CN202443970U - LED packaging structure adopting COB technology - Google Patents
LED packaging structure adopting COB technology Download PDFInfo
- Publication number
- CN202443970U CN202443970U CN 201120569897 CN201120569897U CN202443970U CN 202443970 U CN202443970 U CN 202443970U CN 201120569897 CN201120569897 CN 201120569897 CN 201120569897 U CN201120569897 U CN 201120569897U CN 202443970 U CN202443970 U CN 202443970U
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- led chip
- coating
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
The present utility model relates to an LED packaging structure adopting the COB technology. The prior structure is long in production period and high in costs. The packaging structure comprises a substrate and a plurality of LED chip packaging units; the LED chip packaging units are arranged on the substrate and enclosed by silica gel; a mixture of fluorescent powder and glue is filled inside the enclosed area, and the mixture is plane-shaped on the top part of the enclosed area. Each LED chip packaging unit comprises an LED chip, silver glue and a coating which are arranged successively from the top to the bottom; the coating is arranged on a crystal-fixing position of the substrate, and an electrode of the upper surface of the LED chip is connected with a wiring position of the upper surface of the substrate through a gold thread. In the structure, the LED chips are directly packaged on the substrate, the metal coating is arranged on the crystal-fixing position of the substrate, light reflection is enhanced by the coating, thermal resistance is reduced, heat dissipation is realized, luminescence efficiency is enhanced, and service life of the LED is enhanced.
Description
Technical field
The utility model belongs to LED encapsulation technology field, relates in particular to a kind of LED encapsulating structure of the COB of employing technology.
Background technology
Up to now, the encapsulating structure of LED mainly is SMD, and led chip and support are packaged into individual devices, is welded on the substrate then.For the LED encapsulation, heat radiation and bright dipping are topmost two large problems, and such encapsulating structure passage of heat is longer, makes the LED junction temperature rise, thereby cause light emission rate to reduce, and can shorten the useful life of LED.Be applied in problems such as also having volume is big, particle is many, dazzle exceeds standard, cost height in the lighting device, be unfavorable for the design and the assembling of light source.
Recently, in order to solve the problem that the adopting surface mounted LED encapsulating structure occurs, also there are some uses that COB (chip on board) encapsulating structure of circular groove is arranged.On substrate, slot; Construct reflector with circular groove; Then that led chip is directly solid brilliant on substrate, when the COB encapsulation of carrying out the LED chip, need earlier fluorescent glue to be filled up reflector one by one then, cover substratum transparent after the curing again; Because be outer gibbosity after putting adhesive curing, it is relatively poor to cause LED to go out light consistency.Though this kind COB encapsulating structure has solved some problems that the adopting surface mounted LED encapsulating structure brings, groove need carry out mechanical assistance processing, also needs secondary point glue, and complex structure, operation are more, have increased cost.And lead-in wire during bonding the length of gold thread increase problem such as can cause gold thread to rupture or solder joint is not firm owing to groove is set.So, the COB encapsulating structure of this kind band groove can cause the production cycle long, cost is higher, the unequal problem of colourity.
Summary of the invention
The purpose of the utility model is to provide a kind of LED encapsulating structure of the COB of employing technology; Shortcomings such as paster class LED volume is big, heat radiation is difficult, cost is high, dazzle exceeds standard have been overcome; Having solved existing COB encapsulation needs fluting and puts glue one by one, thereby causes complex structure, the unequal problem of colourity.
The technical scheme that technical solution problem of the present invention is taked is:
A kind of LED encapsulating structure that adopts the COB technology comprises substrate, a plurality of led chip encapsulation unit; A plurality of led chip encapsulation units are arranged on the substrate, and are surrounded by silica gel; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top;
Described led chip encapsulation unit comprises led chip, elargol and the coating that sets gradually from top to bottom; Coating is arranged on the solid brilliant position of substrate, and the led chip upper surface electrode is connected with upper surface of base plate routing position through gold thread.
Said led chip is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side.
Said substrate is rectangular-shaped high-thermal conductive metal base plate.
Said silica gel is heat conductive silica gel, and has the function that prevents that said encapsulating material from overflowing, and described encapsulating material is the amalgam of fluorescent material and glue.
The beneficial effect of the utility model: led chip directly is encapsulated on the substrate; And on the solid brilliant position of substrate, the coat of metal being set, coating has strengthened the light reflection, has reduced thermal resistance; Improved luminous efficiency when being beneficial to heat radiation, thereby also improved the useful life of LED.
But on substrate, surround the silica gel of heat conduction, not only can control the shape and the position of encapsulating material, solved the some glue difficult problem of no cup-like structure in the COB technology, can also auxiliary heat dissipation.
