CN106369366A - LED lamp filament assembly and LED filament lamp - Google Patents
LED lamp filament assembly and LED filament lamp Download PDFInfo
- Publication number
- CN106369366A CN106369366A CN201611006930.3A CN201611006930A CN106369366A CN 106369366 A CN106369366 A CN 106369366A CN 201611006930 A CN201611006930 A CN 201611006930A CN 106369366 A CN106369366 A CN 106369366A
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- CN
- China
- Prior art keywords
- wiring board
- led lamp
- led
- electrode
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to an LED lamp filament assembly. The LED lamp filament assembly comprises a circuit board, more than two substrates and more than two LED light sources, wherein the LED light sources are distributed on the substrates. More than two electrodes are arranged on the circuit board in a spaced mode, the substrates are arranged on the circuit board, the electrodes and the substrates are arranged in a one-to-one corresponding mode, and the electrodes are electrically connected to the LED light sources on the substrates correspondingly arranged. The invention further relates to an LED filament lamp. The LED lamp filament assembly has the advantages that circuit connection is simple and convenient, and the manufacturing technology is simple.
Description
Technical field
The present invention relates to led technology, particularly to a kind of LED lamp silk assembly and LED lamp silk lamp.
Background technology
, generally using filling heat-conducting gas and glass envelope bubble technique manufacture, this technique is to the skill sealing bubble for existing LED lamp silk lamp
Art has high demands, apparatus expensive, be easily caused envelope bubble be not tamping, gas leakage, blast and glass envelope frangible the problems such as；And the radiating of gas
Limited capacity, powerful filament lamp faces the difficult technical problem of radiating；The lux maintenance of whole lamp is low simultaneously, short life.
Existing inflation LED lamp silk lamp of exempting from generally adopts ceramic filament, because being limited it is impossible to meet by its heat conductivility
The radiating requirements of the main flow lamp-type of a806, a1060, a1521, North America a1100 and a1600 etc., need exploitation high heat conduction filament badly, full
The cooling requirements of sufficient main flow lamp-type.Additionally, the filament lamp of spot welding at present, but its specific circuit side connector case is more multiple
Miscellaneous, thus manufacturing process difficulty is larger.
The Chinese utility model patent of Patent No. 201320521382.3 disclose a kind of comb led assembly it is adaptable to
Led steeps shape lamp, comprising: through being punched integrally formed component, wherein this component includes master bar and extends from described master bar
Many strips bar, when being launched into flat board, described master bar becomes a pectination with described many strips bar shaped；Led chip, encapsulation or attachment
On the surface of described many strips bar；And conduction line chart, it is formed on described master bar and sub- bar to electrically connect described led core
Piece；Wherein, the master bar of described component be rolled into a cylindric master bar circle so that on the surface of described sub- bar led chip light-emitting area
The outside enclosed towards described cylindrical shape master bar.That is, design the wiring board of a pectination, led chip is arranged on wiring board, and leads to
Cross conductive line chart and realize electrical connection, then master bar is rolled into a cylindric master bar circle, so that the led chip being arranged on can
With towards multiple angles, to obtain larger angular.
Comb led assembly disclosed in above-mentioned patent, is welded with led chip by conductive line chart, thus by led chip
It is set directly on component (i.e. wiring board), realizes the electrical connection of led chip, still suffer from circuit connection complicated tired with manufacturing process
Difficult problem.
Content of the invention
The technical problem to be solved is: provides a kind of circuit side connector LED lamp silk assembly just, carries further
For including the LED lamp silk lamp of above-mentioned LED lamp silk assembly.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is:
A kind of LED lamp silk assembly, including wiring board, plural substrate be respectively provided with led on the substrate
Light source, described wiring board is interval with plural electrode, and on described substrate, corresponding described electrode is respectively equipped with electrode tip,
Described electrode tip is electrically connected with the LED light source on substrate, the electrode on described wiring board electrically connect with described electrode tip respectively with
Described substrate is electrically connected.
The present invention also provides a kind of LED lamp silk lamp, including lamp socket, light-permeable shell and radiating piece, described light-permeable shell and dissipating
Warmware is respectively arranged on lamp socket, and described radiating piece is arranged in light-permeable shell, also includes above-mentioned LED lamp silk assembly, described
LED lamp silk assembly is arranged in light-permeable shell and described LED light source is towards light-permeable shell, and described wiring board is with radiating piece heat even
Connect.
