JP6210830B2

JP6210830B2 - LED bulb

Info

Publication number: JP6210830B2
Application number: JP2013210323A
Authority: JP
Inventors: 広司市川; 正人外川; 吉正高山; 孝蓮沼; 達郎山田
Original assignee: Citizen Electronics Co Ltd; Citizen Watch Co Ltd
Current assignee: Citizen Electronics Co Ltd; Citizen Watch Co Ltd
Priority date: 2013-05-27
Filing date: 2013-10-07
Publication date: 2017-10-11
Anticipated expiration: 2033-10-07
Also published as: JP2015038853A

Description

本発明は、発光部にＬＥＤチップを備えるＬＥＤ電球に関し、特に詳しくはその発光部に装飾性を持たせることが可能なＬＥＤ電球に関する。 The present invention relates to an LED bulb including an LED chip in a light emitting portion, and more particularly to an LED bulb capable of giving a decorative property to the light emitting portion.

ＬＥＤチップを使用する照明装置が普及してきている。この照明装置には、電球型をはじめとして直管型、シーリングライト、埋め込み型、など様々な形態がある。とくに電球型の照明装置は、ＬＥＤチップのもつ指向性により配光分布が偏り、暗い印象を与えることがある。この配光分布を改善させる一つの手法として、特許文献１の図１にはグローブ内にＬＥＤチップを立体的に配置する手法が示されている。そこで特許文献１の図１を図５に再掲示し、その構造を説明する。 Lighting devices that use LED chips have become widespread. There are various types of lighting devices such as a bulb type, a straight tube type, a ceiling light, and an embedded type. In particular, a light bulb-type lighting device may have a dark impression due to the uneven light distribution due to the directivity of the LED chip. As one method for improving this light distribution, FIG. 1 of Patent Document 1 shows a method of three-dimensionally arranging LED chips in a globe. Therefore, FIG. 1 of Patent Document 1 is shown again in FIG. 5 and the structure thereof will be described.

図５は従来例として示したＬＥＤ電球の斜視図である。図５において、電源収納部８の上部に口金１が連結し、下部にカバー２（グローブ）がとり付けられている。カバー２の内部では、止め金４で支持棒３にフレキシブル回路基板５が固定されている。フレキシブル回路基板５は、帯状枝部を備え、全体的にかご型の形状である。各帯状枝部にはＬＥＤチップ６が実装されている。このＬＥＤ電球では、各ＬＥＤチップ６がかご型のフレキシブル回路基板５の表面にほぼ均等に配置されているため、ＬＥＤチップ６を点灯させると、フレキシブル回路基板５とＬＥＤチップ６からなる発光部が球状になり、カバー２から全方向に光が放射される。 FIG. 5 is a perspective view of an LED bulb shown as a conventional example. In FIG. 5, the base 1 is connected to the upper part of the power storage unit 8, and the cover 2 (glove) is attached to the lower part. Inside the cover 2, a flexible circuit board 5 is fixed to the support bar 3 with a stopper 4. The flexible circuit board 5 is provided with a belt-like branch portion and has a cage shape as a whole. An LED chip 6 is mounted on each belt-like branch. In this LED bulb, each LED chip 6 is arranged substantially evenly on the surface of the cage-type flexible circuit board 5, so that when the LED chip 6 is turned on, a light emitting part composed of the flexible circuit board 5 and the LED chip 6 is formed. It becomes spherical and light is emitted from the cover 2 in all directions.

特開２００３−５９３０５号公報（図１）JP2003-59305A (FIG. 1)

フィラメントを光源とする電球（以下フィラメント電球と呼ぶ）では、フィラメントの形状をデザインし、その発光部に装飾性を持たせることがある。そこでＬＥＤ電球でもフィラメント電球を真似ることにより発光部の装飾性を持たせることが要請された。しかしながら特許文献１では、一部でフレキシブル回路基板の形状に関するバリエーションについて記載があるものの、もともと配光特性（指向性）の改善を目的としていたため、装飾性に係る技術的側面について何ら言及しておらず、従来の構成では装飾的なフィラメントを表現することが困難であった。 In a light bulb using a filament as a light source (hereinafter referred to as a filament light bulb), the shape of the filament may be designed to give the light emitting part a decorative property. Therefore, it has been demanded that the LED light bulb has a decorative property of the light emitting part by imitating the filament light bulb. However, in Patent Document 1, although some variations related to the shape of the flexible circuit board are described, it was originally intended to improve the light distribution characteristics (directivity), so there is no mention of technical aspects related to decorativeness. In other words, it has been difficult to express a decorative filament with the conventional configuration.

そこで本発明は、上記課題に鑑みて為されたものであり、グローブ内でＬＥＤチップを立体的に配置して発光部を構成したとき、その発光部を装飾的にできるＬＥＤ電球を提供することを目的とする。 Then, this invention is made | formed in view of the said subject, and when the LED chip is arrange | positioned three-dimensionally in a globe and a light emission part is comprised, the LED light bulb which can decorate the light emission part is provided. With the goal.

本発明のＬＥＤ電球は、グローブと口金が取り付けられるソケットとを備えるとともに、発光部にＬＥＤチップを備えるＬＥＤ電球において、帯状の部分を有し基材が透明なフレキシブル回路基板と、ＬＥＤダイを内蔵する複数のＬＥＤチップと、前記グローブの内部で前記ソケットの中心に立脚する支柱とを備え、前記ＬＥＤダイは、一対の接続電極を有し、前記ＬＥＤチップは、前記フレキシブル回路基板にフリップチップ実装され、前記
フレキシブル回路基板上の配線電極と前記接続電極が直接的に接続し、前記フレキシブル回路基板は、一端及び他端がそれぞれ前記支柱及び前記ソケットに固定され、上部が外側に向って湾曲し、前記一端と前記他端の間に固定されていない部分があることを特徴とする。
An LED bulb according to the present invention includes a globe to which a globe and a socket to which a base is attached and an LED chip having an LED chip in a light emitting portion. a plurality of LED chips, and a strut that standing inside the center of the socket of the glove, the LED die has a pair of connection electrodes, wherein the LED chip is flip chip to the flexible circuit board is mounted, the flexible circuit wherein the connection electrode is directly connected to the wiring electrodes on the substrate, the flexible circuit board, one end and the other end is fixed to each of said post and said socket, curved upper outwardly However, there is a portion that is not fixed between the one end and the other end .

本発明のＬＥＤ電球に備えられたフレキシブル回路基板は、全体が帯状であるか又はその一部分が帯状である。そしてこの帯状の部分にＬＥＤチップが実装されている。このＬＥＤチップはアノードとカソードに相当する一対の接続電極を備えたＬＥＤダイを内蔵している。このＬＥＤチップをフレキシブル回路基板にフリップチップ実装することにより、ＬＥＤダイの接続電極が直接的にフレキシブル回路基板上の配線電極と接続する。すなわちＬＥＤダイとフレキシブル回路基板との間には、ＬＥＤダイが接続電極側に放射する光を遮るものがない。 The flexible circuit board provided in the LED bulb of the present invention has a band shape as a whole or a part of the flexible circuit board. An LED chip is mounted on the belt-like portion. This LED chip incorporates an LED die provided with a pair of connection electrodes corresponding to an anode and a cathode. By flip-chip mounting the LED chip on the flexible circuit board, the connection electrode of the LED die is directly connected to the wiring electrode on the flexible circuit board. That is, there is nothing between the LED die and the flexible circuit board that blocks light emitted from the LED die toward the connection electrode.

このフレキシブル回路基板が有する帯状部分をグローブ内で立体的に配置しＬＥＤチップを点灯させると、ＬＥＤチップの上面（実装面とは反対側の面）および側面に光が放射されるばかりでなく、ＬＥＤチップの底面（接続電極側の面）から出射する光が透明なフレキシブル回路基板を通り抜け、フレキシブル回路基板の裏側（ＬＥＤチップの実装面とは反対側）にも放射される。すなわちＬＥＤチップとフレキシブル回路基板の帯状部分からなる発光部は、四方に光を放射するためフィラメントの発光特性に類似するようになる。 When the strip-shaped part of the flexible circuit board is three-dimensionally arranged in the globe and the LED chip is turned on, not only light is emitted to the upper surface (surface opposite to the mounting surface) and the side surface of the LED chip, Light emitted from the bottom surface (surface on the connection electrode side) of the LED chip passes through the transparent flexible circuit board, and is also emitted to the back side of the flexible circuit board (the side opposite to the mounting surface of the LED chip). In other words, the light emitting portion composed of the LED chip and the belt-like portion of the flexible circuit board emits light in all directions, and thus becomes similar to the light emission characteristics of the filament.

