CN103388764B - LED illumination lamp - Google Patents
LED illumination lamp Download PDFInfo
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- CN103388764B CN103388764B CN201310316523.2A CN201310316523A CN103388764B CN 103388764 B CN103388764 B CN 103388764B CN 201310316523 A CN201310316523 A CN 201310316523A CN 103388764 B CN103388764 B CN 103388764B
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Abstract
A kind of LED illumination lamp, including bulb housing, substrate, LED chip, radiator, heat dissipating housing, this bulb housing is fixed on the top of this radiator, also include encapsulated layer, the described LED chip of this encapsulated layer cladding and substrate about, this substrate is transparent ceramic base, this substrate is fixed in this bulb housing, described LED chip sets on the substrate, this heat dissipating housing is arranged on the top of this bulb housing, the upper end of this substrate and lower end are stretched out outside this encapsulated layer, and the upper end of this substrate is thermally coupled with heat dissipating housing, and the lower end of this substrate is thermally coupled with radiator.This LED illumination lamp has the higher advantage of radiating efficiency.
Description
Technical field
The present invention relates to a kind of LED light device, particularly a kind of LED illumination lamp.
Background technology
It is known that LED chip operationally can give off heat, more than the 60% of electricity input energy all can be converted into heat.Heat radiation
It is the important prerequisite of LED light source performance and reliability.If heat cannot effectively be derived, LED chip P-N junction temperature can be caused
Raise, and then cause optical color parameter deterioration, the lost of life, even chip failure.On August 15th, 1 authorizes specially
Profit number discloses a printing opacity cell-shell for ZL201010610092.7 Chinese invention patent, one with blast pipe, electric lead-out wire and
The stem stem of support, at least one high voltage LED chip, a driver, an electric connector, this high voltage LED chip is fixed on core
On post, its electrode is through electrode outlet line and the driver of stem stem and can be connected the electric connector of external power and is connected；Described stem stem and
Printing opacity cell-shell vacuum seals, and is filled with high thermal conductivity low viscosity gas in annular seal space.
But, the cell-shell of current LEDbulb lamp is typically plastics (thermal conductivity only has about 0.2W/m.K) or glass (thermal conductivity
Only have about 1W/m.K) compared with conventional metal, ceramic heat-dissipating shell, capacity of heat transmission is very poor, it is impossible to effectively dispel the heat.Helium
Gas thermal conductivity 151mW/m.K, hydrogen heat conductance 181mW/m.K.So-called they be called high thermal conductivity gas, be compared to
For the thermal conductivity (26mW/m.K) of air.But the thermal conductivity of gas is compared with pottery, metal, differs from 4～5 orders of magnitude.
Thus heat cannot be effectively conducted to light source outer surface from chip.In sum, present LED light source bulb lamp, heat dissipation design is deposited
In major defect, cause LED chip junction temperature to raise, and then cause optical color parameter deterioration, less reliable.
Content of the invention
In view of this, it is necessary to the LED illumination lamp that a kind of radiating efficiency is higher is provided.
A kind of LED illumination lamp, including bulb housing, substrate, LED chip, radiator, heat dissipating housing, this bulb housing is fixed on this
The top of radiator, also includes encapsulated layer, and the described LED chip of this encapsulated layer cladding and substrate about, this substrate is transparent
Ceramic substrate, this substrate is fixed in this bulb housing, and described LED chip sets on the substrate, and this heat dissipating housing is arranged on this bulb
The top of shell, the upper end of this substrate and lower end are stretched out outside this encapsulated layer, and the upper end of this substrate is thermally coupled with heat dissipating housing, this substrate
Lower end thermally coupled with radiator.