Evenly some notes encapsulating material gets final product when packaging LED chips, does not need to put one by one glue, and the precision of a glue is controlled does not have too high requirement yet, can use semi-automatic or full automatic spot gluing equipment, has improved the speed of some glue.
Be plane after the said encapsulation material solidifies, the light that led chip is sent can be directional light or has the light of certain diffusion angle, has avoided because packing colloid is outer gibbosity, thereby has caused LED to go out the relatively poor and big problem of colour temperature difference of light consistency.
The utility model need not fluting processing, can carry out single-chip package, also can carry out the encapsulation of multicore sheet, and the encapsulation shape is not limit; Packaging process is simplified, and a kind of simple and practical, thermal diffusivity good, colourity is even, luminous efficiency is high, cost is low LED encapsulating structure is provided.
Description of drawings
Fig. 1 is the structural representation of traditional adopting surface mounted LED encapsulation;
Fig. 2 is the cross sectional representation of the utility model LED encapsulating structure;
Fig. 3 is the structural representation of existing band groove COB encapsulation;
Fig. 4 is the sketch map of the utility model multichip LED encapsulation structure.
Embodiment
Be described further below in conjunction with principle, the structure of accompanying drawing the utility model.
As shown in Figure 1, be the structural representation of traditional adopting surface mounted LED encapsulation.Led chip 1 directly is mounted on the support 10, with gold thread 2 bonding that goes between, fluorescent glue 5 is filled up the groove of support 10, after the curing again with 4 of transparent adhesive tapes on fluorescent glue 5, cover gold thread and be outer gibbosity.Form individual devices with this, be welded in then on the substrate 3.It is thus clear that the operation of adopting surface mounted LED encapsulation is many, passage of heat is long, causes long, heat radiation difficulty of production cycle, thereby shortened the useful life of LED.
As shown in Figure 2, be the cross sectional representation of the utility model single-chip LED encapsulating structure, comprise substrate 3 and a led chip encapsulation unit; The led chip encapsulation unit is arranged on the substrate 3, and is surrounded by silica gel 6; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top;
Described led chip encapsulation unit comprises led chip 1, elargol 9 and the coating 8 that sets gradually from top to bottom; Coating 8 is arranged on the solid brilliant position of substrate 3, strengthens reflection, the raising luminous efficiency of light; Led chip 1 upper surface electrode is connected with substrate 3 upper surface routing positions through gold thread 2.
Led chip 1 is the blue chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side.
Encapsulating material 7 is the amalgam of yellow fluorescent powder and transparent glue, mobile good, refractive index is high, high temperature resistant, combines the formation white light source with led chip 1.
Silica gel 6 existing cohesive actions; Good heat conduction, thermal diffusivity are arranged again, are a kind of neutral organosilicone elastic glue through reinforcement, and normal temperature is curable cohering on substrate 3; Need not high-temperature baking; Implement simple and convenient, but auxiliary heat dissipation has simultaneously and prevents that encapsulating material from overflowing, controlling the function of encapsulating material 7 shapes and position.
As shown in Figure 3, be the sketch map of existing band groove COB encapsulating structure, constitute by led chip 1, gold thread 2, substrate 3, transparent adhesive tape 4 and fluorescent glue 5.
The led chip outward appearance of this construction packages is the point-like of evagination, has that light consistency is relatively poor, the problem of some light, dazzle after the energising, not only can be dazzling, and reduced light efficiency.
As shown in Figure 4, be the sketch map of the utility model multichip LED encapsulation structure.Comprise substrate 3 and a plurality of led chip encapsulation units; A plurality of led chip encapsulation units are arranged on the substrate 3, evenly distribute, and are surrounded by silica gel 6; Filling encapsulating material 7 is plane surrounding regional top in this surrounds the zone.
On substrate 3, connect up, the electric connecting relation of chip chamber is set.
Carry out being electrically connected of led chip 1 and substrate 3 with gold thread 2, an end connects the surface electrode of led chip 1, and the other end connects the electrode of both sides, solid brilliant position on the substrate 3, and the routing distance of gold thread 2 obviously shortens in visible this kind encapsulating structure, and reliability also strengthens thereupon.
Silica gel 6 surrounds said a plurality of led chip encapsulation unit integral body, after encapsulating material 7 is filled into this and surrounds the zone, because encapsulating material 7 self flowability; Be plane surrounding regional top, it is luminous to form area source integral body, has eliminated the point-like effect; Light is evenly soft, bright dipping is consistent, colourity is even; And this encapsulating structure packaging density is higher, can do high power device with the small-power chip, and cost is low, light efficiency is high.
