CN203068211U - Light-emitting diode (LED) lighting lamp - Google Patents
Light-emitting diode (LED) lighting lamp Download PDFInfo
- Publication number
- CN203068211U CN203068211U CN2013200104675U CN201320010467U CN203068211U CN 203068211 U CN203068211 U CN 203068211U CN 2013200104675 U CN2013200104675 U CN 2013200104675U CN 201320010467 U CN201320010467 U CN 201320010467U CN 203068211 U CN203068211 U CN 203068211U
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- illuminating lamp
- led chip
- bulb shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000017525 heat dissipation Effects 0.000 claims abstract description 7
- 241000218202 Coptis Species 0.000 claims description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000011222 crystalline ceramic Substances 0.000 claims description 5
- 229910002106 crystalline ceramic Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A light-emitting diode (LED) lighting lamp comprises a bulb shell, a substrate, an LED chip, a radiator and a heat dissipation cover, wherein the bulb shell is fixedly arranged on the top of the radiator, the substrate is fixedly arranged in the bulb shell, the LED chip is arranged on the substrate, the heat dissipation cover is arranged on the top of the bulb shell, the upper end of the substrate is in hot connection with the heat dissipation cover, and the lower end of the substrate is in hot connection with the radiator. The LED light lamp has the advantage of being high in heat dissipation efficiency.
Description
Technical field
The utility model relates to a kind of LED lighting device, particularly a kind of LED illuminating lamp.
Background technology
As everyone knows, led chip can the evolution of heat in when work, electricity input energy all can be converted into heat more than 60%.Heat radiation is the important prerequisite of led light source performance and reliability.If heat can't effectively be derived, can cause led chip P-N junction temperature to raise, and then cause optical color parameter deterioration, the lost of life, or even chip failure.For example on August 15th, 2012, granted patent number disclosed a printing opacity cell-shell for the ZL201010610092.7 Chinese invention patent, a stem stem that has blast pipe, electric lead-out wire and support, at least one high-voltage LED chip, a driver, an electric connector, this high-voltage LED chip is fixed on the stem stem, and its electrode links to each other with the electric connector that can be connected external power with driver through the electrode outlet line of stem stem; Described stem stem and the vacuum seal of printing opacity cell-shell are filled with high thermal conductivity low viscosity gas in the annular seal space.
Yet, at present the cell-shell of LED bulb lamp normally plastics (thermal conductivity only has about 0.2W/m.K) or glass (thermal conductivity only has about 1W/m.K) compare with metal, the ceramic heat-dissipating shell of routine, capacity of heat transmission is very poor, can't efficiently radiates heat.Helium thermal conductivity 151mW/m.K, hydrogen heat conductance 181mW/m.K.They are high heat conductance gas for so-called title, just compare in the thermal conductivity (26mW/m.K) of air.Yet the thermal conductivity of gas is compared with pottery, metal, differs from 4 ~ 5 orders of magnitude.Thereby heat can't effectively conduct to the light source outer surface from chip.In sum, present led light source bulb lamp, heat dissipation design exists major defect, causes the led chip junction temperature to raise, and then causes optical color parameter deterioration, reliability variation.
The utility model content
In view of this, be necessary the LED illuminating lamp that provides a kind of radiating efficiency higher.
A kind of LED illuminating lamp, comprise bulb shell, substrate, led chip, radiator, heat dissipating housing, this bulb shell is fixed on the top of this radiator, this substrate is fixed in this bulb shell, described led chip is located on this substrate, this heat dissipating housing is arranged on the top of this bulb shell, the upper end of this substrate and heat dissipating housing thermally coupled, and the lower end of this substrate is connected with radiator heat.
Compared with prior art, the utility model LED illuminating lamp is by being fixed on substrate in the bulb shell, the top and bottom of this substrate outside encapsulated layer are connected with the heat dissipating housing at top and the radiator heat of bottom respectively, make to be fixed on the heat that the led chip on the substrate sends and to pass to top heat dissipating housing and bottom heat spreader respectively by these top and bottom.Because this substrate is that the crystalline ceramics substrate has good heat transmitting, the heat that can effectively led chip be distributed is directly delivered to the radiator of top heat dissipating housing and bottom, again by heat dissipating housing and radiator simultaneously to extraneous distribute heat, reach up and down two ends and dispel the heat simultaneously, increase area of dissipation, improve radiating efficiency greatly, strengthen radiating effect, so this LED illuminating lamp has advantage of higher cooling efficiency.
Description of drawings
Fig. 1 is the generalized section of the utility model LED illuminating lamp first embodiment.
Fig. 2 is the stereogram of LED illuminating lamp shown in Figure 1.
100LED lamp 10LED chip
20 substrates, 30 bulb shells
40 heat dissipating housings, 50 radiators
60 lamp holders, 21 encapsulated layers
22 stretch out substrate 23 electrodes
24 gold threads
The specific embodiment
Figure 1 shows that the utility model LED illuminating lamp profile.This LED illuminating lamp 100 comprises led chip 10, substrate 20, bulb shell 30, heat dissipating housing 40, radiator 50, lamp holder 60.This led chip 10 is fixed on this substrate 20, this substrate 20 is fixed in this bulb shell 30, the two ends of this substrate 20 respectively with this heat dissipating housing 40 and these radiator 50 thermally coupleds, this heat dissipating housing 40 is arranged on the top of this bulb shell 30, this bulb shell 30 is fixed on the upper surface of this radiator 50, and the bottom of this radiator 50 is connected with this lamp holder 60.
This heat dissipating housing 40 is the heat dissipation metal cover, and this heat dissipating housing 40 is discoideus structure, and the external diameter of this heat dissipating housing 40 is less than the external diameter of these bulb shell 30 maximums.These heat dissipating housing 40 interlockings with the cavity of a bottom opening of these bulb shell 30 formations, are connected the upper surface of this radiator 50 at the end face (as shown in Figures 1 and 2) of this bulb shell 30.This bulb shell 30 is provided with the printing opacity scattering material.
Please refer to Fig. 1, this substrate 20 is the crystalline ceramics substrate of strip.This substrate 20 comprises encapsulated layer 21, a plurality of gold thread 23, upper end 22, lower end 26 and two strip electrodes 24.This substrate 20 is provided with led chip 10, this led chip 10 can be a plurality of led chips 10, between these led chips 10 is to be electrically connected by gold thread 23, is encapsulated on this crystalline ceramics substrate 20 by encapsulated layer 21 between these led chips 10 and the gold thread 23.This encapsulated layer 21 is one cylindric rectangular, and it coats the substrate 20 around all led chips 10 and the led chip 10.This encapsulated layer 21 also comprises the phosphor powder layer (not shown), and corresponding these led chips 10 of this phosphor powder layer arrange, and this phosphor powder layer coats these led chips 10 and substrate on every side 20 thereof.Stretch out outside this encapsulated layer 21 upper end 22 of this substrate 20 and lower end 26.One end of this two strip electrode 24 is electrically connected with the outermost gold thread 23 of these led chips respectively, and the other end is electrically connected with a driving respectively.Upper end 22 and these heat dissipating housing 40 thermally coupleds of this substrate 20, this lower end 26 and these radiator 50 thermally coupleds (as shown in Figure 1).
The radiating principle of LED illuminating lamp 100 of the present utility model is: during work, the heat that this led chip 10 sends is delivered to upper end 22 and lower end 26 outside this encapsulated layer 21 respectively by the substrates 20 in the encapsulated layer 21, be delivered on this heat dissipating housing 40 and this radiator 50 through this upper end 22 and lower end 26 again, passed through streamed outside heat radiation by radiator 50 outwards heat radiation again, heat dissipating housing 40.
