CN106369366B - LED filament assembly and LED filament lamp - Google Patents
LED filament assembly and LED filament lamp Download PDFInfo
- Publication number
- CN106369366B CN106369366B CN201611006930.3A CN201611006930A CN106369366B CN 106369366 B CN106369366 B CN 106369366B CN 201611006930 A CN201611006930 A CN 201611006930A CN 106369366 B CN106369366 B CN 106369366B
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- circuit board
- led filament
- led
- base plate
- electrodes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
Abstract
The invention relates to an LED filament assembly, which comprises a flexible circuit board, more than two substrates and LED light sources respectively arranged on the substrates, wherein the flexible circuit board is provided with more than two bulges at intervals along the length direction, each bulge is provided with two electrodes, the bulges are adhered to the end parts of the substrates, the substrates are respectively provided with electrode ends corresponding to the electrodes, the electrode ends are electrically connected with the LED light sources on the substrates, the electrodes on the flexible circuit board are respectively electrically connected with the electrode ends so as to electrically connect the substrates, and the flexible circuit board and the more than two bulges are integrally formed. The invention also relates to an LED filament lamp. The LED filament assembly has the advantages of being capable of being automatically produced, simple and convenient in circuit connection and simple in manufacturing process.
Description
Technical Field
The invention relates to the LED technology, in particular to an LED filament assembly and an LED filament lamp.
Background
The existing LED filament lamp is usually manufactured by adopting a process of filling heat conducting gas and sealing glass bubbles, the process has high technical requirement on the sealing of the bubbles, the equipment is expensive, and the problems of no sealing of the bubbles, gas leakage, explosion, frangibility of the glass bubbles and the like are easily caused; the heat dissipation performance of the gas is limited, and the high-power filament lamp faces the technical problem of difficult heat dissipation; meanwhile, the light flux maintenance rate of the whole lamp is low, and the service life is short.
The conventional inflation-free LED filament lamp usually adopts a ceramic filament, and cannot meet the heat dissipation requirements of main stream lamp types such as A806, A1060, A1521, North America A1100 and A1600 due to the limitation of the heat conductivity of the ceramic filament, so that the development of a high heat conduction filament is urgently needed to meet the heat dissipation requirements of the main stream lamp types. In addition, there are spot-welded filament lamps, but the specific circuit connection scheme is complicated, so the manufacturing process is difficult.
Chinese utility model patent No. 201320521382.3 discloses a comb LED subassembly is applicable to the LED bubble shape lamp, include: the component is formed by punching and integrally, wherein the component comprises a mother strip and a plurality of sub strips extending from the mother strip, and the mother strip and the plurality of sub strips form a comb shape when being unfolded into a flat plate; the LED chip is packaged or attached to the surfaces of the plurality of sub-strips; and a conductive line pattern formed on the mother and daughter stripes to electrically connect the LED chips; and the primary strip of the member is rolled into a cylindrical primary strip ring, so that the light emitting surface of the LED chip on the surface of the secondary strip faces the outer side of the cylindrical primary strip. Namely, a comb-shaped circuit board is designed, the LED chips are arranged on the circuit board, the electric connection is realized through a conductive line graph, and then the mother strip is rolled into a cylindrical mother strip ring, so that the LED chips arranged on the mother strip ring can face to a plurality of angles to obtain a larger light angle.
The comb-type LED assembly disclosed in the above patent is soldered to an LED chip via a conductive line pattern, so that the LED chip is directly disposed on a component (i.e., a circuit board) to realize electrical connection of the LED chip, and the problems of complicated circuit connection and difficulty in manufacturing process still exist.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the LED filament assembly is convenient to connect in a circuit mode, and the LED filament lamp comprising the LED filament assembly is further provided.
In order to solve the technical problems, the invention adopts the technical scheme that:
the utility model provides a LED filament assembly, includes circuit board, more than two base plates and sets up respectively LED light source on the base plate, the interval is equipped with the electrode more than two on the circuit board, correspond on the base plate the electrode is equipped with the electrode tip respectively, the electrode tip is connected with the LED light source electricity on the base plate, electrode on the circuit board respectively with the electrode tip electricity is connected in order to incite somebody to action the base plate electricity is connected.
