CN102192411A - LED lamp for reinforcing heat dissipation - Google Patents
LED lamp for reinforcing heat dissipation Download PDFInfo
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- CN102192411A CN102192411A CN2010101212945A CN201010121294A CN102192411A CN 102192411 A CN102192411 A CN 102192411A CN 2010101212945 A CN2010101212945 A CN 2010101212945A CN 201010121294 A CN201010121294 A CN 201010121294A CN 102192411 A CN102192411 A CN 102192411A
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- heat
- insulation material
- alternating current
- led lamp
- wick
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- 230000003014 reinforcing Effects 0.000 title abstract 2
- 239000011159 matrix material Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 36
- 238000009413 insulation Methods 0.000 claims description 34
- 230000002708 enhancing Effects 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- 235000014692 zinc oxide Nutrition 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 19
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
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- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
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- 229910001884 aluminium oxide Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Images
Abstract
The invention discloses an LED lamp for reinforcing heat dissipation, comprising an LED lamp core, wherein a conductive insulating material is filled in a cavity of a lamp holder, and an electrode is mechanically contacted with the lamp core and the lamp holder so as to transmit heat energy from the lamp core to the electrode and adhere a lampshade on the lamp holder to transmit the heat energy from the electrode to the lampshade. The heat dissipation area is enlarged by the lampshade to help the lamp core to dissipate the heat.
Description
Technical field
The present invention relates to a kind of electric light, particularly about a kind of light emitting diode (LED) lamp that can directly replace traditional tungsten filament, halogen or Electricity-saving lamp bulb.
Background technology
Use the LED lamp of direct current LED matrix, must use power supply changeover device to convert alternating current to direct current and supply this direct current LED matrix, therefore can increase the cost of LED lamp as wick.In addition, power supply changeover device is difficult to hide fully be placed in the standard lamp head of conventional bulb, therefore needs mold developing making separately to be different from mechanism's part of conventional bulb, not only more increases cost, also increases the volume of LED lamp.The direct current LED matrix can produce heat energy when energising, so must handle these heat energy by the additional designs cooling mechanism.If can't efficiently radiates heat, high temperature can cause the luminous efficiency of LED to reduce, the life-span reduces and unfavorable effect such as wavelength shift.Power supply changeover device also can produce heat energy alternating current being converted in the galvanic process, particularly inductance wherein and integrated circuit, and high temperature also can damage this class component, causes product to operate.Particularly in high-power application, the light fixture of lighting use for example, the heat energy that the direct current LED matrix produces is higher, and therefore heat radiation is not enough and situation that cause is more serious.Some product adopts many lower powered bullet cut LED, and uses simple bridge rectifier, so that adapt to traditional lamp holder of small size.But lower powered LED brightness is generally low excessively, and the market acceptance is limited, and this series products is often because poor heat radiation, and the light decay phenomenon is serious.
In recent years, the technology of the LED matrix of use alternating current is day by day ripe, and brightness also promotes day by day, has had commercial exploitation and has been worth.The alternating current LED matrix is that a plurality of LED with series and parallel are produced on the same epi-wafer, the resistor that this epi-wafer encapsulation back series connection has certain resistance value, can directly bear civil power uses as high voltages such as 110 volts or 220 volts, therefore economize required power supply changeover device of removing DC LED matrix or rectification circuit, effectively reduce cost and reduce the quality problems that circuit causes.Though the alternating current LED matrix conveniently is applied in the space of small size, still have the problem of heat radiation to handle.Especially in high-power application, the light fixture of lighting use for example, the heat energy of its generation is higher, if set up radiator, can strengthen the volume and the cost of LED lamp, if do not help the heat radiation of alternating current LED matrix, can cause luminous efficiency reduction, the life-span of LED to reduce and wavelength shift, even burn the LED epi-wafer again.
This case applicant once proposed a kind of LED lamp at China's patent application case number No. 098115441, and it fills heat-conducting insulation material in lamp holder, so that heat energy is conducted to this lamp holder from the LED wick, thereby helped this LED wick heat radiation with the electrode of this lamp holder.The application's case is the further improvement to this preceding case.
Summary of the invention
One of purpose of the present invention is to propose the LED lamp that a kind of LED of reinforcement wick dispels the heat.
According to the present invention, a kind of LED lamp of enhance heat comprises the wick that contains at least one alternating current LED matrix, lamp holder with chamber, heat-conducting insulation material is filled in this chamber, mechanically contact an electrode of this wick and this lamp holder, with help heat energy is conducted to this electrode from this wick, and lampshade is sticked together on this lamp holder, to help that heat energy is conducted to this lampshade from this electrode.This lampshade is used for enlarging area of dissipation, further improves radiating effect.
