CN201303008Y

CN201303008Y - Led packaging structure

Info

Publication number: CN201303008Y
Application number: CNU2008202134053U
Authority: CN
Inventors: 黄建中
Original assignee: Brightek Optoelectronic Co Ltd
Current assignee: Brightek Optoelectronic Co Ltd
Priority date: 2008-11-07
Filing date: 2008-11-07
Publication date: 2009-09-02
Anticipated expiration: 2018-11-07

Abstract

The utility model relates to an LED packaging structure, which comprises a luminescent chip and a carrier with a cup body, wherein the luminescent chip is held in the cup body, a first adhesive layer covering the luminescent chip and a second adhesive layer covering the first adhesive layer are filled in the cup body, the second adhesive layer contains fluorescent materials, and a first ring loop is convexly disposed along the edge of the first adhesive layer on the bottom of the cup body of the carrier. The LED packaging structure is characterized in that the first adhesive layer is placed between the second adhesive layer and the luminescent chip to prevent the second adhesive layer containing fluorescent materials from directly contacting with the chip, thereby effectively lowering the work temperature of the fluorescent materials and enabling the fluorescent materials to keep high transformation efficiency. Therefore, the luminous efficiency of the LED can be improved and luminous stability and reliability of the LED can be strengthened. In addition, the first ring loop is convexly disposed at the edge of the first adhesive layer to prevent the first adhesive layer from diffusing to the outside of the first ring loop, thereby the first adhesive layer is capable of effectively covering the luminescent chip and remaining a relatively fine shape.

Description

The LED encapsulating structure

Technical field

The utility model relates to emitting components, relates in particular to a kind of LED encapsulating structure.

Background technology

LED (Light Emitting Diode), promptly light-emitting diode is a kind of semiconductor solid luminescence device.It is to utilize the solid semiconductor chip as luminescent material.When two ends add forward voltage, son and majority that dams that dams of the minority in the semiconductor takes place compoundly, emits superfluous energy and causes photo emissions, directly sends red, orange, yellow, green, blue, blue, purple, white light.Led light source since have high energy-conservation, the life-span long, be beneficial to advantage such as environmental protection, in fact, since LED comes out, the application surface of LED more and more widely, the advantage of its environmental protection and energy saving makes LED be regarded as one of main lighting source of 21 century.

In order to gain a place on illumination market, the white light LEDs of different encapsulated types constantly occurs on market.Along with the extensive application of LED, the demand of LED is increasing, and wherein high-capacity LED will receive increasing concern along with the needs of illumination especially.Yet, how to improve the tuorbillion optical property of LED and how to solve, be still present focus.

Traditional LED encapsulating structure comprises support and is arranged at luminescence chip on the support, and support offers cup, and luminescence chip is contained in the cup and is coated with the fluorescence glue-line.In this traditional LED encapsulating structure, fluorescent colloid directly contacts with luminescence chip, and the heat that light-emitting diode distributed rises the fluorescent material temperature, thereby has reduced the launching efficiency of fluorescent material, influences the luminous efficiency and the tuorbillion optical property of luminescence chip.

The utility model content

In view of this, be necessary to provide the LED encapsulating structure of a kind of luminous efficiency height, stable luminescent property.

A kind of LED encapsulating structure, it comprises luminescence chip and carrier, described carrier has a cup, described luminescence chip is contained in the cup, be filled with first glue-line that covers described luminescence chip and second glue-line that covers first glue-line in the described cup, described second glue-line includes fluorescent material, and described carrier convexes with first ring in bottom of cup along the edge of first glue-line.

Compared with prior art, in described LED encapsulating structure, be separated with first glue-line between between second glue-line and the luminescence chip, directly contact with chip with second glue-line of avoiding containing fluorescent material, thereby the temperature when reducing fluorescent material work effectively, make fluorescent material keep high transformation efficiency, thereby can improve the luminous efficiency of LED, strengthen luminous stability and the reliability of LED.In addition,, do not need all glue-lines all to contain fluorescent material, can reduce the use amount of fluorescent material thus, thereby reduce cost owing to include fluorescent material at second glue-line.In addition, convex with first ring, can stop first glue-line to be diffused into outside first ring, make first glue-line can cover luminescence chip effectively, and make first glue-line keep better shape at the edge of first glue-line.