前記支柱は、導電体からなり、先端に基板取り付け部を有し、前記基板取り付け部に前記フレキシブル回路基板の前記一端が固定されるとともに、前記フレキシブル回路基板は、前記基板取り付け部と電気的に接続し、前記支柱には、電流が流れても良い。
The support column is made of a conductor and has a board attaching portion at a tip. The one end of the flexible circuit board is fixed to the board attaching portion, and the flexible circuit board is electrically connected to the board attaching portion. connected to the strut may current flows.

前記フレキシブル回路基板に電力を供給するための電源基板を備え、前記フレキシブル回路基板の他端が弾性部材を介して前記電源基板に固定されていても良い。 The power supply board for supplying electric power to the flexible circuit board may be provided, and the other end of the flexible circuit board may be fixed to the power supply board via an elastic member.

前記弾性部材が導電性を有し、前記弾性部材を介して前記電源基板から前記フレキシブル回路基板に給電しても良い。 The elastic member may be electrically conductive, and power may be supplied from the power supply board to the flexible circuit board via the elastic member.

前記弾性部材がバネであっても良い。 The elastic member may be a spring.

前記ＬＥＤチップには複数種類のＬＥＤチップが含まれ、各種類毎のＬＥＤチップがそれぞれ直列回路を構成しても良い。 The LED chip may include a plurality of types of LED chips, and each type of LED chip may constitute a series circuit.

前記フレキシブル回路基板は、前記フレキシブル回路基板の長手方向に配列し、前記ＬＥＤチップからなるＬＥＤチップ列を複数備え、前記ＬＥＤチップ列の数は、前記ＬＥＤチップの種類の数よりも少なくても良い。
Said flexible circuit board is arranged in the longitudinal direction of the flexible circuit board, a plurality of LED chip sequence comprised of the LED chip, the number of the LED chip sequence is also less than the number of kinds of the LED chip good.

前記複数種類のＬＥＤチップは前記一対の接続電極に加え、さらに相互に接続する２個の短絡用の接続電極を有し、前記一対の接続電極を一方の対角位置に配するとともに、前記２個の短絡用の接続電極を他方の対角位置に配し、前記ＬＥＤチップ列は２種類のＬＥＤチップを含み、一方の種類のＬＥＤチップと他方の種類のＬＥＤチップがそれぞれ直列回路を構成しても良い。 The plurality of types of LED chips have, in addition to the pair of connection electrodes, two short-circuit connection electrodes that are connected to each other, the pair of connection electrodes are arranged at one diagonal position, and the two Two short-circuit connection electrodes are arranged at the other diagonal position, and the LED chip array includes two types of LED chips, and one type of LED chip and the other type of LED chip each form a series circuit. May be.

前記フレキシブル回路基板上には前記ＬＥＤチップ列が２列あり、一方のＬＥＤチップ列に含まれるＬＥＤチップの種類と、他方のＬＥＤチップに含まれるＬＥＤチップ列の種類が全部又は一部異なっても良い。 There are two LED chip arrays on the flexible circuit board, and the types of LED chips included in one LED chip array and the types of LED chip arrays included in the other LED chip are all or partly different. good.

前記ＬＥＤチップは、赤色で発光するＬＥＤチップと、緑色で発光するＬＥＤチップと、青色で発光するＬＥＤチップと、白色で発光するＬＥＤチップの４種類を含み、前記一方のＬＥＤチップ列にこれらのうちの２種類が含まれ、他方のＬＥＤチップ列に残りの２種類が含まれても良い。 The LED chip includes four types of LED chip that emits red light, LED chip that emits green light, LED chip that emits blue light, and LED chip that emits white light. Two of them may be included, and the remaining two types may be included in the other LED chip row.

本発明のＬＥＤ電球は、ＬＥＤチップとフレキシブル回路基板の帯状部分からなる発光部において、フレキシブル回路基板の裏側にも光を出射するため、発光部がフィラメントと類似する発光特性を持つ。以上のように本発明のＬＥＤ電球は、フレキシブル回路基板の帯状部分の立体形状をデザインすることにより、フィラメント形状をデザインして装飾性を持たせていたフィラメント電球と同様な装飾性が得られる。 The LED light bulb of the present invention emits light also to the back side of the flexible circuit board in the light emitting part composed of the LED chip and the belt-like part of the flexible circuit board, so that the light emitting part has a light emission characteristic similar to that of a filament. As described above, the LED bulb of the present invention has the same decorativeness as that of the filament bulb designed to have a decorative shape by designing the filament shape by designing the three-dimensional shape of the strip portion of the flexible circuit board.

本発明の第１実施形態として示すＬＥＤ電球の斜視図。The perspective view of the LED bulb shown as 1st Embodiment of this invention. 図１に示したＬＥＤ電球の正面図。The front view of the LED light bulb shown in FIG. 図１に示したＬＥＤ電球のＬＥＤチップ周りの断面図。Sectional drawing around the LED chip | tip of the LED bulb shown in FIG. 図１に示したＬＥＤ電球のフレキシブル回路基板下端部周りの拡大図。The enlarged view around the flexible circuit board lower end part of the LED bulb shown in FIG. 従来のＬＥＤ電球の斜視図。The perspective view of the conventional LED bulb. 本発明の第２実施形態として示すＬＥＤ電球に含まれるＬＥＤチップの斜視図。The perspective view of the LED chip contained in the LED bulb shown as 2nd Embodiment of this invention. 図６に示したＬＥＤチップの外観図。FIG. 7 is an external view of the LED chip shown in FIG. 6. 本発明の第２実施形態として示すＬＥＤ電球に含まれるフレキシブル回路基板の平面図。The top view of the flexible circuit board contained in the LED bulb shown as 2nd Embodiment of this invention. 図８に示したフレキシブル回路基板の透視図。FIG. 9 is a perspective view of the flexible circuit board shown in FIG. 8. 図８に示したフレキシブル回路基板の模式的回路図。FIG. 9 is a schematic circuit diagram of the flexible circuit board shown in FIG. 8. 図８に示したフレキシブル回路基板とその周辺部の回路図。The circuit diagram of the flexible circuit board shown in FIG. 8, and its peripheral part. 本発明の第３実施形態として示すＬＥＤ電球の斜視図。The perspective view of the LED bulb shown as 3rd Embodiment of this invention. 図１２に示すフレーム５３の一部分を切り出して拡大した斜視図。FIG. 13 is a perspective view in which a part of the frame 53 shown in FIG. 12 is cut out and enlarged. 図１２に示すフレームの分解斜視図。FIG. 13 is an exploded perspective view of the frame shown in FIG. 12.

以下、添付図１〜４及び図６〜１４を参照しながら本発明の好適な実施形態について詳細に説明する。なお図面の説明において、同一または相当要素には同一の符号を付し、重複する説明は省略する。また説明のため部材の縮尺は適宜変更している。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4 and 6 to 14. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted. For the sake of explanation, the scale of the members is changed as appropriate.

（第１実施形態）
先ず図１と図２により、本発明の第１実施形態であるＬＥＤ電球１０の概要を説明する。図１は、ＬＥＤ電球１０の斜視図であり、図２はＬＥＤ電球１０の正面図である。なお図２ではフレキシブル回路基板１２に実装しているＬＥＤチップ１７の数を減らして描いている。ＬＥＤ電球１０は、ソケット１４の上部にグローブ１１、下部に口金１５が取り付けられている。またソケット１４の中心に支柱１３がつきささっており、その支柱１３の上端に十字型の基板取り付け部１３ａがある。またソケット１４の上面には電源基板１６が搭載され、基板取り付け部１３ａと電源基板１６に間に、４本の帯状のフレキシブル回路基板１２が曲線を描くようにして取り付けられている。この帯状のフレキシブル回路基板１２には複数のＬＥＤチップ１７がフリップチップ実装されている。 (First embodiment)
First, the outline of the LED bulb 10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of the LED bulb 10, and FIG. 2 is a front view of the LED bulb 10. In FIG. 2, the number of LED chips 17 mounted on the flexible circuit board 12 is reduced. The LED bulb 10 has a globe 11 at the top of a socket 14 and a base 15 at the bottom. Further, a support column 13 is attached to the center of the socket 14, and a cross-shaped substrate mounting portion 13 a is provided at the upper end of the support column 13. A power supply board 16 is mounted on the upper surface of the socket 14, and four strip-shaped flexible circuit boards 12 are attached between the board attachment portion 13 a and the power supply board 16 so as to draw a curve. A plurality of LED chips 17 are flip-chip mounted on the strip-shaped flexible circuit board 12.

