CN205264758U - High heat dissipating LED filament - Google Patents
High heat dissipating LED filament Download PDFInfo
- Publication number
- CN205264758U CN205264758U CN201521133446.8U CN201521133446U CN205264758U CN 205264758 U CN205264758 U CN 205264758U CN 201521133446 U CN201521133446 U CN 201521133446U CN 205264758 U CN205264758 U CN 205264758U
- Authority
- CN
- China
- Prior art keywords
- substrate
- led chip
- radiating piece
- base plate
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017074 necrotic cell death Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
The utility model provides a high heat dissipating LED filament, include base plate, LED chip the LED chip sets up at the substrate surface, pass through metal wire connected between the adjacent LED chip, the base plate is the metal substrate, the base plate both ends are equipped with electrode pin, electrode pin passes through metal wire connected with the LED chip, the substrate surface is equipped with the louvre, and wherein one end still is equipped with the radiating piece, radiating piece and as an organic wholeization of base plate structure. The utility model discloses a metal substrate has better heat conductivity, can go out the luminous produced heat conduction of LED chip, still is equipped with the louvre in addition on the base plate, more is favorable to the heat dissipation of filament, and the base plate still is equipped with the radiating piece, and the heat conductivity of radiating piece is high, big with base plate looks specific area, has increased the heat radiating area of LED filament, makes the utility model discloses the LED filament has high heat dissipating, has improved the stability of LED filament simultaneously.
Description
Technical field
The utility model relates to LED field, espespecially a kind of high-heat dissipation LED filament.
Background technology
It is luminous that LED filament can be realized 360 ° of full angles, and without the optics that installs lens and so on additional, can be applicable to the illuminating products such as crystal pendant lamp, candle lamp, bulb lamp, wall lamp, brings unprecedented lighting experience. Mostly LED filament is that employing glass substrate, ceramic substrate, sapphire substrate are basis at present, welds LED chip on substrate, has the poor problem of heat dispersion. The LED filament lamp of prior art is not easy to accomplish to be greater than the lamp of 850lm, its key is that the area of dissipation of filament is little, LED chip can not be given full play to the ability of the bearing power of itself, there are a lot of LED filaments in use, cause LED filament within the theoretical life-span because heat radiation is poor, make the junction between sheet metal and substrate softening, make the less stable of LED filament; Also cause fluorescent material accelerated ageing, glue yellow, or even the generation of the situation of chip necrosis, make product light efficiency reduce rapidly or lose efficacy.
Utility model content
For addressing the above problem, the utility model provides a kind of rapid heat dissipation, high-heat dissipation LED filament that stability is high.
For achieving the above object, the technical solution adopted in the utility model is: a kind of high-heat dissipation LED filament, comprise that substrate, LED chip, described LED chip are arranged on substrate surface, between described adjacent LED chip, connect by metal wire, described substrate is metal substrate, and described substrate two ends are provided with electrode pin, described electrode pin is connected by metal wire with LED chip, described substrate surface is provided with louvre, and wherein one end is also provided with radiating piece, and described radiating piece and substrate are integrated.
Particularly, described radiating piece is the rectangle radiating piece with through hole.
Particularly, the substrate surface that is provided with LED chip described in is provided with fluorescent material dielectric layer.
Particularly, described louvre density of setting on substrate reduces gradually to surrounding centered by LED chip.
The beneficial effects of the utility model are: the utility model adopts metal substrate, there is better thermal conductivity, luminous LED chip produced heat can be conducted, and on substrate, be also provided with louvre, and being more conducive to the heat radiation of filament, substrate is also provided with radiating piece, the thermal conductivity of radiating piece is high, large with substrate phase specific area, increase the area of dissipation of LED filament, made the utility model LED filament there is high-cooling property, improved the stability of LED filament simultaneously.
Brief description of the drawings
Fig. 1 is Facad structure schematic diagram of the present utility model.
Drawing reference numeral explanation: 1. substrate; 11. louvres; 2.LED chip; 3. metal wire; 4. electrode pin; 5. radiating piece; 51. through holes; 6. fluorescent material dielectric layer.
Detailed description of the invention
Refer to shown in Fig. 1, the utility model is about a kind of high-heat dissipation LED filament, comprise that substrate 1, LED chip 2, described LED chip 2 are arranged on substrate 1 surface, between described adjacent LED chip 2, connect by metal wire 3, described substrate 1 is metal substrate 1, described substrate 1 two ends are provided with electrode pin 4, described electrode pin 4 is connected by metal wire 3 with LED chip 2, described substrate 1 surface is provided with louvre 11, wherein one end is also provided with radiating piece 5, and described radiating piece 5 is integrated with substrate 1.
