CN201616432U

CN201616432U - LED multi-chip integrated packaging component

Info

Publication number: CN201616432U
Application number: CN2010201468711U
Authority: CN
Inventors: 向德祥; 于正国; 李静静; 徐俊峰
Original assignee: ANHUI LAIDE ELECTRONIC TECHNOLOGY CO LTD
Current assignee: ANHUI LAIDE ELECTRONIC TECHNOLOGY CO LTD
Priority date: 2010-03-25
Filing date: 2010-03-25
Publication date: 2010-10-27
Anticipated expiration: 2020-03-25

Abstract

The utility model discloses an LED multi-chip integrated packaging component, comprising a base plate [1] and a plurality of chips [6], which is characterized by further comprising a silicon chip [3], a phosphor layer [4] and an optical silicone lens [5]; the bottom of the silicon chip [3] is plated with a gold plated layer; the plurality of chips [6] are connected in series and welded on the silicon chip [3] to form a series-parallel circuit; the base plate [1] is a copper plate, on which a square groove is opened; the bottom of the square groove is electroplated with nickel silver; the silicon chip [3] is arranged in the square groove; an alloy soldering lug [2] is arranged between the silicon chip [3] and the bottom of the square groove so as to fix the silicon chip [3] in the square groove; the phosphor layer [4] fills and covers the silicon chip [3], on which a raised surface is formed; the optical silicone lens [5] in the hemispheric shape is fixed on the base plate [1] to cover the phosphor layer [4]. The LED multi-chip integrated packaging component has the advantages of high reliability and lighting effect, and long useful life.

Description

The integrated packaging of a kind of LED polycrystalline sheet

Technical field

The utility model relates to the integrated packaging of a kind of LED polycrystalline sheet.

Background technology

Many many little wafers of employing of the integrated packaging of existing LED polycrystalline sheet or many wafer connection in series-parallel are integrated; The aluminium base circuit board of the many employings of substrate; The bonding of wafer and substrate adopts elargol to fix; The aluminium base circuit board modes of digging circular groove that adopt, the centre is filled and led up yellow fluorescent glue and is formed white light more.At the packing forms of the present overwhelming majority's the integrated packaging of LED, it is bigger than normal that its LED device exists packaging thermal resistance, and reliability reduces, and luminous efficiency is on the low side, the secondary radiating treatment difficulty of device, shortcomings such as life-span reduction.

The utility model content

The purpose of this utility model solves exactly that the existing integrated packaging thermal resistance of LED polycrystalline sheet is bigger than normal, and reliability is low, and luminous efficiency is on the low side, the secondary radiating treatment difficulty of device, the problem that the life-span reduces.

The technical solution adopted in the utility model is: the integrated packaging of a kind of LED polycrystalline sheet, it comprises substrate and several wafers, it is characterized in that it also comprise silicon chip, fluorescence send out the layer and the optics silica-gel lens, described silicon chip bottom is coated with Gold plated Layer, several wafer connection in series-parallel are welded on and form series-parallel circuit on the silicon chip, described substrate is a copper plate, offer square groove on the substrate, square groove bottom electrical nickel plating silver, silicon chip is positioned at square groove, between silicon chip and the square groove bottom is the alloy weld tabs, and silicon chip is fixed in the square groove; Phosphor powder layer fills and covers on the silicon chip and upper surface forms convex surface, and silica-gel lens is hemisphere and is fixed on substrate top covering phosphor powder layer.

Adopt technique scheme, between copper base and silicon chip, place ultra-thin alloy weld tabs, utilize the eutectic solder technology to carry out the eutectic welding, effectively reduce packaging thermal resistance; Silica-gel lens can change shape according to the difference of application purpose, and its light source luminescent angle should be used as suitable adjustment according to different, is well being promoted aspect brightness and the uniformity.Reduce the quantity of welding lead, promote the soldering reliability of product: with respect to the integrated packaging of most LED polycrystalline sheets, owing to adopt the polycrystalline sheet directly to be welded on the silicon chip, its welding lead quantity can significantly reduce, avoid the failure welding that causes because of rosin joint, thereby promote its welding reliability.Reduce the packaging thermal resistance of device, promote reliability of products: wafer is welded on the silicon chip,, can effectively derives heat because silicon chip has good thermal conductivity; Square groove and silica-gel lens effectively promote and get optical efficiency, avoid the loss of light.Effectively promote light output, reduce assembly cost, reduce packaging cost, promote the useful life of product.

The utility model beneficial effect is: reliability increases greatly, and optical efficiency is improved, and prolong useful life.

Description of drawings

Fig. 1 is the utility model structural representation.

Among the figure, 1, substrate, 2, the alloy weld tabs, 3, silicon chip, 4, phosphor powder layer, 5, silica-gel lens, 6, wafer.

Embodiment

The integrated packaging of a kind of LED polycrystalline of the utility model sheet, as shown in Figure 1, it comprises substrate 1 and several wafers 6, it also comprises silicon chip 3, phosphor powder layer 4 and optics silica-gel lens 5, described silicon chip 3 bottoms are coated with Gold plated Layer, several wafer 6 connection in series-parallel are welded on the silicon chip 3 and form series-parallel circuit, described substrate 1 is a copper plate, offer square groove on the substrate 1, square groove bottom electrical nickel plating silver, silicon chip 3 is positioned at square groove, is alloy weld tabs 2 between silicon chip 3 and the square groove bottom, and silicon chip 3 is fixed in the square groove; Phosphor powder layer 4 fills and covers on the silicon chip 3 and upper surface forms convex surface, and silica-gel lens 5 is hemisphere and is fixed on substrate 1 top covering phosphor powder layer 4.

Claims

1. integrated packaging of LED polycrystalline sheet, it comprises substrate [1] and several wafers [6], it is characterized in that it also comprises silicon chip [3], phosphor powder layer [4] and optics silica-gel lens [5], described silicon chip [3] bottom is coated with Gold plated Layer, several wafers [6] connection in series-parallel is welded on silicon chip [3] and goes up the formation series-parallel circuit, described substrate [1] is a copper plate, substrate offers square groove on [1], square groove bottom electrical nickel plating silver, silicon chip [3] is positioned at square groove, between silicon chip [3] and the square groove bottom is alloy weld tabs [2], and silicon chip [3] is fixed in the square groove; Phosphor powder layer [4] filling and covering silicon chip [3] are gone up and upper surface forms convex surface, and silica-gel lens [5] is hemisphere and is fixed on substrate [1] top covering phosphor powder layer [4].