フレキシブル回路基板１２の基材は透明ポリイミドからなり、厚さが５０μｍである。フレキシブル回路基板１２の一面には配線電極３６（図３参照）が形成され、この配線電極とＬＥＤチップ１７の接続電極３４（図３参照）がハンダを介して直接的に接続してい
る。後述するようにＬＥＤチップ１７は一個のＬＥＤダイ３５（図３参照）を含み、接続電極３４はＬＥＤダイ３５の一部であり、アノードとカソードに対応する。また、各ＬＥＤチップ１７はフレキシブル回路基板１２上で直列接続している。支柱１３及び基板取り付け部１３ａは金属からなり、基板取り付け部１３ａは、帯状のフレキシブル回路基板１２の上端部を固定するとともに、フレキシブル回路基板１２上に形成されたＬＥＤチップ１７の直列回路と電気的に接続している。 The base material of the flexible circuit board 12 is made of transparent polyimide and has a thickness of 50 μm. A wiring electrode 36 (see FIG. 3) is formed on one surface of the flexible circuit board 12, and the wiring electrode and the connection electrode 34 (see FIG. 3) of the LED chip 17 are directly connected via solder. As will be described later, the LED chip 17 includes one LED die 35 (see FIG. 3), and the connection electrode 34 is a part of the LED die 35 and corresponds to the anode and the cathode. Each LED chip 17 is connected in series on the flexible circuit board 12. The support column 13 and the board mounting portion 13a are made of metal. The board mounting portion 13a fixes the upper end portion of the strip-shaped flexible circuit board 12 and is electrically connected to the series circuit of the LED chips 17 formed on the flexible circuit board 12. Connected to.

電源基板１６には、図示していないヒューズ等の安全用部品、電流制限抵抗、ブリッジダイオードを含む電源回路が搭載されている。この電源回路は口金１５を介して商用交流電源と接続し、商用電源を全波整流してＬＥＤチップ１７を駆動する。フレキシブル回路基板１２の下端部で電源基板１６からこの直列回路に流入した電流は、ＬＥＤチップ１７からなる直列回路を流れ、さらにフレキシブル回路基板１２の上端部から基板取り付け部１３ａに流れ込み、支柱１３を通って電源基板１６に戻ってくる。ＬＥＤチップ１７は全波整流波形で駆動されるため、電源基板１６に実装される電源回路は高耐圧で大容量のコンデンサを必要しない。この結果、電源回路が小型化し、小型のソケット１４に収納できるようになる。また商用交流電源が１００ＶでＬＥＤチップ１７の閾値電圧が３Ｖのとき、フレキシブル回路基板１２に含まれるＬＥＤチップ１７の直列回路は段数を３０段程度にする。 A power supply circuit including a safety component such as a fuse (not shown), a current limiting resistor, and a bridge diode is mounted on the power supply board 16. This power supply circuit is connected to a commercial AC power supply via a base 15 and drives the LED chip 17 by full-wave rectification of the commercial power supply. The current flowing into the series circuit from the power supply board 16 at the lower end portion of the flexible circuit board 12 flows through the series circuit composed of the LED chips 17, and further flows into the board attachment portion 13 a from the upper end portion of the flexible circuit board 12. Return to the power supply board 16. Since the LED chip 17 is driven with a full-wave rectified waveform, the power supply circuit mounted on the power supply substrate 16 does not require a high withstand voltage and large capacity capacitor. As a result, the power supply circuit is reduced in size and can be stored in the small socket 14. When the commercial AC power supply is 100V and the threshold voltage of the LED chip 17 is 3V, the series circuit of the LED chips 17 included in the flexible circuit board 12 has about 30 stages.

次に図３によりＬＥＤチップ１７回りの構造を説明する。図３は１個のＬＥＤチップ１７とその近傍のフレキシブル回路基板１２の断面図である。図３に示されるようにＬＥＤチップ１７はフレキシブル回路基板１２の基材３７上面に形成された配線電極３６にフリップチップ実装されている。ＬＥＤチップ１７は、ＬＥＤダイ３５を蛍光樹脂３１で被覆したものであり、ＬＥＤダイ３５はサファイヤ基板３２とその下に形成された半導体層３３と接続電極３４からなる。 Next, the structure around the LED chip 17 will be described with reference to FIG. FIG. 3 is a cross-sectional view of one LED chip 17 and the flexible circuit board 12 in the vicinity thereof. As shown in FIG. 3, the LED chip 17 is flip-chip mounted on the wiring electrode 36 formed on the upper surface of the base material 37 of the flexible circuit board 12. The LED chip 17 is obtained by coating an LED die 35 with a fluorescent resin 31, and the LED die 35 includes a sapphire substrate 32, a semiconductor layer 33 formed thereunder, and a connection electrode 34.

サファイヤ基板３２は厚さが１５０μｍ程度である。半導体層３３はｎ型ＧａＮ層とｐ型ＧａＮ層を含み、厚さが１０μｍ程度である。発光層はｎ型ＧａＮ層とｐ型ＧａＮ層の境界部となる。接続電極３４は、アノードとカソードであり、半導体層３３に含まれる層間絶縁膜及び多層配線を使って２個にまとめられている。接続電極３４の厚さは数１００ｎｍから数十μｍに設定することができるが、ＬＥＤチップ１７では、チップ底面も蛍光樹脂３１で被覆しているので、接続電極３４の厚さを数１０μｍにしている。 The sapphire substrate 32 has a thickness of about 150 μm. The semiconductor layer 33 includes an n-type GaN layer and a p-type GaN layer, and has a thickness of about 10 μm. The light emitting layer is a boundary between the n-type GaN layer and the p-type GaN layer. The connection electrodes 34 are an anode and a cathode, and are combined into two using an interlayer insulating film and multilayer wiring included in the semiconductor layer 33. Although the thickness of the connection electrode 34 can be set from several hundreds of nanometers to several tens of micrometers, in the LED chip 17, since the bottom surface of the chip is covered with the fluorescent resin 31, the thickness of the connection electrode 34 is set to several tens of micrometers. Yes.

ＬＥＤダイ３５を被覆する蛍光樹脂３１は、シリコーン樹脂に蛍光体微粒子を混練し硬化させたものであり、ＬＥＤダイ３５の上部の厚さが３００μｍ、側部の厚さが１００〜２００μｍ、底部の厚さが数１０μｍである。例えばＬＥＤダイ３５の平面サイズが０．５ｍｍｘ１．０ｍｍ程度であれば、ＬＥＤチップ１７の平面サイズが０．８ｍｍｘ１．３ｍｍ程度になる。このようにＬＥＤダイ３５とそのＬＥＤチップ１７の平面サイズがほぼ等しいとき、そのパッケージをチップサイズパッケージ（ＣＳＰともいう）と呼ぶことがある。 The fluorescent resin 31 that covers the LED die 35 is obtained by kneading and curing phosphor fine particles in a silicone resin. The LED die 35 has an upper thickness of 300 μm, a side thickness of 100 to 200 μm, and a bottom portion. The thickness is several tens of μm. For example, if the planar size of the LED die 35 is about 0.5 mm × 1.0 mm, the planar size of the LED chip 17 is about 0.8 mm × 1.3 mm. As described above, when the planar sizes of the LED die 35 and the LED chip 17 are substantially equal, the package may be referred to as a chip size package (also referred to as CSP).

ＬＥＤチップ１７に電流を流すと半導体層３３に含まれる発光層が発光する。この発光は等方的なので、ＬＥＤダイ３５の上面、側面及び底面側に向かう。またこれらの光の一部分は蛍光樹脂３１で波長変換される。このときＬＥＤダイ３５とフレキシブル回路基板１２の間には、サブマウント基板（インターポーザともいう）や遮光性の被覆部材がないので、図の下方行に向かう光は、フレキシブル回路基板１２の透明な部分を通り抜け、フレキシブル回路基板１２の裏側（図の下側）から放射される。 When a current is passed through the LED chip 17, the light emitting layer included in the semiconductor layer 33 emits light. Since this light emission is isotropic, it goes to the upper surface, side surface, and bottom surface side of the LED die 35. A part of the light is wavelength-converted by the fluorescent resin 31. At this time, since there is no submount substrate (also referred to as an interposer) or a light-shielding covering member between the LED die 35 and the flexible circuit board 12, the light traveling downward in the figure is a transparent portion of the flexible circuit board 12. , And is emitted from the back side of the flexible circuit board 12 (the lower side of the figure).

次に図４によりフレキシブル回路基板１２の下端部について説明する。図４は、フレキシブル回路基板１２の下端部及び電源基板１６の一部分を拡大した図であり、（ａ）が斜
視図、（ｂ）が正面図である。フレキシブル回路基板１２の下端部にはバネ４１（弾性部材）が取り付けられている。バネ４１の上部は取り付け孔４２を使ってフレキシブル回路基板１２にかしめられており、バネ４１の下部は電源基板１６の貫通孔４３に差し込まれ、電源基板１６の下面でハンダ４４により固定されている。 Next, the lower end portion of the flexible circuit board 12 will be described with reference to FIG. 4A and 4B are enlarged views of a lower end portion of the flexible circuit board 12 and a part of the power supply board 16, in which FIG. 4A is a perspective view and FIG. 4B is a front view. A spring 41 (elastic member) is attached to the lower end of the flexible circuit board 12. The upper part of the spring 41 is caulked to the flexible circuit board 12 using the attachment hole 42, and the lower part of the spring 41 is inserted into the through hole 43 of the power supply board 16 and fixed by the solder 44 on the lower surface of the power supply board 16. .

