CN204227118U - A kind of Novel LED light source structure - Google Patents
A kind of Novel LED light source structure Download PDFInfo
- Publication number
- CN204227118U CN204227118U CN201420683469.5U CN201420683469U CN204227118U CN 204227118 U CN204227118 U CN 204227118U CN 201420683469 U CN201420683469 U CN 201420683469U CN 204227118 U CN204227118 U CN 204227118U
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- light source
- substrate
- filament
- led light
- source structure
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Abstract
The utility model relates to a kind of Novel LED light source structure.Solve the filament of LED silk lamp and being fixed by spot welding mode of filament support in prior art, easily occur that sealing-off, rosin joint etc. are abnormal, have a strong impact on production yield and the problem in service life of light source.LED light source structure comprises filament and filament support, filament comprises substrate, substrate surface is provided with circuit, LED chip is connected on circuit, substrate two ends connection metal sheet, sheet metal front end bends and forms the connecting plate of flat, and connecting plate is provided with connecting hole, the front end of described filament support is provided with joint pin, and sheet metal is enclosed within joint pin by connecting hole.The utility model has the advantages that: 1 filament and electrode suppor adopt embedded assembling mode, avoid light source and occur the bad problems such as filament sealing-off, rosin joint in traditional electrode welding process.
Description
Technical field
The utility model relates to a kind of LED technology field, especially relates to a kind of Novel LED light source structure.
Background technology
LED silk lamp, from the appearance namely with the incandescent lamp that LED makes, it has: the form similar to incandescent lamp and distribution curve flux; Ball bubble technical maturity, cheap; 360 degree of full angles are luminous, without aperture; High aobvious finger, specular removal; Without the need to features such as independent heat radiations.Meanwhile, also there is many problems in the development of LED bulb, and main restricting factor is LED silk.Current LED silk lamp common structure is: comprise filament and filament support, filament is fixed on filament support by its sheet metal, filament and the fixing of filament support realize mainly through spot welding mode, but be limited by current technical capability, filament easily occurs that in pinpoint welding procedure sealing-off, rosin joint etc. are abnormal, have a strong impact on production yield and the service life of light source, equipment, material etc. simultaneously needed for spot-welding technology also to a certain degree improve light source production cost.
Summary of the invention
The utility model mainly solves the filament of LED silk lamp in prior art and being fixed by spot welding mode of filament support, easily occur that sealing-off, rosin joint etc. are abnormal, have a strong impact on production yield and the problem in service life of light source, provide a kind of embedded assembling structure, the Novel LED light source structure that cost is low.
Another goal of the invention of the utility model solves the problem that existing LED silk lamp filament radiating effect is poor, light emission rate is not high, provides a kind of perfect heat-dissipating, the Novel LED light source structure that light-out effect is good.
The utility model three goals of the invention are that the common filament sheet metal of solution and substrate binding ability are bad, the easy problem occurring to depart from, provide one and effectively can increase substrate and sheet metal binding ability, and effectively discharge the Novel LED light source structure of the stress that filament produces in an assembling process.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: a kind of Novel LED light source structure, comprise filament and filament support, filament comprises substrate, substrate two ends connection metal sheet, substrate is fixed and is electrically connected with some LED chip, described sheet metal front end bends and forms the connecting plate of flat, and connecting plate is provided with connecting hole, the front end of described filament support is provided with joint pin, and sheet metal is enclosed within joint pin by connecting hole.Be connected with light bulb filament support by filament in this programme and have employed embedded assembling mode, on the termination of filament support, correspondence is provided with joint pin, and the connecting plate on sheet metal is nested with on joint pin by connecting hole.This avoid light source and occur the bad problems such as filament sealing-off, rosin joint in traditional electrode welding process, save the cost such as equipment, material needed for welding technology simultaneously, improve product yield, reduce cost.
As a kind of preferred version, described circuit is made up of the connecting circuit of some mutual disconnections, connecting circuit comprises two conductive silver layers, be connected by conducting wire between two conductive silver layers, described LED chip is flip-chip, LED chip is arranged between two adjacent connecting circuits, is connected by connecting circuit.Adopt without bonding wire structure, substrate makes circuit, and mutually disconnect between each connecting circuit, not conducting mutually, adjacent circuit is conducted by LED chip.Connecting circuit two ends are die bond position, adopt and sinter by thick-film technique the conductive silver layer made, LED chip adopts flip-chip, two connecting pins of LED chip are connected with the conductive silver layer of adjacent two connecting circuits respectively respectively by tin cream, like this without the need to bonding wire, not only save the expense of the consumption product such as bonding equipment equipment, metal wire, porcelain mouth, and substantially reduce in welding process because porcelain mouth causes LED electric leakage, rosin joint equivalent risk to the impact of LED chip, greatly improve package reliability and produce yield, also reducing cost simultaneously.
