CN102299145A - Direct-insertion-type multichip LED lamp bead - Google Patents
Direct-insertion-type multichip LED lamp bead Download PDFInfo
- Publication number
- CN102299145A CN102299145A CN2011102332046A CN201110233204A CN102299145A CN 102299145 A CN102299145 A CN 102299145A CN 2011102332046 A CN2011102332046 A CN 2011102332046A CN 201110233204 A CN201110233204 A CN 201110233204A CN 102299145 A CN102299145 A CN 102299145A
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- Prior art keywords
- led
- led chip
- chip
- lamp bead
- lamp pearl
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a direct-insertion-type multichip LED lamp bead. Multiple chips control one lamp bead and a lamp bead structure is simple. The lamp bead comprises: a support, a metal pedestal, at least two LED chips and at least two pins. The pin and the metal pedestal are fixed on the support. The metal pedestal is provided with at least one LED chip installation surface and at least one heat dissipation surface. A surface area of the LED chip installation surface is less than the surface area of the heat dissipation surface. And the LED chip installation surface is vertical to the heat dissipation surface or is close to be vertical to the heat dissipation surface. The LED chips are fixed on the LED chip installing surface. The LED chips are directly conducted through a lead. The lead is also used to conduct the LED chips and an electrode. A structure is simple. Polar point costs and radiator costs can be saved. A heat dissipation effect is good. The LED lamp bead belongs to the direct insertion type so that maintenance and replacement is very convenient. Relative costs are low, which is beneficial to popularize LED light sources.
Description
Technical field
The present invention relates to a kind of large-power LED light bead, particularly a kind of multi-chip LED lamp pearl.
Background technology
Great power LED as the 4th generation electric light source, belong to typical green illumination light source, have long, advantage such as light efficiency is high, radiationless and low-power consumption of life-span than conventional light source, will replace traditional incandescent lamp, tungsten halogen lamp and fluorescent lamp gradually becomes electric light source of new generation and is widely used in the general illumination field.
Multi-chip LED lamp pearl in the market, comprise lamp pearl of a chip controls and two kinds of forms of lamp pearl of a plurality of chip controls, usually each chip is laterally to place, so need bigger horizontal area, the cross-sectional area of the radiator that then adapts with it is also bigger, make that the overall volume of LED lamp pearl is bigger, cause the manufacturing cost of whole LED packaged light source higher; In addition, LED lamp pearl is bonding and be electrically connected on the pcb board, so the heat radiation of LED lamp pearl must be passed through pcb board earlier, and then be communicated with radiator and carry out heat conduction, this pcb board just makes the whole LED packaged light source not only increase cost but also influence the integral insulation performance, and can see exposed solder joint on the pcb board, influenced attractive in appearance; Additionally, if LED lamp pearl damages, be difficult for usually changing or maintenance, even replacement cost is too high.
Name is called " high-power direct plug-in type light emitting diode ", the patent No. is 201010183574.9, the application for a patent for invention prospectus that open day is on October 13rd, 2010 discloses a kind of large-power LED light bead, comprises a Plastic Package cover, and this Plastic Package cover is provided with button bit; One plastic stent, this plastic stent is provided with clasp, and plastic stent was installed on the Plastic Package cover by clasp and cooperating of button bit, and plastic stent is provided with first polarity dots, second polarity dots and the 3rd polarity dots; One sheffield plate, this sheffield plate is installed on the plastic stent, and on the sheffield plate wafer is installed, and this wafer is connected with first polarity dots on the plastic stent; Two silver-plated iron plates, this two silver-plated iron plate is installed on the plastic stent, and respectively with plastic stent on second polarity dots contact with the 3rd polarity dots, second polarity dots is connected with wafer by gold thread with the 3rd polarity dots.
As can be seen, wafer is to be connected with first polarity dots on being arranged on plastic stent in this patent application, though be mechanical connection between not concrete openly wafer and first polarity dots in the specification or be electrically connected, yet this product can be done further simplification with the saving cost.