バネ４１はフレキシブル回路基板１２の下端を保持固定するだけでなく、支柱１３（図１参照）と同様に電流径路の一部にもなっている。つまりＬＥＤチップ１７を点灯させるための電流がバネ４１を流れる。前述したように支柱１３及び基板取り付け部１３ａは、帯状のフレキシブル回路基板１２の上端と電気的に接続しているので、電源基板１６から発した電流は、バネ４１を通って、ＬＥＤチップ１７からなる直列回路、及び支柱１３を経由して電源基板１６に戻ってくる。 The spring 41 not only holds and fixes the lower end of the flexible circuit board 12 but also forms a part of the current path in the same manner as the support 13 (see FIG. 1). That is, a current for turning on the LED chip 17 flows through the spring 41. As described above, the support column 13 and the board mounting portion 13a are electrically connected to the upper end of the strip-shaped flexible circuit board 12, so that the current generated from the power supply board 16 passes through the spring 41 and from the LED chip 17. It returns to the power supply board 16 via the series circuit and the support | pillar 13 which become.

本実施形態のフレキシブル回路基板１２は全体が帯状を為し、支柱１３により立体的に配置されていた。これに対し本発明のＬＥＤ電球は発光部を立体的に構成するのに帯状のフレキシブル回路基板と支柱の組み合わせに限定されない。たとえば一枚のフレキシブル回路基板に複数の帯状部分を設け、帯状部分を曲げることにより光源部を立体的にしても良い。このときフレキシブル回路基板が複数の帯状部分に加え芯になる部分を有するようにすれば支柱を省略できる。しかしながら本実施形態のようにフレキシブル回路基板１２全体を帯状にすることにより、フレキシブル回路基板用材料の消費を少なくできる。 The flexible circuit board 12 of the present embodiment has a band shape as a whole, and is three-dimensionally arranged by the support columns 13. On the other hand, the LED light bulb of the present invention is not limited to a combination of a strip-shaped flexible circuit board and a support to configure the light emitting portion in three dimensions. For example, a plurality of strip-shaped portions may be provided on a single flexible circuit board, and the light source portion may be three-dimensional by bending the strip-shaped portions. At this time, the support can be omitted if the flexible circuit board has a core portion in addition to the plurality of belt-shaped portions. However, the consumption of the material for the flexible circuit board can be reduced by forming the entire flexible circuit board 12 in a strip shape as in this embodiment.

また本実施形態の支柱１３は金属からなり電流を流していた。これに対し本発明のＬＥＤ電球は電流径路として支柱を使わなくても良い。支柱を絶縁体にし、支柱上に回路を形成すればより複雑な発光部を構成できる。 Moreover, the support | pillar 13 of this embodiment consisted of the metal, and sent the electric current. On the other hand, the LED bulb of the present invention does not have to use a support as a current path. A more complicated light-emitting portion can be configured by using a support as an insulator and forming a circuit on the support.

また本実施形態のフレキシブル回路基板１２の下端部には導電性のバネ４１が取り付けられていた。これに対し本発明のＬＥＤ電球は下端部にバネを備える構造に限定されない。例えばフレキシブル回路基板を直接的に電源基板に固定しても良し、バネの代わりにゴム等の弾性部材を用いても良い。また給電径路を弾性部材と別に設けても良い。 In addition, a conductive spring 41 is attached to the lower end portion of the flexible circuit board 12 of the present embodiment. On the other hand, the LED bulb of the present invention is not limited to a structure having a spring at the lower end. For example, the flexible circuit board may be directly fixed to the power supply board, or an elastic member such as rubber may be used instead of the spring. Further, the feeding path may be provided separately from the elastic member.

また本実施形態のＬＥＤチップ１７は底面が蛍光樹脂３１で被覆されていた（以下、図３参照）。これに対し本発明のＬＥＤ電球に含まれるＬＥＤチップは、必ずしも底面を蛍光樹脂で被覆されなくても良い。底面を蛍光樹脂で被覆しなければ接続電極３４を薄くできる。このときＬＥＤダイ３５の側面を被覆する蛍光樹脂３１から放射される波長変換された光は図の下側に向かう成分があるので、フレキシブル回路基板１２の裏側では、ＬＥＤダイ３５の発光と波長変換された光が混色する。 Further, the bottom surface of the LED chip 17 of the present embodiment is covered with the fluorescent resin 31 (refer to FIG. 3 below). On the other hand, the bottom surface of the LED chip included in the LED bulb of the present invention does not necessarily have to be covered with the fluorescent resin. If the bottom surface is not covered with a fluorescent resin, the connection electrode 34 can be thinned. At this time, the wavelength-converted light emitted from the fluorescent resin 31 that covers the side surface of the LED die 35 has a component toward the lower side of the figure, so that the light emission and wavelength conversion of the LED die 35 are performed on the back side of the flexible circuit board 12. The mixed light is mixed.

（第２実施形態）
第１実施形態のＬＥＤ電球１０ではフィラメントを模したフレキシブル回路基板１２の帯状部において、一種類のＬＥＤチップ１７が一列に配列し、一個の直列回路を構成していた。これに対しフレキシブル回路基板の帯状部に複数の直列回路を構成しても良い。このとき各直列回路に含まれるＬＥＤチップの発光特性（種類）を異ならせると、各直列回路に流す電流を調整することにより調色が可能になる。 (Second Embodiment)
In the LED light bulb 10 of the first embodiment, one type of LED chips 17 are arranged in a line in the band-shaped portion of the flexible circuit board 12 simulating a filament to constitute one series circuit. On the other hand, you may comprise a some series circuit in the strip | belt-shaped part of a flexible circuit board. At this time, if the light emission characteristics (types) of the LED chips included in each series circuit are made different, color adjustment can be performed by adjusting the current flowing through each series circuit.

例えば２個の直列回路を備える場合、一方の直列回路に含まれるＬＥＤチップの発光色を暖色系（以下ｗと略記する）とし、他方の直列回路に含まれるＬＥＤチップの発光色を昼光色（以下ｃと略記する）としても良い。こうすると一方の直列回路の発光と他方の発光のバランスにより、ＬＥＤ電球の発光色を暖色から昼光色まで調整できる。またフレキシブル回路基板上において、これら２種類のＬＥＤチップを、ｗ，ｃ，ｗ，ｃ，‥‥という順番で交互に配置し（一本のＬＥＤチップ列）、ＬＥＤチップ実装部の側部にも配線を設けるようにすれば、ＬＥＤチップを一列で配列させながら２個の直列回路を設けること
ができる。この結果、フレキシブル回路基板の帯状部分を細く保ち、フィラメントを効果的に模しながら、調色機能を付加できる。 For example, when two series circuits are provided, the emission color of the LED chip included in one series circuit is a warm color system (hereinafter abbreviated as w), and the emission color of the LED chip included in the other series circuit is a daylight color (hereinafter referred to as “winter color”). abbreviated as c). If it carries out like this, the luminescent color of a LED bulb can be adjusted from warm color to daylight color by the balance of light emission of one series circuit, and the other light emission. On the flexible circuit board, these two types of LED chips are alternately arranged in the order of w, c, w, c,... (One LED chip row), and also on the side of the LED chip mounting portion. If wiring is provided, two series circuits can be provided while arranging LED chips in a line. As a result, a toning function can be added while keeping the strip-like portion of the flexible circuit board thin and effectively imitating the filament.

また赤色で発光するＬＥＤチップ（以下Ｒと略記する）と緑色で発光するＬＥＤチップ（以下Ｇと略記する）と青色で発光するＬＥＤチップ（以下Ｂと略記する）を準備し、フレキシブル回路基板上に、Ｒからなる直列回路、Ｇからなる直列回路、Ｂからなる直列回路を構成してもよい。この場合、各直列回路間の発光比を調整すれば任意の発光色が得られる。さらにフレキシブル回路基板上において、これら３種類のＬＥＤチップを、Ｒ，Ｇ，Ｂ，Ｂ，Ｇ，Ｒ，Ｒ，Ｇ，Ｂ，Ｂ，Ｇ，Ｒ，‥‥という順番で配置し、ＬＥＤチップ実装部の側部にも配線を設けるようにすれば、ＬＥＤチップを一列で配列させながら３個の直列回路を設けることができる。この結果、帯状部分を細く保ち、フィラメントを効果的に模しながら、任意の色で発光する調色機能を付加できる。 An LED chip that emits red light (hereinafter abbreviated as R), an LED chip that emits green light (hereinafter abbreviated as G), and an LED chip that emits blue light (hereinafter abbreviated as B) are prepared on the flexible circuit board. In addition, a series circuit composed of R, a series circuit composed of G, and a series circuit composed of B may be configured. In this case, an arbitrary emission color can be obtained by adjusting the emission ratio between the series circuits. Furthermore, on the flexible circuit board, these three types of LED chips are arranged in the order of R, G, B, B, G, R, R, G, B, B, G, R,. If wiring is also provided on the side of each part, three series circuits can be provided while arranging LED chips in a row. As a result, it is possible to add a toning function that emits light in an arbitrary color while keeping the belt-like portion thin and effectively imitating the filament.

