CN203517393U - A LED fluorescent lamp with enhanced thermal conductivity - Google Patents
A LED fluorescent lamp with enhanced thermal conductivity Download PDFInfo
- Publication number
- CN203517393U CN203517393U CN201320596929.6U CN201320596929U CN203517393U CN 203517393 U CN203517393 U CN 203517393U CN 201320596929 U CN201320596929 U CN 201320596929U CN 203517393 U CN203517393 U CN 203517393U
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- Prior art keywords
- led
- fluorescent lamp
- led light
- layer
- thermal conductivity
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Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 51
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 239000004411 aluminium Substances 0.000 description 36
- 230000000694 effects Effects 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 230000004313 glare Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model relates to the technical field of LED fluorescent lamps, in particular to an LED fluorescent lamp with enhanced thermal conductivity, which comprises a lamp shade and a radiator which are connected with each other, wherein the radiator is connected with an LED luminous substrate, a plurality of LED luminous components are arranged on the LED luminous substrate, each LED luminous component comprises an aluminum substrate, one side above the aluminum substrate is provided with a thermal conductive ceramic layer, the other side above the aluminum substrate is provided with a copper foil layer, the copper foil layer is not connected with the thermal conductive ceramic layer, a chip is connected above the copper foil layer and the thermal conductive ceramic layer, one part of the chip is connected with the copper foil layer, the other part of the chip is connected with the thermal conductive ceramic layer, the surface of the chip is provided with a fluorescent powder layer, a silica gel layer is sleeved above the fluorescent powder layer, a lens is sleeved on the silica gel layer, the LED luminous, thereby effectively prolonging the service life of the LED fluorescent lamp.
Description
Technical field
The utility model relates to LED fluorescent lamp technical field, is specifically related to a kind of LED fluorescent lamp of increased thermal conductivity energy.
Background technology
LED fluorescent lamp and traditional fluorescent lamp are about the same in overall dimensions.Its basic structure is an electroluminescent semi-conducting material, is placed on a leaded shelf, and then surrounding epoxy sealing, plays the effect of protection internal core, so the anti-seismic performance of LED is good.LED fluorescent lamp is compared incandescent lamp economize on electricity up to more than 80%, and it is more than 10 times that the life-span is common fluorescent tube, is almost non-maintaining, do not have the problem that will often change fluorescent tube, ballast, starter, and the expense of saving approximately over a year just can gain cost.The semiconductor light sources that belongs to environmental type, light is soft, and spectroscopic pure is conducive to people's sight protectio and healthy, and the cold light source of 6000K, to visually refrigerant impression of people, contributes to concentrate on, and raises the efficiency.But LED fluorescent lamp has a larger problem, be exactly price, and caloric value is large, and excessive caloric value often easily burns out power supply, shorten the service life of LED.Therefore, the heat dissipation problem of LED fluorescent lamp is the difficult point that current LED is difficult to break through.
The heating main cause of LED fluorescent lamp is because the electric energy adding is not all converted into luminous energy, but a part transforms into heat energy.The light efficiency of LED only has 100lm/W at present, and its electro-optical efficiency approximately only has 20 ~ 30% left and right.That is to say that about 70% electric energy has all become heat energy.Specifically, the generation of LED junction temperature is because two factors are caused: 1, internal quantum is not high, namely when electronics and hole-recombination, can not 100% all produces photon, be commonly referred to by " current leakage ", the recombination rate of Er Shi PN district carrier reduces.Leakage current is multiplied by the power that voltage is exactly this part, is namely converted into heat energy, but this part does not account for main component, because present inner photon efficiency has approached 90%;
2, the inner photon producing cannot all inject to chip exterior and finally be converted into heat, and this part is main, because this external quantum efficiency that is called only has 30% left and right at present, major part has all been converted into heat.
And the heat dissipation problem that solves in the market fluorescent lamp is mainly on the shell radiator of fluorescent lamp, this radiating mode can only be from its heat dissipation problem of formal alleviation, and solution heat dissipation problem that cannot larger efficiency.
Summary of the invention
The purpose of this utility model is for deficiency of the prior art, and a kind of LED fluorescent lamp of increased thermal conductivity energy is provided, and it has good heat dissipation effect, effectively improves the light efficiency of LED fluorescent lamp, thereby effectively extends the LED fluorescent lamp feature in service life.
