WO2017121154A1 - Led filament packaging structure - Google Patents

Led filament packaging structure Download PDF

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Publication number
WO2017121154A1
WO2017121154A1 PCT/CN2016/102247 CN2016102247W WO2017121154A1 WO 2017121154 A1 WO2017121154 A1 WO 2017121154A1 CN 2016102247 W CN2016102247 W CN 2016102247W WO 2017121154 A1 WO2017121154 A1 WO 2017121154A1
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WIPO (PCT)
Prior art keywords
substrate
led light
package structure
light source
led
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PCT/CN2016/102247
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French (fr)
Chinese (zh)
Inventor
曾茂进
王其远
鲍永均
曹亮亮
陈小波
吴明浩
Original Assignee
漳洲立达信光电子科技有限公司
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Publication of WO2017121154A1 publication Critical patent/WO2017121154A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to the field of LED lighting technologies, and in particular, to an LED filament package structure.
  • LED lamps have gradually replaced traditional lighting fixtures. Because LED lighting has the characteristics of point light source and directionality, it is difficult for LED lamps to completely replace traditional incandescent lamps and achieve full light distribution.
  • a LED filament which is formed by encapsulating a group of LED chips on a transparent substrate to form an LED filament, which can realize 360° full-angle illumination, and then connect a plurality of filaments to form a luminous effect similar to a tungsten filament lamp.
  • the LED filament has substantially no heat sink, the substrate is usually a glass material with poor thermal conductivity, and the electrode does not have thermal conductivity.
  • the LED filament cannot be thermally conducted, so it is difficult to conduct the heat generated by the LED chip, and the heat can only be relied on.
  • the convection of radiation and internal gas conducts heat and heat, which easily causes the accumulation of heat, which shortens the life of the LED filament.
  • An LED filament package structure comprises a substrate, an LED light source and two electrode ends, wherein the LED light source is disposed on the substrate and is thermally connected to the substrate, wherein the two electrode ends are made of a heat conductive material.
  • the two electrode ends each include a connecting portion disposed on the substrate and electrically connected to the LED light source, and the connecting portion is thermally connected to the substrate.
  • the present invention has two electrode ends connected to the substrate, and the heat generated by the LED light sources can be effectively exported through the good thermal conductivity of the two electrode ends, thereby avoiding the heat generated by the LED light sources.
  • the substrate is stacked, so that the LED filament package structure has a good heat dissipation effect.
  • the LED filament package structure includes a substrate 10 , an LED light source 20 , and two electrode ends 30 .
  • the LED light sources 20 are disposed on the substrate 10 and thermally connected to the substrate 10 .
  • the substrate 10 is made of a transparent or translucent material.
  • the LED light source 20 is disposed on the front surface of the substrate 10.
  • the front surface of the substrate 10 is further provided with a heat conductive layer 60 (shown in FIG. 3).
  • the heat conductive layer 60 is thermally connected to the front surface of the substrate 10, and the heat conductive layer 60 is The LED light sources 20 are spaced apart and at least one of the two electrode ends 30 is thermally coupled to the thermally conductive layer 60.
  • the heat conducting layer 60 may be a mercury layer disposed on the front surface of the substrate 10, and the electrode end 30 may be soldered on the heat conducting layer 60 while being soldered on the substrate 10.
  • the heat conducting layer 60 serves to transfer heat on the substrate 10 to the electrode terminal 30 more quickly.
  • a metal layer 50 is provided on the back surface of the substrate 10, and the metal layer 50 is thermally connected to the back surface of the substrate 10.
  • These LED light sources 20 are arranged in parallel with each other.
  • the metal layer 50 is disposed at a position away from the LED light source 20 on the back side of the substrate 10 so as to avoid the projection of the LED light source 20 on the back surface of the substrate 10, and let the light emitted by the LED light source 20 pass through the substrate 10 outward.
  • the light is emitted to expand the illumination angle of the LED filament package structure, so that the back surface has light, so that the illumination angle is greater than 180 degrees.