このようなフィラメントを模したフレキシブル回路基板を備えながら調色も可能なＬＥＤ電球の一例として、図６〜図１１により本発明の第２実施形態としてＬＥＤ電球２０について説明する。なおＬＥＤ電球２０は、ＬＥＤチップ６０（図６，７参照）と、ＬＥＤチップ６０を実装するフレキシブル回路基板８５（図８参照）に特徴がある。このためＬＥＤ電球２０の全体図は、第２実施形態の説明のなかでは示していないが、図１に示したＬＥＤ電球１０と類似した形態になる。 As an example of an LED bulb that can be toned while having a flexible circuit board imitating such a filament, an LED bulb 20 will be described as a second embodiment of the present invention with reference to FIGS. The LED bulb 20 is characterized by an LED chip 60 (see FIGS. 6 and 7) and a flexible circuit board 85 (see FIG. 8) on which the LED chip 60 is mounted. For this reason, the overall view of the LED bulb 20 is not shown in the description of the second embodiment, but is similar to the LED bulb 10 shown in FIG.

先ず図６によりＬＥＤ電球２０（符号は図示していない）に含まれるＬＥＤチップ６０の外形を説明する。図６はＬＥＤチップ６０の斜視図である。ＬＥＤチップ６０は直方体であり、被覆樹脂６１が観察される。なお後述するように、ＬＥＤチップ６０は、赤色で発光するＬＥＤチップと、緑色で発光するＬＥＤチップと、青色で発光するＬＥＤチップと、白色で発光するＬＥＤチップの４種類を含むが、被覆樹脂６１の成分を除き外形は共通であるため発光色（種類）の違いを区別せずに説明する（図７も同様）。 First, the outer shape of the LED chip 60 included in the LED bulb 20 (reference numeral is not shown) will be described with reference to FIG. FIG. 6 is a perspective view of the LED chip 60. The LED chip 60 is a rectangular parallelepiped, and the coating resin 61 is observed. As will be described later, the LED chip 60 includes four types of LED chips that emit red light, LED chips that emit green light, LED chips that emit blue light, and LED chips that emit white light. Since the outer shape is the same except for the component 61, the description will be made without distinguishing the difference in the emission color (type) (the same applies to FIG. 7).

次に図７によりＬＥＤ電球２０（符号は図示していない）に含まれるＬＥＤチップ６０の外形を更に詳しく説明する。図７はＬＥＤチップ６０の外形図であり、（ａ）が平面図、（ｂ）が正面図、（ｃ）が底面図である。ＬＥＤチップ６０を上から眺めると被覆樹脂６１が観察される。ＬＥＤチップ６０を正面から眺めると、被覆樹脂とその下部に接続電極７１，７３が観察される。なお（ｂ）中では被覆樹脂内の様子を示すためＬＥＤダイ７５を示している。なおＬＥＤダイ７５には、サファイヤ基板７５ａ、半導体層７５ｂ、接続電極７１，７２，７３，７４が含まれる。 Next, the outer shape of the LED chip 60 included in the LED bulb 20 (reference numerals are not shown) will be described in more detail with reference to FIG. 7A and 7B are external views of the LED chip 60, where FIG. 7A is a plan view, FIG. 7B is a front view, and FIG. 7C is a bottom view. When the LED chip 60 is viewed from above, the coating resin 61 is observed. When the LED chip 60 is viewed from the front, the connection electrodes 71 and 73 are observed on the coating resin and the lower part thereof. In FIG. 5B, an LED die 75 is shown to show the state in the coating resin. The LED die 75 includes a sapphire substrate 75a, a semiconductor layer 75b, and connection electrodes 71, 72, 73, and 74.

ＬＥＤチップ６０を底面側から眺めると、被覆樹脂６１と、被覆樹脂６１に囲まれた接続電極７１，７２，７３，７４が観察される。接続電極７１，７２はそれぞれアノード及びカソードであり、接続電極７３，７４は短絡用の接続電極である。アノード及びカソード用の一対の接続電極７１，７２は対角位置に配置されており、同様に２個の短絡用の接続電極７３，７４も対角位置に配置されている。なおアノード及びカソード用の接続電極７１，７２はＬＥＤダイ７５に含まれる半導体層７５ｂ中の多層配線により位置が調整されている。同様に短絡用の接続電極７３，７４はＬＥＤダイ７５に含まれる半導体層７５ｂ中の多層配線により接続している。また説明のため半導体層７５ｂを透視した状態で図示している。 When the LED chip 60 is viewed from the bottom side, the coating resin 61 and the connection electrodes 71, 72, 73, and 74 surrounded by the coating resin 61 are observed. The connection electrodes 71 and 72 are an anode and a cathode, respectively, and the connection electrodes 73 and 74 are short-circuit connection electrodes. The pair of connection electrodes 71 and 72 for the anode and cathode are arranged at diagonal positions, and similarly, the two short-circuit connection electrodes 73 and 74 are also arranged at diagonal positions. The positions of the anode and cathode connection electrodes 71 and 72 are adjusted by multilayer wiring in the semiconductor layer 75 b included in the LED die 75. Similarly, the short-circuit connection electrodes 73 and 74 are connected by a multilayer wiring in the semiconductor layer 75 b included in the LED die 75. For the sake of explanation, the semiconductor layer 75b is seen through.

次に図８によりＬＥＤチップ８１，８２，８３，８４が実装されたフレキシブル回路基板８５について説明する。図８はＬＥＤ電球２０（符号は図示していない）に含まれるフレキシブル回路基板８５の平面図である。赤色で発光するＬＥＤチップ８１と、緑色で発光するＬＥＤチップ８２と、青色で発光するＬＥＤチップ８３と、白色で発光するＬＥＤチップ８４の４種類が実装されている。図中、左側のＬＥＤチップ列ではＬＥＤチップ８
１とＬＥＤチップ８２が交互に配列し、右側のＬＥＤチップ列ではＬＥＤチップ８４とＬＥＤチップ８３が交互に配列している。ＬＥＤチップ８１，８２の間には配線電極８６が観察され、同様にＬＥＤチップ８４，８３の間にも配線電極８６が観察される。 Next, the flexible circuit board 85 on which the LED chips 81, 82, 83, and 84 are mounted will be described with reference to FIG. FIG. 8 is a plan view of a flexible circuit board 85 included in the LED bulb 20 (reference numerals are not shown). Four types are mounted: an LED chip 81 that emits red light, an LED chip 82 that emits green light, an LED chip 83 that emits blue light, and an LED chip 84 that emits white light. In the left LED chip row in the figure, LED chip 8
1 and LED chips 82 are alternately arranged, and in the right LED chip row, LED chips 84 and 83 are alternately arranged. A wiring electrode 86 is observed between the LED chips 81 and 82, and similarly, the wiring electrode 86 is also observed between the LED chips 84 and 83.

なおＬＥＤチップ８１においては、ＬＥＤダイ７５（図７参照）の青色発光を赤色に波長変換する蛍光体微粒子が被覆樹脂６１（図７参照）に混入されている。同様にＬＥＤチップ８２においても緑色に波長変換する蛍光体微粒子が被覆樹脂６１に混入されている。青色で発光するＬＥＤチップ８３では被覆樹脂６１が透明である。ＬＥＤチップ８４は、黄色に波長変換する蛍光体微粒子が被覆樹脂６１に混入され、青色発光と黄色発光の混色により白色で発光する。なお被覆樹脂６１のベースとなる透明樹脂はシリコーンである。 In the LED chip 81, phosphor fine particles for converting the wavelength of blue light emitted from the LED die 75 (see FIG. 7) into red are mixed in the coating resin 61 (see FIG. 7). Similarly, in the LED chip 82, phosphor fine particles that are converted into green wavelength are mixed in the coating resin 61. In the LED chip 83 that emits blue light, the coating resin 61 is transparent. In the LED chip 84, phosphor fine particles that are converted into yellow are mixed in the coating resin 61, and light is emitted in white by a mixed color of blue light emission and yellow light emission. The transparent resin that is the base of the coating resin 61 is silicone.