As a kind of preferred version, described conducting wire adopts transparent material to make.Conducting wire adopts transparent material such as electrically conducting transparent ink to make, and LED chip light extraction is not stopped, maximum possible increases chip and gets light rate.This programme is compared to thin-film techniques such as sputtering, evaporations, and the equipment used is simple, and easy to operate, cost is low, and by solid for chip on circuit line, increases heat transfer area, also improves product reliability.
As a kind of preferred version, described conducting wire adopts electrocondution slurry to make.Electrocondution slurry does blast process, reduce extinction, and this programme has splendid heat-conducting effect, is more suitable for relatively high power chip or high-voltage chip.
As a kind of preferred version, described substrate is transparency carrier, on the surface of substrate both sides, concavo-convex fluctuating is formed with one deck extension layer, described extension layer comprises some projections and some grooves, described projection and the groove arranged adjacent that interlocks becomes several rows, and between row and row projection and groove also interlaced, described projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.Diffusion layer makes source light to carry out multiple reflections and refraction, and make luminescence more even, diffusion layer too increases the contact area of substrate side surfaces and air in addition, adds the radiating effect of substrate, effectively improves the making power of LED.
As a kind of preferred version, be provided with some louvres along its length in described substrate, the perforate in substrate both ends of the surface respectively of described louvre two ends, louvre density of setting in substrate reduces to surrounding gradually by near luminescence chip.Louvre adds the contact area of substrate and air, and the heat of substrate inside can directly be derived by louvre, further increases the radiating effect of substrate, solves existing filament and is subject to the problem that heat radiation power-limiting is low.The existence of louvre also makes light source luminescent more even in addition, too increases brightness and illumination simultaneously.Luminescence chip position heat is more, and by rationally arranging louvre density, the position heat radiation making heat in substrate many is faster.
As a kind of preferred version, described sheet metal is provided with alligatoring district near the surface of position place of rear end, and alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.Sheet metal rear end is for divide with substrate connecting portion, and sheet metal and substrate adopt glue to bond, and the part be connected is carried out roughening treatment and forms alligatoring district, add the binding ability of sheet metal and substrate with substrate, guarantees that connection is more certain
As a kind of preferred version, described sheet metal also has bar hole.Arrange the stress that bar hole causes in an assembling process in order to discharge filament, bar hole discharges stress by deformation, thus serves protective effect, prevents metal electrode and substrate from coming off.
Therefore, the utility model has the advantages that: 1. filament and electrode suppor adopt embedded assembling mode, avoid light source and occur the bad problems such as filament sealing-off, rosin joint in traditional electrode welding process; 2. adopt without bonding wire structure, not only save the expense of the consumption product such as bonding equipment equipment, metal wire, porcelain mouth, and substantially reduce in welding process because porcelain mouth causes LED electric leakage, rosin joint equivalent risk to the impact of LED chip, greatly improve package reliability and produce yield, also reducing cost simultaneously; 3. substrate both sides are provided with extension layer, and extension layer had both made LED luminescence more even, and added area of dissipation, improve radiating effect, made to make more high-power LED; 4. be provided with louvre in substrate, further increase radiating effect.
Accompanying drawing explanation
Accompanying drawing 1 is a kind of structural representation of filament in the utility model;
Accompanying drawing 2 is a kind of structural representations that in the utility model, substrate is connected with sheet metal, LED chip;
Accompanying drawing 3 is a kind of structural representations that in the utility model, filament is connected with filament support;
Accompanying drawing 4 is a kind of cross-sectional view of substrate in the utility model;
Accompanying drawing 5 is a kind of cross-sectional view of substrate in the utility model;
Accompanying drawing 6 is a kind of structural representations of substrate side surfaces extension layer in the utility model;
Accompanying drawing 7 is structural representations of sheet metal end portion in the utility model.
1-substrate 2-sheet metal 3-filament support 4-LED chip 5-connecting circuit 6-electricity 8-joint pin 9-connecting plate 10-connecting hole 11-louvre 12-projection 13-groove 14-bar hole 15-alligatoring district, silver layer 7-conducting wire.
Detailed description of the invention
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment:
A kind of Novel LED light source structure of the present embodiment, as depicted in figs. 1 and 2, comprise substrate 1, substrate is fixed and is electrically connected with some LED chip 4, adopt glue to be bonded with sheet metal at the two ends of substrate, as shown in Figure 7, sheet metal is provided with alligatoring district 8 near the surface of position place of rear end, and alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.In addition in order to discharge the stress caused in assembling process, sheet metal also has bar hole 3.Sheet metal adopts nested assembling mode to be connected with light bulb filament support 3, this sheet metal front end bends and forms the connecting plate 9 of flat, connecting plate is provided with connecting hole 10, as shown in Figure 3, the front end of filament support 3 is provided with joint pin 8, and connecting plate during installation on sheet metal is nested with on the joint pin of electrode suppor by connecting hole.