The invention also provides an LED filament lamp, which comprises a lamp holder, a light-transmitting shell and a heat radiating piece, wherein the light-transmitting shell and the heat radiating piece are respectively arranged on the lamp holder, the heat radiating piece is arranged in the light-transmitting shell, the LED filament lamp further comprises the LED filament assembly, the LED filament assembly is arranged in the light-transmitting shell, the LED light source faces the light-transmitting shell, and the circuit board is thermally connected with the heat radiating piece.
The invention has the beneficial effects that:
(1) the LED light sources are arranged on the substrate, the circuit board is provided with the plurality of electrodes, only the electrodes of the circuit board can conduct electricity, then the LED light sources on the plurality of substrates are electrically connected with the plurality of electrodes on the circuit board, and the LED light sources in the plurality of filaments can realize a series-parallel scheme according to needs;
(2) the circuit board is equivalent to a heat transfer element, and when the LED lamp filament assembly is actually assembled, the LED lamp filament assembly is thermally connected with the heat dissipation element through the circuit board, so that the heat dissipation requirement is met.
Drawings
FIG. 1 is an exploded view of an LED filament assembly according to an embodiment of the present invention;
FIG. 2 is a perspective view of an LED filament assembly according to an embodiment of the present invention;
fig. 3 is a three-dimensional structural view of the circuit board of the LED filament assembly bent into a ring according to the embodiment of the present invention;
fig. 4 is a perspective structural view of an LED filament lamp according to an embodiment of the present invention.
Description of reference numerals:
1. a circuit board; 11. an electrode; 12. a projection; 13. a heat conducting portion; 2. a substrate; 3. an LED light source; 4. a packaging layer; 5. a lamp socket; 6. a light-transmissive housing; 7. a heat sink.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The most key concept of the invention is as follows: the electrodes are designed on the circuit board, and the LED light source on the substrate is electrically connected with the corresponding electrodes, so that the circuit connection is simplified.
Referring to fig. 1, 2, 3 and 4, an LED filament assembly includes a circuit board 1, two or more substrates 2 and LED light sources 3 respectively disposed on the substrates 2, wherein two or more electrodes 11 are disposed on the circuit board 1 at intervals, the substrates 2 are respectively provided with electrode ends corresponding to the electrodes 11, the electrode ends are electrically connected to the LED light sources 3 on the substrates 2, and the electrodes 11 on the circuit board 1 are respectively electrically connected to the electrode ends to electrically connect the substrates 2.
From the above description, the beneficial effects of the present invention are:
(1) the LED light sources are arranged on the substrate, the circuit board is provided with a plurality of electrodes, only the electrodes of the circuit board can conduct electricity, then the LED light sources on the plurality of substrates are electrically connected with the plurality of electrodes on the circuit board, and the LED light sources in the plurality of filaments can realize a series-parallel scheme according to needs;
(2) the circuit board is equivalent to a heat transfer element, and when the LED lamp filament assembly is actually assembled, the LED lamp filament assembly is thermally connected with the heat dissipation element through the circuit board, so that the heat dissipation requirement is met.
Furthermore, two ends of the circuit board 1 are respectively bent and closed along the length direction, and more than two electrodes 11 are respectively distributed along the bending direction of the circuit board 1.
As can be seen from the above description, as a preferred structure example, the circuit board may adopt the above structure design, the shape of the circuit board may be a long strip, and the shape of the bent circuit board may be adapted to the shape of the housing of the LED filament lamp adapted to the circuit board, for example, if the housing is a circular bulb, the shape of the bent circuit board may be circular or approximately circular; the two ends of the bent circuit board can be closed or not, and the bent circuit board can be designed according to the requirement; after the circuit board 1 is bent, two or more substrates 2 may be parallel to each other and perpendicular to the circuit board 1. Of course, if the housing is a rectangular parallelepiped, the circuit board may not be bent as described above.
Further, the circuit board 1 is provided with two or more protruding portions 12 at intervals along the length direction, and the two or more electrodes 11 are respectively and correspondingly disposed on the two or more protruding portions 12.