The beneficial effects of the present invention is:
(1) by LED light source on substrate, multiple electrodes are set in the circuit board, electrically conductive, so at wiring board only electrode
Afterwards the LED light source on multiple substrates and the multiple electrodes on wiring board are realized electrically connecting, the LED light source in multiple filaments is permissible
Realize connection in series-parallel scheme as needed, the mode that foregoing circuit connects has the advantages that simplicity, its manufacturing process is simple, Ke Yiti
High factory production efficiency；
(2) wiring board is equivalent to heat transfer piece, and in actual assembled, LED lamp silk assembly passes through wiring board with radiating piece heat even
Connect, thus meeting radiating requirements.
Brief description
Fig. 1 is the structure decomposition figure of the LED lamp silk assembly of the embodiment of the present invention；
Fig. 2 is the three-dimensional structure diagram of the LED lamp silk assembly of the embodiment of the present invention；
Fig. 3 is that the wiring board of the LED lamp silk assembly of the embodiment of the present invention bends the three-dimensional structure diagram circularizing；
Fig. 4 is the three-dimensional structure diagram of the LED lamp silk lamp of the embodiment of the present invention.
Label declaration:
1st, wiring board；11st, electrode；12nd, protuberance；13rd, heat-conducting part；2nd, substrate；3rd, LED light source；4th, encapsulated layer；5th, lamp
Seat；6th, light-permeable shell；7th, radiating piece.
Specific embodiment
By describing the technology contents of the present invention in detail, being realized purpose and effect, below in conjunction with embodiment and coordinate attached
Figure is explained.
The design of most critical of the present invention is: designs electrode, the LED light source on substrate and corresponding electrode in the circuit board
Electrical connection, thus simplify circuit connect.
Refer to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, a kind of LED lamp silk assembly, including wiring board 1, plural substrate 2
With the LED light source 3 being separately positioned on described substrate 2, described wiring board 1 is interval with plural electrode 11, described
On substrate 2, corresponding described electrode 11 is respectively equipped with electrode tip, and described electrode tip is electrically connected with the LED light source 3 on substrate 2, described
Electrode 11 on wiring board 1 is electrically connected with described electrode tip respectively to electrically connect described substrate 2.
Knowable to foregoing description, the beneficial effects of the present invention is:
(1) by LED light source on substrate, multiple electrodes are set in the circuit board, electrically conductive, so at wiring board only electrode
Afterwards the LED light source on multiple substrates and the multiple electrodes on wiring board are realized electrically connecting, the LED light source in multiple filaments is permissible
Realize connection in series-parallel scheme as needed, the mode that foregoing circuit connects has the advantages that simplicity, its manufacturing process is simple, Ke Yiti
High factory production efficiency；
(2) wiring board is equivalent to heat transfer piece, and in actual assembled, LED lamp silk assembly passes through wiring board with radiating piece heat even
Connect, thus meeting radiating requirements.
Further, the two ends of described wiring board 1 bend along its length respectively and draw close, plural described electrode
11 respectively along the bending direction distribution of described wiring board 1.
Seen from the above description, as a preferred topology example, wiring board can adopt said structure design, wiring board
Shape can be strip, the shape of wiring board after bending can the housing of LED lamp silk lamp with being adapted to it shape
Adaptation, for example, if housing circle bulb, then, the shape of wiring board after bending can be circular or approximately circular；Curved
The two ends of the wiring board after song can close it is also possible to not close, and specifically can be designed as needed；After wiring board 1 bending,
Can also be parallel to each other between plural substrate 2, and be respectively perpendicular to wiring board 1.Certainly, if housing cuboid, line
Road plate can not also do above-mentioned curved design.
Further, described wiring board 1 is interval with plural protuberance 12, plural institute along its length
State electrode 11 to be correspondingly arranged in respectively on plural described protuberance 12.
Seen from the above description, as a specific topology example, above-mentioned protuberance can be designed, electrode is located at protrusion
In portion, further facilitate electrode and be electrically connected with LED light source.
Further, described protuberance 12 glues located at the end of described substrate 2.
Seen from the above description, as a specific topology example, wiring board can glue and sets (by stickum, for example
Glue etc.) on substrate, further, can glue on substrate by described protuberance, substrate be shaped as strip, protrude
One end of the substrate located at strip is glued in portion, and then substrate is fixed in the circuit board.