Compared with prior art, the utility model adopts metal substrate 1, there is better thermal conductivity, luminous LED chip 2 produced heat can be conducted, and also be provided with louvre 111 on substrate 1, more be conducive to the heat radiation of filament, substrate 1 is also provided with radiating piece 5, and the thermal conductivity of radiating piece 5 is high, large with substrate 1 phase specific area, has increased the area of dissipation of LED filament, make the utility model LED filament there is high-cooling property, improved the stability of LED filament simultaneously.
Particularly, described radiating piece 5 is the rectangle radiating piece 5 with through hole 51.
Adopt such scheme, can reach better radiating effect with the radiating piece 5 of through hole 51.
Particularly, substrate 1 surface that is provided with LED chip 2 described in is provided with fluorescent material dielectric layer 6.
Adopt such scheme, be provided with fluorescent material dielectric layer 6 at substrate 1 one side, be conducive to heat radiation.
Particularly, described louvre 11 density of setting on substrate 1 reduces gradually to surrounding centered by LED chip 2.
Adopt such scheme, the louvre 11 on substrate 1 is reasonably set, be more conducive to heat radiation.
Below by specific embodiment, the utility model is further described.
This specific embodiment adopts metal substrate 1, and metal substrate 1 adopts copper product to make, and substrate 1 surface is provided with louvre 11, because the heat in the middle of substrate 1 is higher than surrounding, so louvre 11 reduces gradually to surrounding centered by LED chip 2; LED chip 2 is arranged on metal substrate 1 surface, between adjacent LED chip 2, connect by metal wire 3, substrate 1 two ends are provided with electrode pin 4, electrode pin 4 is connected by metal wire 3 with LED chip 2, wherein one end is also provided with the rectangle radiating piece 5 with through hole 51, and radiating piece 5 is integrated with substrate 1, and the thermal conductivity of radiating piece 5 is high, large with substrate 1 phase specific area, increase the area of dissipation of LED filament, greatly improved the thermal diffusivity of LED filament; And the one side of substrate 1 is coated with fluorescent material dielectric layer 6, can the heat of LED chip 2 luminous generations better be conducted by the good thermal conductivity of metal substrate 1.
Above embodiment is only that preferred embodiment of the present utility model is described; not scope of the present utility model is limited; do not departing under the prerequisite of the utility model design spirit; various distortion and improvement that the common engineers and technicians in this area make the technical solution of the utility model, all should fall in the definite protection domain of claims of the present utility model.
Claims (4)
1. a high-heat dissipation LED filament, comprise that substrate, LED chip, described LED chip are arranged on substrate surface, between described adjacent LED chip, connect by metal wire, it is characterized in that: described substrate is metal substrate, described substrate two ends are provided with electrode pin, and described electrode pin is connected by metal wire with LED chip, and described substrate surface is provided with louvre, wherein one end is also provided with radiating piece, and described radiating piece and substrate are integrated.
2. a kind of high-heat dissipation LED filament according to claim 1, is characterized in that: described radiating piece is the rectangle radiating piece with through hole.
3. a kind of high-heat dissipation LED filament according to claim 1, is characterized in that: described in be provided with LED chip substrate surface be provided with fluorescent material dielectric layer.
4. a kind of high-heat dissipation LED filament according to claim 1, is characterized in that: described louvre density of setting on substrate reduces gradually to surrounding centered by LED chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521133446.8U CN205264758U (en) | 2015-12-30 | 2015-12-30 | High heat dissipating LED filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521133446.8U CN205264758U (en) | 2015-12-30 | 2015-12-30 | High heat dissipating LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205264758U true CN205264758U (en) | 2016-05-25 |
Family
ID=56006267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521133446.8U Expired - Fee Related CN205264758U (en) | 2015-12-30 | 2015-12-30 | High heat dissipating LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205264758U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11629825B2 (en) | 2014-09-28 | 2023-04-18 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED light bulb with curved filament |
| US11686436B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
| US11690148B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US11892127B2 (en) | 2014-09-28 | 2024-02-06 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED bulb lamp |
-
2015
- 2015-12-30 CN CN201521133446.8U patent/CN205264758U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
| US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11629825B2 (en) | 2014-09-28 | 2023-04-18 | Zhejiang Super Lighting Electric Appliance Co., Lt | LED light bulb with curved filament |
| US11686436B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
| US11690148B2 (en) | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
| US11892127B2 (en) | 2014-09-28 | 2024-02-06 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED bulb lamp |
| US11997768B2 (en) | 2014-09-28 | 2024-05-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
| US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170615 Address after: Baoan District Xixiang street Shenzhen city Guangdong province 518000 Nanchang community port channel beside the oyster industry logistics park A Building 5 floor (gate 2) Patentee after: SHENZHEN LIANSHANG PHOTOELECTRIC CO.,LTD. Address before: Ssangyong Village second 417600 Lang Xinhua County of Hunan Province Town Village Group No. 008 Patentee before: Dai Peng |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160525 |