CN102005445A - Encapsulation structure of light emitting diode (LED) light source module - Google Patents

Encapsulation structure of light emitting diode (LED) light source module Download PDF

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Publication number
CN102005445A
CN102005445A CN2010102995730A CN201010299573A CN102005445A CN 102005445 A CN102005445 A CN 102005445A CN 2010102995730 A CN2010102995730 A CN 2010102995730A CN 201010299573 A CN201010299573 A CN 201010299573A CN 102005445 A CN102005445 A CN 102005445A
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China
Prior art keywords
led
light source
source module
base
led chip
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Pending
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CN2010102995730A
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Chinese (zh)
Inventor
何文铭
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FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
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FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
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Priority to CN2010102995730A priority Critical patent/CN102005445A/en
Priority to PCT/CN2010/078620 priority patent/WO2012040956A1/en
Publication of CN102005445A publication Critical patent/CN102005445A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Led Device Packages (AREA)

Abstract

The invention provides an encapsulation structure of a light emitting diode (LED) light source module, belonging to the field of processing lighting equipment and comprising a base with a reflector cup, and at least one LED chip is arranged in the center of the bottom of the reflector cup of the base, wherein the LED chip is glued on the bottom of the reflector cup by insulation glue. The encapsulation structure is characterized in that a hard silica gel layer is coated around the surface of the LED chip, a mixed layer of glue and fluorescent powder is coated outside the hard silica gel layer, and the positive poles and the negative poles of the chips are led out after the chips are connected by wires.

Description

LED光源模块封装结构 Package structure of LED light source module

【技术领域】【Technical field】

本发明涉及一种照明设备，尤其涉及一种LED光源模块。The invention relates to a lighting device, in particular to an LED light source module.

【背景技术】【Background technique】

LED是一种低电压光源，由于其省电、寿命长，现已被广泛应用于各种低压照明装置，传统的LED光源模块封装结构一般包括一具有反光杯的金属底座，在底座的反光杯底部中央设有若干LED芯片，该LED芯片通过焊接方式或者绝缘胶均匀地粘在反光杯的底部中央，LED芯片之间通过导线相串联或者并联后引出，连接至设置在金属底座上的反光杯外部的线路板，再将LED芯片的上表面涂敷一胶水与荧光粉混合层后使LED芯片被完全覆盖在混合层内部。上述传统的LED光源模块封装结构中，为了节约成本，因此所述胶水与荧光粉混合层采用的大都是软硅胶，但其光效损失较大，若采用硬硅胶则可以提高光效，但同时LED模块的成本会大幅增加，不利于工业上的大规模生产。LED is a low-voltage light source. Due to its power saving and long life, it has been widely used in various low-voltage lighting devices. The traditional LED light source module packaging structure generally includes a metal base with a reflector, and the reflector on the base There are several LED chips in the center of the bottom. The LED chips are evenly glued to the center of the bottom of the reflective cup by welding or insulating glue. The LED chips are connected in series or in parallel through wires, and then connected to the reflective cup on the metal base. On the external circuit board, the upper surface of the LED chip is coated with a mixed layer of glue and phosphor so that the LED chip is completely covered inside the mixed layer. In the above-mentioned traditional LED light source module packaging structure, in order to save costs, the mixed layer of glue and phosphor is mostly made of soft silica gel, but its light efficiency loss is relatively large. If hard silica gel is used, the light efficiency can be improved, but at the same time The cost of the LED module will increase significantly, which is not conducive to industrial mass production.

【发明内容】【Content of invention】

本发明要解决的技术问题，在于提供一种既能够节省生产成本，又可以保持较好的光效的LED光源模块封装结构。The technical problem to be solved by the present invention is to provide an LED light source module packaging structure that can save production costs and maintain better light efficiency.

本发明是这样实现的：一种LED光源模块封装结构，包括一具有反光杯的底座，底座的反光杯底部中央设有至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部，所述LED芯片的表面周围涂敷有一硬硅胶层，在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层，所述芯片之间通过导线连接后引出正负极。The present invention is realized in the following way: a LED light source module packaging structure, including a base with a reflective cup, at least one LED chip is arranged in the center of the bottom of the reflective cup on the base, and the LED chip is glued to the bottom of the reflective cup by insulating glue, so A hard silica gel layer is coated around the surface of the LED chip, and a mixed layer of glue and fluorescent powder is coated on the outside of the hard silica gel layer, and the positive and negative electrodes are drawn out after the chips are connected by wires.