Further, the surface of described substrate 2 is provided with high reflection material layer, and the material of described high reflection material layer is high anti-
Penetrate material.
Seen from the above description, as a preferred topology example, the surface of substrate is provided with above-mentioned high reflection material layer, can
Mirror process is carried out with the surface prior to substrate, then high reflection material layer is arranged at the surface of substrate, high reflection material layer
Concrete method to set up can be using techniques such as evaporations.Described high reflection material is to have high optical reflectance and good heat conduction is led
Electrical material, high reflection material can be in silver, aluminum, gold, chromium, copper, indium, iridium, nickel, platinum, rhenium, rhodium, stannum, tantalum, tungsten and manganese etc.
A kind of or arbitrarily two or more alloys or other high reflection materials (as titanium dioxide etc.).High reflection material layer
Design can improve the luminous reflectance of LED light source.
Further, also include encapsulated layer 4, described encapsulated layer 4 is covered each by LED light source 3 and electrode 11.
Seen from the above description, as a preferred topology example, above-mentioned encapsulated layer can also be set, for example common is glimmering
Photosphere etc., can will be subsequently silver-plated after electrode, LED light source and be used for electrically connect encapsulation gold thread protect.Encapsulated layer
Material can be light transmission material.
Further, the material of described substrate 2 is highly heat-conductive material.
Seen from the above description, as a preferred topology example, the material of substrate is highly heat-conductive material, described high heat conduction
Material is the material with high heat conductance, is greater than 1w/mk, certainly, also has electric conductivity simultaneously.Highly heat-conductive material can be
The metal materials such as copper, aluminum, copper alloy and aluminium alloy.Select highly heat-conductive material as substrate, the LED lamp silk group of the present invention can be made
The heat transfer efficiency of part improves, thus being applicable in the LED lamp silk lamp higher to radiating requirements.
Further, the material of described wiring board 1 is flexible material.
Seen from the above description, as a preferred topology example, the material of wiring board is flexible material, can facilitate line
Road plate carries out certain bending as needed.The material of wiring board is also insulant, such as pottery, resin etc..
A kind of LED lamp silk lamp of the present invention, including lamp socket 5, light-permeable shell 6 and radiating piece 7, described light-permeable shell 6 and dissipating
Warmware 7 is respectively arranged on lamp socket 5, and described radiating piece 7 is arranged in light-permeable shell 6, also includes above-mentioned LED lamp silk assembly,
Described LED lamp silk assembly is arranged in light-permeable shell 6 and described LED light source 3 is towards light-permeable shell 6, described wiring board 1 and radiating
Part 7 thermally coupled.
Further, described wiring board 1 is provided with plural heat transfer part 13, and described heat transfer part 13 is away from described electrode
11 settings, described wiring board 1 is by described heat transfer part 13 and radiating piece 7 thermally coupled.
Seen from the above description, as a preferred topology example, above-mentioned heat transfer part can be designed, thus facilitating wiring board
Carry out thermally coupled with radiating piece.
In above-mentioned LED lamp silk assembly and LED lamp silk lamp:
Protuberance on above-mentioned wiring board, wiring board and heat transfer part can be formed in one setting；
The thickness of aforesaid substrate can be 1.2-2.0mm, particularly 1.6mm；The thickness of above-mentioned wiring board is 0.05-0.2mm,
Particularly 0.1mm；
Can be arranged in parallel between substrate more than above-mentioned two and draw close it is also possible to be mutually inclined, such as along in same
Spindle tilt, in frustum, it is also possible to mutual rely in the case of ensureing normal work.
