CN105674068A - LED filament packaging structure - Google Patents
LED filament packaging structure Download PDFInfo
- Publication number
- CN105674068A CN105674068A CN201610016927.3A CN201610016927A CN105674068A CN 105674068 A CN105674068 A CN 105674068A CN 201610016927 A CN201610016927 A CN 201610016927A CN 105674068 A CN105674068 A CN 105674068A
- Authority
- CN
- China
- Prior art keywords
- substrate
- light source
- led light
- encapsulating structure
- led filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 2
- 239000013536 elastomeric material Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
Abstract
An LED filament packaging structure comprises a substrate, an LED light source and two electrode ends. The LED light source is arranged on the substrate and is in thermal connection with the substrate. The two electrode ends are both made of heat-conducted materials. The two electrode ends each comprises a connecting part. The connecting parts are arranged on the substrate and electrically connected with the LED light source. The connecting parts are in thermal connection with the substrate. The LED filament packaging structure has a good heat dissipation effect.
Description
Technical field
The present invention relates to technical field of LED illumination, particularly to a kind of LED filament encapsulating structure.
Background technology
In recent years, due to quickly growing of LED industry, LED lamp progressively replaces traditional lighting. Owing to LED luminescence has the characteristic such as point source and directivity, therefore LED lamp is difficult to replace conventional incandescent, accomplishes that full luminous intensity distribution illuminates. Existing a kind of LED filament, is that one group of LED chip encapsulation is formed LED filament on the transparent substrate, it is possible to achieve 360 ° of full angle luminescences, then multiple filaments connects the illumination effect forming similar tengsten lamp. At present, LED filament is substantially free of radiator, substrate is generally the glass material that heat conductivility is very poor, electrode does not have heat conductivility yet, LED filament cannot be carried out heat conducting and radiating, conducts so being difficult to the heat by LED chip produces, and heat can only carry out heat conduction and heat radiation by the convection current of radiation and internal gas, easily cause the accumulation of heat so that the lost of life of LED filament.
Summary of the invention
In view of this, it is necessary to a kind of LED filament encapsulating structure dispelling the heat good is provided.
A kind of LED filament encapsulating structure, including substrate, LED light source and two electrode tips, described LED light source arranges on the substrate and is connected with this substrate heat, it is characterized in that, these two electrode tips are all made from a material that be thermally conductive, these two electrode tips all include connecting portion, and described connecting portion arranges on the substrate and electrically connects with described LED light source, and described connecting portion is connected with this substrate heat.
Compared with prior art, the present invention is connected to two electrode tips on the substrate, the heat that these LED light sources produce effectively can be derived by the good heat conductive performance of two electrode tips, the heat that these LED light sources produce is avoided to pile up on the substrate so that this LED filament encapsulating structure has good radiating effect.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of LED filament encapsulating structure first embodiment of the present invention.
Fig. 2 is another axonometric chart of LED filament encapsulating structure shown in Fig. 1.
Fig. 3 is the perspective exploded view of LED filament encapsulating structure shown in Fig. 1.
Fig. 4 is the axonometric chart of electrode tip in LED filament encapsulating structure shown in Fig. 1.
Description of reference numerals:
10 substrate 20LED light sources
30 electrode tip 31 connecting portions
32 pars contractilis 33 interconnecting parts
332 coarse microstructure 40 encapsulated layers
50 metal level 60 heat-conducting layers
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described in further detail.
Refer to Fig. 1 to Fig. 4, this LED filament encapsulating structure, including substrate 10, LED light source 20 and two electrode tips 30, these LED light sources 20 be arranged on this substrate 10 and with this substrate 10 thermally coupled.