  • an LED light source can be disposed on both sides of the substrate 10.
  • the metal layer 50 can increase the thermal conductivity of the substrate 10, allowing more heat to be conducted to the electrode terminals 30, thereby preventing heat from accumulating in the central portion of the substrate 10.
  • the two electrode ends 30 are respectively soldered on the substrate 10 to achieve thermal connection with the substrate 10.
  • the LED light sources 20 are electrically connected to the two electrode terminals 30 through gold wires.
  • the two electrode ends 30 are made of a heat conductive material, and the two electrode ends 30 are respectively provided with connecting portions 31 at one end.
  • the connecting portions 31 are disposed on the substrate 10 and electrically connected to the LED light sources 20, and the connecting portions are electrically connected to the LED light sources 20 31 is thermally connected to the substrate 10.
  • the two electrode ends 30 are made of an elastic material, and each of the electrode ends 30 is provided with a telescopic portion 32 at the middle thereof, and the other end of each electrode end 30 is provided with a communication portion 33.
  • the connecting portion 31, the expansion and contraction portion 32, and the communication portion 33 are integrally formed.
  • the expansion and contraction portion 32 has a bent "several" shape, and the communication portion 33 is thermally connected to the external heat sink.
  • the LED filament package structure undergoes thermal expansion and contraction due to heat, but since the expansion and contraction portion 32 can undergo telescopic deformation, the problem of bending or breaking of the LED filament due to stress can be avoided.
  • the lower surface of the connecting portion 33 is provided with a rough microstructure 332, which may be a plurality of spaced pitches, squares, crosses, triangles, etc., in order to increase the contact neps with the solder paste.
  • the middle portion of the connecting portion 33 is provided with a through hole for allowing the solder paste to flow in better to eliminate the air wrapped in the center of the connecting portion when contacting the solder paste, and to reduce the contact thermal resistance.
  • the connecting portion 31 and the communicating portion 33 may be integrally formed without directly providing the expansion and contraction portion 32.
  • the LED filament package structure further includes an encapsulation layer 40 covering the LED light source 20 on the substrate 10 and the connection portion 31 of the two electrode ends 30.
  • a fluorescent material is disposed on the encapsulation layer 40, and the fluorescent material is disposed corresponding to the LED light sources 20.
  • the fluorescent material can emit white light in conjunction with these LED light sources 20.
  • the present invention has two electrode terminals 30 connected to the substrate 10, and the heat generated by the LED light sources 20 can be effectively exported through the good thermal conductivity of the two electrode terminals 30 to prevent the LED light sources 20 from being generated.
  • the heat is accumulated on the substrate 10, so that the LED filament package structure has a good heat dissipation effect.

Abstract

An LED filament packaging structure comprises a substrate (10), an LED light source (20), and two electrode terminals (30). The LED light source (20) is disposed on the substrate (10) and thermally connected to the substrate (10). The two electrode terminals (30) each are made of a thermally conductive material. Each of the two electrode terminals (30) comprises a connecting portion (31). The connecting portion (31) is disposed on the substrate (10) and is electrically connected to the LED light source (20). The connecting portion (31) is thermally connected to the substrate (10). The LED filament packaging structure has a desirable heat dissipation effect.

Description

LED灯丝封装结构LED filament package structure
本发明涉及LED照明技术领域，特别涉及一种LED灯丝封装结构。The present invention relates to the field of LED lighting technologies, and in particular, to an LED filament package structure.