Refer to Fig. 1 and Fig. 2, embodiments of the invention one are:
The LED lamp silk assembly of the present embodiment, including wiring board 1, encapsulated layer 4, plural substrate 2 and plural
LED light source 3, substrate 2 is strip, and described LED light source 3 is distributed on substrate 2, and described wiring board 1 is spaced along its length and sets
There are plural protuberance 12 and plural heat-conducting part 13, a surface of protuberance 12 is provided with electrode 11, strip
Described substrate 2 one end glue on another surface of protuberance 12, plural described electrode 11 respectively with two with
On described substrate 2 correspond setting, electrode 11 includes positive pole and negative pole, and on described substrate 2, the described electrode 11 of correspondence is respectively
Be provided with electrode tip, described electrode tip is electrically connected with the LED light source 3 on substrate 2, the electrode 11 on described wiring board 1 respectively with institute
State electrode tip to electrically connect to electrically connect described substrate 2.Described encapsulated layer 4 is covered each by LED light source 3 and electrode 11.Described base
The surface of plate 2 is provided with high reflection material layer, and the material of described high reflection material layer is the high material of reflectance.Described substrate 2
Material is highly heat-conductive material.Described wiring board 1 is flexible circuit board.Protuberance 12 on wiring board 1, wiring board and heat transfer part 13
It is integrally formed setting, what the protuberance 12 on wiring board 1, wiring board and heat transfer part 13 were formed is integrally formed in part, only thereon
Electrode conductable, other parts are insulant.
Refer to Fig. 2, be parallel to each other between plural substrate 2, and be respectively perpendicular to wiring board 1.
Refer to Fig. 1 and Fig. 3, embodiments of the invention two are:
The LED lamp silk assembly of the present embodiment, including wiring board 1, encapsulated layer 4, plural substrate 2 and plural
LED light source 3, substrate 2 is strip, and described LED light source 3 is distributed on substrate 2, and described wiring board 1 is spaced along its length
Be provided with plural protuberance 12 and plural heat-conducting part 13, protuberance 12 is provided with electrode 11, strip described
One end of substrate 2 is glued on protuberance 12, and plural described electrode 11 is respectively with plural described substrate 2 one by one
It is correspondingly arranged, electrode 11 includes positive pole and negative pole, on described substrate 2, corresponding described electrode 11 is respectively equipped with electrode tip, described electricity
Extremely electrically connect with the LED light source 3 on substrate 2, the electrode 11 on described wiring board 1 is electrically connected with described electrode tip respectively to incite somebody to action
Described substrate 2 electrically connects.Described encapsulated layer 4 is covered each by LED light source 3 and electrode 11.The surface of described substrate 2 is provided with high reflection
Material layer, the material of described high reflection material layer is high reflection material.The material of described substrate 2 is highly heat-conductive material.Described line
Road plate 1 is flexible circuit board.Protuberance 12 on wiring board 1, wiring board and heat transfer part 13 are integrally formed setting, wiring board 1, line
What the protuberance 12 on the plate of road and heat transfer part 13 were formed is integrally formed in part, electrode conductable only thereon, and other parts are equal
For insulant.
Refer to Fig. 3, the two ends of described wiring board 1 bend along its length and draw close, form annular, plural base
It is mutually inclined along same central shaft between plate and draws close, overall is in frustum, and LED light source 3 is towards outside the ring of annular wiring board 1
Direction.
Embodiment three
Refer to Fig. 4, the LED lamp silk lamp of the present embodiment, including lamp socket 5, light-permeable shell 6, radiating piece 7 and LED lamp silk group
Part, light-permeable shell 6 is circular bulb, and the structure of described LED lamp silk assembly is the LED lamp silk assembly of above-described embodiment two.Described
Light-permeable shell 6 and radiating piece 7 are respectively arranged on lamp socket 5, and described radiating piece 7 is arranged in light-permeable shell 6, also includes above-mentioned,
Described LED lamp silk assembly is arranged in light-permeable shell 6 and described LED light source 3 is towards light-permeable shell 6, described wiring board 1 and radiating
Part 7 thermally coupled.Described wiring board 1 is provided with plural heat transfer part 13, and described heat transfer part 13 is arranged away from described electrode 11,
Described wiring board 1 is by described heat transfer part 13 and radiating piece 7 thermally coupled.
In sum, the LED lamp silk assembly that the present invention provides has circuit and connects the easy and simple advantage of manufacturing process.
The foregoing is only embodiments of the invention, not thereby limit the present invention the scope of the claims, every using this
The equivalents that bright description and accompanying drawing content are made, or directly or indirectly it is used in the technical field of correlation, all include in the same manner
In the scope of patent protection of the present invention.
Claims (10)
1. a kind of LED lamp silk assembly is it is characterised in that including wiring board, plural substrate and being separately positioned on described base
LED light source on plate, described wiring board is interval with plural electrode, and on described substrate, corresponding described electrode sets respectively
Have electrode tip, described electrode tip is electrically connected with the LED light source on substrate, the electrode on described wiring board respectively with described electrode tip
Electrical connection is to electrically connect described substrate.