The preferably, this heat-conducting insulation material some between this wick and this lampshade, help heat energy is conducted to this lampshade from this wick.The preferably, the heat-conducting insulation material of this part has the surface of white to improve light emission rate.
Description of drawings
Fig. 1 is the schematic diagram of the first embodiment of the present invention;
Fig. 2 is the schematic diagram of equivalent circuit of the LED lamp of Fig. 1;
Fig. 3 is the schematic diagram of several alternating current LED epi-wafers;
Fig. 4 is the schematic diagram of the second embodiment of the present invention;
Fig. 5 is the schematic diagram of many epi-wafers wick;
Fig. 6 is the schematic diagram of the third embodiment of the present invention;
Fig. 7 is the schematic diagram of the fourth embodiment of the present invention;
Fig. 8 is the schematic diagram of the fifth embodiment of the present invention;
Fig. 9 is the schematic diagram of the sixth embodiment of the present invention;
Figure 10 is the schematic diagram of the seventh embodiment of the present invention;
Figure 11 is the schematic diagram of the eighth embodiment of the present invention;
Figure 12 is packaged in structure in the same encapsulation with alternating current LED epi-wafer and chip resister;
Figure 13 is the schematic diagram of equivalent circuit of the assembly of Figure 12; And
Figure 14 is to use the schematic diagram of embodiment of the assembly of Figure 12.
Specific embodiment
Below in conjunction with Figure of description the specific embodiment of the present invention is done detailed description.
Fig. 1 is the schematic diagram of the first embodiment of the present invention.In order to highlight characteristics of the present invention, the standard lamp head 10 that this embodiment uses miniature bulb to use, its have electrode 12 with 14 for being connected AC power.Be familiar with as those skilled in the art, electrode 12 is the metal-backs with spiral lamination profile 16, and chamber 18 is arranged in it.This embodiment uses an alternating current LED matrix 20 as wick, and this wick is that alternating current LED epi-wafer 22 is fixed on the support 24, and covers sealing 26 thereon.LED is encapsulated as prior art, for simplicity of illustration, does not draw the detailed packaging structure of alternating current LED matrix 20 herein.One end of resistor 30 is soldered to electrode 14, and the other end is soldered to LED matrix 20 with lead 32, and the two ends of lead 34 are respectively welded to electrode 12 and alternating current LED matrix 20.The equivalent circuit of this LED lamp as shown in Figure 2, alternating current LED epi-wafer 22 and resistor 30 are to be connected between electrode 12 and 14.Be familiar with as those skilled in the art, so-called alternating current LED epi-wafer, the LED that contains two opposite direction configurations is connected in parallel between two branch connecting pins, have at least one LED on each this direction, the LED of these two opposite direction configurations is lighted in the positive and negative half period of AC power respectively.The size of the resistance value R of resistor 30 is to select according to the current value of design requirement.Resistor 30 also has the function of protection alternating current LED epi-wafer 22, and when being connected to the AC power generation surging of electrode 12 and 14, resistor 30 can absorb most surge voltage.Get back to Fig. 1, one of characteristics of the present invention, be in chamber 18, to fill heat-conducting insulation material 36, its first that is positioned at this wick below mechanically contacts support 24 and electrode 12, provides first passage of heat that alternating current LED epi-wafer 22 is dispelled the heat because of thermal energy conduction to the electrode 12 that electrified light emitting produces.Be familiar with as those skilled in the art, support 24 contains the sheet metal of helpful alternating current LED epi-wafer 22 heat radiations usually, and therefore, support 24 is attached on the heat-conducting insulation material 36, has good thermal conductance effect.Except helping 22 heat radiations of alternating current LED epi-wafer, heat-conducting insulation material 36 also helps resistor 30 heat radiations, because resistor 30 is embedded in the heat-conducting insulation material 36.Shown in the partial enlarged drawing on Fig. 1 right side, the second portion 78 of heat-conducting insulation material 36 sticks together lampshade 40 on lamp holder 10, thereby provide second passage of heat that heat energy is conducted to lampshade 40 from lamp holder 10, the third part 80 of heat-conducting insulation material 36 thereby provides the 3rd passage of heat that heat energy is conducted to lampshade 40 from wick between wick and lampshade 40.Because lampshade 40 has enlarged area of dissipation, so better radiating effect can be provided.The preferably, the third part 80 of heat-conducting insulation material 36 has the surface 82 of white, with absorption and the increase reflection of light that reduces light, therefore improves the light emission rate of LED lamp.