As can be seen from the above description, as a specific structure example, the protrusion may be designed, and the electrode is disposed on the protrusion, so as to further facilitate the electrical connection between the electrode and the LED light source.
Further, the protruding portion 12 is adhered to an end portion of the substrate 2.
As can be seen from the above description, as a specific structure example, the circuit board may be adhered (by an adhesive substance, such as glue, etc.) on the substrate, and further, the substrate may be adhered on the substrate by the protruding portion, the substrate is in a shape of a long strip, and the protruding portion is adhered on one end of the long strip, so as to fix the substrate on the circuit board.
Further, a high-reflection material layer is arranged on the surface of the substrate 2, and the high-reflection material layer is made of a high-reflection material.
As can be seen from the above description, as a preferred structure example, the high-reflection material layer is disposed on the surface of the substrate, and the high-reflection material layer may be disposed on the surface of the substrate after the mirror surface treatment is performed on the surface of the substrate. The high-reflection material is a material with high optical reflectivity and good heat conduction and electric conductivity, and can be one or an alloy of more than two of silver, aluminum, gold, chromium, copper, indium, iridium, nickel, platinum, rhenium, rhodium, tin, tantalum, tungsten, manganese and the like, and can also be other high-reflection materials (such as titanium dioxide and the like). The design of the high-reflection material layer can improve the light reflectivity of the LED light source.
Further, the LED light source device further comprises an encapsulating layer 4, wherein the encapsulating layer 4 covers the LED light source 3 and the electrode 11 respectively.
As can be seen from the above description, as a preferred structure example, the above-mentioned packaging layer, such as a common fluorescent layer, may be further provided, so as to protect the electrodes after silver plating, the LED light source, and the packaging gold wires for electrical connection. The material of the encapsulation layer can be a light-transmitting material.
Further, the substrate 2 is made of a high thermal conductive material.
As can be seen from the above description, as a preferred structure example, the substrate is made of a high thermal conductivity material, which is a material with high thermal conductivity, such as greater than 1W/MK, and, of course, has electrical conductivity. The high heat conduction material can be copper, aluminum, copper alloy, aluminum alloy and other metal materials. The high-heat-conduction material is selected as the substrate, so that the heat conduction efficiency of the LED filament assembly is improved, and the LED filament assembly can be suitable for LED filament lamps with high heat dissipation requirements.
Furthermore, the circuit board 1 is made of a flexible material.
As can be seen from the above description, as a preferred structure example, the circuit board is made of a flexible material, which facilitates the circuit board to bend to a certain extent according to the requirement. The material of the circuit board is also an insulating material, such as ceramic, resin, etc.
The LED filament lamp comprises a lamp holder 5, a light-transmitting shell 6 and a heat dissipation piece 7, wherein the light-transmitting shell 6 and the heat dissipation piece 7 are respectively arranged on the lamp holder 5, the heat dissipation piece 7 is arranged in the light-transmitting shell 6, the LED filament lamp further comprises the LED filament assembly, the LED filament assembly is arranged in the light-transmitting shell 6, an LED light source 3 faces the light-transmitting shell 6, and a circuit board 1 is thermally connected with the heat dissipation piece 7.
Furthermore, more than two heat transfer parts 13 are arranged on the circuit board 1, the heat transfer parts 13 are arranged far away from the electrodes 11, and the circuit board 1 is thermally connected with the heat dissipation part 7 through the heat transfer parts 13.
As apparent from the above description, as a preferable configuration example, the heat transfer portion may be designed so as to facilitate thermal connection of the circuit board with the heat sink.
Among above-mentioned LED filament assembly and the LED filament lamp:
the circuit board, the convex part on the circuit board and the heat transfer part can be integrally formed;
the thickness of the above substrate may be 1.2 to 2.0mm, particularly 1.6 mm; the thickness of the circuit board is 0.05-0.2mm, especially 0.1 mm;
the two or more substrates can be arranged in parallel, and can also be inclined and closed to each other, for example, the substrates are inclined along the same central shaft and are frustum-shaped, and the substrates can also lean against each other under the condition of ensuring normal work.