Compared with prior art, LED illumination lamp of the present invention is by being fixed in bulb housing substrate, and this substrate is outside encapsulated layer
Top and bottom thermally coupled with the radiator of the heat dissipating housing at top and bottom respectively, make the LED chip being fixed on substrate send
Heat be delivered separately to top heat dissipation cover and bottom heat spreader by this top and bottom.Owing to this substrate is transparent ceramic base
There is good heat transmitting, effectively the heat that LED chip distributes can be directly delivered to the radiator of top heat dissipation cover and bottom,
Outwardly distributed heat again by heat dissipating housing and radiator simultaneously, reach upper and lower two ends and dispel the heat simultaneously, increasing heat radiation area, significantly carry
High cooling efficiency, enhancing radiating effect, so, this LED illumination lamp has the higher advantage of radiating efficiency.
Brief description
Fig. 1 is the generalized section of LED illumination lamp first embodiment of the present invention.
Fig. 2 is the stereogram of LED illumination lamp shown in Fig. 1.
100LED lamp 10LED chip
20 substrate 30 bulb housings
40 heat dissipating housing 50 radiators
60 lamp holder 21 encapsulated layers
22 stretch out substrate 23 electrode
24 gold threads
Detailed description of the invention
Fig. 1 show LED illumination lamp profile of the present invention.This LED illumination lamp 100 includes LED chip the 10th, substrate the 20th, lamp
Cell-shell the 30th, heat dissipating housing the 40th, radiator the 50th, lamp holder 60.This LED chip 10 is fixed on this substrate 20, and this substrate 20 is solid
Being scheduled in this bulb housing 30, the two ends of this substrate 20 are thermally coupled with this heat dissipating housing 40 and this radiator 50 respectively, this heat dissipating housing
40 tops being arranged on this bulb housing 30, this bulb housing 30 is fixed on the upper surface of this radiator 50, the end of this radiator 50
Portion is connected with this lamp holder 60.
This heat dissipating housing 40 is heat dissipation metal cover, and this heat dissipating housing 40 is discoideus structure, and the external diameter of this heat dissipating housing 40 is less than this bulb
The external diameter of shell 30 maximum.This heat dissipating housing 40 rabbets the end face (as shown in Figures 1 and 2) at this bulb housing 30, with this lamp
Cell-shell 30 constitutes the cavity of a bottom opening, is connected to the upper surface of this radiator 50.This bulb housing 30 is provided with printing opacity and dissipates
Penetrate material.
Refer to Fig. 1, the transparent ceramic base that this substrate 20 is strip.The 23rd, this substrate 20 includes encapsulated layer the 21st, multiple gold threads
Upper end the 22nd, lower end 26 and two strip electrodes 24.It can be multiple that this substrate 20 is provided with LED chip the 10th, this LED chip 10
LED chip 10, is to be electrically connected by gold thread 23 between these LED chip 10, between these LED chip 10 and gold thread 23
It is encapsulated in this transparent ceramic base 20 by encapsulated layer 21.This encapsulated layer 21 is a cylindric strip, and its cladding is all of
Substrate 20 around LED chip 10 and LED chip 10.This encapsulated layer 21 also includes phosphor powder layer (not shown),
This phosphor powder layer these LED chip 10 corresponding are arranged, and this phosphor powder layer is coated with these LED chip 10 and substrate about 20.
The upper end 22 of this substrate 20 and lower end 26 are stretched out outside this encapsulated layer 21.One end of this two strip electrode 24 respectively with these LED
The outermost gold thread of chip 23 electrically connects, and the other end electrically connects with a driving respectively.Upper end 22 and this heat radiation of this substrate 20
Cover 40 thermally coupled, this lower end 26 and this radiator 50 thermally coupled (as shown in Figure 1).
The radiating principle of the LED illumination lamp 100 of the present invention is: during work, and the heat that this LED chip 10 sends passes through encapsulated layer
Substrate 20 in 21 be delivered to this encapsulated layer 21 respectively outside upper end 22 and lower end 26, then pass through this upper end 22 and lower end
26 be delivered to this heat dissipating housing 40 with on this radiator 50, by radiator 50 outwards heat radiation again, heat dissipating housing 40 by streamed
Outwards heat radiation.