Heat-conducting insulation material 36 can be selected epoxy resin for use, perhaps heat conduction powder, for example aluminium oxide, aluminium nitride, boron nitride or other Heat Conduction Material, the perhaps mixture of the two.Form the surface 82 of white, can on the third part 80 of heat-conducting insulation material 36, be coated with Chinese white, or titanium dioxide is mixed in the heat-conducting insulation material 36.
What conventional bulb was used is standard lamp head, and for example E12, E14, E17, E26 and E27 are the lamp holders of traditional osram lamp, and MR16 and GU10 are the lamp holders of traditional based on halogen bulb.
As shown in Figure 1, the size of this LED lamp is approximately identical with lamp holder 10, has good heat-sinking capability again, can reach the high power applications that prior art is not accomplished.In the lamp holder of traditional based on halogen bulb, an electrode is the cylindrical metal shell, is insulated thing and another electrode separation is opened.Some standard lamp head then is to use two needle electrodes insulated from each other.No matter be lamp holder or other standard lamp head of traditional osram lamp, traditional based on halogen bulb, all there is chamber can fill heat-conducting insulation material, therefore have at least an electrode to dispel the heat with the wick of helping the LED lamp.Because the electrode of lamp holder outwards exposes to the open air, so good radiating effect can be provided.
The brightness that can select for use the alternating current LED epi-wafer 22 that includes more LED quantity to improve the LED lamp.Fig. 3 is the schematic diagram of several alternating current LED epi-wafers 22, and first kind is the opposite LED of two string directions in parallel between two branch connecting pins, and each string comprises plural LED; Second kind is right at the LED of series connection more than two couples between two branch connecting pins, and every pair of LEDs is connected in parallel to containing the opposite LED of both direction; The third is that LED more than five is configured to bridge architecture.These have all had commercial product to select for use.
Lampshade 40 prevents that as over cap aqueous vapor, dust or external force are applied on the intraware of LED lamp.Lampshade 40 also has the function of optical module, and the modes such as atomizing, geometry design that can see through produce various required optical effects.The vaporific structure of lampshade 40 can be utilized sandblast, etching, static powder body coating, coating silica gel, spray paint or the injection molding method making.
Fig. 4 is the schematic diagram of the second embodiment of the present invention.The wick of this embodiment comprise circuit board 28 and on alternating current LED matrix 20, alternating current LED matrix 20 contains at least one alternating current LED epi-wafer 22.Resistors in series 38 changes into and being installed on the circuit board 28, and with lead 34 and 32 circuit board 28 is connected between electrode 12 and 14.Circuit board 28 can be selected the assembly of tempered glass fiber (FR4) or metal substrate (IMS) for use; Alternating current LED matrix 20 and resistors in series 38 can be selected surface installing type assembly (SMD) for use, use surface mount technology (SMT) to be installed on the circuit board 28.Because resistor 38 is to be welded on the circuit board 28, therefore can use variable resistance to increase the elasticity of using, for example convenient current value of adjusting by alternating current LED matrix 20.The amount of heat-conducting insulation material 36 is filled to it and covers on the circuit board 28, so the third part 80 of heat-conducting insulation material 36 is above circuit board 28, shown in the partial enlarged drawing on right side.The embodiment of further feature and Fig. 1 is identical.
If improve the brightness of LED lamp, can use more alternating current LED matrix 20 series, parallel or connection in series-parallel.Many epi-wafers wick for example shown in Figure 5 is three row's alternating current LED matrixs 20 in parallel between the weld pad 52 and 54 of circuit board 28, and each row is contained three alternating current LED matrixs 20.If the power of each alternating current LED matrix 20 is 1 watt, then this wick can reach 9 watts.
The wick of Fig. 1, Fig. 4 and Fig. 5 is that alternating current LED matrix 20 is attached on the circuit board 28, also can change on circuit board 28 encapsulation alternating current epi-wafer 22 into, and it is that naked crystalline substance with alternating current epi-wafer 22 directly is attached on the circuit board 28, covers sealing 26 behind the routing again.
Fig. 6 is the schematic diagram of the third embodiment of the present invention, alternating current LED matrix 20 is welded on the card of heat-conducting piece 50, the other end of heat-conducting piece 50 is imbedded in the heat-conducting insulation material 36, utilizes it to imbed the height that the depth in the heat-conducting insulation material 36 is adjusted alternating current LED matrix 20.The embodiment of further feature and Fig. 1 is identical.