近年来，由于LED 产业的发展迅速，LED 灯具逐步取代传统的照明灯具。由于LED发光具有点光源和方向性等特性，故LED灯具很难完全代替传统白炽灯，做到全配光照明。现有一种LED灯丝，是将一组LED芯片封装在透明基板上形成LED灯丝，可以实现360°全角度发光，然后将多个灯丝连接形成类似钨丝灯的发光效果。目前，LED灯丝基本没有散热体，基板通常为导热性能很差的玻璃材料，电极也不具有导热性能，LED灯丝无法进行热传导散热，所以很难将LED芯片产生的热量传导出去，热量只能靠辐射和内部气体的对流进行导热和散热，容易造成热量的堆积，使得LED灯丝的寿命缩短。In recent years, due to the rapid development of the LED industry, LED lamps have gradually replaced traditional lighting fixtures. Because LED lighting has the characteristics of point light source and directionality, it is difficult for LED lamps to completely replace traditional incandescent lamps and achieve full light distribution. There is a LED filament which is formed by encapsulating a group of LED chips on a transparent substrate to form an LED filament, which can realize 360° full-angle illumination, and then connect a plurality of filaments to form a luminous effect similar to a tungsten filament lamp. At present, the LED filament has substantially no heat sink, the substrate is usually a glass material with poor thermal conductivity, and the electrode does not have thermal conductivity. The LED filament cannot be thermally conducted, so it is difficult to conduct the heat generated by the LED chip, and the heat can only be relied on. The convection of radiation and internal gas conducts heat and heat, which easily causes the accumulation of heat, which shortens the life of the LED filament.
有鉴于此，有必要提供一种散热良好的LED灯丝封装结构。In view of this, it is necessary to provide a LED filament package structure with good heat dissipation.
一种LED灯丝封装结构，包括基板、LED光源及两个电极端，所述LED光源设置在该基板上且与该基板热连接，其特征在于，该两个电极端均由导热材料制成，该两个电极端均包括连接部，所述连接部设置在该基板上且与所述LED光源电连接，所述连接部与该基板热连接。An LED filament package structure comprises a substrate, an LED light source and two electrode ends, wherein the LED light source is disposed on the substrate and is thermally connected to the substrate, wherein the two electrode ends are made of a heat conductive material. The two electrode ends each include a connecting portion disposed on the substrate and electrically connected to the LED light source, and the connecting portion is thermally connected to the substrate.
与现有技术相比，本发明在该基板上连接有两个电极端，通过两个电极端的良好导热性能能够将这些LED光源产生的热量有效的导出去，避免这些LED光源产生的热量在该基板上堆积，使得该LED灯丝封装结构具有良好的散热效果。Compared with the prior art, the present invention has two electrode ends connected to the substrate, and the heat generated by the LED light sources can be effectively exported through the good thermal conductivity of the two electrode ends, thereby avoiding the heat generated by the LED light sources. The substrate is stacked, so that the LED filament package structure has a good heat dissipation effect.
图1figure 1
是本发明LED灯丝封装结构第一实施例的立体图。It is a perspective view of the first embodiment of the LED filament package structure of the present invention.
图2figure 2
是图1所示LED灯丝封装结构另一立体图。 It is another perspective view of the LED filament package structure shown in FIG.
图3 image 3
是图1所示LED灯丝封装结构的立体分解示意图。It is a perspective exploded view of the LED filament package structure shown in FIG.
图4Figure 4
是图1所示LED灯丝封装结构中电极端的立体图。 It is a perspective view of the electrode end in the LED filament package structure shown in FIG.
下面结合附图与具体实施方式对本发明作进一步详细描述。The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
请参考图1至图4，该LED灯丝封装结构，包括基板10、LED光源20及两个电极端30，这些LED光源20设置在该基板10上且与该基板10热连接。Referring to FIG. 1 to FIG. 4 , the LED filament package structure includes a substrate 10 , an LED light source 20 , and two electrode ends 30 . The LED light sources 20 are disposed on the substrate 10 and thermally connected to the substrate 10 .
其中，该基板10由透明或半透明材料制成。这些LED光源20设置在该基板10的正面，该基板10的正面上还设有导热层60（如图3所示），该导热层60与该基板10的正面热连接，该导热层60与这些LED光源20间隔设置，该两个电极端30中的至少一个与该导热层60热连接。该导热层60可以为设置在该基板10正面的水银层，上述电极端30可以在焊接在该基板10上的同时焊接在该导热层60上。该导热层60用于将该基板10上的热量更快的传递到上述电极端30。该基板10的背面设有金属层50，该金属层50与该基板10的背面热连接。这些LED光源20相互平行排列。该金属层50在该基板10的背面偏离该LED光源20的位置处设置，以便避开这些LED光源20在该基板10的背面的投影，让LED光源20发出的光线穿过该基板10向外射出，从而扩大该LED灯丝封装结构的发光角度，使其背面有光，使发光角度大于180度。当然，可以理解的，使该LED灯丝封装结构的发光角度大于180度的方法还有很多种，例如，可在该基板10的正反两面都设置LED光源。该金属层50可以提高该基板10的导热率，让更多的热量传导到这些电极端30上，避免热量堆积在该基板10的中心部位。Wherein, the substrate 10 is made of a transparent or translucent material. The LED light source 20 is disposed on the front surface of the substrate 10. The front surface of the substrate 10 is further provided with a heat conductive layer 60 (shown in FIG. 3). The heat conductive layer 60 is thermally connected to the front surface of the substrate 10, and the heat conductive layer 60 is The LED light sources 20 are spaced apart and at least one of the two electrode ends 30 is thermally coupled to the thermally conductive layer 60. The heat conducting layer 60 may be a mercury layer disposed on the front surface of the substrate 10, and the electrode end 30 may be soldered on the heat conducting layer 60 while being soldered on the substrate 10. The heat conducting layer 60 serves to transfer heat on the substrate 10 to the electrode terminal 30 more quickly. A metal layer 50 is provided on the back surface of the substrate 10, and the metal layer 50 is thermally connected to the back surface of the substrate 10. These LED light sources 20 are arranged in parallel with each other. The metal layer 50 is disposed at a position away from the LED light source 20 on the back side of the substrate 10 so as to avoid the projection of the LED light source 20 on the back surface of the substrate 10, and let the light emitted by the LED light source 20 pass through the substrate 10 outward. The light is emitted to expand the illumination angle of the LED filament package structure, so that the back surface has light, so that the illumination angle is greater than 180 degrees. Of course, it can be understood that there are many methods for making the LED filament package structure have an illumination angle greater than 180 degrees. For example, an LED light source can be disposed on both sides of the substrate 10. The metal layer 50 can increase the thermal conductivity of the substrate 10, allowing more heat to be conducted to the electrode terminals 30, thereby preventing heat from accumulating in the central portion of the substrate 10.
其中，该两个电极端30分别焊接在该基板10上以便实现与该基板10的热连接，这些LED光源20通过金线分别与该两个电极端30电连接。该两个电极端30均由导热材料制成，该两个电极端30均在一端设有连接部31，这些连接部31设置在该基板10上且与这些LED光源20电连接，这些连接部31与该基板10热连接。本实施例中，该两个电极端30均由弹性材料制成，每个电极端30的中部设有伸缩部32，每个电极端30的另一端设有连通部33。该连接部31、伸缩部32及连通部33一体成型。该伸缩部32为弯折的“几”字形结构，该连通部33与外界的散热件热连接。工作时，该LED灯丝封装结构受热会发生热胀冷缩，但由于该伸缩部32可以发生伸缩变形，所以可避免因应力产生LED灯丝弯曲或断裂的问题。该连通部33的下表面设有粗糙微结构332，该粗糙微结构332可以是多个间隔排列的麻点，方格，十字，三角等，以便增加与焊接锡膏的接触棉结。该连通部33的中部设有贯穿的通孔，可以让焊接锡膏更好的流入以排除连通部中心在接触锡膏时包裹的空气，减小接触热阻。当然，也可以不设置该伸缩部32，而直接让连接部31与连通部33一体成型。The two electrode ends 30 are respectively soldered on the substrate 10 to achieve thermal connection with the substrate 10. The LED light sources 20 are electrically connected to the two electrode terminals 30 through gold wires. The two electrode ends 30 are made of a heat conductive material, and the two electrode ends 30 are respectively provided with connecting portions 31 at one end. The connecting portions 31 are disposed on the substrate 10 and electrically connected to the LED light sources 20, and the connecting portions are electrically connected to the LED light sources 20 31 is thermally connected to the substrate 10. In this embodiment, the two electrode ends 30 are made of an elastic material, and each of the electrode ends 30 is provided with a telescopic portion 32 at the middle thereof, and the other end of each electrode