Description of drawings

Fig. 1 is the LED encapsulating structure generalized section that the utility model embodiment provides.

Fig. 2 is the schematic top plan view of the LED encapsulating structure of Fig. 1.

Fig. 3 is the polycrystalline substance schematic diagram of the LED encapsulating structure of Fig. 1.

Embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.

See also Fig. 1 and Fig. 2, the LED encapsulating structure 100 that provides for the utility model embodiment.This LED encapsulating structure 100 comprises luminescence chip 13 and carrier 101.Carrier 101 has a cup 103, and luminescence chip 13 is contained in the cup 103.Be filled with first glue-line 12 that covers luminescence chip 13 in the cup 103.Carrier 101 convexes with first ring 17 in bottom of cup along the edge of first glue-line 12, to stop first glue-line 12 excessive.Be coated with second glue-line, 11, the second glue-lines 11 on first glue-line 12 and include fluorescent material.

In the present embodiment, carrier 101 can be made by thermoplastic.Cup 103 is located at the middle part of carrier 101, and the bottom of cup 103 has provided perforate 104, in perforate 104, be provided with one heat sink 23, luminescence chip 13 is arranged on heat sink 23.Perforate 104 comprises first through hole 105 of next-door neighbour cup 103 bottoms and joins the aperture of second through hole, 106, the first through holes 105 that communicate less than the aperture of second through hole 106 with first through hole 105.Heat sink 23 comprise the top 232 of supporting luminescence chip 13 and the bottom 234 that links to each other with top 232, heat sink top 232 and bottom 234 are contained in respectively in first through hole 105 and second through hole 106, and second through hole 106 can further be extended in bottom 234, and bottom 234 is provided with the heat radiation pad 236 that is used for the welding of secondary heat abstractor.The area of bottom 234 is greater than the area at top 232, and the area at top 232 is less than the area of cup 103 bottoms.Thereby, can pass through more large-area heat sink 23 bottom 234, the heat that luminescence chip 13 is produced in time distributes.

Heat sink 23 top 232 and bottom 234 are structure as a whole, and its material can be good metal of copper or aluminium, other thermal conductivity or their alloy.Heat sink 23 upper surface just is provided with the end face at the top 232 of chip 13, and it is handled through brightening, to increase light extraction efficiency.

Carrier 101 is provided with a cross-notching 102 in the bottom of cup 103, this cross-notching 102 extends carrier 101 respective sides faces respectively, is provided with the pin 18 that is electrically connected with luminescence chip 13 in each fluting 102.As shown in figs. 1 and 3, each pin 18 extends carrier 101 corresponding sides and further extends to the outside of carrier 101, to be electrically connected with external pad 19, by external pad 19 chip 13 is electrically connected on the wiring board.Each pin 18 is electrically connected to luminescence chip 13 by lead 14, and pair of pins 18 lays respectively at the both sides of luminescence chip 13.

In the present embodiment, first ring 17 is integrative-structures with carrier 101, promptly is integrated structure.As shown in Figure 1, first through hole 105 is a circular hole, and first ring 17 can be that it has certain altitude by the upwardly extending protruding circle of the hole wall of first through hole 105.First glue-line 12 can be to cover luminescence chip 13 fully, and is limited in first ring 17.Especially in manufacturing place glue process, under the barrier effect of glue self tension force and first ring 17, colloid is limited in first ring 17, can not be diffused into outside first ring 17, make first glue-line 12 can effectively cover luminescence chip 13, and keep shape preferably.

Further, carrier 101 convexes with second ring 16 in bottom of cup along the edge of second glue-line 11, is diffused into outside second ring 16 to stop second glue-line 11, makes second glue-line 11 effectively cover first glue-lines 12, and evenly distributes.Being coated with the 3rd glue-line 10, the first glue-lines 12 and the 3rd glue-line 10 on second glue-line 11 and can adopting identical or different transparent colloid material, for example can be silica gel or epoxy resin.Second glue-line 11 also can adopt transparent colloid as base material, can be silica gel or epoxy resin for example, and blending has fluorescent powder in transparent colloid then, forms the fluorescence glue-line.

First glue-line 12 can separate the luminescence chip 13 and second glue-line 11, to reach the purpose that luminescence chip 13 and second glue-line 11 that contains fluorescent material can not directly be contacted, thereby the heat that chip 13 is produced can not directly act on second glue-line 11, make that the fluorescent material temperature can be lower than the fluorescent material temperature in direct covering luminescence chip 13 colloid layers in second glue-line 11, to improve the fluorescent material conversion efficiency, finally reach the purpose of improving the LED luminescent properties.