Referring to fig. 1 and fig. 2, a first embodiment of the present invention is:
the LED filament assembly of this embodiment, including circuit board 1, packaging layer 4, base plate 2 more than two and LED light source 3 more than two, base plate 2 is rectangular shape, LED light source 3 distributes on base plate 2, circuit board 1 is equipped with bulge 12 more than two and heat-conducting portion 13 more than two along the length direction interval, is equipped with electrode 11 on the surface of bulge 12, rectangular shape the one end of base plate 2 is glued and is located another of bulge 12 on the surface, more than two electrode 11 respectively with more than two 2 one-to-one settings of base plate, electrode 11 include anodal and negative pole, correspond on the base plate 2 electrode 11 is equipped with the electrode tip respectively, the electrode tip is connected with the LED light source 3 electricity on the base plate 2, electrode 11 on the circuit board 1 respectively with the electrode tip electricity is connected in order will 2 electricity of base plate connects. The encapsulation layer 4 covers the LED light sources 3 and the electrodes 11, respectively. The surface of the substrate 2 is provided with a high-reflection material layer, and the high-reflection material layer is made of a material with high reflectivity. The substrate 2 is made of high heat conduction material. The circuit board 1 is a flexible circuit board. The circuit board 1, the protruding portion 12 on the circuit board and the heat transfer portion 13 are integrally formed, only electrodes on the integrally formed component formed by the circuit board 1, the protruding portion 12 on the circuit board and the heat transfer portion 13 can conduct electricity, and other parts are made of insulating materials.
Referring to fig. 2, two or more substrates 2 are parallel to each other and perpendicular to the circuit board 1.
Referring to fig. 1 and fig. 3, a second embodiment of the present invention is:
the LED filament assembly of this embodiment, including circuit board 1, packaging layer 4, base plate 2 more than two and LED light source 3 more than two, base plate 2 is rectangular shape, LED light source 3 distributes on base plate 2, be equipped with bulge 12 more than two and heat-conducting portion 13 more than two along the length direction interval on the circuit board 1, be equipped with electrode 11 on the bulge 12, rectangular shape the one end of base plate 2 is glued and is located on bulge 12, more than two electrode 11 respectively with more than two 2 one-to-one settings of base plate, electrode 11 include anodal and negative pole, correspond on the base plate 2 electrode 11 is equipped with the electrode tip respectively, the electrode tip is connected with the LED light source 3 electricity on the base plate 2, electrode 11 on the circuit board 1 respectively with the electrode tip electricity is connected in order to incite somebody to action base plate 2 electricity is connected. The encapsulation layer 4 covers the LED light sources 3 and the electrodes 11, respectively. The surface of the substrate 2 is provided with a high-reflection material layer, and the high-reflection material layer is made of a high-reflection material. The substrate 2 is made of high heat conduction material. The circuit board 1 is a flexible circuit board. The circuit board 1, the protruding portion 12 on the circuit board and the heat transfer portion 13 are integrally formed, only electrodes on the integrally formed component formed by the circuit board 1, the protruding portion 12 on the circuit board and the heat transfer portion 13 can conduct electricity, and other parts are made of insulating materials.
Referring to fig. 3, two ends of the circuit board 1 are bent and closed along a length direction to form a ring, more than two substrates are inclined and closed along a same central axis, the whole body is in a frustum shape, and the LED light source 3 faces an outward direction of the ring-shaped circuit board 1.
EXAMPLE III
Referring to fig. 4, the LED filament lamp of the present embodiment includes a lamp holder 5, a light-transmitting casing 6, a heat sink 7 and an LED filament assembly, where the light-transmitting casing 6 is a circular bulb, and the LED filament assembly is the LED filament assembly of the second embodiment. The LED lamp comprises a lamp holder 5, a light-transmitting shell 6, a heat radiating piece 7, an LED lamp filament assembly and a circuit board 1, wherein the light-transmitting shell 6 and the heat radiating piece 7 are arranged on the lamp holder 5 respectively, the heat radiating piece 7 is arranged in the light-transmitting shell 6, the LED lamp filament assembly is arranged in the light-transmitting shell 6, the LED light source 3 faces the light-transmitting shell 6, and the circuit board 1 is in. The circuit board 1 is provided with more than two heat transfer parts 13, the heat transfer parts 13 are far away from the electrodes 11, and the circuit board 1 is thermally connected with the heat dissipation part 7 through the heat transfer parts 13.
