CN202332956U - Integrally-packaged high-power LED (Light Emitting Diode) device - Google Patents
Integrally-packaged high-power LED (Light Emitting Diode) device Download PDFInfo
- Publication number
- CN202332956U CN202332956U CN2011204880604U CN201120488060U CN202332956U CN 202332956 U CN202332956 U CN 202332956U CN 2011204880604 U CN2011204880604 U CN 2011204880604U CN 201120488060 U CN201120488060 U CN 201120488060U CN 202332956 U CN202332956 U CN 202332956U
- Authority
- CN
- China
- Prior art keywords
- led chip
- copper base
- led
- power led
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides an integrally-packaged high-power LED (Light Emitting Diode) device which comprises a bracket and LED chips, wherein the bracket comprises a ceramic base and a copper baseplate; the LED chips are bound on the copper baseplate through a noble metal heat-conducting binding material and are arranged in a matrix mode that two adjacent rows are staggered; contacts of the adjacent LED chips are welded through a cambered gold thread; and the contact of each LED chip and the copper baseplate connected with positive and negative poles are welded through a cambered gold thread. The device provided by the utility model has the beneficial effects that in terms of designs of light acquiring efficiency, heat dispersion and current density, such a package structure is optimal.
Description
Technical field
The utility model relates to a kind of semiconductor illumination device, particularly a kind of great power LED device of integrated encapsulation.
Background technology
At present, mainly there are two big technology aspect the LED encapsulation: traditional individual particle lamp bead seal packing technique and high-power integrated encapsulation technology.
Traditional individual particle lamp bead seal packing technique shortcoming:
(1) be not easy to secondary light-distribution, bigger a part of light is lost, and the utilance of light is lower, and energy-saving effect is not remarkable;
(2) LED lamp pearl is more on every light fixture, and production and assembly are complicated, and man efficiency is not high, and the product fraction defective is higher, increases cost;
(3) the colour temperature consistency of light fixture is bad, is prone to macula lutea;
(4) every lamp failure rate is higher, is prone to blackspot, black-tape;
(5) the product pattern is single, lacks to change, and can not give prominence to the city lighting characteristics.
High-power integrated encapsulation technology shortcoming:
(1) lamp luminescence is concentrated, and dazzle is bigger, is difficult for solving;
(2) heat is concentrated, radiating treatment bad easy light fixture useful life of influencing;
(3) present, individual particle lamp bead seal is adorned mode relatively, and application example is less, is unfavorable for that the user accepts.
Summary of the invention
Be technical deficiency more than solving, the utility model provides the great power LED device of the less integrated encapsulation of a kind of perfect heat-dissipating and dazzle.
The utility model is realized through following measure:
The great power LED device of a kind of integrated encapsulation of the utility model comprises support and led chip, institute
State support and comprise ceramics seat and copper base; Said led chip is bonded on the copper base through noble metal heat conduction binding material; Led chip is arranged with the staggered matrix-style of adjacent two row, welds mutually through the gold thread that radian is arranged between the copper base of between the adjacent LED chip contacts and led chip contact and connection both positive and negative polarity.
Above-mentioned copper base surface is a mirror surface structure.
Scribble the mixed layer of fluorescent material and sealing on the above-mentioned led chip, scribble adhesive layer on the mixed layer of fluorescent material and sealing.
The beneficial effect of the utility model is:
This encapsulating structure all is best for the design of getting optical efficiency, heat dispersion and current density.1. thermal resistance is low, and the thermal resistance of this novel package structure generally is merely 14 ℃/W, and comparable conventional LED reduces about 20 times; 2. reliability is high; Employed special-purpose sealing in 40-120 ℃ scope, can not make wire and support lead break off because of the internal stress that temperature shock produces; With the encapsulant of this silicon rubber as optical coupling, the such flavescence phenomenon of ordinary optical epoxy resin can not appear; Metal lead wire frame can not stain because of oxidation yet.3. the optimal design of mirror surface makes radiation controlled the highest with optical efficiency, so not only can obtain higher luminous flux, but also have higher photoelectric conversion efficiency.
Description of drawings
Fig. 1 is the supporting structure sketch map of the utility model.
Fig. 2 is the led chip alignment placement structural representation of the utility model.
Fig. 3 is the led chip syndeton sketch map of the utility model.
Among the figure: 1 ceramics seat, 2 copper bases, 3LED chip, 4 gold threads.
Embodiment
Like Fig. 1,2, shown in 3, the great power LED device of a kind of integrated encapsulation of the utility model comprises support and led chip 3, and support comprises ceramics seat 1 and copper base 2, and copper base 2 adopts the better copper of special processing heat conductivility to do material, reduces junction temperature.Led chip 3 is bonded on the copper base 2 through noble metal heat conduction binding material, uses noble metal heat conduction binding material, and heat is derived fast, and junction temperature is controlled at below 65 ℃, good heat dissipation effect.Led chip 3 is arranged with the staggered matrix-style of adjacent two row, optimum organization, and space utilization is more reasonable.Weld mutually through the gold thread 4 that radian is arranged between between adjacent LED chip 3 contacts and led chip 3 contacts and the copper base 2 that connects both positive and negative polarity, improve light emission rate to a greater extent, guaranteed welding reliability simultaneously.
The foregoing description is said to be in order to specify this patent; Though describe through specific term in the literary composition; But can not limit the protection range of this patent with this; The personage who is familiar with this technical field can change or revise it after the spirit of understanding this patent and principle and reach equivalent purpose, and this equivalence change and modification all should be covered by the claim scope and define in the category.
Claims (3)
1. the great power LED device of an integrated encapsulation comprises support and led chip, it is characterized in that: institute
State support and comprise ceramics seat and copper base; Said led chip is bonded on the copper base through noble metal heat conduction binding material; Led chip is arranged with the staggered matrix-style of adjacent two row, welds mutually through the gold thread that radian is arranged between the copper base of between the adjacent LED chip contacts and led chip contact and connection both positive and negative polarity.
2. the great power LED device of integrated encapsulation according to claim 1 is characterized in that: said copper base surface is mirror surface structure.
3. the great power LED device of integrated encapsulation according to claim 1 is characterized in that: scribble the mixed layer of fluorescent material and sealing on the said led chip, scribble adhesive layer on the mixed layer of fluorescent material and sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204880604U CN202332956U (en) | 2011-11-30 | 2011-11-30 | Integrally-packaged high-power LED (Light Emitting Diode) device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204880604U CN202332956U (en) | 2011-11-30 | 2011-11-30 | Integrally-packaged high-power LED (Light Emitting Diode) device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202332956U true CN202332956U (en) | 2012-07-11 |
Family
ID=46444923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204880604U Expired - Fee Related CN202332956U (en) | 2011-11-30 | 2011-11-30 | Integrally-packaged high-power LED (Light Emitting Diode) device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202332956U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659186A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | LED integrated module |
-
2011
- 2011-11-30 CN CN2011204880604U patent/CN202332956U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659186A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | LED integrated module |
| CN104659186B (en) * | 2015-02-12 | 2017-06-20 | 矽照光电（厦门）有限公司 | A kind of LED integration modules |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201363572Y (en) | LED light source module | |
| CN106252491A (en) | Light-emitting device | |
| TW201143023A (en) | Light emitting diode package, lighting device and light emitting diode package substrate | |
| JP2011192703A (en) | Light emitting device, and illumination apparatus | |
| CN201590435U (en) | LED encapsulation structure | |
| CN202013881U (en) | Integrated packaging structure with vertically structured LED chips | |
| CN201428943Y (en) | Led lamp | |
| CN202332956U (en) | Integrally-packaged high-power LED (Light Emitting Diode) device | |
| CN207938606U (en) | A kind of LED encapsulation structure of upside-down mounting RGB chips | |
| CN204045626U (en) | Chip-packaging structure on the light-emitting diode panel of many races array | |
| CN206401317U (en) | A kind of full-spectrum LED encapsulating structure of unstressed configuration powder | |
| CN102468293A (en) | Polycrystal packaging structure directly and electrically connected to alternating-current power supply | |
| CN201966210U (en) | White-light light emitting diode (LED) encapsulating structure | |
| CN201946591U (en) | Two-chip light-emitting diode (LED) packaging structure | |
| CN201303008Y (en) | Led packaging structure | |
| CN202678310U (en) | A large-power LED integrated array lighting source based on COB technology | |
| CN209418539U (en) | A kind of high-efficient large power LED light source encapsulating structure | |
| CN209298156U (en) | A kind of LED light PCB light source board group part | |
| CN208422957U (en) | A kind of integrated LED multi-chip three-dimension packaging light source | |
| CN201628185U (en) | Light emitting diode support and packaging structure thereof | |
| CN202695440U (en) | Led integrated light source | |
| CN201666469U (en) | LED module packaging structure | |
| CN205919161U (en) | Adopt de -electrification source photovoltaic module of no gold thread white light LED chip of high pressure | |
| CN203398152U (en) | Led | |
| CN204361095U (en) | A kind of HV-COB LED light source excited based on long-distance fluorescent powder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20161130 |