CN202432277U - LED light source and LED lighting device - Google Patents

LED light source and LED lighting device Download PDF

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Publication number
CN202432277U
CN202432277U CN2011204952763U CN201120495276U CN202432277U CN 202432277 U CN202432277 U CN 202432277U CN 2011204952763 U CN2011204952763 U CN 2011204952763U CN 201120495276 U CN201120495276 U CN 201120495276U CN 202432277 U CN202432277 U CN 202432277U
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CN
China
Prior art keywords
light source
heat radiation
led light
led
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2011204952763U
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Chinese (zh)
Inventor
文茂强
刁文学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen mayor express Semiconductor Technology Co., Ltd.
Original Assignee
SHENZHEN CYT OPTOELECTRONIC TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by SHENZHEN CYT OPTOELECTRONIC TECHNOLOGY CO LTD filed Critical SHENZHEN CYT OPTOELECTRONIC TECHNOLOGY CO LTD
Priority to CN2011204952763U priority Critical patent/CN202432277U/en
Application granted granted Critical
Publication of CN202432277U publication Critical patent/CN202432277U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model is applicable to the technical field of lighting and provides an LED light source and an LED lighting device. The LED light source comprises a support and a plurality of LED chips, wherein the LED chips are subjected to crystal solidification and wire soldering on the support. A heat radiation solder pad is arranged at the bottom of the support. Since the heat radiation solder pad is arranged at the bottom of the support, heat radiation conduction paths of the LED chips are added, heat radiation capability of the LED light source is greatly enhanced, the LED chips can operate at the lower temperature and accordingly, the service life of the LED light source is guaranteed.

Description

A kind of led light source and LED lighting device
Technical field
The utility model belongs to lighting technical field, relates in particular to a kind of led light source and LED lighting device.
Background technology
Many weeks, LED is as the new generation of green lighting source, has numerous advantages such as light efficiency height, life-span are long, bright in luster, energy-saving and environmental protection, and application is more and more widely grown like indoor and outdoor lighting, backlight, medical treatment, traffic, plant etc.
The energy-conserving and environment-protective theory is advocated in the whole world makes LED become irreversible trend, and the LED lighting device will little by little replace present incandescent lamp and electricity-saving lamp.Yet existing led light source poor heat radiation influences its service life.
The utility model content
The purpose of the utility model embodiment is to provide a kind of led light source, is intended to solve the problem of existing led light source poor heat radiation.
The utility model embodiment is achieved in that a kind of led light source, comprises that support and solid crystalline substance are wired in a plurality of led chips of said support, and the bottom of said support is provided with the heat radiation pad.
Another purpose of the utility model embodiment is to provide a kind of LED lighting device, and said LED lighting device adopts above-mentioned led light source.
The utility model embodiment establishes the heat radiation pad in the bottom of support, has increased the heat radiation conducting path of led chip, has greatly promoted the heat-sinking capability of led light source, makes led chip work in lower temperature, has guaranteed the service life of led light source.
Description of drawings
Fig. 1 is the vertical view of the led light source that provides of the utility model embodiment;
Fig. 2 is the upward view of the led light source that provides of the utility model embodiment;
Fig. 3 is the sectional view of the led light source that provides of the utility model embodiment;
Fig. 4 is the circuit diagram of the led light source that provides of the utility model embodiment.
The specific embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
The utility model embodiment establishes the heat radiation pad in the bottom of support, has increased the heat radiation conducting path of led chip, has greatly promoted the heat-sinking capability of led light source, makes led chip work in lower temperature, has guaranteed the service life of led light source.
Be described in detail below in conjunction with the realization of specific embodiment the utility model.
Shown in Fig. 1~4, the led light source that the utility model embodiment provides comprises that support 1 and solid crystalline substance are wired in a plurality of led chips 2 of said support 1, and the bottom of said support 1 is provided with heat radiation pad 11.Said heat radiation pad 11 has increased the heat radiation conducting path of led chip 2, has greatly promoted the heat-sinking capability of led light source, makes led chip 2 work in lower temperature, has guaranteed the service life of led light source.
Pad 11 of heat radiation described in the utility model embodiment and led chip 2 all are positioned at the middle part of said support 1, have shortened the heat dissipation path of 11 of led chip 2 and heat radiation pads like this, have further promoted the heat-sinking capability of led light source.
Particularly, said support 1 is made up of the substrate 12 of the solid said led chip 2 of brilliant bonding wire and the reflector 13 that is fixedly arranged on said substrate 12, and said heat radiation pad 11 is located at the lower surface of said substrate 12.The heat of led chip 2 generations conducts to heat radiation pad 11 through substrate 12 like this, and the heat conduction is more direct, and it is faster to dispel the heat.
A plurality of led chips 2 insert positive terminal pad 14 and negative terminal pad 15 respectively after being connected in series successively, and said positive terminal pad 14 and negative terminal pad 15 lay respectively at the both sides of said heat radiation pad 11, and adjacent two pads are separated by insulator 16.Be convenient to the user like this and weld this led light source, solve the problem of power supply design aspect simultaneously for the client, it is very convenient to operate.Wherein, said heat radiation pad 11 is preferably copper heat radiation pad.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.