Summary of the invention
The invention provides a kind of direct insertion multi-chip LED lamp pearl, a plurality of led chips are integrated in one, and realized lamp pearl of a plurality of chip controls, and lamp pearl structure are simplified more.
For achieving the above object, the present invention takes following technical scheme:
A kind of direct insertion multi-chip LED lamp pearl comprises support, metal base, at least two led chips and at least two pins; Pin and metal base are fixed on the support, and metal base is provided with at least one led chip installed surface, also is provided with at least one radiating surface; The surface area of described led chip installed surface is less than the surface area of described radiating surface; And described led chip installed surface and described radiating surface are orthogonal or near orthogonal; Led chip is fixed on the led chip installed surface, adopts the direct conducting of lead between the led chip; Also adopt the direct conducting of lead between led chip and the electrode.
LED lamp pearl of the present invention need not to be provided with polarity dots, can realize multi-chip light emitting.And led chip mainly is that radiating surface by metal base dispels the heat, because the surface area of radiating surface is greater than the surface area of led chip installed surface, and radiating surface and led chip installed surface are orthogonal or near orthogonal, even therefore the surface area of led chip installed surface is smaller, needn't worry that also LED lamp pearl temperature is too high, because the heat of LED lamp pearl can be delivered to radiator by radiating surface.Because it is smaller that the area of led chip installed surface can make, so the volume of radiator also can be smaller, thereby save manufacturing cost.In addition, such LED lamp pearl can be realized direct insertion installation, is convenient for changing the lamp pearl.
Should be noted that led chip installed surface and described radiating surface are orthogonal or approaching orthogonal, refer to and to be mutually 90 ° between led chip installed surface and the radiating surface, also can have certain angular deviation between the two.It is generally acknowledged that two angles between the face belong to two faces near mutually perpendicular situation between 60 °～90 °.
When the quantity of pin was 2, led chip can be for being electrically connected in series mode between 2 pins, or electric connection mode in parallel, or the series-parallel connection electric connection mode.
Cap preferably is installed on support; Cap can be light-distribution lens, controls with the lighting angle to led chip.
The present invention is simple in structure, saves polarity dots cost and radiator cost, good heat dissipation effect.And it is luminous to realize that a plurality of chips are controlled a lamp pearl.This kind LED lamp pearl is direct insertion, and maintain and replace is very convenient, and relevant cost is cheap, is beneficial to popularizing of led light source.
Description of drawings
Fig. 1 is the structural perspective of embodiment;
Fig. 2 is the front view (removing cap) of embodiment;
Fig. 3 is that the A-A of Fig. 2 is to cutaway view.
Description of reference numerals: 1-support; The 2-cap; The 3-pin; The 4-LED chip; The 5-copper sheet; The 6-radiating surface; 7-LED chip installed surface; The 8-gold thread.
Embodiment
Below in conjunction with drawings and Examples content of the present invention is described further.
As shown in Figure 1, 2, present embodiment is formed by support 1, cap 2, two pins 3, led chip 4 with as the copper sheet 5 of metal base.Cap 2 is a light-distribution lens.Pin 3 and copper sheet 5 are fixed on the support 1, and copper sheet 5 is flat bulk, and copper sheet 5 is provided with a led chip installed surface 7 and two radiating surfaces 6.All become 90 ° between led chip installed surface 7 and two radiating surfaces 6, and the surface area of led chip installed surface 7 will be much smaller than the surface area of radiating surface 6, so LED lamp pearl can utilize radiating surface to dispel the heat fully.
As shown in Figure 2, be fixed with led chip 4 on the led chip installed surface 7.Present embodiment is provided with six led chips 4, what these six led chips 4 adopted between two pins 3 is the series-parallel connection electric connection mode, as shown in Figure 3, be specially three led chips 4 and be connected into a row by gold thread 8, this row's two ends are electrically connected on the immediate pin 3 by gold thread 8 correspondences, other three led chips 4 also are connected into another row by gold thread 8, and this another row's two ends also are electrically connected on the immediate pin 3 by gold thread 8 correspondences.