次に図９によりＬＥＤチップ８１〜８４の接続状態を説明する。図９は、図８に示したフレキシブル回路基板８５の透視図である。図９において各ＬＥＤチップ８１〜８４の右上隅の接続電極７１はアノードであり、左下隅の接続電極７２はカソードであり、左上隅の接続電極７３と右下隅の接続電極７４は短絡用の接続電極である。ＬＥＤチップ８１のアノード用接続電極７１は図中上側のＬＥＤチップ８２の短絡用接続電極７４に接続し、ＬＥＤチップ８１のカソード用接続電極７２は図中下側のＬＥＤチップ８２の短絡用接続電極７３と接続している。同様にＬＥＤチップ８２，８３，８４のアノード用接続電極７１は図中上側のＬＥＤチップ８１，８４，８３の短絡用接続電極７４に接続し、ＬＥＤチップ８２，８３，８４のカソード用接続電極７２は図中下側のＬＥＤチップ８１，８４，８３の短絡用接続電極７３と接続している。 Next, the connection state of the LED chips 81 to 84 will be described with reference to FIG. FIG. 9 is a perspective view of the flexible circuit board 85 shown in FIG. In FIG. 9, the connection electrode 71 in the upper right corner of each LED chip 81 to 84 is an anode, the connection electrode 72 in the lower left corner is a cathode, and the connection electrode 73 in the upper left corner and the connection electrode 74 in the lower right corner are short-circuit connections. Electrode. The anode connection electrode 71 of the LED chip 81 is connected to the short-circuit connection electrode 74 of the upper LED chip 82 in the figure, and the cathode connection electrode 72 of the LED chip 81 is the short-circuit connection electrode of the lower LED chip 82 in the figure. 73 is connected. Similarly, the anode connection electrode 71 of the LED chips 82, 83, 84 is connected to the short-circuit connection electrode 74 of the upper LED chip 81, 84, 83 in the drawing, and the cathode connection electrode 72 of the LED chips 82, 83, 84. Is connected to the short-circuit connection electrode 73 of the lower LED chip 81, 84, 83 in the drawing.

次に図１０によりＬＥＤチップ８１〜８４の接続状態をさらに詳しく説明する。図１０は、図８に示したフレキシブル回路基板８５の模式的回路図であり、図８の左側のＬＥＤチップ列のうち４個のＬＥＤチップ８１ａ，８１ｂ，８２ａ，８２ｂについて示したものである。なお図中、ＬＥＤチップを個別に示すため符号にサフィックスを付している。 Next, the connection state of the LED chips 81 to 84 will be described in more detail with reference to FIG. FIG. 10 is a schematic circuit diagram of the flexible circuit board 85 shown in FIG. 8, which shows four LED chips 81a, 81b, 82a, and 82b in the left LED chip row of FIG. In the figure, suffixes are added to the reference numerals to indicate LED chips individually.

図１０において、ＬＥＤチップ８１ａに含まれるＬＥＤのカソード（接続電極７２）は、ＬＥＤチップ８２ａの短絡用接続電極７３，７４を経由してＬＥＤチップ８１ｂに含まれるアノード（接続電極７１）に接続している。つまりＬＥＤチップ８１ａに含まれるＬＥＤとＬＥＤチップ８１ｂに含まれるＬＥＤは直列接続している。同様にＬＥＤチップ８２ａに含まれるＬＥＤとＬＥＤチップ８２ｂに含まれるＬＥＤも直列接続している。すなわち短絡用接続電極７３，７４の間の径路を単なる配線とみなした場合、図８の左側のＬＥＤチップ列では、ＬＥＤチップ８１同士が直列回路を構成するとともにＬＥＤチップ８２同士が直列回路を構成する。同様に図８の右側のＬＥＤチップ列では、ＬＥＤチップ８３同士も直列回路を構成するとともにＬＥＤチップ８４同士も直列回路を構成する。 In FIG. 10, the cathode (connection electrode 72) of the LED included in the LED chip 81a is connected to the anode (connection electrode 71) included in the LED chip 81b via the short-circuit connection electrodes 73 and 74 of the LED chip 82a. ing. That is, the LED included in the LED chip 81a and the LED included in the LED chip 81b are connected in series. Similarly, the LEDs included in the LED chip 82a and the LEDs included in the LED chip 82b are connected in series. That is, when the path between the short-circuit connection electrodes 73 and 74 is regarded as a simple wiring, in the LED chip row on the left side of FIG. 8, the LED chips 81 constitute a series circuit and the LED chips 82 constitute a series circuit. To do. Similarly, in the LED chip row on the right side of FIG. 8, the LED chips 83 also form a series circuit, and the LED chips 84 also form a series circuit.

最後に図１１によりＬＥＤ電球２０の全体の回路について説明する。図１１は図８に示したフレキシブル回路基板８５（図８参照）とその周辺部の回路図である。フレキシブル回路基板８５上には、ＬＥＤチップ８１からなる直列回路１０１と、ＬＥＤチップ８２からなる直列回路１０２と、ＬＥＤチップ８３からなる直列回路１０３と、ＬＥＤチップ８４からなる直列回路１０４とがある。直列回路１０１〜１０４の上端部は、高電圧側の電源１０５と接続している。各直列回路１０１，１０２，１０３，１０４の下端部にはそれぞれ電流制限回路１０１ａ，１０２ａ，１０３ａ，１０４ａが接続している。電流制限回路１０１ａ，１０２ａ，１０３ａ，１０４ａは、他端が低電圧側の電源１０６に接続し、制御回路１０７によりそれぞれ独立して制御される。 Finally, the entire circuit of the LED bulb 20 will be described with reference to FIG. FIG. 11 is a circuit diagram of the flexible circuit board 85 (see FIG. 8) and its peripheral portion shown in FIG. On the flexible circuit board 85, there are a series circuit 101 composed of LED chips 81, a series circuit 102 composed of LED chips 82, a series circuit 103 composed of LED chips 83, and a series circuit 104 composed of LED chips 84. The upper ends of the series circuits 101 to 104 are connected to the power source 105 on the high voltage side. Current limiting circuits 101a, 102a, 103a, 104a are connected to the lower ends of the series circuits 101, 102, 103, 104, respectively. The other ends of the current limiting circuits 101a, 102a, 103a, 104a are connected to the power source 106 on the low voltage side, and are controlled independently by the control circuit 107.

以上のようにして直列回路１０１〜１０４の発光量が独立して調整できるため、任意の発光色が得られる。このとき電源１０５は支柱１３（図１参照）から供給されても良い。またフレキシブル回路基板８５の下端部と電源基板１６（図１参照）とはコネクタで接続
する。フレキシブル回路基板８５の下端部と電源基板１６は第1実施形態のＬＥＤ電球１０のようにバネ等の弾性部材で接続固定しても良い。なお図１１の回路図は１枚の帯状のフレキシブル回路基板について描いたものであるが、ＬＥＤ電球２０はＬＥＤ電球１０（図１参照）と同様に複数枚のフレキシブル回路基板が備えられている。このとき制御回路１０７や電流制限回路１０１ａ〜１０４ａ等は集積化されていると良く、調色の制御は無線又は商用電源に重畳した制御信号により行う。 Since the light emission amounts of the series circuits 101 to 104 can be independently adjusted as described above, an arbitrary light emission color can be obtained. At this time, the power source 105 may be supplied from the support 13 (see FIG. 1). The lower end portion of the flexible circuit board 85 and the power supply board 16 (see FIG. 1) are connected by a connector. The lower end portion of the flexible circuit board 85 and the power supply board 16 may be connected and fixed by an elastic member such as a spring as in the LED bulb 10 of the first embodiment. The circuit diagram of FIG. 11 is drawn with respect to one strip-shaped flexible circuit board, but the LED bulb 20 is provided with a plurality of flexible circuit boards in the same manner as the LED bulb 10 (see FIG. 1). At this time, the control circuit 107, the current limiting circuits 101a to 104a, and the like are preferably integrated, and the toning control is performed by a control signal superimposed on a wireless or commercial power source.

またＬＥＤ電球２０において、フレキシブル回路基板８５は、２本のＬＥＤチップ列を有するだけであり、各ＬＥＤチップ８１〜８４の隣接部にのみ配線電極８６があるだけで、側部には配線（配線電極）がないので、その分、帯状部分を細くできている。 Further, in the LED bulb 20, the flexible circuit board 85 has only two LED chip rows, the wiring electrodes 86 are only provided in the adjacent portions of the LED chips 81 to 84, and the wiring (wiring) is provided on the side portion. Since there is no electrode), the band-shaped part is made thinner accordingly.