Claims (9)

1. a led light source comprises that support and solid crystalline substance are wired in a plurality of led chips of said support, is characterized in that the bottom of said support is provided with the heat radiation pad.
2. led light source as claimed in claim 1 is characterized in that, said heat radiation pad and led chip all are located at the middle part of said support.
3. according to claim 1 or claim 2 led light source is characterized in that, said support is made up of the substrate of the solid said led chip of brilliant bonding wire and the reflector that is fixedly arranged on said substrate, and said heat radiation pad is located at the lower surface of said substrate.
4. according to claim 1 or claim 2 led light source; It is characterized in that; Insert positive terminal pad and negative terminal pad after a plurality of led chips are connected in series successively respectively, said positive terminal pad and negative terminal pad lay respectively at the both sides of said heat radiation pad, and adjacent two pads are separated by insulator.
5. led light source as claimed in claim 3 is characterized in that, inserts positive terminal pad and negative terminal pad respectively after a plurality of led chips are connected in series successively, and said positive terminal pad and negative terminal pad lay respectively at the both sides of said heat radiation pad, and adjacent two pads are separated by insulator.
6. like claim 1,2 or 5 described led light sources, it is characterized in that said heat radiation pad is copper heat radiation pad.
7. led light source as claimed in claim 3 is characterized in that, said heat radiation pad is copper heat radiation pad.
8. led light source as claimed in claim 4 is characterized in that, said heat radiation pad is copper heat radiation pad.
9. a LED lighting device is characterized in that, said LED lighting device adopts like each described led light source in the claim 1~8.
CN2011204952763U 2011-12-02 2011-12-02 LED light source and LED lighting device Expired - Lifetime CN202432277U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204952763U CN202432277U (en) 2011-12-02 2011-12-02 LED light source and LED lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011204952763U CN202432277U (en) 2011-12-02 2011-12-02 LED light source and LED lighting device

Publications (1)

Publication Number Publication Date
CN202432277U true CN202432277U (en) 2012-09-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011204952763U Expired - Lifetime CN202432277U (en) 2011-12-02 2011-12-02 LED light source and LED lighting device

Country Status (1)

Country Link
CN (1) CN202432277U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102980065A (en) * 2012-11-21 2013-03-20 惠州雷曼光电科技有限公司 LED (Light-emitting Diode) light source, LED display module and LED illumination device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102980065A (en) * 2012-11-21 2013-03-20 惠州雷曼光电科技有限公司 LED (Light-emitting Diode) light source, LED display module and LED illumination device
CN102980065B (en) * 2012-11-21 2015-07-01 惠州雷曼光电科技有限公司 LED (Light-emitting Diode) light source, LED display module and LED illumination device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address

Address after: 518000 Guangdong City, Nanshan District province high tech in the middle of the two road, No. 2 Shenzhen International Software Park, room 201-205, room, 4 (only office) (222-226)

Patentee after: Shenzhen mayor express Semiconductor Technology Co., Ltd.

Address before: 518000, No. 2, building 4, two software park, central science and technology zone, Nanshan District hi tech Zone, Guangdong, Shenzhen

Patentee before: Shenzhen CYT Optoelectronic Technology Co.,Ltd.

CP03 Change of name, title or address
CX01 Expiry of patent term

Granted publication date: 20120912

CX01 Expiry of patent term