Claims (1)
1. a LED encapsulating structure that adopts the COB technology comprises substrate, a plurality of led chip encapsulation unit, and it is characterized in that: a plurality of led chip encapsulation units are arranged on the substrate, and are surrounded by silica gel; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top;
Described led chip encapsulation unit comprises led chip, elargol and the coating that sets gradually from top to bottom; Coating is arranged on the solid brilliant position of substrate, and the led chip upper surface electrode is connected with upper surface of base plate routing position through gold thread.
2. a kind of LED encapsulating structure that adopts the COB technology as claimed in claim 1, it is characterized in that: said led chip is the chip of bipolar electrode, routing position pad is positioned at solid brilliant position dual-side.
3. a kind of LED encapsulating structure that adopts the COB technology as claimed in claim 1, it is characterized in that: said substrate is rectangular-shaped high-thermal conductive metal base plate.
4. a kind of LED encapsulating structure that adopts the COB technology as claimed in claim 1, it is characterized in that: said silica gel is heat conductive silica gel, and has the function that prevents that said encapsulating material from overflowing, described encapsulating material is the amalgam of fluorescent material and glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120569897 CN202443970U (en) | 2011-12-31 | 2011-12-31 | LED packaging structure adopting COB technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120569897 CN202443970U (en) | 2011-12-31 | 2011-12-31 | LED packaging structure adopting COB technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202443970U true CN202443970U (en) | 2012-09-19 |
Family
ID=46825404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120569897 Expired - Fee Related CN202443970U (en) | 2011-12-31 | 2011-12-31 | LED packaging structure adopting COB technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202443970U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103000788A (en) * | 2012-11-30 | 2013-03-27 | 深圳市璨阳光电有限公司 | LED packaging structure and method |
| CN103730565A (en) * | 2014-01-17 | 2014-04-16 | 北京大学东莞光电研究院 | Aluminum nitride Chip On Board (COB) light-emitting diode (LED) light source and packaging method thereof |
-
2011
- 2011-12-31 CN CN 201120569897 patent/CN202443970U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103000788A (en) * | 2012-11-30 | 2013-03-27 | 深圳市璨阳光电有限公司 | LED packaging structure and method |
| CN103730565A (en) * | 2014-01-17 | 2014-04-16 | 北京大学东莞光电研究院 | Aluminum nitride Chip On Board (COB) light-emitting diode (LED) light source and packaging method thereof |
| CN103730565B (en) * | 2014-01-17 | 2016-08-03 | 北京大学东莞光电研究院 | A kind of method for packing of aluminium nitride COB LED light source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203857313U (en) | LED bulb lamp with high lighting effect | |
| CN202004043U (en) | Patch-type white light LED device | |
| CN102751274A (en) | Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip | |
| CN203134860U (en) | Packaging structure for small-medium power LED paster | |
| CN204130588U (en) | A kind of COB light source without packaged chip | |
| CN102447049B (en) | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator | |
| CN103840071A (en) | LED lamp bar manufacturing method and LED lamp bar | |
| CN204118067U (en) | Directly be packaged in the LED chip encapsulation architecture of radiator | |
| CN203503708U (en) | Sapphire base LED encapsulation structure | |
| CN202443970U (en) | LED packaging structure adopting COB technology | |
| CN101436638B (en) | High-power LED packaging structure | |
| CN207353289U (en) | A kind of LED encapsulation structure and automobile dimming-distance lighting system for improving light efficiency | |
| CN106356437B (en) | A kind of white light LED packaging device and preparation method thereof | |
| CN103822143A (en) | LED (light emitting diode) street lamp light source module with silicon substrates | |
| CN207883721U (en) | A kind of LED light bar with excellent heat dispersion performance | |
| CN102842668B (en) | Structure of chip and preparation method thereof is directly encapsulated on a kind of temperature-uniforming plate | |
| CN202120908U (en) | Single-lead light-emitting diode (LED) module | |
| CN216872009U (en) | Circular high-power LED packaging structure capable of improving light-emitting efficiency of chip | |
| CN203038968U (en) | LED illumination module | |
| CN202736973U (en) | Three-dimensional cladded and packaged LED chip | |
| CN203836739U (en) | Silicon-substrate LED road lamp light source module | |
| CN206349386U (en) | A kind of LED lamp bead structure with stability and refractive index | |
| CN201616432U (en) | LED multi-chip integrated packaging component | |
| CN201303008Y (en) | Led packaging structure | |
| CN205028918U (en) | LED support and LED packaging body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120919 Termination date: 20141231 |
|
| EXPY | Termination of patent right or utility model |