In sum, LED illumination lamp 100 of the present invention is by being fixed in bulb housing 30 substrate 20, and this substrate 20 exists
Upper end 22 outside encapsulated layer 21 and lower end 26 are thermally coupled with the radiator 50 of the heat dissipating housing 40 at top and bottom respectively, make solid
The heat that the LED chip 10 being scheduled on 20 substrates sends is delivered separately to top heat dissipation cover 40 by this upper end 22 with lower end 26
With bottom heat spreader 50.Owing to this substrate 22 is that transparent ceramic base has good heat transmitting, can be effectively by LED chip
10 heats distributing are directly delivered to the radiator 50 of top heat dissipation cover 40 and bottom, more same by heat dissipating housing 40 and radiator 50
When outwardly distribute heat, reach upper and lower two ends and dispel the heat simultaneously, increasing heat radiation area, be greatly improved radiating efficiency, strengthen heat radiation
Effect.Compared with traditional LED ball bulb, this practical new LED 100 has the higher advantage of radiating efficiency.By
On this bulb housing 30, printing opacity scattering material is set, it is possible to use this bulb housing 30 realizes secondary light-distribution, makes originally by this heat dissipating housing
40 parts blocked also can be shone by light.
Claims (9)
1. a LED illumination lamp, including bulb housing, substrate, LED chip, radiator, heat dissipating housing, this bulb housing is fixed
Top at this radiator, it is characterised in that also include encapsulated layer, the described LED chip of this encapsulated layer cladding and base about
Plate, this substrate is transparent ceramic base, and this substrate is fixed in this bulb housing, and described LED chip sets on the substrate, and this dissipates
Heat cover is arranged on the top of this bulb housing, and the upper end of this substrate and lower end are stretched out outside this encapsulated layer, the upper end of this substrate and heat radiation
Covering thermally coupled, the lower end of this substrate is thermally coupled with radiator.
2. LED illumination lamp according to claim 1, it is characterised in that: also including gold thread, this LED chip includes many
Individual LED chip, is electrically connected by gold thread between these LED chip.
3. LED illumination lamp according to claim 2, it is characterised in that: this encapsulated layer also includes phosphor powder layer, and this is glimmering
Light bisque to should LED chip arrange.
4. LED illumination lamp according to claim 3, it is characterised in that: this LED chip is arranged on this substrate side,
The described LED chip of phosphor powder layer cladding and substrate about.
5. LED illumination lamp according to claim 2, it is characterised in that: also include two strip electrodes, this two strip electrode
One end gold thread outermost with described LED chip respectively electrically connects, and the other end electrically connects with a driving respectively.
6. LED illumination lamp according to claim 1, it is characterised in that: this heat dissipating housing is heat dissipation metal cover.
7. LED illumination lamp according to claim 1, it is characterised in that: this substrate is list structure, dissipates with this respectively
Hot device is thermally coupled with heat dissipating housing.
8. LED illumination lamp according to claim 1, it is characterised in that: the external diameter of this heat dissipating housing is less than this bulb housing
The external diameter of general goal.