2. LED lamp silk assembly according to claim 1 is it is characterised in that the two ends of described wiring board are respectively along length side
To bending and drawing close, plural described electrode is respectively along the bending direction distribution of described wiring board.
3. LED lamp silk assembly according to claim 1 and 2 is it is characterised in that described wiring board is spaced along its length and sets
There is plural protuberance, plural described electrode is correspondingly arranged on plural described protuberance respectively.
4. LED lamp silk assembly according to claim 3 is it is characterised in that described protuberance glues located at the end of described substrate
Portion.
5. LED lamp silk assembly according to claim 1 is it is characterised in that the surface of described substrate is provided with high reflection material
Layer, the material of described high reflection material layer is high reflection material.
6. it is characterised in that also including encapsulated layer, described encapsulated layer covers LED lamp silk assembly according to claim 1 respectively
Lid LED light source and electrode.
7. LED lamp silk assembly according to claim 1 is it is characterised in that the material of described substrate is highly heat-conductive material.
8. LED lamp silk assembly according to claim 1 is it is characterised in that the material of described wiring board is flexible material line
Road plate.
9. a kind of LED lamp silk lamp, including lamp socket, light-permeable shell and radiating piece, described light-permeable shell and radiating piece are respectively arranged at
On lamp socket, described radiating piece is arranged in light-permeable shell it is characterised in that also including described in claim 1-8 any one
LED lamp silk assembly, described LED lamp silk assembly is arranged in light-permeable shell and described LED light source is towards light-permeable shell, described circuit
Plate and radiating piece thermally coupled.
10. LED lamp silk lamp according to claim 9 is it is characterised in that described wiring board is provided with plural heat transfer
Portion, described heat transfer part is arranged away from described electrode, and described wiring board is by described heat transfer part and radiating piece thermally coupled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611006930.3A CN106369366B (en) | 2016-11-16 | 2016-11-16 | LED filament assembly and LED filament lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611006930.3A CN106369366B (en) | 2016-11-16 | 2016-11-16 | LED filament assembly and LED filament lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106369366A true CN106369366A (en) | 2017-02-01 |
| CN106369366B CN106369366B (en) | 2020-01-21 |
Family
ID=57893271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611006930.3A Active CN106369366B (en) | 2016-11-16 | 2016-11-16 | LED filament assembly and LED filament lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106369366B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022068122A1 (en) * | 2020-09-30 | 2022-04-07 | 深圳市裕富照明有限公司 | Light emitting assembly having circuit board-supported led filament, and led filament lamp |
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| CN203549461U (en) * | 2013-10-08 | 2014-04-16 | 林柏丞 | Light bulb provided with multi-direction illumination function and employing three-dimensional light-emitting diode (3D LED) filaments |
| CN105674100A (en) * | 2016-01-14 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED lamp filament lamp |
| CN105674068A (en) * | 2016-01-11 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
| CN205640259U (en) * | 2016-01-28 | 2016-10-12 | 漳州立达信光电子科技有限公司 | LED (Light emitting diode) filament lamp |
| CN206207086U (en) * | 2016-11-16 | 2017-05-31 | 漳州立达信光电子科技有限公司 | A kind of LED filament component and LED filament lamp |
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2016
- 2016-11-16 CN CN201611006930.3A patent/CN106369366B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203549461U (en) * | 2013-10-08 | 2014-04-16 | 林柏丞 | Light bulb provided with multi-direction illumination function and employing three-dimensional light-emitting diode (3D LED) filaments |
| CN105674068A (en) * | 2016-01-11 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
| CN105674100A (en) * | 2016-01-14 | 2016-06-15 | 漳州立达信光电子科技有限公司 | LED lamp filament lamp |
| CN205640259U (en) * | 2016-01-28 | 2016-10-12 | 漳州立达信光电子科技有限公司 | LED (Light emitting diode) filament lamp |
| CN206207086U (en) * | 2016-11-16 | 2017-05-31 | 漳州立达信光电子科技有限公司 | A kind of LED filament component and LED filament lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022068122A1 (en) * | 2020-09-30 | 2022-04-07 | 深圳市裕富照明有限公司 | Light emitting assembly having circuit board-supported led filament, and led filament lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106369366B (en) | 2020-01-21 |
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