end 30 is provided with a communication portion 33. The connecting portion 31, the expansion and contraction portion 32, and the communication portion 33 are integrally formed. The expansion and contraction portion 32 has a bent "several" shape, and the communication portion 33 is thermally connected to the external heat sink. During operation, the LED filament package structure undergoes thermal expansion and contraction due to heat, but since the expansion and contraction portion 32 can undergo telescopic deformation, the problem of bending or breaking of the LED filament due to stress can be avoided. The lower surface of the connecting portion 33 is provided with a rough microstructure 332, which may be a plurality of spaced pitches, squares, crosses, triangles, etc., in order to increase the contact neps with the solder paste. The middle portion of the connecting portion 33 is provided with a through hole for allowing the solder paste to flow in better to eliminate the air wrapped in the center of the connecting portion when contacting the solder paste, and to reduce the contact thermal resistance. Needless to say, the connecting portion 31 and the communicating portion 33 may be integrally formed without directly providing the expansion and contraction portion 32.
其中，该LED灯丝封装结构还包括封装层40，该封装层40覆盖该基板10上的LED光源20及该两个电极端30的连接部31上。该封装层40上设有荧光材料，该荧光材料对应这些LED光源20设置。该荧光材料可以配合这些LED光源20发出白光。The LED filament package structure further includes an encapsulation layer 40 covering the LED light source 20 on the substrate 10 and the connection portion 31 of the two electrode ends 30. A fluorescent material is disposed on the encapsulation layer 40, and the fluorescent material is disposed corresponding to the LED light sources 20. The fluorescent material can emit white light in conjunction with these LED light sources 20.
综上所述，本发明在该基板10上连接有两个电极端30，通过两个电极端30的良好导热性能能够将这些LED光源20产生的热量有效的导出去，避免这些LED光源20产生的热量在该基板10上堆积，使得该LED灯丝封装结构具有良好的散热效果。In summary, the present invention has two electrode terminals 30 connected to the substrate 10, and the heat generated by the LED light sources 20 can be effectively exported through the good thermal conductivity of the two electrode terminals 30 to prevent the LED light sources 20 from being generated. The heat is accumulated on the substrate 10, so that the LED filament package structure has a good heat dissipation effect.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，任何本领域人员在不脱离本方案技术范围内，利用上述揭露的技术内容作些许改动的为同等变化的等效实施例。但凡脱离本发明技术方案内容，依据本发明技术实质对以上实施例所做的任何修改、等同替换、改进等，均应包含在本发明保护的范围之内。The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any person skilled in the art can make some modifications to the equivalent of the above-mentioned technical contents without departing from the technical scope of the present invention. Example. Any modifications, equivalent substitutions, improvements, etc. to the above embodiments in accordance with the technical scope of the present invention are intended to be included within the scope of the present invention.
10 基板 10 substrate
20 LED光源 20 LED light source
30 电极端 30 electrode end
31 连接部31 Connection
32 伸缩部 32 expansion and contraction department
33 连通部 33 Connecting Department
332 粗糙微结构 332 rough microstructure
40 封装层 40 encapsulation layer
50 金属层 50 metal layer
60 导热层 60 thermal layer

Claims (11)

  1. 一种LED灯丝封装结构，包括基板、LED光源及两个电极端，所述LED光源设置在该基板上且与该基板热连接，其特征在于，该两个电极端均由导热材料制成，该两个电极端均包括连接部，所述连接部设置在该基板上且与所述LED光源电连接，所述连接部与该基板热连接。An LED filament package structure comprises a substrate, an LED light source and two electrode ends, wherein the LED light source is disposed on the substrate and is thermally connected to the substrate, wherein the two electrode ends are made of a heat conductive material. The two electrode ends each include a connecting portion disposed on the substrate and electrically connected to the LED light source, and the connecting portion is thermally connected to the substrate.