9. the LED illumination lamp according to claim 1 or 8, it is characterised in that: this bulb housing is provided with printing opacity scattering material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310316523.2A CN103388764B (en) | 2013-01-09 | 2013-07-25 | LED illumination lamp |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100072202 | 2013-01-09 | ||
| CN201310007220 | 2013-01-09 | ||
| CN201310007220.2 | 2013-01-09 | ||
| CN201310316523.2A CN103388764B (en) | 2013-01-09 | 2013-07-25 | LED illumination lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103388764A CN103388764A (en) | 2013-11-13 |
| CN103388764B true CN103388764B (en) | 2016-11-09 |
Family
ID=49533121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310316523.2A Active CN103388764B (en) | 2013-01-09 | 2013-07-25 | LED illumination lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103388764B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015103753A1 (en) * | 2014-01-09 | 2015-07-16 | 深圳市新益昌自动化设备有限公司 | Led lamp and light-emitting lamp wick |
| CN105588025B (en) * | 2014-11-17 | 2020-02-21 | 通用电气照明解决方案有限公司 | LED lighting device |
| CN105371116A (en) * | 2015-11-13 | 2016-03-02 | 嘉兴市正大照明有限公司 | LED energy-saving illuminating lamp with radiating function |
| CN105371112B (en) * | 2015-11-13 | 2018-12-07 | 嘉兴市正大照明有限公司 | A kind of explosion-proof anti-astigmatism incandescent lighting lamp |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201363586Y (en) * | 2009-02-20 | 2009-12-16 | 林峻毅 | Columnar LED lamp |
| CN102261589A (en) * | 2011-07-28 | 2011-11-30 | 厦门立明光电有限公司 | Lighting LED lamp |
| CN202281062U (en) * | 2011-08-29 | 2012-06-20 | 浙江锐迪生光电有限公司 | LED chip 4-Pi light-emitting LED bulb with high color rendering index |
| CN102506324A (en) * | 2011-11-01 | 2012-06-20 | 杭州潮江科技有限公司 | LED (light emitting diode) lamp with novel heat dissipation structure and method for manufacturing LED lamp |
| TW201239256A (en) * | 2011-01-11 | 2012-10-01 | Koninkl Philips Electronics Nv | Lighting device |
| CN102792089A (en) * | 2010-11-04 | 2012-11-21 | 松下电器产业株式会社 | Light emitting device, bulb-type lamp, and illuminating device |
| CN102800789A (en) * | 2011-05-27 | 2012-11-28 | 东芝照明技术株式会社 | Light-emitting module and lighting apparatus |
| CN203068211U (en) * | 2013-01-09 | 2013-07-17 | 厦门立明光电有限公司 | Light-emitting diode (LED) lighting lamp |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4995989B2 (en) * | 2010-10-12 | 2012-08-08 | パナソニック株式会社 | lamp |
-
2013
- 2013-07-25 CN CN201310316523.2A patent/CN103388764B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201363586Y (en) * | 2009-02-20 | 2009-12-16 | 林峻毅 | Columnar LED lamp |
| CN102792089A (en) * | 2010-11-04 | 2012-11-21 | 松下电器产业株式会社 | Light emitting device, bulb-type lamp, and illuminating device |
| TW201239256A (en) * | 2011-01-11 | 2012-10-01 | Koninkl Philips Electronics Nv | Lighting device |
| CN102800789A (en) * | 2011-05-27 | 2012-11-28 | 东芝照明技术株式会社 | Light-emitting module and lighting apparatus |
| CN102261589A (en) * | 2011-07-28 | 2011-11-30 | 厦门立明光电有限公司 | Lighting LED lamp |
| CN202281062U (en) * | 2011-08-29 | 2012-06-20 | 浙江锐迪生光电有限公司 | LED chip 4-Pi light-emitting LED bulb with high color rendering index |
| CN102506324A (en) * | 2011-11-01 | 2012-06-20 | 杭州潮江科技有限公司 | LED (light emitting diode) lamp with novel heat dissipation structure and method for manufacturing LED lamp |
| CN203068211U (en) * | 2013-01-09 | 2013-07-17 | 厦门立明光电有限公司 | Light-emitting diode (LED) lighting lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103388764A (en) | 2013-11-13 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two Road No. 1511 Applicant after: LEELEDS LIGHTING (XIAMEN) CO., LTD. Address before: The Lake District of Xiamen City, Fujian province 361010 Fang Hubei two Road No. 1511 Applicant before: Xiamen Liming Photoelectric Co., Ltd. |
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| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: XIAMEN LIMING PHOTOELECTRIC CO., LTD. TO: XIAMEN LEEDARSON LIGHTING CO., LTD. |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |