 3, thus described ceramic substrate 3 can be fitted to described recessed disk 221.Those skilled in the art can adopt the circular aluminium sheet 22 of different structures that ceramic substrate 3 is set with requiring as required.Described in addition disk is provided with 4 holes, is used to install and fix ceramic substrate 3 and passes lead, fixes ceramic substrate 3 by bolt or screw in the present embodiment.Those skilled in the art can be as required fixes ceramic substrate 3 and passes lead with the hole that requires to adopt varying number or different securing member and different modes and structure.
Ceramic substrate 3 is made by aluminium oxide or aluminium nitride in the utility model, because the thermal conductivity of pottery is not less than 20W/ (m.K) and has good insulation performance and stability, its breakdown voltage is not less than 12Kv/mm usually, the industrial frequency withstand voltage value can stably reach more than the 2000V, so be suitable as very much the substrate of LED lamp, those skilled in the art can and require according to concrete needs to adopt other ceramic material to make ceramic substrate 3.Described in addition ceramic substrate 3 is circular, and is complementary with recessed disk 221 on the circular aluminium sheet 22 of heat dissipation element 2, can closely embed in the recessed disk 221.Be printed with conducting wire and pad on the surface of described ceramic substrate 3.5 high-power and high-luminance LEDs 31 are in the mode of led array, and the pad dress of printing by the surface of described ceramic substrate 3 is soldered on the ceramic substrate 3.And LED 31 also is electrically connected with driving element 4 by the conducting wire that is electrically connected with pad that the surface of described ceramic substrate 3 is printed.Those skilled in the art can be according to actual needs and the LED that requires to adopt other kind, and is for example single led, and led array, as led light source; Those skilled in the art can also adopt other mode to be connected described LED31 and driving element 4 with method with requiring according to actual needs.Ceramic substrate 3 is provided with corresponding 4 holes, 4 holes with the recessed disk 221 of heat dissipation element 2, can ceramic substrate 3 closely is fixed on the recessed disk 221 of heat dissipation element 2 and connect lead to driving element 4 with screw or other retaining elements by above-mentioned hole.Those skilled in the art can be according to actual needs be fixed on ceramic substrate 3 on the heat dissipation element 2 with the mode that requires to adopt other or connects lead to driving element 4.
In the utility model driving element 4 be in the prior art with the driver of current constant mode driving LED 31, this area staff can adopt driving element, circuit or the module of other kind to realize the function of driving LED 31 as required.The input of described driving element 4 is connected with lamp holder 1 by lead, and output links to each other with conducting wire on the ceramic substrate 3 by lead.Described driving element 4 is installed in heat dissipation element 2 and lamp holder 1 and spins in the cavity that the back forms.
Lampshade 5 is made by the glass or the plastics of high transmission rate in the utility model, and to the light generation diffuse reflection effect of LED31, the light that LED31 is sent is even, soft, is difficult for producing dazzling phenomenon.It is the effect that realizes control LED31 light that this area staff can adopt the lampshade material of other kind and the lampshade of other shape as required.
The process that structure of the present utility model is installed is as follows:
During the assembling of LED lamp, at first with in the round plastic pipe 12 of driving element 4 insertion lamp holders 1 or in the hollow aluminum pipe 23 of insertion heat dissipation element 2, and lamp holder 1 closely spins lamp holder 1 and heat dissipation element 2 by the external screw thread of himself and the internal thread of heat dissipation element 2, perhaps be coated with high-strength structureal adhesives between the internal thread of external screw thread on the lamp holder 1 and heat dissipation element 2, adhesive solidifies behind the certain hour after lamp holder 1 and heat dissipation element 2 closely spin.Thereby driving element 4 is comprised in the cavity of described lamp holder 1 round plastic pipe 12 and heat dissipation element 2 hollow aluminum pipes 23 compositions, after this external curing, when when lamp holder 1 and 2 of heat dissipation elements apply the reactive torque of regulation, 2 of lamp holder 1 and heat dissipation elements can not produce the segregation phenomenon that gets loose, and satisfy the security requirement of relevant criterion.
After this recessed disk 221 surfaces of heat dissipation element 2 evenly are coated with the Heat Conduction Material of high thermal conductivity in advance, for example heat-conducting silicone grease or heat conductive silica gel etc., and those skilled in the art can adopt other Heat Conduction Material as required.Then, on recessed disk 221 surfaces with screw fastening installation ceramic substrate 3, thereby contacting between the bottom that makes ceramic substrate 3 and the heat dissipation element 2 is more closely abundant.In this way, the heat that produces when LED31 energising work can be delivered to rapidly on the heat dissipation element 2 by the ceramic substrate 3 of high thermal conductivity, rapidly heat is dispersed in the surrounding environment by heat dissipation element 2, has guaranteed that the LED31 junction temperature can not raise unusually.
Then, lampshade 5 and heat dissipation element 2 become an integral body by high temperature resistant, high-intensity adhesive bonding connection.Those skilled in the art can adopt other fixedly connected mode to connect lampshade 5 and heat dissipation element 2 as required.
Obtain the overall structure schematic diagram of the LED lamp of present embodiment as shown in Figure 3 by above-mentioned assembling process.
Second embodiment:
Figure 4 shows that the STRUCTURE DECOMPOSITION schematic diagram of the LED lamp of present embodiment, the difference of the LED lamp among LED lamp in the present embodiment and above-mentioned first embodiment is, there is not lampshade in the present embodiment, and replaced LED31 among first embodiment with a led module 32, because what led module 32 adopted in the present embodiment is led module of the prior art, and because described led module has complete optical system, so no longer need lampshade to control the light that LED sends in the present embodiment, thereby can reach the effect of better heat radiation.Those skilled in the art can adopt the led module of other kind or quantity as required.Identical among other element and the connected mode between the element and first embodiment in the lamp, repeat no more here.
Owing to do not have lampshade in the present embodiment, and replaced LED31 among first embodiment with a led module 32, so no longer comprise the assembling process of lampshade in the assembling process of present embodiment, and the assembling process of the LED31 among the assembling process of led module 32 and first embodiment is identical, the assembling that is other element in the lamp also is identical with first embodiment, so just repeat no more here.Can obtain the overall structure schematic diagram of LED lamp as shown in Figure 5 by above-mentioned assembling.
Though more than described the specific embodiment of the present utility model, it will be understood by those of skill in the art that these only illustrate, protection domain of the present utility model is limited by appended claims.Those skilled in the art can make numerous variations or modification to these embodiments under the prerequisite that does not deviate from principle of the present utility model and essence, but these changes and modification all fall into protection domain of the present utility model.