Wherein, this substrate 10 is made up of transparent or semitransparent material. These LED light sources 20 are arranged on the front of this substrate 10, the front of this substrate 10 is additionally provided with heat-conducting layer 60 (as shown in Figure 3), the front thermally coupled of this heat-conducting layer 60 and this substrate 10, this heat-conducting layer 60 and the setting of these LED light sources 20 interval, at least one in these two electrode tips 30 and this heat-conducting layer 60 thermally coupled. This heat-conducting layer 60 can be the hydrargyrum layer being arranged on this substrate 10 front, and above-mentioned electrode tip 30 can be welded on this heat-conducting layer 60 while being welded on this substrate 10. This heat-conducting layer 60 is for being delivered to above-mentioned electrode tip 30 faster by the heat on this substrate 10. The back side of this substrate 10 is provided with metal level 50, the back side thermally coupled of this metal level 50 and this substrate 10. These LED light sources 20 are arranged parallel to each other. This metal level 50 deviates the position of this LED light source 20 and arranges at the back side of this substrate 10, to avoid these LED light source 20 projections at the back side of this substrate 10, the light that LED light source 20 sends is allowed outwards to penetrate through this substrate 10, thus expanding the lighting angle of this LED filament encapsulating structure, make it be backed with light, make lighting angle more than 180 degree. It will of course be understood that, make the lighting angle of this LED filament encapsulating structure method more than 180 degree also a variety of, for instance, LED light source can be all set at the tow sides of this substrate 10. This metal level 50 can improve the thermal conductivity of this substrate 10, allows more heat be transmitted on these electrode tips 30, it is to avoid heat build-up is in the centre of this substrate 10.
Wherein, these two electrode tips 30 are respectively welded on this substrate 10 to realize the thermally coupled with this substrate 10, and these LED light sources 20 are electrically connected with these two electrode tips 30 respectively by gold thread. These two electrode tips 30 are all made from a material that be thermally conductive, and these two electrode tips 30 are all at one end provided with connecting portion 31, and these connecting portions 31 are arranged on this substrate 10 and electrically connect with these LED light sources 20, these connecting portions 31 and these substrate 10 thermally coupleds. In the present embodiment, these two electrode tips 30 are made by elastomeric material, and the middle part of each electrode tip 30 is provided with pars contractilis 32, and the other end of each electrode tip 30 is communicated with portion 33. This connecting portion 31, pars contractilis 32 and interconnecting part 33 are one-body molded. This pars contractilis 32 is " several " character form structure of bending, the radiating piece thermally coupled in this interconnecting part 33 and the external world. During work, this LED filament encapsulating structure is heated and can expand with heat and contract with cold, but owing to dilatation can occur this pars contractilis 32, so the problem that stress produces LED filament bending or fracture can be avoided. The lower surface of this interconnecting part 33 is provided with coarse microstructure 332, and this coarse microstructure 332 can be multiple spaced pits, grid, cross, triangle etc., in order to increase contacts cotton knot with welding tin cream. The through hole that the middle part of this interconnecting part 33 is provided with through, it is possible to allow welding tin cream better flow into get rid of interconnecting part center air of parcel when contacting tin cream, reduce thermal contact resistance. It is of course also possible to be not provided with this pars contractilis 32, and directly allow connecting portion 31 and interconnecting part 33 one-body molded.
Wherein, this LED filament encapsulating structure also includes encapsulated layer 40, and this encapsulated layer 40 covers on the connecting portion 31 of the LED light source 20 on this substrate 10 and these two electrode tips 30. This encapsulated layer 40 is provided with fluorescent material, and this fluorescent material these LED light sources 20 corresponding are arranged. This fluorescent material can coordinate these LED light sources 20 to send white light.
In sum, the present invention is connected to two electrode tips 30 on this substrate 10, the heat that these LED light sources 20 produce effectively can be derived by the good heat conductive performance of two electrode tips 30, the heat that these LED light sources 20 produce is avoided to pile up on this substrate 10 so that this LED filament encapsulating structure has good radiating effect.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, any those skilled in the art are without departing from, in this programme technical scope, utilizing the technology contents of above-mentioned exposure to make the Equivalent embodiments for equal change of few modifications. In every case depart from technical solution of the present invention content, according to the technology of the present invention essence to any amendment made for any of the above embodiments, equivalent replacement, improvement etc., should be included within the scope of protection of the invention.