Claims (6)
1. a direct insertion multi-chip LED lamp pearl comprises support, metal base, at least two led chips and at least two pins; Pin and metal base are fixed on the support, it is characterized in that: metal base is provided with at least one led chip installed surface, also is provided with at least one radiating surface; The surface area of described led chip installed surface is less than the surface area of described radiating surface; And described led chip installed surface and described radiating surface are orthogonal or near orthogonal; Led chip is fixed on the led chip installed surface, adopts the direct conducting of lead between the led chip; Also adopt the direct conducting of lead between led chip and the electrode.
2. a kind of direct insertion multi-chip LED lamp pearl as claimed in claim 1, it is characterized in that: the quantity of pin is 2, led chip between 2 pins for being electrically connected in series mode.
3. a kind of direct insertion multi-chip LED lamp pearl as claimed in claim 1, it is characterized in that: the quantity of pin is 2, led chip is electric connection mode in parallel between 2 pins.
4. a kind of direct insertion multi-chip LED lamp pearl as claimed in claim 1, it is characterized in that: the quantity of pin is 2, led chip is the series-parallel connection electric connection mode between 2 pins.
5. a kind of direct insertion multi-chip LED lamp pearl as claimed in claim 1 is characterized in that: cap is installed on support.
6. a kind of direct insertion multi-chip LED lamp pearl as claimed in claim 5, it is characterized in that: cap is a light-distribution lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102332046A CN102299145A (en) | 2011-08-15 | 2011-08-15 | Direct-insertion-type multichip LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102332046A CN102299145A (en) | 2011-08-15 | 2011-08-15 | Direct-insertion-type multichip LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102299145A true CN102299145A (en) | 2011-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102332046A Pending CN102299145A (en) | 2011-08-15 | 2011-08-15 | Direct-insertion-type multichip LED lamp bead |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325917A (en) * | 2012-12-20 | 2013-09-25 | 天津金玛光电有限公司 | Straight-inserted type LED with heat conduction function |
| CN103579420A (en) * | 2013-10-18 | 2014-02-12 | 武宁华阳实业有限公司 | Packaging technology of LED energy-saving lamp |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1769762A (en) * | 2004-11-05 | 2006-05-10 | NxGen技术股份有限公司 | Solid state lighting device |
| JP2006295084A (en) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | Package structure of light emitting diode |
| CN2926814Y (en) * | 2006-06-28 | 2007-07-25 | 王小平 | LED illuminating light |
| CN101859864A (en) * | 2010-05-26 | 2010-10-13 | 邓旭恒 | High-power direct plug-in type light emitting diode |
| CN202259291U (en) * | 2011-08-15 | 2012-05-30 | 吕松坚 | Direct inserting type multi-chip LED lamp bead |
-
2011
- 2011-08-15 CN CN2011102332046A patent/CN102299145A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1769762A (en) * | 2004-11-05 | 2006-05-10 | NxGen技术股份有限公司 | Solid state lighting device |
| JP2006295084A (en) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | Package structure of light emitting diode |
| CN2926814Y (en) * | 2006-06-28 | 2007-07-25 | 王小平 | LED illuminating light |
| CN101859864A (en) * | 2010-05-26 | 2010-10-13 | 邓旭恒 | High-power direct plug-in type light emitting diode |
| CN202259291U (en) * | 2011-08-15 | 2012-05-30 | 吕松坚 | Direct inserting type multi-chip LED lamp bead |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325917A (en) * | 2012-12-20 | 2013-09-25 | 天津金玛光电有限公司 | Straight-inserted type LED with heat conduction function |
| CN103579420A (en) * | 2013-10-18 | 2014-02-12 | 武宁华阳实业有限公司 | Packaging technology of LED energy-saving lamp |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20111228 |