In sum, the utility model LED illuminating lamp 100 is by being fixed on substrate 20 in the bulb shell 30, the upper end 22 of this substrate 20 outside encapsulated layer 21 and lower end 26 respectively with the heat dissipating housing 40 at top and radiator 50 thermally coupleds of bottom, the heat that the led chip 10 that is fixed on 20 substrates is sent passes to top heat dissipating housing 40 and bottom heat spreader 50 respectively by this upper end 22 and lower end 26.Because this substrate 22 is that the crystalline ceramics substrate has good heat transmitting, the heat that can effectively led chip 10 be distributed is directly delivered to the radiator 50 of top heat dissipating housing 40 and bottom, again by heat dissipating housing 40 and radiator 50 simultaneously to extraneous distribute heat, reach up and down two ends and dispel the heat simultaneously, increase area of dissipation, improve radiating efficiency greatly, strengthen radiating effect.Compare with traditional LED ball bulb, this practical new LED lamp 100 has advantage of higher cooling efficiency.By at this bulb shell 30 the printing opacity scattering material being set, can utilize this bulb shell 30 to realize secondary light-distribution, the part of originally being blocked by this heat dissipating housing 40 also can be arrived by illumination.
Claims (10)
1. LED illuminating lamp, comprise bulb shell, substrate, led chip, radiator, heat dissipating housing, this bulb shell is fixed on the top of this radiator, it is characterized in that, this substrate is fixed in this bulb shell, and described led chip is located on this substrate, and this heat dissipating housing is arranged on the top of this bulb shell, the upper end of this substrate and heat dissipating housing thermally coupled, the lower end of this substrate is connected with radiator heat.
2. LED illuminating lamp according to claim 1, it is characterized in that: also comprise gold thread, this led chip comprises a plurality of led chips, is electrically connected by gold thread between these led chips.
3. LED illuminating lamp according to claim 2, it is characterized in that: also comprise encapsulated layer, this encapsulated layer coats described led chip and substrate on every side thereof.
4. LED illuminating lamp according to claim 3, it is characterized in that: this encapsulated layer also comprises phosphor powder layer, this phosphor powder layer is to should the led chip setting.
5. LED illuminating lamp according to claim 4, it is characterized in that: this substrate is the crystalline ceramics substrate, and this led chip is arranged on this substrate one side, and phosphor powder layer coats described led chip and substrate on every side thereof.
6. LED illuminating lamp according to claim 2, it is characterized in that: also comprise two strip electrodes, an end of this two strip electrode is electrically connected with the outermost gold thread of described led chip respectively, and the other end is electrically connected with a driving respectively.
7. LED illuminating lamp according to claim 1, it is characterized in that: this heat dissipating housing is the heat dissipation metal cover.
8. LED illuminating lamp according to claim 3, it is characterized in that: this substrate is list structure, stretch out outside this encapsulated layer the top and bottom of this substrate, respectively with this radiator and heat dissipating housing thermally coupled.
9. LED illuminating lamp according to claim 1, it is characterized in that: the external diameter of this heat dissipating housing is less than the external diameter of this bulb shell maximum.
10. according to claim 1 or 9 described LED illuminating lamps, it is characterized in that: this bulb shell is provided with the printing opacity scattering material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200104675U CN203068211U (en) | 2013-01-09 | 2013-01-09 | Light-emitting diode (LED) lighting lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200104675U CN203068211U (en) | 2013-01-09 | 2013-01-09 | Light-emitting diode (LED) lighting lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203068211U true CN203068211U (en) | 2013-07-17 |
Family
ID=48766991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013200104675U Expired - Lifetime CN203068211U (en) | 2013-01-09 | 2013-01-09 | Light-emitting diode (LED) lighting lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203068211U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103388764A (en) * | 2013-01-09 | 2013-11-13 | 厦门立明光电有限公司 | LED (light-emitting diode) lighting lamp |
-
2013
- 2013-01-09 CN CN2013200104675U patent/CN203068211U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103388764A (en) * | 2013-01-09 | 2013-11-13 | 厦门立明光电有限公司 | LED (light-emitting diode) lighting lamp |
| CN103388764B (en) * | 2013-01-09 | 2016-11-09 | 厦门立达信照明有限公司 | LED illumination lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: XIAMEN LEEDARSON LIGHTING CO., LTD. Free format text: FORMER NAME: XIAMEN LIMING PHOTOELECTRIC CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two Road No. 1511 Patentee after: LEELEDS LIGHTING (XIAMEN) Co.,Ltd. Address before: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two Road No. 1511 Patentee before: Xiamen Liming Photoelectric Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130717 |
|
| CX01 | Expiry of patent term |