In conclusion, the LED filament assembly provided by the invention has the advantages of simple and convenient circuit connection and simple manufacturing process.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (7)
1. The utility model provides a LED filament assembly, its characterized in that includes flexible line way board, the base plate more than two and sets up respectively LED light source on the base plate, flexible line way board is equipped with the bulge more than two along the length direction interval, each the bulge is equipped with two electrodes, the bulge glues to be located the tip of base plate, correspond on the base plate the electrode is equipped with the electrode tip respectively, the electrode tip is connected with the LED light source electricity on the base plate, electrode on the flexible line way board respectively with the electrode tip electricity is connected in order to incite somebody to action the base plate electricity is connected, flexible line way board and more than two bulge integrated into one piece.
2. The LED filament assembly according to claim 1, wherein two ends of the flexible circuit board are respectively bent and closed along a length direction, and more than two electrodes are respectively distributed along the bending direction of the flexible circuit board.
3. The LED filament assembly of claim 1, wherein a highly reflective material layer is disposed on a surface of the substrate, and the highly reflective material layer is made of a highly reflective material.
4. The LED filament assembly of claim 1, further comprising an encapsulation layer covering the LED light source and the electrodes, respectively.
5. The LED filament assembly of claim 1, wherein the substrate is made of a highly thermally conductive material.
6. An LED filament lamp comprises a lamp holder, a light-transmitting shell and a heat dissipation part, wherein the light-transmitting shell and the heat dissipation part are respectively arranged on the lamp holder, and the heat dissipation part is arranged in the light-transmitting shell.
7. The LED filament lamp of claim 6, wherein the flexible circuit board has two or more heat transfer portions disposed thereon, the heat transfer portions being disposed away from the electrodes, the flexible circuit board being thermally connected to a heat sink via the heat transfer portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611006930.3A CN106369366B (en) | 2016-11-16 | 2016-11-16 | LED filament assembly and LED filament lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611006930.3A CN106369366B (en) | 2016-11-16 | 2016-11-16 | LED filament assembly and LED filament lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106369366A CN106369366A (en) | 2017-02-01 |
| CN106369366B true CN106369366B (en) | 2020-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611006930.3A Active CN106369366B (en) | 2016-11-16 | 2016-11-16 | LED filament assembly and LED filament lamp |
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| CN (1) | CN106369366B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112082097A (en) * | 2020-09-30 | 2020-12-15 | 深圳市裕富照明有限公司 | Circuit board supporting LED lamp filament light-emitting component and LED lamp filament lamp |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203549461U (en) * | 2013-10-08 | 2014-04-16 | 林柏丞 | Light bulb provided with multi-direction illumination function and employing three-dimensional light-emitting diode (3D LED) filaments |
| CN105674100A (en) * | 2016-01-14 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED lamp filament lamp |
| CN105674068A (en) * | 2016-01-11 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
| CN205640259U (en) * | 2016-01-28 | 2016-10-12 | 漳州立达信光电子科技有限公司 | LED (Light emitting diode) filament lamp |
| CN206207086U (en) * | 2016-11-16 | 2017-05-31 | 漳州立达信光电子科技有限公司 | A kind of LED filament component and LED filament lamp |
-
2016
- 2016-11-16 CN CN201611006930.3A patent/CN106369366B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203549461U (en) * | 2013-10-08 | 2014-04-16 | 林柏丞 | Light bulb provided with multi-direction illumination function and employing three-dimensional light-emitting diode (3D LED) filaments |
| CN105674068A (en) * | 2016-01-11 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
| CN105674100A (en) * | 2016-01-14 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED lamp filament lamp |
| CN205640259U (en) * | 2016-01-28 | 2016-10-12 | 漳州立达信光电子科技有限公司 | LED (Light emitting diode) filament lamp |
| CN206207086U (en) * | 2016-11-16 | 2017-05-31 | 漳州立达信光电子科技有限公司 | A kind of LED filament component and LED filament lamp |
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| CN106369366A (en) | 2017-02-01 |
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