所述底座上设有绝缘片，所述LED芯片经串联或并联连接后引出至绝缘片。An insulating sheet is provided on the base, and the LED chips are connected to the insulating sheet after being connected in series or in parallel.

所述底座的上表面设有一电镀的反光层。An electroplated reflective layer is provided on the upper surface of the base.

所述底座和反光杯均为圆形。Both the base and the reflector are circular.

所述绝缘片为玻璃纤维片，绝缘片上设有印刷电路。The insulating sheet is a glass fiber sheet, and a printed circuit is arranged on the insulating sheet.

本发明具有如下优点：采用上述将LED芯片的表面周围涂敷有一硬硅胶层，在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层的双胶层结构，可以大大节省了生产成本，并且其光效损失极少，有利于大批量的工业化生产。The present invention has the following advantages: the above-mentioned double-layer structure in which a hard silica gel layer is coated around the surface of the LED chip and a mixed layer of glue and fluorescent powder is applied outside the hard silica gel layer can greatly save production costs , and its light efficiency loss is very small, which is conducive to mass industrial production.

【附图说明】【Description of drawings】

下面参照附图结合实施例对本发明作进一步的说明。The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

图1是本发明的实施例一的整体结构示意图。FIG. 1 is a schematic diagram of the overall structure of Embodiment 1 of the present invention.

图2是图1的A-A剖视图。Fig. 2 is a sectional view along A-A of Fig. 1 .

【具体实施方式】【Detailed ways】

下面结合具体实施例来对本发明进行详细的说明。The present invention will be described in detail below in conjunction with specific embodiments.

请参阅图1至图2所示，是本发明的所述的LED光源模块封装结构，包括底座11、LED芯片12、绝缘胶13、胶水与荧光粉混合层14、反光杯15、线路板16、硬硅胶层17、导线18。Please refer to Fig. 1 to Fig. 2, which are the LED light source module packaging structure of the present invention, including base 11, LED chip 12, insulating glue 13, glue and phosphor mixed layer 14, reflective cup 15, circuit board 16 , hard silica gel layer 17, wire 18.

所述底座11的中央设有一反光杯15，本实施例中的底座11和反光杯15均为圆形，所述底座11为铜制一体成型，其上表面有一电镀的反光层，在本实施例中该反光层为镀银层，反光杯15的底部设有若干LED芯片12，这些LED芯片12通过绝缘胶粘在反光杯15的底部，所述LED芯片12的表面周围涂敷有一硬硅胶层17，在该硬硅胶层17的外部还涂敷有一胶水与荧光粉混合层14，底座11上还预留有容纳线路板16的小槽，将线路板16安装在该小槽内后，所述若干LED芯片12之间用导线18经串联或并联后引出连接至线路板16，形成正负极。The center of the base 11 is provided with a reflective cup 15. The base 11 and the reflective cup 15 in this embodiment are both circular. In the example, the reflective layer is a silver-plated layer, and the bottom of the reflective cup 15 is provided with several LED chips 12, and these LED chips 12 are glued to the bottom of the reflective cup 15 by insulating glue, and a hard silica gel is coated around the surface of the LED chip 12. Layer 17, a glue and fluorescent powder mixed layer 14 is coated on the outside of the hard silica gel layer 17, and a small groove for accommodating the circuit board 16 is reserved on the base 11. After the circuit board 16 is installed in the small groove, The plurality of LED chips 12 are connected to the circuit board 16 with wires 18 connected in series or in parallel to form positive and negative poles.

上述实施例中，所述底座也不局限于圆形，可以做成方形或者长条形等形状，仍然可以达到前述的发明目的。In the above-mentioned embodiments, the base is not limited to a circular shape, and can be made into a square shape or a long strip shape, and still achieve the above-mentioned purpose of the invention.