The outer surface of the 3rd glue-line 10 can become plane or arcwall face, is illustrated as arcwall face, and the 3rd glue-line 10 can reach the effect of protection first, second glue-line 12 of internal layer and 11.Certainly, also can not adopt the form of the 3rd glue-line 10, then second glue-line 11 directly covers full whole cup 103, and outer surface be shaped as plane or arcwall face.

First,

second ring

17 and 16, and carrier 101 is identical material, mainly is high temperature thermoplastic, and carrier 101, first ring 17 and second ring 16 structure that is formed in one, first ring 16 and second ring 17 are concentric ring.The position of luminescence chip 13 is in first,

second ring

17 and 16.

In addition, margin of optic cup face at cup 103 is an inclined-plane, and the bottom surface of this inclined-plane and cup 103 is formed with reflector 15 respectively, and reflector 15 is a coating, coating material can be silver or other highly reflective material, and the reflector 15 and cup 103 bottoms on inclined-plane are angled.

In the LED encapsulating structure of the foregoing description, be separated with first glue-line 12 between between second glue-line 11 and the luminescence chip 13, second glue-line 11 that contains fluorescent material directly contacts with luminescence chip 13, thereby the temperature when reducing fluorescent material work effectively, make fluorescent material keep high transformation efficiency, thereby can improve the luminous efficiency of LED, strengthen luminous stability and the reliability of LED.In addition,, do not need all glue-lines all to contain fluorescent material, can reduce the use amount of fluorescent material thus, thereby reduce cost owing to only include fluorescent material at second glue-line 11.In addition, convex with first ring 17, can stop first glue-line 12 to be diffused into outside first ring 17, make first glue-line 12 can effectively cover luminescence chip 13, and make first glue-line 12 keep better shape at the edge of first glue-line 12.

In addition, chip 13 directly contacts with heat sink, thereby the heat that chip 13 produces can be distributed rapidly in time by heat sink 23.

The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.

Claims

1, a kind of LED encapsulating structure, it comprises luminescence chip and carrier, described carrier has a cup, described luminescence chip is contained in the cup, it is characterized in that, be filled with first glue-line that covers described luminescence chip and second glue-line that covers first glue-line in the described cup, described second glue-line includes fluorescent material, and described carrier convexes with first ring in bottom of cup along the edge of first glue-line.

2, LED encapsulating structure as claimed in claim 1 is characterized in that, is coated with the 3rd glue-line on described second glue-line, and the colloid material of described first glue-line and the 3rd glue-line is layer of silica gel or epoxy resin layer.

3, LED encapsulating structure as claimed in claim 1 is characterized in that, described carrier also convexes with second ring in bottom of cup along the edge of second glue-line.

4, as claim 1 or 3 described LED encapsulating structures, it is characterized in that described ring and described carrier are integrative-structures.

5, LED encapsulating structure as claimed in claim 1 is characterized in that, the bottom of described cup has provided perforate, in described perforate, be provided with one heat sink, described luminescence chip be arranged at described heat sink on.

6, LED encapsulating structure as claimed in claim 5, it is characterized in that, described perforate comprises first through hole that is close to bottom of cup and second through hole that joins and communicate with first through hole, the aperture of described first through hole is less than the aperture of second through hole, described heat sink the comprise top of supporting luminescence chip and the bottom that links to each other with the top, described heat sink top and bottom are contained in respectively in first through hole and second through hole.

7, LED encapsulating structure as claimed in claim 6 is characterized in that, described second through hole is further extended in described heat sink bottom, and described heat sink bottom is provided with the heat radiation pad that is used for the welding of secondary heat abstractor.

8, LED encapsulating structure as claimed in claim 6 is characterized in that, described first ring is by the upwardly extending protruding circle of the hole wall of first through hole.

9, LED encapsulating structure as claimed in claim 1, it is characterized in that, described carrier is provided with a cross-notching in the bottom of cup, a described cross-notching extends carrier respective sides face respectively, be provided with the pin that is electrically connected with chip in each fluting, each pin extends the corresponding side of carrier and further extends to carrier and is electrically connected with external pad outward.