CN204227119U

CN204227119U - A kind of LED silk

Info

Publication number: CN204227119U
Application number: CN201420684888.0U
Authority: CN
Inventors: 王东海; 林成通
Original assignee: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
Current assignee: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
Priority date: 2014-11-14
Filing date: 2014-11-14
Publication date: 2015-03-25
Anticipated expiration: 2024-11-14

Abstract

The utility model relates to a kind of LED silk.Solve LED silk substrate and sheet metal associativity in prior art poor, easily cause the problem of disengaging.Filament comprises substrate, substrate surface is provided with circuit, LED chip is connected on circuit, substrate two ends connection metal sheet, described sheet metal is provided with alligatoring district near the surface of position place of rear end, and alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.The utility model has the advantages that sheet metal roughening treatment, add the binding ability of sheet metal and substrate, guarantee that connection is more certain; Adopt without bonding wire structure, not only save the expense of the consumption product such as bonding equipment equipment, metal wire, porcelain mouth, and substantially reduce in welding process because porcelain mouth causes LED electric leakage, rosin joint equivalent risk to the impact of LED chip, greatly improve package reliability and produce yield, also reducing cost simultaneously; Heat radiation, light-out effect is good.

Description

A kind of LED silk

Technical field

The utility model relates to a kind of LED technology field, especially relates to a kind of LED silk.

Background technology

LED silk lamp, from the appearance namely with the incandescent lamp that LED makes, it has: 1. similar to incandescent lamp form and distribution curve flux; Ball bubble technical maturity, cheap; 360 degree of full angles are luminous, without aperture; High aobvious finger, specular removal; Without the need to features such as independent heat radiations.Meanwhile, also there is many problems in the development of LED bulb, and main restricting factor is LED silk.LED silk structure generally comprises substrate, and substrate is provided with LED chip, and substrate two ends are connected with sheet metal, and the mode bondd by glue between sheet metal and substrate is interfixed.But this structure easily occurs that in filament production and assembly and use procedure sheet metal and substrate depart from causes dead lamp, and the binding ability how increasing filament support and substrate is current urgent problem.In addition, existing LED silk due to substrate area of dissipation little, light fixture radiating effect is poor, by heat radiation restriction whole lamp power low.

Summary of the invention

It is poor that the utility model mainly solves LED silk substrate and sheet metal associativity in prior art, easily causes the problem of disengaging, provide the LED silk of a kind of substrate and sheet metal excellent bonding performance.

Another goal of the invention of the utility model solves the problem that existing LED silk light extraction efficiency is bad and thermal diffusivity is imperfect, provides a kind of LED silk omitting bonding wire, cost-saving, good heat dissipation effect.

Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: a kind of LED silk, comprise substrate, substrate is fixed and is electrically connected with some LED chip, substrate two ends connection metal sheet, described sheet metal is provided with alligatoring district near the surface of position place of rear end, and alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.Sheet metal rear end is for divide with substrate connecting portion, and sheet metal and substrate adopt glue to bond, and the part be connected is carried out roughening treatment and forms alligatoring district, add the binding ability of sheet metal and substrate with substrate, guarantees that connection is more certain.

As a kind of preferred version, described sheet metal also has bar hole.Arrange the stress that bar hole causes in an assembling process in order to discharge filament, bar hole discharges stress by deformation, thus serves protective effect, prevents metal electrode and substrate from coming off.

As a kind of preferred version, described circuit is made up of the connecting circuit of some mutual disconnections, connecting circuit comprises two conductive silver layers, be connected by conducting wire between two conductive silver layers, described LED chip is flip-chip, LED chip is arranged between two adjacent connecting circuits, is connected by connecting circuit.The present invention adopts without bonding wire structure, and substrate makes circuit, and mutually disconnect between each connecting circuit, not conducting mutually, adjacent circuit is conducted by LED chip.Connecting circuit two ends are die bond position, adopt and sinter by thick-film technique the conductive silver layer made, LED chip adopts flip-chip, two connecting pins of LED chip are connected with the conductive silver layer of adjacent two connecting circuits respectively respectively by tin cream, like this without the need to bonding wire, not only save the expense of the consumption product such as bonding equipment equipment, metal wire, porcelain mouth, and substantially reduce in welding process because porcelain mouth causes LED electric leakage, rosin joint equivalent risk to the impact of LED chip, greatly improve package reliability and produce yield, also reducing cost simultaneously.

As a kind of preferred version, described conducting wire adopts transparent material to make.Conducting wire adopts transparent material such as electrically conducting transparent ink to make, and LED chip light extraction is not stopped, maximum possible increases chip and gets light rate.This programme is compared to thin-film techniques such as sputtering, evaporations, and the equipment used is simple, and easy to operate, cost is low, and by solid for chip on circuit line, increases heat transfer area, also improves product reliability.

As a kind of preferred version, described conducting wire adopts electrocondution slurry to make.Electrocondution slurry does blast process, reduce extinction, and this programme has splendid heat-conducting effect, is more suitable for relatively high power chip or high-voltage chip.

As a kind of preferred version, described substrate is transparency carrier, on the surface of substrate both sides, concavo-convex fluctuating is formed with one deck extension layer, described extension layer comprises some projections and some grooves, described projection and the groove arranged adjacent that interlocks becomes several rows, and between row and row projection and groove also interlaced, described projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.Diffusion layer makes source light to carry out multiple reflections and refraction, and make luminescence more even, diffusion layer too increases the contact area of substrate side surfaces and air in addition, adds the radiating effect of substrate, effectively improves the making power of LED.