Claims (11)
1. a LED filament encapsulating structure, including substrate, LED light source and two electrode tips, described LED light source arranges on the substrate and is connected with this substrate heat, it is characterized in that, these two electrode tips are all made from a material that be thermally conductive, these two electrode tips all include connecting portion, and described connecting portion arranges on the substrate and electrically connects with described LED light source, and described connecting portion is connected with this substrate heat.
2. LED filament encapsulating structure according to claim 1, it is characterised in that: also including encapsulated layer, described encapsulated layer covers the LED light source on this substrate and the connecting portion of these two electrode tips.
3. LED filament encapsulating structure according to claim 2, it is characterised in that: this encapsulated layer is provided with fluorescent material, and the corresponding described LED light source of this fluorescent material is arranged.
4. LED filament encapsulating structure according to claim 1, it is characterised in that: this substrate is made up of transparent or semitransparent material.
5. LED filament encapsulating structure according to claim 4, it is characterised in that: described LED light source is arranged on the front of this substrate, and the back side of this substrate is provided with metal level, the back side thermally coupled of this metal level and this substrate.
6. LED filament encapsulating structure according to claim 5, it is characterised in that: described LED light source is arranged parallel to each other, and this metal level deviates the position of this LED light source and arranges at the back side of this substrate.
7. LED filament encapsulating structure according to claim 1, it is characterized in that: described LED light source is arranged on the front of this substrate, the front of this substrate is additionally provided with heat-conducting layer, the front thermally coupled of this heat-conducting layer and this substrate, this heat-conducting layer and the setting of described LED light source interval, at least one in these two electrode tips and this heat-conducting layer thermally coupled.
8. LED filament encapsulating structure according to claim 1, it is characterised in that: these two electrode tips are respectively welded on the substrate, and described LED light source is electrically connected with these two electrode tips respectively by gold thread.
9. LED filament encapsulating structure according to claim 1, it is characterised in that: these two electrode tips are made by elastomeric material, and the middle part of each electrode tip is provided with pars contractilis, and this pars contractilis is " several " character form structure of bending.
10. LED filament encapsulating structure according to claim 9, it is characterised in that: described electrode tip also includes the interconnecting part being connected with this connecting portion, and this interconnecting part is for extraneous radiating piece thermally coupled, and the lower surface of this interconnecting part is provided with coarse microstructure.
11. LED filament encapsulating structure according to claim 9, it is characterised in that: described electrode tip also includes the interconnecting part being connected with this connecting portion, and this interconnecting part is for extraneous radiating piece thermally coupled, the through hole that the middle part of this interconnecting part is provided with through.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610016927.3A CN105674068B (en) | 2016-01-11 | 2016-01-11 | LED filament packaging structure |
| PCT/CN2016/102247 WO2017121154A1 (en) | 2016-01-11 | 2016-10-17 | Led filament packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610016927.3A CN105674068B (en) | 2016-01-11 | 2016-01-11 | LED filament packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105674068A true CN105674068A (en) | 2016-06-15 |
| CN105674068B CN105674068B (en) | 2020-08-25 |
Family