The purpose of this utility model is achieved through the following technical solutions:
A kind of LED fluorescent lamp of increased thermal conductivity energy, comprise lampshade and radiator, lampshade and radiator form daylight lamp casing body, radiator is connected with LED light-emitting substrate, described LED light-emitting substrate is provided with several LED emitting components, LED emitting components comprises aluminium base, aluminium base top one side is provided with one deck thermal conductive ceramic layer, aluminium base top opposite side is provided with copper foil layer, copper foil layer is not connected with described thermal conductive ceramic layer, described copper foil layer and thermal conductive ceramic layer top are connected with chip jointly, a part for chip and described copper foil layer join, another part of chip and described thermal conductive ceramic layer join, the surface of chip is provided with phosphor powder layer, the top of phosphor powder layer is arranged with layer of silica gel, in layer of silica gel, be arranged with lens, the port part of lens is connected with described aluminium base, described aluminium base is connected with described LED light-emitting substrate.
Wherein, between described chip and thermal conductive ceramic layer, be provided with heat conduction gold goal.
Wherein, described phosphor powder layer is provided with Gold plated Layer.
Wherein, described radiator includes integrated aluminium heat-conducting plate and aluminium radiator, between described aluminium heat-conducting plate and described aluminium radiator, form power supply and put chamber, described power supply is put in chamber and is provided with LED power supply, and described LED light-emitting substrate is arranged on described aluminium heat-conducting plate.
Wherein, the outer surface of described aluminium radiator is provided with radiating fin.
Wherein, described radiating fin is provided with hollow bulb, and hollow bulb is communicated to described power supply and puts chamber.
Wherein, described LED light-emitting substrate comprises left LED light-emitting substrate and right LED light-emitting substrate, and the angle of described left LED light-emitting substrate and right LED light-emitting substrate is less than 180 °.
Wherein, the LED emitting components being arranged on described left LED light-emitting substrate and right LED light-emitting substrate is crisscross arranged.
Wherein, the inner surface of described lampshade is provided with Anti Glare Coatings.
Wherein, the both sides of described aluminium radiator have extended dust flaps.
The beneficial effects of the utility model: the ceramic powders of nanometer grade high heat conduction by plating one deck suitable thickness on aluminium base is as dielectric layer, its thermal conductivity can reach 1-2.2W/m.k, therefore can play from the heating root of LED chip the effect of heat radiation, radiating effect is remarkable, effectively prevent that LED fluorescent lamp from, because excess Temperature causes the problem of the lost of life, improving the service efficiency of LED fluorescent lamp and reducing its use cost.
Accompanying drawing explanation
Utilize accompanying drawing to be described further utility model, but the embodiment in accompanying drawing does not form any restriction of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the structural representation of the utility model LED emitting components;
Fig. 2 be a kind of increased thermal conductivity of the utility model can the schematic cross-section of radiator of LED fluorescent lamp embodiment 1;
Fig. 3 is the structural representation of the LED fluorescent lamp cross section of a kind of increased thermal conductivity energy of the utility model.
Reference numeral comprises:
1---lampshade 2---radiator 3---LED light-emitting substrate 4---LED emitting components
5---LED power supply 40---aluminium base 41---thermal conductive ceramic layer 42---copper foil layers
43---chip 44---phosphor powder layer 45---layer of silica gel 46---lens
47---heat conduction gold goal 48---Gold plated Layer 21---aluminium heat-conducting plate 22---aluminium radiators
11---Anti Glare Coatings 6---groove 7---reflectors.
The specific embodiment
With the following Examples the utility model is further described.
embodiment 1.