As a kind of preferred version, be provided with some louvres along its length in described substrate, the perforate in substrate both ends of the surface respectively of described louvre two ends, louvre density of setting in substrate reduces to surrounding gradually by near luminescence chip.Louvre adds the contact area of substrate and air, and the heat of substrate inside can directly be derived by louvre, further increases the radiating effect of substrate, solves existing filament and is subject to the problem that heat radiation power-limiting is low.The existence of louvre also makes light source luminescent more even in addition, too increases brightness and illumination simultaneously.Luminescence chip position heat is more, and by rationally arranging louvre density, the position heat radiation making heat in substrate many is faster.

Therefore, the utility model has the advantages that: 1. sheet metal roughening treatment, add the binding ability of sheet metal and substrate, guarantee that connection is more certain; 2. adopt without bonding wire structure, not only save the expense of the consumption product such as bonding equipment equipment, metal wire, porcelain mouth, and substantially reduce in welding process because porcelain mouth causes LED electric leakage, rosin joint equivalent risk to the impact of LED chip, greatly improve package reliability and produce yield, also reducing cost simultaneously; 3. substrate both sides are provided with extension layer, and extension layer had both made LED luminescence more even, and added area of dissipation, improve radiating effect, made to make more high-power LED; 4. be provided with louvre in substrate, further increase radiating effect.

Accompanying drawing explanation

Accompanying drawing 1 is a kind of structural representation of the present utility model;

Accompanying drawing 2 is a kind of structural representations of substrate surface connecting circuit in the utility model;

Accompanying drawing 3 is a kind of structural representations of sheet metal in the utility model;

Accompanying drawing 4 is a kind of cross-sectional view of substrate in the utility model;

Accompanying drawing 5 is a kind of structural representations of substrate side surfaces extension layer in the utility model.

1-substrate 2-sheet metal 3-bar hole 4-LED chip 5-connecting circuit 6-conductive silver layer 7-conducting wire 8-alligatoring district 9-louvre 10-projection 11-groove.

Detailed description of the invention

Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.

Embodiment:

A kind of LED silk of the present embodiment, as shown in Figure 1, comprises substrate 1, substrate is fixed and is electrically connected with some LED chip 4, adopts glue to be bonded with sheet metal at the two ends of substrate.As shown in Figure 3, sheet metal is provided with alligatoring district 8 near the surface of position place of rear end, and alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.In addition in order to discharge the stress caused in assembling process, sheet metal also has bar hole 3.

As shown in Figure 2, circuit is made up of some connecting circuits 5, and connecting circuit comprises two electric silver layers 6, and electric silver layer adopts to be made up of thick-film technique sintering, connected by conducting wire 7 between electricity silver layer, conducting wire wiping transparent material makes or adopts electrocondution slurry to make.Disconnect mutually between each connecting circuit, be not communicated with mutually, LED chip is connected on adjacent connecting circuit, and LED chip adopts flip-chip, and two connecting pins of LED chip are connected with the conductive silver layer of adjacent two connecting circuits respectively respectively by tin cream.

Substrate is transparency carrier, on the surface of substrate both sides, concavo-convex fluctuating is formed with one deck extension layer, as shown in Figure 5, extension layer comprises some projections 10 and some grooves 11, projection and the groove arranged adjacent that interlocks becomes several rows, and between row and row projection and groove also interlaced, projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.

As shown in Figure 4, be provided with some louvres 9 in substrate along its length, louvre two ends are perforate in substrate both ends of the surface respectively, and louvre density of setting in substrate reduces to surrounding gradually by near luminescence chip.

Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.

Although more employ the terms such as substrate, sheet metal, bar hole, LED chip, connecting circuit herein, do not get rid of the possibility using other term.These terms are used to be only used to describe and explain essence of the present utility model more easily; The restriction that they are construed to any one additional is all contrary with the utility model spirit.

Claims

1. a LED silk, comprise substrate, substrate is fixed and is electrically connected with some LED chip, substrate two ends connection metal sheet, it is characterized in that: described sheet metal (2) is provided with alligatoring district (8) near the surface of position place of rear end, alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.

2. a kind of LED silk according to claim 1, is characterized in that described sheet metal (2) also has bar hole (3).

3. a kind of LED silk according to claim 1, it is characterized in that described circuit is made up of the connecting circuit (5) of some mutual disconnections, connecting circuit comprises two conductive silver layers (6), be connected by conducting wire (7) between two conductive silver layers, described LED chip is flip-chip, LED chip is arranged between two adjacent connecting circuits, is connected by connecting circuit.

4. a kind of LED silk according to claim 3, is characterized in that described conducting wire (7) adopts transparent material to make.

5. a kind of LED silk according to claim 3, is characterized in that described conducting wire (7) adopts electrocondution slurry to make.

6. a kind of LED silk according to claim 1 or 2 or 3, it is characterized in that described substrate (1) is transparency carrier, on the surface of substrate both sides, concavo-convex fluctuating is formed with one deck extension layer, described extension layer comprises some projections (10) and some grooves (11), described projection and the groove arranged adjacent that interlocks becomes several rows, and between row and row projection and groove also interlaced, described projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.

7. a kind of LED silk according to claim 1 or 2 or 3, it is characterized in that being provided with some louvres (9) along its length in described substrate (1), the perforate in substrate both ends of the surface respectively of described louvre two ends, louvre (9) density of setting in substrate (1) reduces to surrounding gradually by near luminescence chip.