Claims (5)

1.一种LED光源模块封装结构，包括一具有反光杯的底座，底座的反光杯底部中央设有至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部，其特征在于：所述LED芯片的表面周围涂敷有一硬硅胶层，在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层，所述芯片之间通过导线连接后引出正负极。1. A LED light source module packaging structure, comprising a base with a reflective cup, at least one LED chip is arranged in the center of the bottom of the reflective cup of the base, and the LED chip is glued to the bottom of the reflective cup by insulating glue, characterized in that: A hard silica gel layer is coated around the surface of the LED chip, and a mixed layer of glue and fluorescent powder is coated on the outside of the hard silica gel layer, and the positive and negative electrodes are drawn out after the chips are connected by wires. 2.根据权利要求1所述的LED光源模块封装结构，其特征在于：所述底座上设有绝缘片，所述LED芯片经串联或并联连接后引出至绝缘片。2. The packaging structure of the LED light source module according to claim 1, wherein an insulating sheet is provided on the base, and the LED chips are led out to the insulating sheet after being connected in series or in parallel. 3.根据权利要求1所述的LED光源模块封装结构，其特征在于：所述底座的上表面设有一电镀的反光层。3. The package structure of LED light source module according to claim 1, characterized in that: an electroplated reflective layer is provided on the upper surface of the base. 4.根据权利要求1所述的LED光源模块封装结构，其特征在于：所述底座和反光杯均为圆形。4. The package structure of LED light source module according to claim 1, characterized in that: the base and the reflective cup are both circular. 5.根据权利要求2所述的LED光源模块封装结构，其特征在于：所述绝缘片为玻璃纤维片，绝缘片上设有印刷电路。 5. The package structure of LED light source module according to claim 2, characterized in that: the insulating sheet is a glass fiber sheet, and a printed circuit is arranged on the insulating sheet. the
CN2010102995730A 2010-09-30 2010-09-30 Encapsulation structure of light emitting diode (LED) light source module Pending CN102005445A (en)

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CN2010102995730A CN102005445A (en) 2010-09-30 2010-09-30 Encapsulation structure of light emitting diode (LED) light source module
PCT/CN2010/078620 WO2012040956A1 (en) 2010-09-30 2010-11-11 Packaging structure of led lighting source module

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102290410A (en) * 2011-08-16 2011-12-21 陈炜旻 LED (light emitting diode) area light source and manufacturing method thereof
CN102299247A (en) * 2011-05-20 2011-12-28 浙江英特来光电科技有限公司 Outdoor LED module group
CN102306695A (en) * 2011-09-09 2012-01-04 福建省万邦光电科技有限公司 Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070287208A1 (en) * 2006-05-17 2007-12-13 3M Innovative Properties Company Method of Making Light Emitting Device With Multilayer Silicon-Containing Encapsulant
CN101399304A (en) * 2007-09-27 2009-04-01 海立尔股份有限公司 Method for manufacturing light emitting diode with multilayer optical lens and structure thereof
CN201820757U (en) * 2010-09-30 2011-05-04 福建省万邦光电科技有限公司 LED (light-emitting diode) light source module packaging structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7405433B2 (en) * 2005-02-22 2008-07-29 Avago Technologies Ecbu Ip Pte Ltd Semiconductor light emitting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070287208A1 (en) * 2006-05-17 2007-12-13 3M Innovative Properties Company Method of Making Light Emitting Device With Multilayer Silicon-Containing Encapsulant
CN101399304A (en) * 2007-09-27 2009-04-01 海立尔股份有限公司 Method for manufacturing light emitting diode with multilayer optical lens and structure thereof
CN201820757U (en) * 2010-09-30 2011-05-04 福建省万邦光电科技有限公司 LED (light-emitting diode) light source module packaging structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102299247A (en) * 2011-05-20 2011-12-28 浙江英特来光电科技有限公司 Outdoor LED module group
CN102290410A (en) * 2011-08-16 2011-12-21 陈炜旻 LED (light emitting diode) area light source and manufacturing method thereof
CN102290410B (en) * 2011-08-16 2016-09-07 陈炜旻 LED area light source and manufacture method thereof
CN102306695A (en) * 2011-09-09 2012-01-04 福建省万邦光电科技有限公司 Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module

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Application publication date: 20110406