Fig. 7 is the schematic diagram of the fourth embodiment of the present invention, use has the circuit board 28 of perforation 60, one end of heat-conducting piece 50 is above circuit board 28, and the other end 60 is imbedded in the heat-conducting insulation material 36 through perforation, and alternating current LED matrix 20 is welded on the end that heat-conducting piece 50 exposes.The pin 66 of alternating current LED matrix 20 is soldered to circuit board 28, has scolding tin 70 to be soldered to electrode 12 in the perforation 64 of circuit board 28.Resistor 30 is welded between electrode 14 and the circuit board 28, so resistor 30 and alternating current LED matrix 20 are connected between electrode 12 and 14.Circuit board 28 can be selected the assembly of tempered glass fiber or metal substrate for use.The preferably, circuit board 28 is thermal contact conductance insulating materials 36 mechanically also.In different embodiment, also can change resistor 30 into be welded on the circuit board 28 resistor, or the increase resistor is connected with resistor 30 on circuit board 28.The preferably, the upper surface coating Chinese white of circuit board 28 is to improve the light emission rate of LED lamp.The embodiment of further feature and Fig. 4 is identical.
Fig. 8 is the schematic diagram of the fifth embodiment of the present invention, use has the circuit board 28 of perforation 60, welding alternating current LED matrix 20 on it, the first of heat-conducting insulation material 36 is through 60 bottoms of contact ac electricity LED matrix 20 mechanically of boring a hole, the third part 80 of heat-conducting insulation material 36 covers on the circuit board 28, the preferably, it is the surface of the full circuit board 28 of lid as far as possible, except alternating current LED matrix 20.The third part 80 of heat-conducting insulation material 36 has the surface of white to improve light emission rate.The embodiment of further feature and Fig. 7 is identical.
The LED lamp of Fig. 8 is used half-mask lampshade 40 instead, and as shown in Figure 9, the inner surface of lampshade 40 can plated film or coating reflectorized material and form reflective surface 86.The embodiment of further feature and Fig. 8 is identical.
The embodiment of Figure 10 uses the circuit board 28 with metal substrate.Sort circuit plate 28 has aluminium lamination, copper layer and heat-conducting layer between between the two, and heat-sinking capability is higher than the tempered glass fibre base plate.Alternating current LED matrix 20 is welded on the circuit board 28 with the COB encapsulating structure, scolding tin 70 is soldered to electrode 12 with circuit board 28, resistor 30 is welded between electrode 14 and the circuit board 28, so resistor 30 and alternating current LED matrix 20 are connected between electrode 12 and 14.In different embodiment, also can change resistor 30 into be welded on the circuit board 28 resistor, or the increase resistor is connected with resistor 30 on circuit board 28.Circuit board 28 has perforation 84 for filling heat-conducting insulation material 36 in chamber 18.The embodiment of further feature and Fig. 8 is identical.
As shown in figure 11, except resistor 30, can increase a resistor 38 that is installed on the circuit board 28 and be connected between resistor 30 and the alternating current LED matrix 20.Resistor 38 can adopt variable resistance, adjusts its resistance value according to demand.The embodiment of further feature and Fig. 4 is identical.
Figure 12 is packaged in structure in the same encapsulation with alternating current LED epi-wafer 22 and chip resister 90, alternating current LED epi-wafer 22 and two chip resisters 90 are attached on the pad 88, closing line 92 connects alternating current LED epi-wafer 22 and chip resister 90, closing line 94 connects pin 66 and chip resister 90, sealing 26 coats all circuit structures, and its equivalent circuit as shown in figure 13.The embodiment of Figure 14 is that the assembly with Figure 12 is welded between electrode 12 and 14 and forms the loop, and the embodiment of further feature and Fig. 1 is identical.
In the various embodiments described above, generally speaking, the cooling mechanism by the second portion 78 and the third part 80 of heat-conducting insulation material 36 are set up can help the operating temperature of alternating current LED matrix 20 to reduce by 1 to 5 ℃ again.
According to the application of reality, the alternating current LED matrix 20 of employing, its power are between 0.3 to 5W, and the preferably is 1 to 3W, selects the resistor 30 or 38 of 50 to 50000 nurses difficult to understand.The working voltage of alternating current LED matrix 20 is between 12 to 240 volts, if use single alternating current LED matrix 20, then its working voltage is chosen as 110 volts or 220 volts of persons according to AC power; A plurality of alternating current LED matrixs 20 if connect, then the voltage of its use can be selected the junior for use, for example 12 volts.
Except the various encapsulating structures that the various embodiments described above are showed, the also applicable the present invention of the assembly of other different kenels or encapsulation.
More than; only be preferred embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claim was defined.