またＬＥＤチップ８１〜８４は、発光色が赤色、緑色、青色、白色の４種類であり、一方のＬＥＤチップ列（図８の左側）にこれらのうちの２種類（赤色と緑色で発光するＬＥＤチップ８１，８２）が含まれ、他方のＬＥＤチップ列（図８の右側）に残りの２種類（青色と白色で発光するＬＥＤチップ８３，８４）が含まれていた。しかしながら発光色の組合せはこれに限られず、一方のＬＥＤチップ列に含まれるＬＥＤチップの種類と、他方のＬＥＤチップ列に含まれるＬＥＤチップの種類を一部異ならせるだけでも良い。例えばＬＥＤチップ８４を緑色発光とする。こうすると緑色に対する視感度が高いため明るく感じる。また発光色の組合せを、赤色、緑色、青色、橙色としても良い。このようにすると黒体輻射のスペクトルに近づく。またＬＥＤダイ７５を近紫外線を発光するものとしても良い。このようにするといっそう黒体輻射のスペクトルに近づけることができる。 The LED chips 81 to 84 have four types of emission colors of red, green, blue, and white, and one of these LED chip rows (left side in FIG. 8) has two types (LEDs that emit light in red and green). Chips 81 and 82), and the remaining two types (LED chips 83 and 84 emitting light in blue and white) were included in the other LED chip row (right side in FIG. 8). However, the combination of the light emission colors is not limited to this, and the type of the LED chip included in one LED chip row may be different from the type of the LED chip included in the other LED chip row. For example, the LED chip 84 emits green light. This makes it feel bright because of its high visibility to green. Further, the combination of the emission colors may be red, green, blue, or orange. This approaches the spectrum of blackbody radiation. The LED die 75 may emit near ultraviolet light. In this way, the spectrum of black body radiation can be made closer.

（第３実施形態）
図１，２に示したＬＥＤ電球１０は、グローブ１１内に備えられた支柱１３に、多数のＬＥＤチップ１７を実装したフレキシブル回路基板１２の一端が固定していた。すなわちフレキシブル回路基板１２はグローブ１１内において半固定状態で配置されていた。このためフレキシブル回路基板１１の裏面は空気に接することとなる。ところが空気は熱伝導性が悪いため、ＬＥＤチップ１２の発光輝度を上げるため電流を増やそうとすると、ＬＥＤ電球１０ではＬＥＤチップ１２が発する熱を効率よく放散させることができない。この結果、ＬＥＤ電球１０は発光効率が低下する。またフレキシブル回路基板１２が半固定状態であるため、振動などによりフレキシブル回路基板１２が切断するという不具合が生じたり、組み立て性が低下したりもする。 (Third embodiment)
In the LED bulb 10 shown in FIGS. 1 and 2, one end of a flexible circuit board 12 on which a large number of LED chips 17 are mounted is fixed to a support column 13 provided in the globe 11. That is, the flexible circuit board 12 is arranged in a semi-fixed state in the globe 11. For this reason, the back surface of the flexible circuit board 11 comes into contact with air. However, since air has poor thermal conductivity, the LED bulb 10 cannot efficiently dissipate the heat generated by the LED chip 12 when the current is increased in order to increase the light emission luminance of the LED chip 12. As a result, the luminous efficiency of the LED bulb 10 decreases. Further, since the flexible circuit board 12 is in a semi-fixed state, there is a problem that the flexible circuit board 12 is cut due to vibration or the like, or the assemblability is lowered.

そこで図１２から図１４により第３実施形態として、フィラメント電球と同等の装飾性を維持しながら、放熱性や機械的強度、組み立て性を改善したＬＥＤ電球５０について説明する。 Accordingly, as a third embodiment, an LED bulb 50 with improved heat dissipation, mechanical strength, and assemblability while maintaining the same decorativeness as that of a filament bulb will be described with reference to FIGS.

まず図１２によりＬＥＤ電球５０の外観を説明する。図１２はＬＥＤ電球５０の斜視図である。ＬＥＤ電球５０はグローブ５１、ソケット５４及び口金５５を備え、グローブ５１の内部にフレーム５３が配置されている。フレーム５３はその基部５３ｃ（図１４参照）がソケット５４に差し込まれている。またフレーム５３はその頂部で四つ股（十字型）に広がった枝状の部分が基部５３で再び一つにまとまった構造をとっている。さらにフレーム５３の枝状の部分の外側に、ＬＥＤチップ５７を実装した帯状のフレキシブル回路基板５２（図１３参照）が貼りつけられている。このフレーム５３は透明プラスチックからなり、ＬＥＤチップ５７の実装面側から出射する光を通過させることができる。 First, the external appearance of the LED bulb 50 will be described with reference to FIG. FIG. 12 is a perspective view of the LED bulb 50. The LED bulb 50 includes a globe 51, a socket 54, and a base 55, and a frame 53 is disposed inside the globe 51. The base 53c (see FIG. 14) of the frame 53 is inserted into the socket 54. Further, the frame 53 has a structure in which a branch-like portion that spreads out into four forks (cross shape) at the top is united again at the base 53. Further, a strip-shaped flexible circuit board 52 (see FIG. 13) on which the LED chip 57 is mounted is attached to the outside of the branch-shaped portion of the frame 53. The frame 53 is made of transparent plastic, and allows light emitted from the mounting surface side of the LED chip 57 to pass therethrough.

次に図１３によりＬＥＤ電球５０が備えるフレーム５３をさらに詳しく説明する。図１３はＬＥＤ電球５０のフレーム５３の一部分を切り出して拡大した斜視図である。図１３の上部では、フレーム５３の断面５３ｄとフレキシブル回路基板５２の断面５２ｄが観察され、フレーム５３の断面５３ｄはＨ型をしている。フレーム５３の外側（グローブ５１
側、図１２参照）の溝にはフレキシブル回路基板５２がはめ込まれるようにして貼り付けられている。さらにフレキシブル回路基板５２にはＬＥＤチップ５７がフリップチップ実装されている。 Next, the frame 53 provided in the LED bulb 50 will be described in more detail with reference to FIG. FIG. 13 is a perspective view in which a part of the frame 53 of the LED bulb 50 is cut out and enlarged. In the upper part of FIG. 13, a cross section 53d of the frame 53 and a cross section 52d of the flexible circuit board 52 are observed, and the cross section 53d of the frame 53 has an H shape. Outside of frame 53 (glove 51
Side, see FIG. 12), a flexible circuit board 52 is attached so as to be fitted. Further, an LED chip 57 is flip-chip mounted on the flexible circuit board 52.

なおフレキシブル回路基板５２は、図１等で示したＬＥＤ電球１０に内蔵されたフレキシブル回路基板１２と同様に透明ポリイミドである。またＬＥＤチップ５７は、ＬＥＤ電球１０のフレキシブル回路基板１２に実装されていたＬＥＤチップ１２と同じものである。ここでフレキシブル基板５２に褐色で半透明のポリイミド基板を採用しても良い。この場合、ＬＥＤチップ５７の実装面側は蛍光体が薄い（図３参照）ので青みがかった発光になるが、褐色のポリイミド基板が青成分を吸収するため、グローブ５１の外側に向かって放射される光の色調と、グローブ５１の内側に向かって放射される光の色調がバランスされる。 The flexible circuit board 52 is made of transparent polyimide, similar to the flexible circuit board 12 built in the LED bulb 10 shown in FIG. The LED chip 57 is the same as the LED chip 12 mounted on the flexible circuit board 12 of the LED bulb 10. Here, a brown and translucent polyimide substrate may be adopted as the flexible substrate 52. In this case, since the phosphor on the mounting surface side of the LED chip 57 is thin (see FIG. 3), the light emission is bluish. However, the brown polyimide substrate absorbs the blue component, so that it is emitted toward the outside of the globe 51. The color tone of light and the color tone of light emitted toward the inside of the globe 51 are balanced.

最後に図１４によりフレーム５３の組み立てに係る構造を説明する。図１４はＬＥＤ電球５０に含まれるフレーム５３の分解斜視図である。フレーム５３は上部５３ａと下部５３ｂと基部５３ｃからなる。フレーム５３の上部５３ａと下部５４は分離しており、フレーム５３の下部５３ｂと基部５３ｃは一体化している。フレーム５３の上部５３ａと下部５３ｂは、それぞれの接続部に図示していない凸部と凹部を備え、これらが嵌合した状態で接着剤により固定される。フレーム５３の上部５３ａと下部５３ｂを分離させた理由は、量産性を考慮してフレーム５３を金型で作らなければならなかったためであり、金型から取り外せるようにフレーム５３を２分割した。 Finally, the structure related to the assembly of the frame 53 will be described with reference to FIG. FIG. 14 is an exploded perspective view of the frame 53 included in the LED bulb 50. The frame 53 includes an upper portion 53a, a lower portion 53b, and a base portion 53c. The upper part 53a and the lower part 54 of the frame 53 are separated, and the lower part 53b and the base part 53c of the frame 53 are integrated. The upper part 53a and the lower part 53b of the frame 53 are provided with a convex part and a concave part (not shown) at their respective connecting parts, and are fixed by an adhesive in a state in which these are fitted. The reason why the upper part 53a and the lower part 53b of the frame 53 are separated is that the frame 53 must be made of a mold in consideration of mass productivity, and the frame 53 is divided into two parts so that it can be removed from the mold.