As shown in Figure 1, a kind of LED fluorescent lamp of increased thermal conductivity energy, comprise interconnective lampshade 1 and radiator 2, lampshade 1 forms fluorescent lamp housing with radiator 2, radiator 2 is connected with LED light-emitting substrate 3, described LED light-emitting substrate 3 is provided with several LED emitting components 4, LED emitting components 4 comprises aluminium base 40, aluminium base 40 top one sides are provided with one deck thermal conductive ceramic layer 41, aluminium base 40 top opposite sides are provided with copper foil layer 42, copper foil layer 42 is not connected with described thermal conductive ceramic layer 41, described copper foil layer 42 is connected with chip 43 with thermal conductive ceramic layer 41 top, a part for chip 43 and described copper foil layer 42 join, another part of chip 43 and described thermal conductive ceramic layer 41 join, the surface of chip 43 is provided with phosphor powder layer 44, the top of phosphor powder layer 44 is arranged with layer of silica gel 45, in layer of silica gel 45, be arranged with lens 46, the port part of lens 46 is connected with described aluminium base 40, described aluminium base 40 is connected with described LED light-emitting substrate 3.By be coated with one deck thermal conductive ceramic layer 41 on aluminium base 40, this thermal conductive ceramic layer 41 is to have nanometer grade high heat conduction function, can effectively transmit the heat of chip 43, reaches the object of real heat radiation, and radiating effect is remarkable.
Between described chip 43 and thermal conductive ceramic layer 41, be provided with heat conduction gold goal 47, strengthen its heat conductivility.
Described phosphor powder layer 44 is provided with Gold plated Layer 48, fluorescence layering is difficult for aging, and luminous flux is large, and lighting effect is good.
As shown in Figure 2, described radiator 2 includes integrated aluminium heat-conducting plate 21 and aluminium radiator 22, between described aluminium heat-conducting plate 21 and described aluminium radiator 22, form power supply and put chamber, described power supply is put in chamber and is provided with LED power supply 5, and described LED light-emitting substrate 3 is arranged on described aluminium heat-conducting plate 21.Radiator 2 adopts one-body molded, reduces the thermal resistance between aluminium heat-conducting plate 21 and aluminium radiator 22, conducts heat fast, improves heat dispersion.
As shown in Figure 2, be arranged on the comprising of aluminium heat-conducting plate 21 middle part for putting the groove 6 of LED light-emitting substrate 3, also comprise the reflector with certain gradient 7 joining with groove 6 two ends, jointly form aluminium heat-conducting plate 21, one-body molded with aluminium radiator 22.
embodiment 2.
The difference of the present embodiment and embodiment 1 is: as shown in Figure 3, the outer surface of described aluminium radiator 22 is provided with radiating fin, strengthens the contact area of aluminium radiator 22 and air, strengthens radiating effect.
Described radiating fin comprises the heat radiation thin slice that two opposite side join, and two heat radiation thin slices are arranged with hollow bulb, and hollow bulb leads to described power supply puts chamber.Increase the hot-air of aluminium radiator 22 inside and the contact area of aluminium radiator 22, improve heat transfer efficiency, strengthen radiating effect.
Described LED light-emitting substrate 3 comprises left LED light-emitting substrate 3 and right LED light-emitting substrate 3, and the angle of described left LED light-emitting substrate 3 and right LED light-emitting substrate 3 is less than 180 °.With respect to traditional horizontal LED light-emitting substrate 3, form the LED light-emitting substrate 33 of certain angle, its irradiating angle is more concentrated, and light efficiency is stronger.
The inner surface of described lampshade 1 is provided with Anti Glare Coatings 11, makes illumination softer, prevents that dazzle from causing user's eyes uncomfortable.
The other technologies feature of the present embodiment all adopts the explanation of embodiment 1, does not repeat them here.
Finally should be noted that; above embodiment is only in order to illustrate the technical solution of the utility model; but not restriction to the utility model protection domain; although the utility model has been done to explain with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement the technical solution of the utility model, and not depart from essence and the scope of technical solutions of the utility model.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320596929.6U CN203517393U (en) | 2013-09-26 | 2013-09-26 | A LED fluorescent lamp with enhanced thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320596929.6U CN203517393U (en) | 2013-09-26 | 2013-09-26 | A LED fluorescent lamp with enhanced thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203517393U true CN203517393U (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320596929.6U Expired - Fee Related CN203517393U (en) | 2013-09-26 | 2013-09-26 | A LED fluorescent lamp with enhanced thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203517393U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104864284A (en) * | 2015-04-03 | 2015-08-26 | 浙江侨鸣光电有限公司 | Ultraviolet LED lamp bead |
-
2013
- 2013-09-26 CN CN201320596929.6U patent/CN203517393U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104864284A (en) * | 2015-04-03 | 2015-08-26 | 浙江侨鸣光电有限公司 | Ultraviolet LED lamp bead |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20150926 |
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| EXPY | Termination of patent right or utility model |