Claims (10)
1. the LED lamp of an enhance heat is characterized in that, comprising:
Wick contains the alternating current LED matrix of at least one power between 0.3 to 5W;
Have the lamp holder of first and second electrode, it has chamber, and this first electrode has spiral lamination, column or needle-like profile;
Resistance value is connected between this first and second electrode between the resistor between 50 to 50000 nurses difficult to understand and this wick;
The heat-conducting insulation material of thermal conductivity factor between 0.25 to 30W/mK is filled in this chamber; And
Lampshade;
Wherein, this heat-conducting insulation material has first and mechanically contacts this wick and this first electrode, thereby provide first passage of heat to help this wick heat radiation to this first electrode, and second portion sticks together this lampshade on this lamp holder, thereby provides second passage of heat that heat energy is conducted to this lampshade from this first electrode.
2. the LED lamp of enhance heat as claimed in claim 1 is characterized in that, this heat-conducting insulation material has third part between this wick and this lampshade, thereby provides the 3rd passage of heat that heat energy is conducted to this lampshade from this wick.
3. the LED lamp of enhance heat as claimed in claim 1 or 2 is characterized in that, the first of this heat-conducting insulation material directly contacts the bottom of this alternating current LED matrix.
4. the LED lamp of enhance heat as claimed in claim 1 is characterized in that, this wick comprises this at least one alternating current LED matrix of circuit board bearing, and mechanically contacts the first of this heat-conducting insulation material.
5. the LED lamp of enhance heat as claimed in claim 4 is characterized in that, a part of upper surface of this circuit board is coated with Chinese white.
6. the LED lamp of enhance heat as claimed in claim 4 is characterized in that, this heat-conducting insulation material has third part and covers on this circuit board, and mechanically contacts this lampshade, thereby provides the 3rd passage of heat that heat energy is conducted to this lampshade from this wick.
7. the LED lamp of enhance heat as claimed in claim 1 is characterized in that, the alternating current LED epi-wafer of this resistor and this alternating current LED matrix is packaged in the same encapsulation.
8. the LED lamp of enhance heat as claimed in claim 1 is characterized in that, this heat-conducting insulation material comprises epoxy resin, or the heat conduction powder, or its mixture.
9. as the LED lamp of claim 2 or 6 described enhance heats, it is characterized in that the third part of this heat-conducting insulation material has the surface of white.
10. the LED lamp of enhance heat as claimed in claim 9 is characterized in that, this heat-conducting insulation material comprises titanium dioxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010121294.5A CN102192411B (en) | 2010-03-10 | 2010-03-10 | The LED of enhance heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010121294.5A CN102192411B (en) | 2010-03-10 | 2010-03-10 | The LED of enhance heat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102192411A true CN102192411A (en) | 2011-09-21 |
| CN102192411B CN102192411B (en) | 2015-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010121294.5A Active CN102192411B (en) | 2010-03-10 | 2010-03-10 | The LED of enhance heat |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883505A (en) * | 2012-09-21 | 2013-01-16 | 深圳Tcl新技术有限公司 | LED (light-emitting diode) driving circuit, method and LED lamp bar |
| WO2017024429A1 (en) * | 2015-08-07 | 2017-02-16 | 深圳市裕富照明有限公司 | Gas-filled led light bulb using smt |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2736938Y (en) * | 2004-09-21 | 2005-10-26 | 凌建春 | Energy-saving colored electric bulb |
| CN2753951Y (en) * | 2004-11-16 | 2006-01-25 | 谢岳桂 | Energy-saving small electric bulb |
| CN201314520Y (en) * | 2008-10-14 | 2009-09-23 | 曹金城 | Polygonal LED lamp bulb applicable to energy-saving modification of Chinese style lamps |
-
2010
- 2010-03-10 CN CN201010121294.5A patent/CN102192411B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2736938Y (en) * | 2004-09-21 | 2005-10-26 | 凌建春 | Energy-saving colored electric bulb |
| CN2753951Y (en) * | 2004-11-16 | 2006-01-25 | 谢岳桂 | Energy-saving small electric bulb |
| CN201314520Y (en) * | 2008-10-14 | 2009-09-23 | 曹金城 | Polygonal LED lamp bulb applicable to energy-saving modification of Chinese style lamps |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883505A (en) * | 2012-09-21 | 2013-01-16 | 深圳Tcl新技术有限公司 | LED (light-emitting diode) driving circuit, method and LED lamp bar |
| WO2017024429A1 (en) * | 2015-08-07 | 2017-02-16 | 深圳市裕富照明有限公司 | Gas-filled led light bulb using smt |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102192411B (en) | 2015-09-09 |
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