ID=56300031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610016927.3A Active CN105674068B (en) | 2016-01-11 | 2016-01-11 | LED filament packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105674068B (en) |
| WO (1) | WO2017121154A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106369366A (en) * | 2016-11-16 | 2017-02-01 | 漳州立达信光电子科技有限公司 | LED lamp filament assembly and LED filament lamp |
| WO2017121154A1 (en) * | 2016-01-11 | 2017-07-20 | 漳洲立达信光电子科技有限公司 | Led filament packaging structure |
| CN109099324A (en) * | 2018-08-27 | 2018-12-28 | 广东华辉煌光电科技有限公司 | A kind of metal wire built-in filament and filament lamp |
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| CN201113123Y (en) * | 2007-10-16 | 2008-09-10 | 迈迪克(上海)照明科技有限公司 | Straight pipe fluorescent lamp elastic lamp holder |
| CN103134004A (en) * | 2011-11-27 | 2013-06-05 | 王凯 | High luminous efficiency sodium lamp with lamp anti-explosion structure |
| CN203784711U (en) * | 2014-04-21 | 2014-08-20 | 史杰 | Lamp with LED filament packaged by bent COB |
| CN204005448U (en) * | 2014-07-11 | 2014-12-10 | 木林森股份有限公司 | The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger |
| CN204118125U (en) * | 2014-10-30 | 2015-01-21 | 杭州庄诚进出口有限公司 | A kind of New LED filament encapsulating structure |
| CN104505453A (en) * | 2014-11-14 | 2015-04-08 | 浙江英特来光电科技有限公司 | LED (Light Emitting Diode) lamp filament without bonding wire |
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| CN205488193U (en) * | 2016-01-11 | 2016-08-17 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
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| US20070063213A1 (en) * | 2005-09-21 | 2007-03-22 | Lighthouse Technology Co., Ltd. | LED package |
| TWM457299U (en) * | 2013-03-15 | 2013-07-11 | Unity Opto Technology Co Ltd | Omni-directional light-emitting element featuring high heat dissipation efficiency |
| CN204227118U (en) * | 2014-11-14 | 2015-03-25 | 浙江英特来光电科技有限公司 | A kind of Novel LED light source structure |
| CN204301010U (en) * | 2014-11-19 | 2015-04-29 | 哈尔滨鎏霞光电技术有限公司 | A kind of omnidirectional luminous LED lamp silk for automatic spot |
| CN204879597U (en) * | 2015-08-28 | 2015-12-16 | 深圳市源磊科技有限公司 | LED bulb and LED filament that has terminal structure thereof |
| CN105674068B (en) * | 2016-01-11 | 2020-08-25 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
-
2016
- 2016-01-11 CN CN201610016927.3A patent/CN105674068B/en active Active
- 2016-10-17 WO PCT/CN2016/102247 patent/WO2017121154A1/en active Application Filing
Patent Citations (8)
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| CN201113123Y (en) * | 2007-10-16 | 2008-09-10 | 迈迪克(上海)照明科技有限公司 | Straight pipe fluorescent lamp elastic lamp holder |
| CN103134004A (en) * | 2011-11-27 | 2013-06-05 | 王凯 | High luminous efficiency sodium lamp with lamp anti-explosion structure |
| CN203784711U (en) * | 2014-04-21 | 2014-08-20 | 史杰 | Lamp with LED filament packaged by bent COB |
| CN204005448U (en) * | 2014-07-11 | 2014-12-10 | 木林森股份有限公司 | The LED lamp bar of a kind of LED substrate for LED lamp bar and large light emitting anger |
| CN204118125U (en) * | 2014-10-30 | 2015-01-21 | 杭州庄诚进出口有限公司 | A kind of New LED filament encapsulating structure |
| CN104505453A (en) * | 2014-11-14 | 2015-04-08 | 浙江英特来光电科技有限公司 | LED (Light Emitting Diode) lamp filament without bonding wire |
| CN204387750U (en) * | 2014-12-30 | 2015-06-10 | 宁波海奈特照明科技有限公司 | A kind of LED silk bulb |
| CN205488193U (en) * | 2016-01-11 | 2016-08-17 | 漳州立达信光电子科技有限公司 | LED filament packaging structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017121154A1 (en) * | 2016-01-11 | 2017-07-20 | 漳洲立达信光电子科技有限公司 | Led filament packaging structure |
| CN106369366A (en) * | 2016-11-16 | 2017-02-01 | 漳州立达信光电子科技有限公司 | LED lamp filament assembly and LED filament lamp |
| CN106369366B (en) * | 2016-11-16 | 2020-01-21 | 漳州立达信光电子科技有限公司 | LED filament assembly and LED filament lamp |
| CN109099324A (en) * | 2018-08-27 | 2018-12-28 | 广东华辉煌光电科技有限公司 | A kind of metal wire built-in filament and filament lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017121154A1 (en) | 2017-07-20 |
| CN105674068B (en) | 2020-08-25 |
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