前述のようにフレーム５３は透明であるためＬＥＤチップ５７の実装面側の発光が、フレキシブル回路基板５２及びフレーム５３を抜け、ＬＥＤ電球５０の中心方向に出射する。この結果、ＬＥＤ電球５０はフィラメント電球と同等の装飾性を維持することが可能となる。さらにフレキシブル回路基板５２の非実装面側がフレームを介して空気と接するようになると空気に接する表面積が増加するため放熱性が向上する。また硬質であるフレーム５３にフレキシブル回路基板５２が固定されているため、フレキシブル回路基板５２に係る機械的強度が増加し、たとえＬＥＤ電球５０が振動してもフレキシブル回路基板５２の切断が防止される。またフレキシブル回路基板５２がフレーム５３に固定されているため、フレキシブル回路基板５３をグローブ５１内に配置する際にフレキシブル基板５２が変形しないので組み立て性が向上する。 As described above, since the frame 53 is transparent, light emission on the mounting surface side of the LED chip 57 passes through the flexible circuit board 52 and the frame 53 and is emitted toward the center of the LED bulb 50. As a result, the LED bulb 50 can maintain a decorative property equivalent to that of the filament bulb. Further, when the non-mounting surface side of the flexible circuit board 52 comes into contact with air through the frame, the surface area in contact with the air increases, so that the heat dissipation is improved. Further, since the flexible circuit board 52 is fixed to the rigid frame 53, the mechanical strength of the flexible circuit board 52 is increased, and the flexible circuit board 52 is prevented from being cut even if the LED bulb 50 vibrates. . Further, since the flexible circuit board 52 is fixed to the frame 53, the flexible board 52 is not deformed when the flexible circuit board 53 is placed in the globe 51, so that the assemblability is improved.

本実施形態のＬＥＤ電球５０ではフレーム５３が４本の枝状部を備えていた。しかしながらフレームを備えた本発明のＬＥＤ電球では、フレームが４本の枝状部を備えていたものに限定されない。例えばフレームが平板を交差させるような構造をとっても良い。このとき平板の側面にフレキシブル回路基板を貼り付けることになる。また第２実施形態で示したＬＥＤ電球２０のように、ＬＥＤ電球５０でもフレキシブル回路基板５２に実装するＬＥＤチップ５７が複数種類からなっていたり、フレキシブル回路基板５２にＬＥＤチップ５７が２列で配列したりしていても良い。 In the LED bulb 50 of this embodiment, the frame 53 includes four branch portions. However, the LED light bulb of the present invention including the frame is not limited to the one in which the frame includes four branch portions. For example, a structure in which a frame crosses flat plates may be taken. At this time, the flexible circuit board is attached to the side surface of the flat plate. In addition, as in the LED bulb 20 shown in the second embodiment, the LED bulb 50 also includes a plurality of types of LED chips 57 mounted on the flexible circuit board 52, or the LED chips 57 are arranged in two rows on the flexible circuit board 52. You may do it.

１０，２０，５０…ＬＥＤ電球、
１１，５１…グローブ、
１２，５２，８５…フレキシブル回路基板、
１３…支柱、
１３ａ…基板取り付け部、
１４，５４…ソケット、
１５，５５…口金、
１６…電源基板、
１７，５７，６０，８１，８２，８３，８４…ＬＥＤチップ、
３１…蛍光樹脂、
３２，７５ａ…サファイヤ基板、
３３，７５ｂ…半導体層、
３４，７１，７２，７３，７４…接続電極、
３５，７５…ＬＥＤダイ、
３６，８６…配線電極、
３７…基材、
４１…バネ（弾性部材）、
４２…取り付け孔、
４３…貫通孔、
５２ｄ…フレキシブル回路基板の断面、
５３…フレーム、
５３ａ…フレームの上部、
５３ｂ…フレームの下部、
５３ｃ…フレームの基部、
５３ｄ…フレームの断面、
６１…被覆樹脂、
１０１，１０２，１０３，１０４…直列回路、
１０１ａ，１０２ａ，１０３ａ，１０４ａ…電流制限回路、
１０５，１０６…電源、
１０７…制御回路。 10, 20, 50 ... LED bulbs,
11, 51 ... Globe,
12, 52, 85 ... flexible circuit board,
13 ... posts
13a ... board mounting part,
14, 54 ... socket,
15, 55 ...
16 ... power supply board,
17, 57, 60, 81, 82, 83, 84 ... LED chip,
31 ... Fluorescent resin,
32, 75a ... sapphire substrate,
33, 75b ... semiconductor layer,
34, 71, 72, 73, 74 ... connection electrodes,
35,75 ... LED die,
36, 86 ... wiring electrodes,
37. Base material,
41 ... Spring (elastic member),
42 ... mounting hole,
43 ... through hole,
52d: cross section of flexible circuit board,
53 ... Frame,
53a ... upper part of the frame,
53b ... the lower part of the frame,
53c ... base of the frame,
53d: Cross section of frame,
61 ... Coating resin,
101, 102, 103, 104 ... series circuit,
101a, 102a, 103a, 104a ... current limiting circuit,
105, 106 ... power supply,
107: Control circuit.

Claims

In an LED bulb having a globe and a socket to which a base is attached, and having an LED chip in the light emitting part,
A flexible circuit board having a belt-like portion and a transparent substrate;
A plurality of LED chips containing LED dies ;
A post that stands on the center of the socket inside the globe ;
The LED die has a pair of connection electrodes,
The LED chip, the is flip-chip mounted on the flexible circuit board, the connection electrode and the wiring electrode on the flexible circuit board is directly connected,
One end and the other end of the flexible circuit board are fixed to the support column and the socket, respectively, and an upper portion is curved outward, and there is an unfixed portion between the one end and the other end. LED bulb characterized by that.

The support column is made of a conductor, has a substrate attachment portion at a tip, and the one end of the flexible circuit board is fixed to the substrate attachment portion,
The flexible circuit board is electrically connected to the board mounting portion,
The LED bulb according to claim 1 , wherein a current flows through the support column.

In an LED bulb equipped with an LED chip in the light emitting part,
A flexible circuit board having a belt-like portion and a transparent substrate;
A plurality of LED chips containing LED dies,
The LED die has a pair of connection electrodes;
The wiring electrode on the flexible circuit board and the connection electrode are directly connected by flip-chip mounting the LED chip on the flexible circuit board ,
It has a prop that stands inside,
One end of the flexible circuit board is fixed to the column,
A power supply board for supplying power to the flexible circuit board;
The LED bulb characterized in that the other end of the flexible circuit board is fixed to the power supply board via an elastic member .

The elastic member has conductivity, LED bulb according to claim 3, characterized in that power from the power board to the flexible circuit board via the elastic member.

The LED light bulb according to claim 3 or 4 , wherein the elastic member is a spring.

Wherein the LED chip includes a plurality of types of LED chips, LED chips for each kind, LED bulb according to claim 1, any one of 5, characterized in that to constitute a series circuit.

It said flexible circuit board is arranged in the longitudinal direction of the flexible circuit board, a plurality of LED chip sequence comprised of the LED chip,
The LED bulb according to claim 6 , wherein the number of the LED chip rows is smaller than the number of types of the LED chips.

In an LED bulb equipped with an LED chip in the light emitting part,
A flexible circuit board having a belt-like portion and a transparent substrate;
A plurality of LED chips containing LED dies,
The LED die has a pair of connection electrodes;
The wiring electrode on the flexible circuit board and the connection electrode are directly connected by flip-chip mounting the LED chip on the flexible circuit board ,
The LED chip includes a plurality of types of LED chips,
Each type of LED chip constitutes a series circuit,
The number of LED chip rows on the flexible circuit board is less than the number of types of the LED chips,
The plurality of types of LED chips have, in addition to the pair of connection electrodes, two short-circuit connection electrodes that are connected to each other, the pair of connection electrodes are arranged at one diagonal position, and the two The short-circuit connection electrodes are arranged at the other diagonal position, and the LED chip row includes two kinds of LED chips, and one kind of LED chip and the other kind of LED chip respectively constitute a series circuit. LED bulb characterized by that.

Said two of said LED chip sequence provided in the flexible circuit board, the type of LED chips in one LED chip column, the type of LED chips are different, all or part included in the other LED chip sequence The LED bulb according to claim 7 or 8 , wherein

The LED chip includes four types of LED chip that emits red light, LED chip that emits green light, LED chip that emits blue light, and LED chip that emits white light. 10. The LED bulb according to claim 9 , wherein two of them are included, and the remaining two types are included in the other LED chip row.