  2. 根据权利要求1所述的LED灯丝封装结构，其特征在于：还包括封装层，所述封装层覆盖该基板上的LED光源及该两个电极端的连接部。The LED filament package structure according to claim 1, further comprising an encapsulation layer covering the LED light source on the substrate and the connection portion between the two electrode ends.
  3. 根据权利要求2所述的LED灯丝封装结构，其特征在于：该封装层上设有荧光材料，该荧光材料对应所述LED光源设置。The LED filament package structure according to claim 2, wherein the encapsulation layer is provided with a fluorescent material, and the fluorescent material is disposed corresponding to the LED light source.
  4. 根据权利要求1所述的LED灯丝封装结构，其特征在于：该基板由透明或半透明材料制成。The LED filament package structure according to claim 1, wherein the substrate is made of a transparent or translucent material.
  5. 根据权利要求4所述的LED灯丝封装结构，其特征在于：所述LED光源设置在该基板的正面，该基板的背面设有金属层，该金属层与该基板的背面热连接。The LED filament package structure according to claim 4, wherein the LED light source is disposed on a front surface of the substrate, and a metal layer is disposed on a back surface of the substrate, the metal layer being thermally connected to a back surface of the substrate.
  6. 根据权利要求5所述的LED灯丝封装结构，其特征在于：所述LED光源相互平行排列，该金属层在该基板的背面偏离该LED光源的位置处设置。The LED filament package structure according to claim 5, wherein the LED light sources are arranged in parallel with each other, and the metal layer is disposed at a position where the back surface of the substrate deviates from the LED light source.
  7. 根据权利要求1所述的LED灯丝封装结构，其特征在于：所述LED光源设置在该基板的正面，该基板的正面上还设有导热层，该导热层与该基板的正面热连接，该导热层与所述LED光源间隔设置，该两个电极端中的至少一个与该导热层热连接。The LED filament package structure according to claim 1, wherein the LED light source is disposed on a front surface of the substrate, and a heat conductive layer is further disposed on a front surface of the substrate, the heat conductive layer being thermally connected to a front surface of the substrate, A thermally conductive layer is spaced from the LED light source, at least one of the two electrode ends being thermally coupled to the thermally conductive layer.
  8. 根据权利要求1所述的LED灯丝封装结构，其特征在于：该两个电极端分别焊接在该基板上，所述LED光源通过金线分别与该两个电极端电连接。The LED filament package structure according to claim 1, wherein the two electrode ends are respectively soldered on the substrate, and the LED light sources are electrically connected to the two electrode ends through gold wires.
  9. 根据权利要求1所述的LED灯丝封装结构，其特征在于：该两个电极端均由弹性材料制成，每个电极端的中部设有伸缩部，该伸缩部为弯折的“几”字形结构。The LED filament package structure according to claim 1, wherein the two electrode ends are made of an elastic material, and each of the electrode ends is provided with a telescopic portion in a middle portion thereof, and the telescopic portion is a bent "several" shape. structure.
  10. 根据权利要求9所述的LED灯丝封装结构，其特征在于：所述电极端还包括与该连接部连接的连通部，该连通部用于同外界的散热件热连接，该连通部的下表面设有粗糙微结构。The LED filament package structure according to claim 9, wherein the electrode end further comprises a communication portion connected to the connection portion, the communication portion being for thermally connecting with an external heat sink, and a lower surface of the communication portion It has a rough microstructure.
  11. 根据权利要求9所述的LED灯丝封装结构，其特征在于：所述电极端还包括与该连接部连接的连通部，该连通部用于同外界的散热件热连接，该连通部的中部设有贯穿的通孔。The LED filament package structure according to claim 9, wherein the electrode end further comprises a communication portion connected to the connecting portion, the communication portion is configured to be thermally connected to an external heat sink, and the middle portion of the communication portion is There are through holes.
PCT/CN2016/102247 2016-01-11 2016-10-17 Led filament packaging structure WO2017121154A1 (en)

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