Claims (19)

1. a LED lamp comprises a heat dissipation element, a lamp holder and some led light sources, it is characterized in that, described LED lamp also comprises a ceramic substrate, and wherein said led light source is arranged on the described ceramic substrate.
2. LED lamp according to claim 1 is characterized in that described LED lamp also comprises a driving element, and wherein said ceramic substrate, heat dissipation element and described lamp holder connect successively, and described led light source, driving element and described lamp holder are electrically connected successively.
3. LED lamp according to claim 1, it is characterized in that, described heat dissipation element comprises a substrate placement seat and some fin, described substrate placement seat comprises a substrate placement surface and a fin placement surface, wherein said substrate placement surface engages with described ceramic substrate, and described fin placement surface is provided with described fin.
4. as LED lamp as described in the claim 3, it is characterized in that described substrate placement surface and described ceramic substrate are chimeric.
5. as LED lamp as described in the claim 4, it is characterized in that described substrate placement surface has a concave surface, described substrate placement surface is chimeric by described concave surface and described ceramic substrate.
6. as LED lamp as described in the claim 3, it is characterized in that, also be coated with a Heat Conduction Material between the substrate placement surface of described substrate placement seat and the described ceramic substrate.
7. as LED lamp as described in the claim 6, it is characterized in that described Heat Conduction Material is thermal grease conduction, heat-conducting glue or heat-conducting cream.
8. as LED lamp as described in the claim 3, it is characterized in that the substrate placement surface of described substrate placement seat also is connected with described ceramic substrate by some securing members.
9. as LED lamp as described in the claim 8, it is characterized in that described securing member is bolt or screw.
10. LED lamp according to claim 1 is characterized in that described LED lamp also comprises a lampshade, and described lampshade is connected with described heat dissipation element, and coats described ceramic substrate.
11., it is characterized in that described lampshade is connected with described heat dissipation element gummed as LED lamp as described in the claim 10.
12., it is characterized in that the material of described lampshade is glass or plastics as LED lamp as described in the claim 10.
13. the LED lamp is characterized in that according to claim 1, described led light source is single led or led array or led module.
14. the LED lamp is characterized in that according to claim 1, described lamp holder is spirally connected and/or glues together with described heat dissipation element and is connected.
15. the LED lamp is characterized in that according to claim 1, described ceramic substrate also comprises some leads, and described lead is arranged on the described ceramic substrate, and described led light source is electrically connected with described driving element by described lead.
16. as LED lamp as described in the claim 15, it is characterized in that described ceramic substrate also comprises the some pads that are connected with described lead, described pad is arranged on the described ceramic substrate, described led light source is fixedly set on the described ceramic substrate by described pad.
17. the LED lamp is characterized in that according to claim 1, the material of described ceramic substrate is aluminium oxide or aluminium nitride.
18. the LED lamp is characterized in that according to claim 1, the material of described heat dissipation element is aluminium, aluminium alloy or pottery.
19. the LED lamp is characterized in that according to claim 1, described heat dissipation element has a hollow cavity, the described hollow cavity described driving element that is used to pack into.
CN2010206792798U 2010-12-24 2010-12-24 LED (light-emitting diode) lamp Expired - Fee Related CN201934985U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206792798U CN201934985U (en) 2010-12-24 2010-12-24 LED (light-emitting diode) lamp

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Application Number Priority Date Filing Date Title
CN2010206792798U CN201934985U (en) 2010-12-24 2010-12-24 LED (light-emitting diode) lamp

Publications (1)

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CN201934985U true CN201934985U (en) 2011-08-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013053198A1 (en) * 2011-10-09 2013-04-18 Chen Jeong-Shiun Light-emitting diode lighting having plastic light housing
CN103175177A (en) * 2011-12-21 2013-06-26 戴培钧 Heat dissipation structure used for light emitting diode (LED) lamp and LED lamp using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013053198A1 (en) * 2011-10-09 2013-04-18 Chen Jeong-Shiun Light-emitting diode lighting having plastic light housing
CN103175177A (en) * 2011-12-21 2013-06-26 戴培钧 Heat dissipation structure used for light emitting diode (LED) lamp and LED lamp using same

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110817

Termination date: 20141224

EXPY Termination of patent right or utility model