As shown in Figure 4, circuit is made up of some connecting circuits 5, and connecting circuit comprises two electric silver layers 6, and electric silver layer adopts to be made up of thick-film technique sintering, connected by conducting wire 7 between electricity silver layer, conducting wire wiping transparent material makes or adopts electrocondution slurry to make.Disconnect mutually between each connecting circuit, be not communicated with mutually, LED chip is connected on adjacent connecting circuit, and LED chip adopts flip-chip, and two connecting pins of LED chip are connected with the conductive silver layer of adjacent two connecting circuits respectively respectively by tin cream.
Substrate is transparency carrier, on the surface of substrate both sides, concavo-convex fluctuating is formed with one deck extension layer, as shown in Figure 6, extension layer comprises some projections 12 and some grooves 13, projection and the groove arranged adjacent that interlocks becomes several rows, and between row and row projection and groove also interlaced, projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.
As shown in Figure 5, be provided with some louvres 11 in substrate along its length, louvre two ends are perforate in substrate both ends of the surface respectively, and louvre density of setting in substrate reduces to surrounding gradually by near luminescence chip.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.
Although more employ the terms such as substrate, sheet metal, LED chip, connecting circuit herein, do not get rid of the possibility using other term.These terms are used to be only used to describe and explain essence of the present utility model more easily; The restriction that they are construed to any one additional is all contrary with the utility model spirit.
Claims (8)
1. a Novel LED light source structure, comprise filament and filament support, filament comprises substrate, substrate two ends connection metal sheet, substrate fixed and is electrically connected with some LED chip, it is characterized in that: described sheet metal (2) front end bends and forms the connecting plate (9) of flat, and connecting plate is provided with connecting hole (10), the front end of described filament support (3) is provided with joint pin (8), sheet metal is enclosed within joint pin by connecting hole.
2. a kind of Novel LED light source structure according to claim 1, it is characterized in that described circuit is made up of the connecting circuit (5) of some mutual disconnections, connecting circuit comprises two conductive silver layers (6), be connected by conducting wire (7) between two conductive silver layers, described LED chip is flip-chip, LED chip is arranged between two adjacent connecting circuits, is connected by connecting circuit.
3. a kind of Novel LED light source structure according to claim 2, is characterized in that described conducting wire (7) adopts transparent material to make.
4. a kind of Novel LED light source structure according to claim 2, is characterized in that described conducting wire (7) adopts electrocondution slurry to make.
5. a kind of Novel LED light source structure according to claim 1 or 2 or 3 or 4, it is characterized in that described substrate (1) is transparency carrier, on the surface of substrate both sides, concavo-convex fluctuating is formed with one deck extension layer, described extension layer comprises some projections (12) and some grooves (13), described projection and the groove arranged adjacent that interlocks becomes several rows, and row and row between projection and groove also interlaced, described projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.
6. a kind of Novel LED light source structure according to claim 1 or 2 or 3 or 4, it is characterized in that being provided with some louvres (11) along its length in described substrate (1), the perforate in substrate both ends of the surface respectively of described louvre two ends, louvre (11) density of setting in substrate (1) reduces to surrounding gradually by near luminescence chip.
7. a kind of Novel LED light source structure according to claim 1 or 2 or 3 or 4, it is characterized in that described sheet metal (2) is provided with alligatoring district (15) near the surface of position place of rear end, alligatoring district is the structure adopting any one or more combination in salient point, pit, stamp, line ball or blister copper.
8. a kind of Novel LED light source structure according to claim 1 or 2 or 3 or 4, is characterized in that described sheet metal (2) also has bar hole (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420683469.5U CN204227118U (en) | 2014-11-14 | 2014-11-14 | A kind of Novel LED light source structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420683469.5U CN204227118U (en) | 2014-11-14 | 2014-11-14 | A kind of Novel LED light source structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204227118U true CN204227118U (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420683469.5U Expired - Fee Related CN204227118U (en) | 2014-11-14 | 2014-11-14 | A kind of Novel LED light source structure |
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| CN (1) | CN204227118U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105299505A (en) * | 2015-10-23 | 2016-02-03 | 晶阳照明有限公司 | LED lamp filament assembly and illumination device comprising same |
| WO2017121154A1 (en) * | 2016-01-11 | 2017-07-20 | 漳洲立达信光电子科技有限公司 | Led filament packaging structure |
-
2014
- 2014-11-14 CN CN201420683469.5U patent/CN204227118U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105299505A (en) * | 2015-10-23 | 2016-02-03 | 晶阳照明有限公司 | LED lamp filament assembly and illumination device comprising same |
| WO2017121154A1 (en) * | 2016-01-11 | 2017-07-20 | 漳洲立达信光电子科技有限公司 | Led filament packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20211114 |